TWI424587B - Light emitting diodes with nanoscale surface structure and embossing molds forming nanometer scale surface structures - Google Patents

Light emitting diodes with nanoscale surface structure and embossing molds forming nanometer scale surface structures Download PDF

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TWI424587B
TWI424587B TW97124542A TW97124542A TWI424587B TW I424587 B TWI424587 B TW I424587B TW 97124542 A TW97124542 A TW 97124542A TW 97124542 A TW97124542 A TW 97124542A TW I424587 B TWI424587 B TW I424587B
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light
surface structure
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scale surface
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TW201001749A (en
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Chung Hsiang Lin
Chang Chin Yu
Hung Wen Huang
Hao Chung Kuo
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Luxtaltek Corp
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Description

具有奈米級表面結構的發光二極體及形成奈米級表面結構的壓印模具Light-emitting diode having a nano-scale surface structure and imprint mold forming a nano-scale surface structure

本發明是有關於一種固態發光元件(solid-state light emitting device),特別是指一種高光取出率(extraction efficiency)的發光二極體。The present invention relates to a solid-state light emitting device, and more particularly to a light-emitting diode having a high light extraction efficiency.

於固態發光元件中,特別是發光二極體(LED),常利用例如控制磊晶條件的磊晶製程,或是濕式蝕刻、乾式蝕刻等粗化製程,讓發光二極體的出光面具有預定的粗糙程度,藉此增加光取出率,以提昇元件整體的發光亮度。In a solid-state light-emitting device, in particular, a light-emitting diode (LED), for example, an epitaxial process for controlling epitaxial conditions, or a roughening process such as wet etching or dry etching, so that the light-emitting surface of the light-emitting diode has The predetermined roughness is thereby increased the light extraction rate to increase the luminance of the entire component.

相關技術例如「Nitride-Based LEDs With 800℃ Grown p-AlInGaN-GaN Double-Cap Layers」(S.J.Chang等,IEEE Photonics Technolog Letters, Vol.16, NO.6, June 2004p.1447~1449),利用800℃的磊晶溫度使p型氮化鎵得以較慢的橫向成長(lateral growth)速度成長,而得到具有粗糙的出光面的發光二極體;「Increase In The Extraction Efficiency Of GaN-based Light-Emitting Diodes Via Surface Roughening」(T. Fujii等,Applied Physics Letters Vol.84, NO.6, p.855~857)利用以氫氧化鉀為主的蝕刻劑施予光電化學(photoelectro-chemical,簡稱PEC)蝕刻,以形成錐狀圖案的粗化出光面;「Integrate ZnO Nanotips On GaN Light Emitting Diodes For Enhanced Emission Efficiency」(J. Zhong等,Applied Physics Letters 90,203515(2007)),揭露在p型氮化鎵上形成氧化鋅奈米針之粗化出光面的技 術。Related art such as "Nitride-Based LEDs With 800 °C Grown p-AlInGaN-GaN Double-Cap Layers" (SJ Chang et al, IEEE Photonics Technolog Letters, Vol. 16, No. 6, June 2004 p. 1447 ~ 1449), using 800 The epitaxial temperature of °C allows the p-type gallium nitride to grow at a slower lateral growth rate to obtain a light-emitting diode having a rough light-emitting surface; "Increase In The Extraction Efficiency Of GaN-based Light-Emitting Diodes Via Surface Roughening" (T. Fujii et al., Applied Physics Letters Vol. 84, No. 6, p. 855-857) is applied to photoelectro-chemical (PEC) using an etchant based on potassium hydroxide. Etching to form a roughened light surface of a tapered pattern; "Integrate ZnO Nanotips On GaN Light Emitting Diodes For Enhanced Emission Efficiency" (J. Zhong et al., Applied Physics Letters 90, 203515 (2007)), discloses p-type nitridation Technique for forming a roughened surface of zinc oxide nano-needle on gallium Surgery.

