TWI463932B - Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards - Google Patents

Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards Download PDF

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Publication number
TWI463932B
TWI463932B TW099104706A TW99104706A TWI463932B TW I463932 B TWI463932 B TW I463932B TW 099104706 A TW099104706 A TW 099104706A TW 99104706 A TW99104706 A TW 99104706A TW I463932 B TWI463932 B TW I463932B
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Taiwan
Prior art keywords
sub
assemblies
counterbore
plurality
hole
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TW099104706A
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Chinese (zh)
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TW201106826A (en
Inventor
Raj Kumar
Monte Dreyer
Michael J Taylor
Ruben Zepeda
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Dynamic Details Inc
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Priority to US12/539,172 priority Critical patent/US8453322B2/en
Application filed by Dynamic Details Inc filed Critical Dynamic Details Inc
Publication of TW201106826A publication Critical patent/TW201106826A/en
Application granted granted Critical
Publication of TWI463932B publication Critical patent/TWI463932B/en

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Description

Additional functional single-laminated stacked connecting columns with metallized through-holes for multilayer printed circuit boards Related application

The priority and benefits of the US Provisional Patent Application No. 61/189,171, filed on August 14, 2008, are hereby incorporated by reference.

Field of invention

The present invention relates generally to printed circuit (wiring) boards and methods of making same, and more particularly to a multilayer printed circuit board having additional functionality and a method of making the same.

Description of related technology

Most electronic systems will include printed circuit boards with high density electronic interconnects. A printed circuit board can include one or more circuit cores, substrates or carriers, and the like. In a fabrication of a printed circuit board having the one or more circuit carriers, electronic circuits (eg, pads, electronic interconnects, etc.) are formed on opposite sides of a separate circuit carrier to form a pair of circuit layers . The circuit layer pairs of the circuit board can be physically or chemically bonded to form the printed circuit board, that is, by using an adhesive (or a prepreg or a bonding layer), and the circuit layers are The adhesive is stacked in a press to cure the resulting circuit board structure, drilled or laser drilled through the holes, and then the copper holes are plated with the through holes to interconnect the circuit layer pairs. The curing process is used to cure the adhesive to provide permanent physical bonding of the board structure. However, such adhesives typically shrink very much during the curing process. This shrinkage, combined with later through hole drilling and metal plating processes, can cause considerable stresses to enter the overall structure, causing damage or unreliable inter-layers between the circuit layers in combination and/or other thermal processes. Connect or bond. Accordingly, there is a need for a material and associated process that compensates for such shrinkage and provides an unstressed and reliable electronic interconnect between the pairs of circuit layers.

Moreover, the plating of the vias (or channels) with copper material requires an additional, expensive, and time consuming process sequence that is more difficult to perform with a quick transition. Accordingly, it would be desirable to provide a printed circuit board and method of making same that can be quickly and easily combined during a combined process and/or to ensure interconnects (or vias or microchannels) on the printed circuit board. The alignment is reduced to reduce the cost of the combination. Furthermore, there is a need to provide a multilayer printed circuit board with additional functionality and a method of making the same.

Summary of invention

Embodiments of the present invention are directed to add-ons of stacked microchannel laminated printed circuit boards formed in one or two lamination cycles in a parallel process, and/or they may have carrier-to-carrier, second-order The (secondary assembly to sub-assembly) attachments and the like are provided with conductive channels and the like, each of which is filled with a conductive material (for example, a conductive paste) along the Z-axis.

One embodiment of the present invention provides a method of fabricating at least a portion of a printed circuit board. The method includes attaching the plurality of sub-assemblies to each other after processing at least one of the plurality of sub-assemblies. Each of the sub-assemblies includes a plurality of circuit layers, and the processing of the at least one of the sub-assemblies includes: forming at least one hole having a first diameter and a first depth from the at least one of the sub-assemblies Forming a first side into the at least one subassembly; forming at least one counterbore at the at least one hole having a second diameter greater than the first diameter, and a second depth shorter than the first depth Entering the at least one sub-assembly from the first side of the at least one of the sub-assemblies; performing a metallization step of the at least one hole and the at least one counterbore to metallize the at least one hole and the at least one a counterbore; applying a layer of adhesive to the first side of the at least one subassembly; applying a protective film to the laminating adhesive; forming at least one channel into the laminating adhesive to expose the at least one a metallization portion of a counterbore; filling at least one conductive paste into the at least one channel formed in the layered adhesive; and removing the protective film to expose the layer on the at least one sub-assembly Adhesives are attached to the other sub-assemblies.

