TWI447748B - 晶片型阻抗器之製造方法 - Google Patents

晶片型阻抗器之製造方法 Download PDF

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Publication number
TWI447748B
TWI447748B TW094109785A TW94109785A TWI447748B TW I447748 B TWI447748 B TW I447748B TW 094109785 A TW094109785 A TW 094109785A TW 94109785 A TW94109785 A TW 94109785A TW I447748 B TWI447748 B TW I447748B
Authority
TW
Taiwan
Prior art keywords
wafer
groove
dividing
type resistor
dividing groove
Prior art date
Application number
TW094109785A
Other languages
English (en)
Chinese (zh)
Other versions
TW200537532A (en
Inventor
Hideshi Tohyama
Toshihide Yoshida
Hirokazu Kato
Satoru Higano
Original Assignee
Mitsubishi Materials Corp
Kamaya Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, Kamaya Electric Co Ltd filed Critical Mitsubishi Materials Corp
Publication of TW200537532A publication Critical patent/TW200537532A/zh
Application granted granted Critical
Publication of TWI447748B publication Critical patent/TWI447748B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
TW094109785A 2004-03-31 2005-03-29 晶片型阻抗器之製造方法 TWI447748B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004104384 2004-03-31
JP2005068394A JP2005317927A (ja) 2004-03-31 2005-03-11 チップ抵抗器

Publications (2)

Publication Number Publication Date
TW200537532A TW200537532A (en) 2005-11-16
TWI447748B true TWI447748B (zh) 2014-08-01

Family

ID=35064048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109785A TWI447748B (zh) 2004-03-31 2005-03-29 晶片型阻抗器之製造方法

Country Status (6)

Country Link
JP (1) JP2005317927A (ja)
KR (1) KR101016475B1 (ja)
CN (1) CN1977347B (ja)
HK (1) HK1105713A1 (ja)
TW (1) TWI447748B (ja)
WO (1) WO2005096323A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602738B2 (ja) * 2004-10-29 2010-12-22 太陽社電気株式会社 チップ抵抗器の製造方法
JP5242474B2 (ja) * 2009-03-24 2013-07-24 日本特殊陶業株式会社 多数個取りセラミック配線基板
JP2012009767A (ja) * 2009-11-27 2012-01-12 Kyocera Corp 多数個取り配線基板およびその製造方法、ならびに配線基板およびその製造方法
CN102394164B (zh) * 2011-07-11 2014-04-16 广东风华高新科技股份有限公司 一种小型片式电阻的制造方法
JP6144136B2 (ja) * 2013-07-17 2017-06-07 Koa株式会社 チップ抵抗器の製造方法
KR101538416B1 (ko) * 2015-02-25 2015-07-22 랄렉 일렉트로닉 코포레이션 칩 저항기 및 그 제작 방법
JP2017224677A (ja) * 2016-06-14 2017-12-21 Koa株式会社 チップ抵抗器およびその製造方法
CN106205911B (zh) * 2016-08-30 2020-01-21 肇庆鼎晟电子科技有限公司 一种防短路的热敏芯片及其制备方法
EP3418266A1 (de) * 2017-06-22 2018-12-26 Heraeus Deutschland GmbH & Co. KG Keramik-metall-substrat mit geringer amorpher phase
EP4212497A1 (en) * 2017-05-16 2023-07-19 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001167914A (ja) * 1999-12-08 2001-06-22 Rohm Co Ltd 絶縁基板の分割溝形状
JP2003086408A (ja) * 2001-09-11 2003-03-20 Mitsubishi Materials Corp チップ抵抗器の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931983B2 (ja) * 1977-06-17 1984-08-06 日本電気株式会社 半導体装置の製造方法
JPS57183092A (en) * 1981-05-06 1982-11-11 Nippon Carbide Kogyo Kk Sintered board capable of being readily separated
JPS5830118A (ja) * 1981-08-14 1983-02-22 ティーディーケイ株式会社 電子部品、その製造方法及び製造装置
JP3800795B2 (ja) * 1998-02-23 2006-07-26 富士ゼロックス株式会社 レーザ加工条件自動設定方法およびレーザ加工条件自動設定装置
JP2002313613A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd チップ電子部品の製造方法
JP2004276386A (ja) * 2003-03-14 2004-10-07 Koa Corp 分割用セラミック基板およびその製造方法
JP4227821B2 (ja) * 2003-03-24 2009-02-18 コーア株式会社 チップ抵抗器の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001167914A (ja) * 1999-12-08 2001-06-22 Rohm Co Ltd 絶縁基板の分割溝形状
JP2003086408A (ja) * 2001-09-11 2003-03-20 Mitsubishi Materials Corp チップ抵抗器の製造方法

Also Published As

Publication number Publication date
KR20070024506A (ko) 2007-03-02
CN1977347B (zh) 2010-11-03
HK1105713A1 (en) 2008-02-22
CN1977347A (zh) 2007-06-06
KR101016475B1 (ko) 2011-02-24
TW200537532A (en) 2005-11-16
JP2005317927A (ja) 2005-11-10
WO2005096323A1 (ja) 2005-10-13

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