整體而言,以目前的技術形成的粗化出光面均勻度並不佳,雖然確實可以有效提昇光取出率,但是效果仍非較佳,此外,粗化製程的再現性並無法一致,因此,目前仍無法穩定的供業界上線量產。On the whole, the uniformity of the roughened light surface formed by the current technology is not good, although the light extraction rate can be effectively improved, the effect is still not preferable, and the reproducibility of the roughening process is not uniform, therefore, At present, it is still not stable for the mass production of the industry.

因此,如何在量產穩定的前提要求下,設計、製作具有最佳光取出率之出光面的發光二極體,是相關領域者一直努力的目標。Therefore, how to design and fabricate a light-emitting diode having an optimum light extraction rate of the light-emitting surface under the premise of stable mass production is a goal that the related field has been striving for.

在量產的前提要求下,經由同一製程的產品再現性一定要極高,以目前的所有製程來說,經由模具壓印,將預先設計好的圖案轉移到發光二極體上以得到粗化出光面,是重現性最高的技術之一。Under the premise of mass production, the reproducibility of the product through the same process must be extremely high. In all current processes, the pre-designed pattern is transferred to the LED through the die imprinting to obtain the roughening. The light surface is one of the most reproducible technologies.

所以,發明人構思欲設計、製作具有最佳光取出率的發光二極體,一定要由此製程著手;然而,經由模具壓印、移轉圖案的技術雖然成熟,但是要將此技術轉用於固態元件,特別是發光二極體上粗化出光面以提昇光取出率時,要克服的難題一是在於圖案的設計,二是在於當欲轉印的圖案的尺度縮減至奈米尺度時,模具上設計的圖案與轉移後的圖案會受限於製程而產生變形,如此一來,就會使得設計時模擬得到的光取出率,與實際得到的產品有所差異,而達不到預定的目標。Therefore, the inventor conceived that the design of the light-emitting diode with the best light extraction rate must be started by this process; however, the technology of imprinting and transferring the pattern through the mold is mature, but the technology should be transferred. When the solid surface component, especially the light-emitting diode, is roughened to enhance the light extraction rate, one of the problems to be overcome is the design of the pattern, and the second is that when the scale of the pattern to be transferred is reduced to the nanometer scale. The pattern designed on the mold and the transferred pattern will be limited by the process and will be deformed. As a result, the light extraction rate simulated during the design will be different from the actual product, and the reservation will not be achieved. The goal.

發明人認為,要解決欲轉印的圖案受限於本身尺度以及製程限制而發生改變的問題,可以從不規則圖形的方向 著手,藉著不規則圖形抵銷掉轉印圖案發生變形的誤差,但,不規則圖形又必須呈有序的分佈排列,如此才能在具有高度重現性的前提下,實質改善光取出率。The inventor believes that to solve the problem that the pattern to be transferred is limited by its own scale and process limitation, it can be from the direction of the irregular pattern. At the beginning, the error of deformation of the transfer pattern is offset by the irregular pattern, but the irregular pattern must be arranged in an orderly manner, so that the light extraction rate can be substantially improved under the premise of high reproducibility.

基於上述的想法,發明人進行多數次實驗,得到本發明提供一種具有最佳光取出率之具有奈米級表面結構的發光二極體。Based on the above ideas, the inventors conducted a majority of experiments, and obtained the present invention to provide a light-emitting diode having a nano-scale surface structure having an optimum light extraction rate.

此外,本發明還提供一種適用於奈米壓印機而可形成固態元件的奈米級表面結構的壓印模具。Further, the present invention provides an imprint mold suitable for use in a nanoimprinting machine to form a nano-scale surface structure of a solid element.

於是,本發明一種具有奈米級表面結構的發光二極體,包含一發光本體,及一奈米級表面結構。Thus, the present invention has a nano-scale surface structure of a light-emitting diode comprising a light-emitting body and a nano-scale surface structure.

該發光本體通電時以光電效應產生光,並具有一供光出射至外界的出光面。The light-emitting body generates light by a photoelectric effect when energized, and has a light-emitting surface for emitting light to the outside.