In one embodiment, the metallization of the at least one hole and the at least one counterbore includes electroplating the at least one hole and the at least one counterbore to plate the at least one hole and the at least one counterbore. Electroplating of the at least one hole and the at least one counterbore may include electrolytic copper plating the at least one hole and the at least one counterbore, and plating the at least one hole and the at least one counterbore with copper.

In an embodiment, the attaching of the sub-assemblies includes: aligning the sub-assemblies with each other; and curing the laminating adhesive on the at least one sub-assembly such that the plurality of sub-assemblies are layer-by-layer Hehe.

In one embodiment, the at least one sub-assembly comprises a substrate, at least one foil pad on the substrate, and a prepreg on the substrate and covering the at least one foil pad, wherein the at least one hole Forming includes drilling the at least one hole at a location corresponding to the at least one foil pad, and wherein forming the at least one counterbore comprises drilling the at least one counterbore at a location corresponding to the at least one foil pad. In one embodiment, the drilling of the at least one hole includes completely drilling the at least one hole through the prepreg and the at least one foil pad, and the drilling of the at least one counterbore comprises at least a portion The at least one counterbore is drilled through the prepreg and only partially through the at least one foil pad. In one embodiment, the at least one hole is drilled to at least partially pass through the prepreg, the at least one foil pad, and the substrate to drill the at least one hole, and the at least one counterbore The drilling includes drilling the at least one counterbore at least partially through the prepreg.

In an embodiment, before the drilling of the at least one hole, the method further comprises: laminating a solid metal foil layer on one side of the at least one sub-assembly as one of the outermost layers of the at least one sub-assembly And selectively removing a portion of the solid metal foil layer to form a clearance at a location corresponding to the at least one aperture and the at least one counterbore. The forming of the at least one hole may include drilling the at least one hole at the clearance, and the forming of the at least one counterbore may include drilling the at least one counterbore at the clearance. Selectively removing a portion of the solid metal foil layer to form the clearance may include selectively removing the portion of the solid metal foil layer to form the clearance such that the third diameter is substantially the same as the second diameter .

In an embodiment, the method further includes: forming at least one other hole having substantially the first diameter and the first depth entering the at least another sub-assembly from at least one of the second sides of the other of the sub-assemblies Forming at least another counterbore at the at least one other aperture having substantially the second diameter and the second depth entering the at least another subassembly from the second side of the at least another subassembly And performing a metallization step of the at least one other aperture and the at least one counterbore to metallize the at least one other aperture and the at least one counterbore. The attaching of the plurality of sub-assemblies may include: aligning the at least one counterbore and the at least one counterbore to face each other and electrically coupled via the at least one channel filling the conductive paste; and The layered adhesive on the at least one sub-assembly is cured to laminate the at least one sub-assembly to the at least another sub-assembly.

In one embodiment, the first diameter is about 6 mils (mil = one thousandth of a mile) and the second diameter is about 10 mils.

In one embodiment, the at least one counterbore is formed by a laser bore, and the at least one bore is formed by mechanical drilling. The at least one channel can be formed by laser drilling.

In one embodiment, the at least one counterbore is formed by a borehole, the at least one bore is formed by a borehole, and the at least one passage is formed by a borehole.

Another embodiment of the present invention provides a method of fabricating at least a portion of a printed circuit board. The method includes attaching the plurality of sub-assemblies to each other after processing the at least one of the sub-assemblies. Each of the sub-assemblies includes a plurality of circuit layers, and the processing of the at least one sub-assembly includes: forming at least one countersunk from the first side of the at least one sub-assembly into the at least one sub-assembly The hole has a first diameter and a first depth; at the first at least one counterbore, the first side of the at least one sub-assembly enters the at least one sub-assembly to form at least one hole having a second diameter smaller than The first diameter and the second depth are longer than the first depth; performing a metallization step of the at least one hole and the at least one counterbore to metallize the at least one hole and the at least one counterbore; applying a layer Adhesive on the first side of the at least one sub-assembly; applying a protective film to the laminating adhesive; forming at least one channel in the laminating adhesive to expose one of the at least one counterbore Filling at least one conductive paste in the at least one channel formed in the layered adhesive; and removing the protective film to expose the layered adhesive on the at least one sub-assembly for use with other The secondary assembly is attached.

