TWI435144B - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
TWI435144B
TWI435144B TW99111206A TW99111206A TWI435144B TW I435144 B TWI435144 B TW I435144B TW 99111206 A TW99111206 A TW 99111206A TW 99111206 A TW99111206 A TW 99111206A TW I435144 B TWI435144 B TW I435144B
Authority
TW
Taiwan
Prior art keywords
light
heat
backlight module
heat sink
emitting
Prior art date
Application number
TW99111206A
Other languages
Chinese (zh)
Other versions
TW201135326A (en
Inventor
Hung Chih Lin
Yi Wen Lin
Original Assignee
Young Lighting Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Young Lighting Technology Corp filed Critical Young Lighting Technology Corp
Priority to TW99111206A priority Critical patent/TWI435144B/en
Publication of TW201135326A publication Critical patent/TW201135326A/en
Application granted granted Critical
Publication of TWI435144B publication Critical patent/TWI435144B/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package

Description

Backlight module

The invention relates to a backlight module.

9 is a schematic view showing a conventional backlight module. As shown in FIG. 9 , the backlight module 100 includes a back plate 102 , a light emitting diode light strip 104 , a light guide plate 106 , and a reflective sheet 110 . The LED strip 104 is disposed on one side of the light guide plate 106 to form a backlight module 100 that emits light on one side. The single-sided illumination backlight module 100 can greatly reduce the number of LEDs used, but relatively high brightness and power are required for each LED, so it is easy to generate excessive waste heat, heat concentration and is difficult to be generated at the light source. The problem of dissipation causes uneven brightness, and the optical structure in the backlight module is easily deformed by heat, resulting in poor overall optical performance.

Therefore, some conventional designs have been proposed to solve this problem. For example, Taiwan Patent Publication No. TWM325447 discloses a design of a light-emitting diode heat dissipation module using a heat pipe to improve heat dissipation efficiency. In addition, Taiwan Patent Publication No. TW546491 discloses a backlight module design using a heat pipe to improve heat dissipation efficiency.

The invention provides a backlight module, which has good thermal uniformity, heat dissipation efficiency and structural strength.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In an embodiment of the present invention, a backlight module includes a light guide plate, a back plate, a heat sink, a light emitting component, and at least one high efficiency heat dissipation. conductor. The light guide plate has a light incident surface, and the back plate is disposed on a bottom side of the light guide plate. The heat dissipating member is disposed adjacent to the light incident surface, the heat dissipating member has a bottom portion and a side portion, and the bottom portion is at an angle with the side portion. The light-emitting element is disposed on one side of the heat-dissipating surface of the light guide plate, and the high-efficiency heat-dissipating conductor is disposed between the heat-dissipating member and the back plate and respectively contacts the heat-dissipating member and the back plate.

In one embodiment, the light-emitting element is a light-emitting diode light strip, and the light-emitting diode light strip is attached to the side of the heat sink and includes a plurality of top-emitting light-emitting diodes.

In one embodiment, the light-emitting element is a light-emitting diode light strip, and the light-emitting diode light strip is attached to the bottom of the heat sink and includes a plurality of side-emitting light-emitting diodes.

In one embodiment, the heat sink has a T-shaped or L-shaped cross-sectional shape.

In one embodiment, one end of the high efficiency heat dissipating conductor contacts the bottom of the heat sink and the other end extends away from the light emitting element, and the high efficiency heat dissipating conductor is interspersed in a plurality of different regions on the backplane.

In one embodiment, the high efficiency heat dissipating conductor is a heat pipe, a hot column, or a heat spreader.

Another embodiment of the present invention provides a backlight module including a light guide plate, a back plate, a heat sink, a light emitting element, and at least one high efficiency heat dissipation conductor. The light guide plate has a light incident surface, and the back plate is disposed on a bottom side of the light guide plate. The heat dissipating member is disposed adjacent to the light incident surface and attached to the back plate. The heat dissipating member has a bottom portion and a side portion, and the bottom portion is at an angle with the side portion. The light-emitting element is disposed on one side of the heat-dissipating surface of the light guide plate, and the high-efficiency heat-dissipating conductor is disposed on the back plate. One end of the high-efficiency heat-dissipating conductor overlaps the heat sink and the other end extends away from the light-emitting element.