該奈米級表面結構包括多數形成在該出光面且排列成多數內徑成等差數列之同心環的凹槽,該等凹槽的截面形狀為多數無規則性且大小在奈米尺度範圍內的圖形,且屬於同一同心環之相鄰兩凹槽的間距在奈米尺度範圍。The nano-scale surface structure comprises a plurality of grooves formed on the light-emitting surface and arranged in a concentric ring with a plurality of inner diameters in a series of equal numbers, the cross-sectional shapes of the grooves being mostly irregular and having a size in the nanometer scale The pattern, and the spacing between adjacent two grooves belonging to the same concentric ring is in the nanometer scale range.

此外,本發明一種形成奈米級表面結構的壓印模具,適用於一奈米壓印機而將一塗佈於晶圓表面之熱固性聚合物形成對應的圖案薄膜,進而將該圖案薄膜的態樣轉移至該晶圓表面,該形成奈米級表面結構的壓印模具包含一模具本體,及一結構圖案。In addition, the present invention relates to an imprinting mold for forming a nano-scale surface structure, which is suitable for a nano-imprinting machine to form a corresponding patterned film on a thermosetting polymer coated on the surface of the wafer, and then the state of the patterned film. The sample is transferred to the surface of the wafer, and the imprinting mold forming the nano-scale surface structure comprises a mold body and a structural pattern.

該模具本體可拆卸連結在該奈米壓印機中並具有一壓印面。The mold body is detachably coupled to the nanoimprinting machine and has an embossed surface.

該結構圖案包括多數形成在該壓印面且排列成多數內 徑成等差數列之同心環的凸點,該等凸點的截面形狀為無規則性且大小在奈米尺度範圍內的矩形,且屬於同一同心環之相鄰兩凸點的間距在奈米尺度範圍。The structural pattern includes a majority formed on the embossed surface and arranged in a plurality a bump of a concentric ring of equal difference series, the cross-sectional shape of the bumps being a rectangle having a size irregular in the nanometer scale, and the spacing of adjacent two bumps belonging to the same concentric ring is in the nanometer Scale range.

本發明的功效在於:在滿足量產的前提下,設計具有單個呈無規則且為奈米尺度大小,但多數成彼此內徑為等差數數列之同心環排列的結構圖案的壓印模具,並以壓印轉印方式製作出具有對應之奈米級表面結構的發光二極體,而這樣圖案的奈米級表面結構可實質提昇發光二極體的光取出率,有效提高元件整體的發光亮度。The utility model has the advantages that: in the premise of satisfying mass production, an imprinting mold having a single structural pattern which is irregular and has a size of a nanometer, but a plurality of concentric rings arranged with an inner diameter of an arithmetic number are arranged, The light-emitting diode having the corresponding nano-scale surface structure is formed by the imprint transfer method, and the nano-scale surface structure of the pattern can substantially improve the light extraction rate of the light-emitting diode, thereby effectively improving the overall light emission of the component. brightness.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

而在本實施例被詳細描述之前,要注意的是,在以下的說明內容與圖示,都是以垂直注入式發光二極體結構說明,且未繪示出電極,而具有本技術領域普通知識人士皆可自以下的說明,而輕易地理解本發明之技術思想,並將本發明應用於各式結構的發光二極體,乃至類似的固態發光元件中。Before the present embodiment is described in detail, it should be noted that the following description and illustrations are all illustrated by a vertical injection type LED structure, and the electrodes are not shown, but have ordinary fields in the art. The skilled person can easily understand the technical idea of the present invention from the following description, and apply the present invention to various types of light-emitting diodes, and even similar solid-state light-emitting elements.

參閱圖1與圖2,本發明具有奈米級表面結構的發光二極體2之一較佳實施例包含一發光本體3,及一奈米級表面結構4,具有更高的光取出率表現、整體亮度更高。Referring to FIG. 1 and FIG. 2, a preferred embodiment of the light-emitting diode 2 having a nano-scale surface structure comprises a light-emitting body 3 and a nano-scale surface structure 4, which has a higher light extraction rate performance. The overall brightness is higher.