Another embodiment of the present invention provides a printed circuit board including a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one counterbore and at least one hole, the at least one counterbore Having a first diameter and a first depth into the at least one sub-assembly from a first side of the at least one sub-assembly, the at least one aperture having a second diameter less than the first diameter and a second depth Longer than the first depth entering the at least one sub-assembly from the first side of the at least one sub-assembly at the at least one counterbore; a metal being metallized to the at least one hole and the at least one sink a plurality of laminating adhesives, each of the laminating adhesives being between a sub-assembly and a corresponding sub-assembly, and having at least one passage formed therethrough; and a mating The paste is filled in the at least one channel, wherein the sub-assemblies are electrically coupled to each other via the at least one microchannel of the adhesive layers and the at least one counterbore and the at least one hole of the sub-assemblies Pick up.

In one embodiment, the metal in the at least one hole is firmly anchored to the at least one hole with metal in the at least one counterbore.

In one embodiment, the at least one counterbore is configured to oppose at least one other counterbore of at least one other subassembly and to increase a contact surface area.

Simple illustration

The drawings are to be construed as illustrative of the embodiments of the invention

The patent or application file contains at least one color drawn drawing. A copy of this patent or patent application publication with a color schema will be provided by the Patent Office upon request and payment of the required fee.

1A, 1B, and 1C illustrate a detailed process that allows one assembly to be prepared in accordance with one embodiment of the present invention.

Figure 2 illustrates the joining of three sub-assemblies in accordance with one embodiment of the present invention.

Figure 3 is a detailed view of one of the ink contacts showing that the package is relatively "flat" in the secondary assembly of Figure 2.

4A and 4B illustrate a laser countersunk hole pattern of a package that is made "flat" in accordance with an embodiment of the present invention for attachment of the secondary assembly to the secondary assembly.

Detailed description of the preferred embodiment

In the following detailed description, only certain embodiments of the invention are shown and described As will be appreciated by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the invention. Accordingly, the drawings and description are to be considered as illustrative and not limiting.

In the context of the present application, when an element is referred to as being "on" another element, it may be directly on the other element or indirectly on the other element. There are multiple mediation components in between. In the present specification, the same reference numerals are used to refer to the same elements.

As contemplated, embodiments of the present invention provide a multilayer printed circuit board with additional functionality and a method of fabricating the same.

In more detail, stacked microchannels, etc., which are formed by laminating or laminating a single-sided laminate, have been disclosed, and are the subject of U.S. Patent No. 7,523,545, filed on Feb. 14, 2007. The same assignee of the present invention is assigned and the contents are hereby attached. Here, in one embodiment, a single-sided laminate will be coated with an adhesive, and the passage will be laser-generated through the adhesive to create and fill the ink. The different layers are made in parallel and stacked together for lamination. The second foil is imaged and etched in a printing and etching process. These layers and the like can be individually tested before stacking and lamination.

Conventional sequential lamination often requires that the secondary assemblies be laminated prior to the second lamination to attach the first assembly to the second assembly. The attachment of such sub-assembly to the sub-assembly can be accomplished in a manner similar to a plurality of single-sided materials, and if two or more sub-assemblies are attached in this manner, it is possible to construct a very high aspect ratio. The conductive path passes through the PCB for use as a probe card. The traditional sequential construction can also start from the middle with a structure such as 3+N+3 (3 sub-assemblies + N sub-assemblies + 3 sub-assemblies), which will be added from the center. Outer layer. A similar strategy can be performed with the single stack method.

The U.S. Patent No. 7,523,545, the disclosure of which is incorporated herein by reference. Herein, it has been found in the essence of the present invention that laminating a piece of prepreg to thicker copper will result in the primary assembly having the thick copper encapsulated by the prepreg, allowing the encapsulated conductor and a flat surface to be implemented. Stacking of single-layer cores.

It has also been discovered in the essence of the invention that more material types than FR4 and GPY materials can be used in the single layer parallel build process.

A large number of channels using plasma (Diconex) and chemical grinding are suitable for making such channels, especially in thinner structures or thinner layers that must be ground.

