TWI446984B - Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus - Google Patents

Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus Download PDF

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Publication number
TWI446984B
TWI446984B TW100111704A TW100111704A TWI446984B TW I446984 B TWI446984 B TW I446984B TW 100111704 A TW100111704 A TW 100111704A TW 100111704 A TW100111704 A TW 100111704A TW I446984 B TWI446984 B TW I446984B
Authority
TW
Taiwan
Prior art keywords
workpiece
method
processing apparatus
dividing
laser processing
Prior art date
Application number
TW100111704A
Other versions
TW201210727A (en
Inventor
Shohei Nagatomo
Ikuyoshi Nakatani
Mitsuru Sugata
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010146249A priority Critical patent/JP5104912B2/en
Priority to JP2010146248A priority patent/JP5104911B2/en
Priority to JP2010146247A priority patent/JP5104910B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201210727A publication Critical patent/TW201210727A/en
Application granted granted Critical
Publication of TWI446984B publication Critical patent/TWI446984B/en

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TW100111704A 2010-06-28 2011-04-01 Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus TWI446984B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010146249A JP5104912B2 (en) 2010-06-28 2010-06-28 The laser processing apparatus
JP2010146248A JP5104911B2 (en) 2010-06-28 2010-06-28 Method for processing a workpiece, the division method and laser processing apparatus of the workpiece
JP2010146247A JP5104910B2 (en) 2010-06-28 2010-06-28 The method of division processing method and workpiece of the workpiece

Publications (2)

Publication Number Publication Date
TW201210727A TW201210727A (en) 2012-03-16
TWI446984B true TWI446984B (en) 2014-08-01

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ID=45355351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100111704A TWI446984B (en) 2010-06-28 2011-04-01 Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus

Country Status (2)

Country Link
CN (1) CN102294546B (en)
TW (1) TWI446984B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6064519B2 (en) * 2012-10-29 2017-01-25 三星ダイヤモンド工業株式会社 Laser machining apparatus, and machining condition setting method of the patterned substrate
JP6036173B2 (en) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 The laser processing apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101073145A (en) * 2004-12-08 2007-11-14 雷射先进科技株式会社 Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam
TW200806594A (en) * 2006-07-14 2008-02-01 Jenoptik Automatisierungstech Method for generating optically perceptible laser-induced cracks in brittle material
US20080217301A1 (en) * 2007-03-06 2008-09-11 Disco Corporation Laser beam processing machine
JP2009056474A (en) * 2007-08-30 2009-03-19 Sumitomo Heavy Ind Ltd Laser beam machining apparatus and machining method
CN100471609C (en) * 2000-09-13 2009-03-25 浜松光子学株式会社 Manufacturing objects cutting method
CN101461039A (en) * 2006-07-03 2009-06-17 浜松光子学株式会社 Laser material processing method
TWI321828B (en) * 2003-09-10 2010-03-11 Hamamatsu Photonics Kk Manufacturing method of a semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100471609C (en) * 2000-09-13 2009-03-25 浜松光子学株式会社 Manufacturing objects cutting method
TWI321828B (en) * 2003-09-10 2010-03-11 Hamamatsu Photonics Kk Manufacturing method of a semiconductor device
CN101073145A (en) * 2004-12-08 2007-11-14 雷射先进科技株式会社 Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam
CN101461039A (en) * 2006-07-03 2009-06-17 浜松光子学株式会社 Laser material processing method
TW200806594A (en) * 2006-07-14 2008-02-01 Jenoptik Automatisierungstech Method for generating optically perceptible laser-induced cracks in brittle material
US20080217301A1 (en) * 2007-03-06 2008-09-11 Disco Corporation Laser beam processing machine
JP2009056474A (en) * 2007-08-30 2009-03-19 Sumitomo Heavy Ind Ltd Laser beam machining apparatus and machining method

Also Published As

Publication number Publication date
TW201210727A (en) 2012-03-16
CN102294546A (en) 2011-12-28
CN102294546B (en) 2015-02-25

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