該發光本體3具有一矽基板31,與一設置在矽基板31上並以氮化鎵系半導體材料磊晶形成的磊晶膜32,該磊晶 膜32並包括一在通電時以光電效應產生光的p-n接面33(p-n junction),與一供光出射至外界的出光面34。The illuminating body 3 has a 矽 substrate 31 and an epitaxial film 32 disposed on the ytterbium substrate 31 and epitaxially formed by a gallium nitride based semiconductor material. The film 32 includes a p-n junction 33 (p-n junction) which generates light by a photoelectric effect upon energization, and a light-emitting surface 34 which is supplied to the outside by a light supply.

同時參閱圖3、圖4,該奈米級表面結構4是利用壓印轉印技術形成(相關製程請容後再續),包括多數形成在該出光面34且以同一圓心排列成多數同心環100的凹槽41,該等凹槽41的截面形狀為多數無規則性且大小在奈米尺度範圍內的圖形,且屬於同一同心環100之相鄰兩凹槽41的間距在奈米尺度範圍,該等同心環100的內徑成公差是50nm~1000nm的等差數列。Referring to FIG. 3 and FIG. 4, the nano-scale surface structure 4 is formed by using an imprint transfer technology (relevant process is required), and a plurality of concentric rings are formed on the light-emitting surface 34 and arranged in the same center. a groove 41 of 100, the cross-sectional shape of the grooves 41 is a pattern with a majority of irregularities and a size in the nanometer scale, and the spacing between adjacent two grooves 41 belonging to the same concentric ring 100 is in the nanometer scale range. The inner diameter of the equivalent core ring 100 has a tolerance of 50 nm to 1000 nm.

在本例中,該等同心環100是同心圓環,且內徑公差是200nm,該等凹槽41的截面形狀為長度不等但寬度近似的長條形,且最大的內徑長度是50nm~1000nm,深度是50nm~1000nm。In this example, the equivalent core ring 100 is a concentric ring with an inner diameter tolerance of 200 nm, and the cross-sectional shape of the grooves 41 is an elongated shape having an unequal length but an approximate width, and the largest inner diameter is 50 nm. ~1000nm, the depth is 50nm~1000nm.

參閱圖5,圖5是上述本發明具有奈米級表面結構4的發光二極體2之較佳實施例相較於現有的發光二極體(出光面非粗糙面之發光二極體)的電流一順向電壓的比較結果,由圖中可知上述本發明具有奈米級表面結構4的發光二極體2之較佳實施例與現有的發光二極體的電性需求、電性表現相似。Referring to FIG. 5, FIG. 5 is a view showing a preferred embodiment of the light-emitting diode 2 having the nano-scale surface structure 4 of the present invention as compared with the conventional light-emitting diode (light-emitting diode of the non-rough surface of the light-emitting surface). Comparing the current-forward voltage, it can be seen from the figure that the preferred embodiment of the above-described light-emitting diode 2 having the nano-scale surface structure 4 of the present invention is similar to the electrical requirements and electrical performance of the existing light-emitting diode. .

參閱圖6、圖7、圖8,圖6是上述本發明具有奈米級表面結構4的發光二極體2之較佳實施例與現有的發光二極體的電流一光輸出強度的比較結果,圖7是光譜比較表現,圖8則是各方向光輸出強度的比較結果,由此三圖比較可知,本發明具有奈米級表面結構4的發光二極體2確 實藉著奈米級表面結構4而較現有的發光二極體有更高光取出率與整體發光亮度表現。Referring to FIG. 6, FIG. 7, and FIG. 8, FIG. 6 is a comparison result of the current-light output intensity of the preferred embodiment of the light-emitting diode 2 having the nano-scale surface structure 4 of the present invention and the conventional light-emitting diode. Figure 7 is a comparison of the spectral performance, and Figure 8 is a comparison of the light output intensities in each direction. From the comparison of the three figures, the light-emitting diode 2 having the nano-scale surface structure 4 of the present invention is indeed Compared with the existing light-emitting diodes, the nano-scale surface structure 4 has higher light extraction rate and overall light-emitting brightness performance.