More specifically, the additional functionality of the parallel construction technique (parallel construction) in accordance with an embodiment of the present invention is as follows:

1. Incorporate 2 metal hierarchies into the parallel build

a. The single-sided ink core may be inverted and disposed on one side of the 2 metal level assembly, and on the opposite side, the single-sided core may be disposed in the opposite orientation when stacked.

b. The secondary assembly can be made from a core or a plurality of cores that are secured together with a prepreg or a composition having an adhesive or the like.

c. The secondary assembly may have plated through holes or the like which may be filled with a conductive or non-conductive hole-filling material.

d. The secondary assembly can be a mixture of single and double layer composites constructed in parallel.

2. Incorporate a 1 metal hierarchy into the parallel build

a. The secondary assembly can be made from one core or from a plurality of cores that are secured together with a prepreg or a composition having an adhesive or the like.

b. The secondary assembly may have plated through holes or the like which may be filled with a conductive or non-conductive hole-filling material.

c. The secondary assembly can be a mixture of single and double layer composites constructed in parallel.

d. The secondary assembly may use a conventional printed through hole (PTH) or a metal (or copper) wrap having a counterbore, as described in more detail in the post printed through hole (PTH).

3. Attach the prepreg to the thick copper to create a flat single-sided sub-assembly.

4. Expand the allowable material table to include all materials currently used to build the PCB.

5. Expand the allowable release material list to include release coated paper.

6. Channels can be made by plasma or chemical grinding or other suitable means of making such channels.

Embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings. As those skilled in the art will appreciate, the described embodiments may be modified in various suitable ways without departing from the spirit or scope of the invention.

1A, 1B, and 1C illustrate a detail to allow a single assembly to be prepared for a process. Here, the subassembly will be made relatively "flat" for a combination of several substructures. A related art for making a relatively flat circuit board or a sub-assembly of the circuit board is disclosed in U.S. Patent Application Serial No. 12/157,021, filed on Jun. 5, 2008, assigned to The same assignee, and its contents are included here.

More specifically, a method of fabricating at least a portion of a printed circuit board using a lamination process sequence in which a plurality of sub-assemblies are attached to each other in accordance with an embodiment of the present invention will be referred to FIGS. 1A, 1B, and 1C. Figure to illustrate.

As shown in Figure 1A, a first assembly 100 will be processed. The first assembly 100 includes a plurality of circuit layers. Here, in FIG. 1A, one or more holes 110 and the like each having a first diameter and a first depth are formed by one of the first sides 120 of the first subassembly 100. Here, the holes 110 are formed by mechanical drilling, but the invention is not limited thereby. Furthermore, as shown in FIG. 1A, one or more counterbore holes 130 and the like may be formed, each having a second diameter greater than the first diameter, and a second depth being defined by the first subassembly 100. The first side 120 is shorter than the first depth. In one embodiment, the first diameter is about 6 mils (mils) and the second diameter is about 10 mils. Here, as also shown in FIG. 1A, a counterbore 130 is formed at a position corresponding to a corresponding hole 110. Further, although it is shown in Fig. 1A that the counterbore holes 130 are formed after the holes 100 are formed, the present invention is not limited thereby. That is, in another embodiment of the invention, the counterbore holes 130 may be formed prior to the formation of the holes 100.

In FIG. 1B, the holes 110 and counterbore holes 130 are metallized with a metallic material 140. In this regard, in one embodiment, the holes 110 and counterbore holes 130 are metallized by electrolytically plating the holes 110 and counterbore holes 130 to plate the holes 110 and counterbore holes 130 by electroplating. Electrolytic plating of the holes 110 and counterbore holes 130 may include electrolytic copper to plate the holes 110 and counterbore holes 130, and the holes and counterbore holes are closed by copper plating.

Moreover, as shown in FIG. 1B, a solid metal foil layer 150 is previously laminated on the first side 120 of the first subassembly 100 as the outermost layer of the first subassembly, and is etched. Or flattened and removed by the first side 120 of the first subassembly 100. A layer of adhesive (viscous film) 170 嗣 will be applied to the first side 120 of the first assembly 100. A protective film (release film) will be applied to the layered adhesive.