In summary, the backlight module of the embodiment of the present invention has at least one of the following advantages: because the high-efficiency heat-dissipating conductor contacts the heat-dissipating member and the back plate at the same time, the end of the high-efficiency heat-dissipating conductor contacting the heat-dissipating member can quickly absorb the waste heat and transmit to the heat. The other end of the backplane is contacted, and a plurality of high-efficiency heat-dissipating conductors can be dispersed in different directions on the entire surface of the backplane in a direction away from the light-emitting elements, so that the problem of concentrated heat accumulation of the backlight module of the single-side illumination can be effectively solved. The high heat of the single-side illumination can be effectively transmitted to the cold region of the back panel and uniformly dispersed, thereby effectively improving the thermal uniformity of the backlight module as a whole, and improving the structure of the backlight module due to uneven heating. Furthermore, the heat dissipating member is formed by a reinforcing rib structure at the bottom and the side of the clip, which can improve the strength of the mechanism, improve the thermal deformation and reduce the total thickness after assembly, and can increase the heat dissipation and heat conduction performance of the LED strip. In addition, the bottom portion and the side portion of the heat dissipating member may be perpendicular to each other to form a T-shaped cross-sectional shape or an L-shaped cross-sectional shape, because the LED strip can be locked to the T-shaped or L-shaped according to actual needs. The horizontal wall or the vertical wall of the cross section allows the light emitting diodes of different light directions to be applied.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

1 is an exploded perspective view of a backlight module according to an embodiment of the present invention, and FIG. 2 is an enlarged partial cross-sectional view of the backlight module of FIG. Referring to FIG. 1 and FIG. 2 , the backlight module 10 includes a light guide plate 12 , a back plate 14 , a heat sink 16 , a light emitting component 18 , at least one high efficiency heat dissipation conductor 22 , and a reflective sheet 24 . The light guide plate 12 has a light incident surface 12a. The back plate 14 is disposed on a bottom side of the light guide plate 12, and the heat dissipation member 16 is disposed at a position adjacent to the light incident surface 12a of the light guide plate 12. The heat sink 16 has a bottom portion 16a and a side portion 16b, and the bottom portion 16a is at an angle to the side portion 16b. The light-emitting element 18 is disposed on one side of the heat-dissipating member 16 on the light guide plate 12, and the high-efficiency heat-dissipating conductor 22 is disposed between the heat sink 16 and the back plate 14, and respectively contacts the heat sink 16 and the back plate 14. The light-emitting element 16 can be, for example, a LED light bar, and the high-efficiency heat-dissipating conductor 22 is, for example, a heat pipe, a heat column, or a vapor chamber. Wait. 3 shows the distribution of the high efficiency heat dissipating conductor 22 on the backing plate 14. In one embodiment, one end of the high efficiency heat dissipating conductor 22 contacts the bottom portion 16a of the heat sink 16, and the other end extends away from the light emitting element 18. Referring to FIG. 2 and FIG. 3 simultaneously, after the waste heat generated by the light-emitting element 18 is transmitted to the heat sink 16, the high-efficiency heat-dissipating conductor 22 contacts the heat-dissipating member 16 and the back plate 14 at the same time, and the high-efficiency heat-dissipating conductor 22 contacts one end of the heat-dissipating member 16. The waste heat can be quickly absorbed and transmitted to the other end of the contact back plate 14, and the plurality of high-efficiency heat-dissipating conductors 22 can be spread in different directions on the entire surface of the back plate 14 in a direction away from the light-emitting element 18 as shown in FIG. The problem of concentrated heat accumulation of the backlight module of the single-sided illumination can be solved, and the high heat of the single-side illumination can be effectively transmitted to the cold zone of the backboard 14 and evenly dispersed, thereby greatly improving the thermal uniformity of the backlight module 10 as a whole. The structure in the backlight module 10 is prevented from being thermally deformed due to uneven heating. The heat dissipating component 16 and the high-efficiency heat dissipating conductor 22 can be respectively fixed on the backlight module 10, or as shown in FIG. 4, the heat dissipating component 16 and the high-efficiency heat dissipating conductor 22 can be combined to form an integrated heat dissipating module before assembly. The heat dissipation module is then fixed on the backlight module 10.