上述本發明具有奈米級表面結構4的發光二極體2之較佳實施例,在以下面關於模具與製造過程的詳細說明後,當可更加清楚的明白。而要再加以說明的是,以下的說明都是對應上述而敘述製作單一晶粒的說明,稍有半導體製程概念的人士,均可簡單自以下說明中得知以晶圓為單位的實際量產製作過程。The preferred embodiment of the above described light-emitting diode 2 of the present invention having a nano-scale surface structure 4 will be more clearly understood in the following detailed description of the mold and the manufacturing process. It should be further noted that the following descriptions are all descriptions for making a single die in accordance with the above description. Those who have a slight semiconductor process concept can easily know the actual mass production in wafers from the following description. Production process.

參閱圖9、圖10,首先是準備一適用於奈米壓印機(圖未示)的壓印模具5,該壓印模具5包含一可拆卸連結在該奈米壓印機中並具有一壓印面511的模具本體51,及一形成在該壓印面511的結構圖案52。Referring to FIG. 9 and FIG. 10, firstly, an imprinting mold 5 suitable for a nano imprinting machine (not shown) is prepared. The imprinting mold 5 includes a detachable coupling in the nano imprinting machine and has a The mold body 51 of the embossed surface 511, and a structural pattern 52 formed on the embossed surface 511.

該結構圖案52對應上述本發明具有奈米級表面結構4的發光二極體2之較佳實施例的奈米級表面結構4,包括多數形成在該壓印面511且以同一圓心排列成多數同心環100的凸點521,對應於所欲形成之奈米級表面結構4的凹槽41,該等凸點521的截面形狀為無規則性且大小在奈米尺度範圍內的矩形塊,且屬於同一同心環100之相鄰兩凸點521的間距在奈米尺度範圍,該等同心環100的內徑成公差是50nm~1000nm的等差數列。The structure pattern 52 corresponds to the nano-scale surface structure 4 of the preferred embodiment of the above-described light-emitting diode 2 having the nano-scale surface structure 4 of the present invention, and includes a plurality of concentric surfaces formed on the embossed surface 511 and arranged in the same center to form a plurality of concentric portions. The bumps 521 of the ring 100 correspond to the grooves 41 of the nano-scale surface structure 4 to be formed, and the cross-sectional shapes of the bumps 521 are rectangular blocks having irregularities and sizes in the nanometer scale, and belong to The spacing between adjacent two bumps 521 of the same concentric ring 100 is in the nanometer scale range, and the inner diameter of the equivalent core ring 100 has a tolerance of 50 nm to 1000 nm.

對應於上述本發明之較佳實施例,在此該等同心環100是同心圓環,且內徑公差是200nm,該等凸點521的截面形狀為長度不等但寬度相同的矩形,且該些凸點的長是50nm~1000nm,寬是50nm~1000nm,高度是50nm~ 1000nm。Corresponding to the preferred embodiment of the present invention, the equivalent core ring 100 is a concentric ring, and the inner diameter tolerance is 200 nm, and the cross-sectional shape of the bumps 521 is a rectangle having different lengths but the same width, and the The length of these bumps is 50nm~1000nm, the width is 50nm~1000nm, and the height is 50nm~ 1000nm.