Here, the protective film (or Mylar sheet) is shown to be attached to the laminated adhesive (or prepreg or adhesive layer) 170 interposed between the protective film and the first sub-assembly 100. The assembly. However, the protective film of the present invention is not limited to Mylar (polyester film) sheets, but may be made of any suitable material such as polyester, oriented polypropylene, polyvinyl fluoride, polyethylene, high density polyethylene, polynaphthene. , pacothane R , polymethylpentene, or a compound thereof. Also, in FIG. 1C, one or more channels 160 may be formed in the viscous adhesive 170, and the positions correspond to the counterbore holes 130 and the holes 110, respectively. Here, in FIG. 1C, the channel (or microchannel) 160 is formed by laser drilling. However, the invention is not thus limited.

Further, as shown in Fig. 1C, a conductive paste (conductive ink) is filled in the via 160 formed in the viscous adhesive 170.

Finally, as shown in Figures 1C, 2 and 3, the final printed circuit board (or a final sub-assembly) 200 will be removed by stacking the protective film (see Figure 1C) for a second time. The assembly is formed by a 100' laminate (see Figures 2 and 3). That is, as shown in Figures 2 and 3, the second assembly 100' is disposed such that the adhesive layer 170 is interposed between the two sub-assemblies 100 and 100' and then cured. The final printed circuit board 200 is formed (see Figure 2). Here, the final printed circuit board 200 is formed such that the respective channels 160 are also positioned corresponding to a plurality of copper foil pads (ie, etched conductors shown in FIG. 1A) located in the first sub-assembly 100. At least one of 180. Moreover, in one embodiment, the second subassembly 100' is formed in a manner substantially similar to that used to form the first subassembly 100.

Here, the printed circuit board 200 shown in FIG. 2 includes a plurality of circuit layers. The conductive paste in the channels 160 and the metal material 140 in the counterbore holes 130 and the holes 110 electrically connect the plurality of copper foil pads 180 located in the first assembly 100 to the second time. A plurality of copper foil pads (eg, etched conductors) in the assembly 100'.

Accordingly, a printed circuit board having Z-axis interconnects (e.g., such holes 110, counterbore holes 130, and/or microchannels 160) is provided that eliminates the need for a microchannel-plated And/or eliminating the need to flatten a plated protrusion on a surface, which can be made in one or two lamination cycles, and/or it can have a carrier-to-carrier (or sub-assembly) The attachment of the assembly has a conductive path or the like, each of which is filled with a conductive material (for example, a conductive paste) along the Z-axis.

Moreover, in one embodiment, the metal material (or metal) 140 in the at least one hole 110 is secured to the at least one hole 110 by a metal material (or metal) 140 in a corresponding counterbore hole 130. Anchored.

In an embodiment, and as shown in FIG. 3, the counterbore 130 of the first subassembly 100 is configured to be opposite the other counterbore of the second subassembly 100' and Increase a contact surface area.

In an embodiment, the first and second sub-assemblies 100 and 100' are attached as follows: the first and second sub-assemblies 100 and 100' are aligned with each other; and the first assembly is cured The layered adhesive 170 on 100 is such that the first and second sub-assemblies 100 and 100' are laminated to each other.

That is, in view of the above, the attachment of the plurality of sub-assemblies may include: aligning at least one counterbore 130 and at least another counterbore 130 to face each other and filling the conductive paste via at least one The channels 160 are electrically coupled to each other; and the layered adhesive 170 is cured on at least one of the sub-assemblies (eg, the first assembly 100) to laminate the at least one sub-assembly to another sub-assembly ( For example, the second assembly 100').

In one embodiment, each of the sub-assemblies forming the circuit board 200 includes a substrate, at least one foil pad (or copper foil pad) on the substrate, and a prepreg on the substrate. And covering at least one foil pad, wherein at least one of the holes 110 is formed by drilling the at least one hole so that its position corresponds to the at least one foil pad, and at least one of the counterbore holes is at least drilled A counterbore is formed such that its position corresponds to the at least one foil pad. In one embodiment, the drilling of the at least one hole 110 includes drilling the at least one hole 110 completely through the prepreg and the at least one foil pad, and the drilling of the at least one counterbore 130 includes at least The at least one counterbore 130 is drilled partially through the at least one foil pad. In one embodiment, the drilling of the at least one hole 110 includes at least partially penetrating the prepreg, the at least one foil pad, and the substrate to drill the at least one hole 110, and the at least one counterbore The drilling of 130 includes drilling the at least one counterbore 130 at least partially through the prepreg.