Furthermore, the heat dissipating member 16 forms a reinforcing rib structure by the angled bottom portion 16a and the side portion 16b, which can improve the strength of the mechanism, improve the thermal deformation and reduce the total thickness after assembly, and can increase the heat dissipation of the LED strip. Thermal conductivity. In this embodiment, the bottom portion 16a and the side portion 16b of the heat dissipating member 16 may be perpendicular to each other to form a T-shaped cross-sectional shape (as shown in FIGS. 5A and 5B) or an L-shaped cross-sectional shape (FIG. 6). Shown). Since the light-emitting diode light bar can be locked to the horizontal wall or the vertical wall surface of the T-shaped or L-shaped cross section according to actual needs, the light-emitting diodes with different light-emitting directions can be applied. As shown in FIG. 5A, the light-emitting diode light bar can be attached to the side portion 16b of the heat sink 16 and includes a plurality of top-emitting light-emitting diodes 18a. Alternatively, as shown in FIG. 5B, the LED strip can be attached to the bottom portion 16a of the heat sink 16 and include a plurality of side-emitting LEDs 18b.

The inventor tested with a single-sided illumination backlight module. The test results show that the overall temperature difference of the conventional backlight module reaches about 32 ° C (= 59 ° C - 27 ° C), and the overall temperature difference of the backlight module of the above embodiment is about 18 ° C. (=47 ° C-29 ° C). It can be seen that the high-efficiency heat-dissipating conductor 22 can effectively conduct high heat at the light source to the low-temperature region of the backlight module to improve the temperature distribution uniformity of the backlight module, and can lower the temperature of the heat source of the backlight module by about 12 ° C, so Improve heat concentration and overheating.

FIG. 7 is an enlarged partial cross-sectional view of a backlight module according to another embodiment of the present invention. As shown in FIG. 7, the heat dissipating member 16 and the high-efficiency heat dissipating conductor 22 of the backlight module 30 are respectively located at two sides of the backing plate 14, and the heat dissipating member 16 is disposed at a position adjacent to the light-incident surface 12a of the light guide plate and attached to the backing plate 14 The heat sink 16 has a bottom portion 16a and a side portion 16b, and the bottom portion 16a is at an angle to the side portion 16b. The light-emitting element 18 is disposed on one side of the heat-dissipating member 16 on the light guide plate 12. The high-efficiency heat-dissipating conductor 22 is disposed on the back plate 14. One end of the high-efficiency heat-dissipating conductor 22 overlaps the heat-dissipating member 16 and the other end extends away from the light-emitting element 18, thereby transferring the waste heat of the light-emitting element 18 to the cold zone of the backboard 14. And evenly dispersed. In this embodiment, since the high-efficiency heat-dissipating conductor 22 is located on one side of the backing plate 14 instead of between the heat-dissipating member 16 and the backing plate 14, the contact surface of the high-efficiency heat-dissipating conductor 22 and the backing plate 14 can be increased to further improve heat dissipation efficiency. .

In addition, as shown in FIGS. 8A-8F, the manner in which the high-efficiency heat-dissipating conductors 22 are located on the backing plate 14 is not limited at all, and the high-efficiency heat-dissipating conductors 22 are dispersed in different regions on the backing plate 14 to obtain improved heat uniformity and heat dissipation efficiency. Effect.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

10, 30. . . Backlight module

12. . . Light guide

12a. . . Light guide plate

14. . . Backplane

16. . . Heat sink

16a. . . Heat sink bottom

16b. . . Heat sink side

18. . . Light-emitting element

18a. . . Top-emitting light-emitting diode

18b. . . Side-emitting type light-emitting diode

twenty two. . . High efficiency heat conductor

twenty four. . . A reflective sheet

100. . . Backlight module

102. . . Backplane

104. . . LED light bar

106. . . Light guide

110. . . A reflective sheet

1 is an exploded view of a backlight module according to an embodiment of the invention.