接著是以一般製程製作出發光二極體2結構的發光本體3;然後採用化學氣相沉積方式在發光本體3出光面34沉積一層二氧化矽(SiO2 ),接著再塗佈一層極薄的熱固聚合物;之後,即利用設置有該壓印模具5的奈米壓印機,以該壓印模具5加熱、加壓該熱固聚合物,使壓印模具5的結構圖案52轉移至熱固聚合物上;接下來使用反應離子式蝕刻(RIE)將熱固聚合物的圖案轉移至二氧化矽上:最後,再利用電感耦合式電漿蝕刻方式以形成有圖案的二氧化矽層作為遮罩,等向蝕刻至發光本體3,待蝕刻完成並利用BOE(去氧化蝕刻溶液)去除剩下的二氧化矽結構,即完成本發明具有奈米級表面結構4的發光二極體2之較佳實施例。Then, the illuminating body 3 of the structure of the illuminating diode 2 is fabricated by a general process; then, a layer of cerium oxide (SiO 2 ) is deposited on the illuminating surface 34 of the illuminating body 3 by chemical vapor deposition, and then a very thin heat is applied. The polymer is solidified; then, the nano-imprinting machine provided with the imprinting mold 5 is used, and the thermosetting polymer is heated and pressurized by the imprinting mold 5 to transfer the structural pattern 52 of the imprinting mold 5 to heat. On the solid polymer; the pattern of the thermosetting polymer is transferred to the cerium oxide by reactive ion etching (RIE): Finally, an inductively coupled plasma etching method is used to form a patterned cerium oxide layer. The mask is isotropically etched to the illuminating body 3, and is completed by etching and the remaining cerium oxide structure is removed by BOE (deoxidation etching solution), that is, the light-emitting diode 2 having the nano-scale surface structure 4 of the present invention is completed. Preferred embodiment.

在這個製程中要特別說明的是,由於壓印模具5的凸點521尺度極小,所以在壓印於熱固聚合物上後,原本應該確實對應形成的矩形凹槽41,會變形實質仍呈矩形的長條狀(即矩形的四個內角無法再保持90度而鈍化),之後,一連串的蝕刻過程會讓此圖案的角度更加糊化,最終,即得到如圖3、圖4的長條狀凹槽41;而特別的是,雖然原始壓印模具5的設計圖案是矩形塊,最終產品的圖案是長條狀凹槽41,然而因為設計初始即考慮以不規則圖形抵銷掉轉印圖案發生變形的誤差,且該些不規則圖形又呈有序(內徑成等差數列)的同心環100分佈排列,所以可以實質改善元件的光取出率。In this process, it should be particularly noted that since the bump 521 of the imprinting mold 5 has a very small scale, after being embossed on the thermosetting polymer, the rectangular recess 41 which should be formed correspondingly should be deformed substantially. The stripe of the rectangle (that is, the four inner corners of the rectangle can no longer be maintained at 90 degrees and passivated), after which a series of etching processes will make the angle of the pattern more gelatinized, and finally, the length as shown in Fig. 3 and Fig. 4 is obtained. Strip-shaped groove 41; and in particular, although the design pattern of the original imprinting mold 5 is a rectangular block, the pattern of the final product is the elongated groove 41, but the design is initially considered to offset the transfer by the irregular pattern. The pattern is deformed by the error, and the irregular patterns are arranged in an orderly arrangement (the inner diameter is equal to the number of columns) of concentric rings 100, so that the light extraction rate of the element can be substantially improved.

另外還要強調的是,本發明具有奈米級表面結構的發光二極體之奈米級表面結構的凹槽41排列,是可以如圖11所示,該等同心環100的半徑遠大於晶片邊長,而使得在晶片出光面上的凹槽41排列,看起來像是平行線排列的態樣,也可以是如圖12、圖13所示,於單一晶片上排列成有多數個以不同圓心而成的同心環100態樣,且該等同心環100的圓心也可以是規則(如圖12所示)或是不規則排列(如圖13所示),皆可以實質改善元件的光取出率;此外,根據計算,同心多邊形環狀(例如六邊形、八邊形..等)排列也可以實質地改善元件的光取出率,由於此等規則有序的排列態樣眾多,在此不再一一舉例詳述。In addition, it should be emphasized that the arrangement of the grooves 41 of the nano-scale surface structure of the light-emitting diode having the nano-scale surface structure can be as shown in FIG. 11, and the radius of the equivalent-heart ring 100 is much larger than that of the wafer. The length of the side is such that the grooves 41 on the light-emitting surface of the wafer are arranged to look like a parallel line arrangement, or may be arranged on a single wafer to have a plurality of different ones as shown in FIGS. 12 and 13 . The center of the concentric ring is 100, and the center of the equivalent ring 100 can also be regular (as shown in FIG. 12) or irregularly arranged (as shown in FIG. 13), which can substantially improve the light extraction of the component. In addition, according to the calculation, the arrangement of concentric polygonal rings (for example, hexagons, octagons, etc.) can also substantially improve the light extraction rate of the components, due to the numerous ordered arrangements of these rules, here No more detailed examples.