As shown, Figure 2 represents that the three sub-assemblies are connected together as previously described, i.e., attached at the PTH with ink contacts. Figure 3 is a detailed view of the ink contacts showing that the packages on the secondary assembly are each relatively "flat". 4A and 4B illustrate a laser countersunk hole pattern of one of the packages that is made "flat" for the secondary assembly to be attached to the secondary assembly.

Here, in the drawings 1A, 1B and 1C, the counterbore according to an embodiment of the present invention is shown as being mechanically produced, but the present invention is not limited thereby. In another embodiment, and referring to Figures 4A and 4B, for example, the counterbore may be formed by imaging an opening around the through hole and removing the surrounding material by laser. That is, as shown in FIGS. 4A and 4B, in an embodiment of the present invention, before the at least one hole 310 is drilled, the method further comprises: laminating a solid metal foil layer (foil) 300 at least On the first side of the sub-assembly, as the outermost layer of the at least one sub-assembly; and selectively removing a portion of the solid metal foil layer 300 in correspondence with the at least one hole 310 A clearance is formed with the position of at least one corresponding counterbore 330. The forming of the at least one hole 310 can include drilling the at least one hole 310 at the clearance, and the forming of the at least one counterbore hole 330 can include drilling the at least one counterbore hole 330 at the clearance. Selectively removing a portion of the solid metal foil layer 300 to form the clearance system can include removing the portion of the solid metal foil layer 300 to form the clearance and having a diameter substantially the same as the at least one Corresponding to the diameter of the counterbore 330. In case a CO 2 laser is used, the copper foil pad (or etched conductor) 180, such as shown in Figures 1A, 2 and 3, will block further penetration. It may be preferred to have a smaller diameter hole, a hole having a non-circular counterbore, and a thinner foil as the underlying pad. The examples in Figures 1A, 1B, 1C, 2 and 3 utilize 2 oz of copper, but they can be very thin or even thicker than 2 oz.

Referring to Figures 2 and 3, the three sub-assemblies can be prepared to each approximately 60 mils thick. The channel being drilled can be approximately 6 mils in diameter. The counterbore can be about 10 mils in diameter. The capture pad in each assembly or within can be about 10 mils. The opposing pads in the stack can be about 12 mils in diameter. Each assembly having one or more printed through holes (PTH) may have an aspect ratio of about 10:1. These shapes can be made for each assembly. If three sub-assemblies are attached to create a plate that is approximately 180 mils thick, the overall aspect ratio is approximately 30:1. Especially in a hole of about 6 mils, it can be difficult to drill through through about 180 mils. That is, if the plate can be drilled, it can be very difficult to first metallize a seed layer on the inside of the hole and then plate the seed layer in a PTH process.

High aspect ratio pore systems are preferred and/or desirable in inexpensive test equipment such as probes and carrier cards. These small diameter holes meet the spacing requirements of the tester. Its associated high-level numbers make these appliances very difficult to manufacture. A comparable process must be accurately drilled from the two surfaces and forced to pump electroless and electrolytic solution through the holes to prepare the PTH. This comparable method is subject to borehole misalignment and poor production capacity.

Looking at the above, and in accordance with embodiments of the present invention, the main advantages of using parallel construction techniques to construct a multilayer board are as follows:

1. The sequential component board will have several times more chances to discard the previous steps.

2. Parallel construction There are fewer steps to make a board and allow the board to be made several times faster.

3. The faster manufacture of the board improves the customer's learning cycle time when making prototypes.

4. Faster manufacturing time allows the board to be produced according to customer requirements, while fewer products are placed on the rack at the manufacturing, assembly and customer locations.

5. The entire process will produce less waste and higher quality than a sequential build process due to fewer steps, even if the same equipment and process are used to make the board.

6. The overall capacity of a board for a device group will increase.

7. It is possible to make a mixture of materials with other incompatible materials.

8. It is possible to incorporate a specific layer into the panel.

9. Using the countersink technology will create an abutment pad for the secondary assembly's ink assembly. The metal (or copper) encapsulation is flush with the resin/glass composite and can be prepared by a countersink technique, ie mechanical drilling with countersunk holes or a combined mechanical drilling and laser Spigot. This counterbored technique creates a more reliable sub-assembly with through-holes that create less bending stress in the layers that bury the sub-assembly with conventional electroplating techniques. In summary, the use of countersinking techniques as described above in accordance with an embodiment of the present invention can result in very high aspect ratio apertures and result in layer-to-layer circuit densities that are higher than conventionally produced.