2 is an enlarged partial cross-sectional view of the backlight module of FIG. 1 after assembly.

FIG. 3 is a schematic view showing the distribution of a high-efficiency heat-dissipating conductor on a backboard.

4 is a schematic view of a heat dissipation module in which a heat sink and a high-efficiency heat-dissipating conductor are integrated.

FIG. 5A is a schematic view showing the arrangement of a light-emitting element according to an embodiment of the invention.

FIG. 5B is a schematic view showing the arrangement of a light emitting element according to another embodiment of the present invention.

6 is a schematic view of a heat sink according to another embodiment of the present invention.

FIG. 7 is an enlarged partial cross-sectional view of a backlight module according to another embodiment of the present invention.

8A-8F are schematic diagrams showing different distribution embodiments of high efficiency heat dissipating conductors on a backplane.

9 is a schematic view showing a conventional backlight module.

10. . . Backlight module

12. . . Light guide

12a. . . Light guide plate

14. . . Backplane

16. . . Heat sink

16a. . . Heat sink bottom

16b. . . Heat sink side

18. . . Light-emitting element

twenty two. . . High efficiency heat conductor

twenty four. . . A reflective sheet

Claims (7)

  1. A backlight module includes: a light guide plate having a light incident surface; a back plate disposed on a bottom side of the light guide plate; a heat sink member disposed adjacent to the light incident surface, the heat sink having a heat sink a bottom portion and a side portion, wherein the bottom portion is at an angle with the side portion; a light emitting element disposed on a side of the heat sink facing the light guide plate; and at least one high efficiency heat dissipation conductor, wherein the heat sink member is high The efficiency heat dissipating conductors are respectively located at two sides of the back board, and the high efficiency heat dissipating conductor contacts the back board and does not contact the heat dissipating member.
  2. The backlight module of claim 1, wherein the light-emitting element is a light-emitting diode light strip, the light-emitting diode light strip is attached to the side of the heat sink and comprises a plurality of top-emitting light-emitting diodes body.
  3. The backlight module of claim 1, wherein the light-emitting element is a light-emitting diode light strip, the light-emitting diode light strip is attached to the bottom of the heat sink and includes a plurality of side-emitting light-emitting diodes .
  4. The backlight module of claim 1, wherein the heat sink has a T-shaped or an L-shaped cross-sectional shape.
  5. The backlight module of claim 1, wherein one end of the high-efficiency heat-dissipating conductor contacts the bottom of the heat sink and the other end extends away from the light-emitting element.
  6. The backlight module of claim 1, wherein the high efficiency heat dissipation conductor is interspersed in a plurality of different regions of the backplane.
  7. The backlight module of claim 1, wherein the high efficiency heat dissipation conductor is a heat pipe, a heat column, or a heat spreader.
TW99111206A 2010-04-12 2010-04-12 Backlight module TWI435144B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99111206A TWI435144B (en) 2010-04-12 2010-04-12 Backlight module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99111206A TWI435144B (en) 2010-04-12 2010-04-12 Backlight module
US13/073,057 US8573811B2 (en) 2010-04-12 2011-03-28 Backlight module with heat dissipating element and heat sink

Publications (2)

Publication Number Publication Date
TW201135326A TW201135326A (en) 2011-10-16
TWI435144B true TWI435144B (en) 2014-04-21

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CN106678622A (en) * 2017-02-06 2017-05-17 京东方科技集团股份有限公司 Side entering type backlight module and display device
CN107179631A (en) * 2017-06-27 2017-09-19 厦门天马微电子有限公司 A kind of display device

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US20110249470A1 (en) 2011-10-13
US8573811B2 (en) 2013-11-05
TW201135326A (en) 2011-10-16

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