While the present invention has been described in connection with the embodiments of the present invention, it is understood that the invention is not intended to And various amendments in its equivalent.

100‧‧‧ assemblies

100’‧‧‧second assembly

110,310‧‧‧ hole

120‧‧‧ first side

130‧‧‧ countersunk hole

140‧‧‧Metal materials

150‧‧‧Foil layer

160‧‧‧ channel

170‧‧‧Laminating adhesive

180‧‧‧ Copper foil pad

200‧‧‧Printed circuit board

300‧‧‧Foil

1A, 1B, and 1C illustrate a detailed process that allows one assembly to be prepared in accordance with one embodiment of the present invention.

Figure 2 illustrates the joining of three sub-assemblies in accordance with one embodiment of the present invention.

Figure 3 is a detailed view of one of the ink contacts showing that the package is relatively "flat" in the secondary assembly of Figure 2.

4A and 4B illustrate a laser countersunk hole pattern of a package that is made "flat" in accordance with an embodiment of the present invention for attachment of the secondary assembly to the secondary assembly.

100. . . Secondary assembly

100’. . . Second assembly

170. . . Laminated adhesive

180. . . Copper foil pad

200. . . A printed circuit board

Claims (17)

  1. A method of fabricating at least a portion of a printed circuit board, the method comprising: attaching a plurality of sub-assemblies to each other after processing at least one of the plurality of sub-assemblies, wherein the plurality of sub-assemblies are attached to each other Each of the sub-assemblies includes a plurality of circuit layers, and the step of processing at least one of the plurality of sub-assemblies includes: one of at least one of the plurality of sub-assemblies a first side forming at least one hole into at least one of the plurality of sub-assemblies, the at least one hole having a first diameter and a first depth; wherein the plurality of sub-assemblies The first side of the at least one sub-assembly forms at least one counterbore that enters at least one sub-assembly of the plurality of sub-assemblies and at the at least one hole, the at least one counterbore Having a second diameter greater than the first diameter and a second depth shorter than the first depth; performing a metallization step of the at least one hole and the at least one counterbore to metallize the at least one hole And the at least one counterbore; applying a layer of adhesive layer to the a first side of at least one of the plurality of sub-assemblies; applying a protective film to the layer of adhesive; forming at least one via that enters the layer of adhesive Exposing a metallized portion of the at least one counterbore; filling at least one conductive paste into the at least one channel formed in the layer of adhesive; and The protective film is removed to expose the layer of adhesive on at least one of the plurality of sub-assemblies for attachment to other sub-assemblies of the plurality of sub-assemblies.
  2. The method of claim 1, wherein the step of metallizing the at least one hole and the at least one counterbore comprises: electroplating the at least one hole and the at least one counterbore to plate the at least one hole And the at least one counterbore.
  3. The method of claim 2, wherein the step of electrolytically plating the at least one hole and the at least one counterbore comprises: electrolyzing copper to plate the at least one hole and the at least one counterbore, and plating with copper The at least one hole and the at least one counterbore are closed.
  4. The method of claim 1, wherein the step of attaching the plurality of sub-assemblies comprises: aligning the sub-assemblies with each other; and curing at least one of the plurality of sub-assemblies The layer of adhesive is laminated to laminate the plurality of sub-assemblies with each other.
  5. The method of claim 1, wherein at least one of the plurality of sub-assemblies comprises a substrate, at least one foil pad on the substrate, and overlying the substrate a prepreg of at least one foil pad; wherein the step of forming the at least one hole comprises: drilling the at least one hole at a position corresponding to the at least one foil pad; and wherein the at least one counterbore is formed The step includes: drilling the at least one counterbore at a location corresponding to the at least one foil pad.
  6. The method of claim 5, wherein the at least one hole is drilled The step includes: drilling the at least one hole completely through the prepreg and the at least one foil pad; and wherein the step of drilling the at least one counterbore comprises: at least partially passing through the prepreg, and The at least one counterbore is drilled only partially through the at least one foil pad.
  7. The method of claim 5, wherein the step of drilling the at least one hole comprises: drilling the at least one hole at least partially through the prepreg, the at least one foil pad, and the substrate; The step of drilling the at least one counterbore includes: drilling the at least one counterbore at least partially through the prepreg.
  8. The method of claim 1, wherein before the step of drilling the at least one hole, the method further comprises: laminating a solid metal foil layer in at least one of the plurality of sub-assemblies On the first side, as an outermost layer of at least one of the plurality of sub-assemblies; and selectively removing a portion of the solid metal foil layer to correspond to the at least one The hole and the position of the at least one counterbore form a clearance.
  9. The method of claim 8, wherein the forming the at least one hole comprises: drilling the at least one hole in the clearance; and wherein the step of forming the at least one counterbore comprises: at the clearance The at least one counterbore is drilled.
  10. The method of claim 9, wherein the step of selectively removing the portion of the solid metal foil layer to form the clearance comprises: selectively removing the portion of the solid metal foil layer to form the The gap is such that it has a third diameter that is substantially the same as the second diameter.
  11. The method of claim 1, further comprising: forming a second side of at least another of the plurality of sub-assemblies, forming at least one of the plurality of sub-assemblies At least another aperture of the secondary assembly, the at least one other aperture having substantially the first diameter and the first depth; formed by the second side of at least another of the plurality of secondary assemblies Entering at least another sub-assembly of the plurality of sub-assemblies and at least another counterbore at the at least one other hole, the at least another counterbore having substantially the second diameter and the a second depth; and a metallization step of the at least one other aperture and the at least another counterbore to metallize the at least one other aperture and the at least one counterbore.
  12. The method of claim 11, wherein the step of attaching the sub-assemblies comprises: aligning the at least one counterbore with the at least one counterbore to make it relatively and via filling the conductive paste The at least one channel is electrically coupled to each other; and the layered adhesive layer on at least one of the plurality of sub-assemblies is cured to at least one of the plurality of sub-assemblies Layered into at least another sub-assembly of the plurality of sub-assemblies.
  13. The method of claim 1, wherein the first diameter is about 6 mils and the second diameter is about 10 mils.
  14. The method of claim 1, wherein the at least one counterbore is formed by laser drilling, and wherein the at least one hole is formed by mechanical drilling.
  15. The method of claim 14, wherein the at least one channel is formed by laser drilling.
  16. The method of claim 1, wherein the at least one counterbore is formed by drilling, wherein the at least one hole is formed by drilling, and wherein the at least one channel is formed by drilling.
  17. A method of fabricating at least a portion of a printed circuit board, the method comprising: attaching a plurality of sub-assemblies to each other after processing at least one of the plurality of sub-assemblies, wherein the plurality of sub-assemblies are attached to each other Each of the sub-assemblies includes a plurality of circuit layers, and the step of processing at least one of the plurality of sub-assemblies includes: one of at least one of the plurality of sub-assemblies a first side forming at least one counterbore that enters at least one of the plurality of sub-assemblies, the at least one counterbore having a first diameter and a first depth; The first side of the at least one sub-assembly of the sub-assembly forms at least one hole into the at least one sub-assembly of the plurality of sub-assemblies and at the at least one counterbore, the at least a hole having a second diameter smaller than the first diameter and a second depth longer than the first depth; performing a metallization step of the at least one hole and the at least one counterbore to metallize the at least one a hole and the at least one counterbore; applying a layer of adhesive layer to On the other side of the first plurality of times in the assembly of the at least one secondary assembly; Applying a protective film to the layer of adhesive layer; forming at least one channel into the layer of adhesive layer to expose a metallized portion of the at least one counterbore; filling at least one conductive paste into the system Forming in the at least one channel in the layer of adhesive layer; and removing the protective film to expose the layer of adhesive layer on at least one of the plurality of sub-assemblies for supply Attachment of other sub-assemblies in these majority sub-assemblies.
TW099104706A 2008-08-14 2010-02-12 Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards TWI463932B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200306770A (en) * 2002-02-22 2003-11-16 Fujikura Ltd Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method
CN101449630A (en) * 2006-04-19 2009-06-03 动态细节有限公司 Printed circuit boards with stacked micros vias

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200306770A (en) * 2002-02-22 2003-11-16 Fujikura Ltd Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method
CN101449630A (en) * 2006-04-19 2009-06-03 动态细节有限公司 Printed circuit boards with stacked micros vias

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