綜上所述,本發明確實以壓印轉印方式,而在高重現性的量產前提下,設計以尺度在奈米尺度之壓印模具的結構圖案,轉移至發光本體上形成奈米級表面結構,藉由單個單個成不規則,但彼此又呈有序的同心環分佈排列的圖形抵銷掉製程中會發生變形而導致實際產品光取出率不高的誤差,提供一種確實具有高光取出率之具有奈米級表面結構的發光二極體,達到本發明的創作目的。In summary, the present invention does use an imprint transfer method, and under the premise of high reproducible mass production, a structural pattern of an imprint mold having a scale on a nanometer scale is designed, and transferred to a light-emitting body to form a nanometer. The level surface structure, by a single single irregular pattern, but arranged in an ordered concentric ring pattern, offsets the error that the deformation of the process will occur and the actual product light extraction rate is not high, providing a true high light. The light-emitting diode having a nano-scale surface structure with a take-out rate achieves the inventive object of the present invention.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100‧‧‧同心環100‧‧‧Concentric Ring

2‧‧‧發光二極體2‧‧‧Lighting diode

3‧‧‧發光本體3‧‧‧Lighting body

31‧‧‧矽基板31‧‧‧矽 substrate

32‧‧‧磊晶膜32‧‧‧Elevation film

33‧‧‧p-n接面33‧‧‧p-n junction

34‧‧‧出光面34‧‧‧Glossy

4‧‧‧奈米級表面結構4‧‧‧Nano-scale surface structure

41‧‧‧凹槽41‧‧‧ Groove

5‧‧‧壓印模具5‧‧‧ Imprinting mold

51‧‧‧模具本體51‧‧‧Mold body

511‧‧‧壓印面511‧‧‧embossed surface

52‧‧‧結構圖案52‧‧‧Structural pattern

521‧‧‧凸點521‧‧‧ bumps

圖1是一俯視圖,說明本發明具有奈米級表面結構的 發光二極體之一較佳實施例;圖2是一剖視圖,與圖1共同說明本發明具有奈米級表面結構的發光二極體之該較佳實施例;圖3是一原子力顯微鏡照片圖,輔助說明圖1之一奈米級表面結構;圖4是一電子顯微鏡照片圖,輔助說明圖1之一奈米級表面結構;圖5是一電流一順向電壓曲線圖,說明本發明具有奈米級表面結構的發光二極體與現有的發光二極體的電性;圖6是一電流一光輸出強度曲線圖,說明本發明具有奈米級表面結構的發光二極體與現有的發光二極體的光輸出表現;圖7是一光譜曲線圖,說明本發明具有奈米級表面結構的發光二極體與現有的發光二極體的光譜;圖8是一各方向光輸出強度圖,說明本發明具有奈米級表面結構的發光二極體與現有的發光二極體各方向光輸出強度;圖9是一立體圖,說明用於製作本發明具有奈米級表面結構的發光二極體之較佳實施例的一壓印模具圖10是一電子顯微鏡照片圖,輔助說明圖9之壓印模具的一結構圖案;圖11是一俯視圖,說明本發明具有奈米級表面結構的發光二極體之奈米級表面結構的另一凹槽有序排列的態樣; 圖12是一俯視圖,說明本發明具有奈米級表面結構的發光二極體之奈米級表面結構的又一凹槽有序排列的態樣;及圖13是一俯視圖,說明本發明具有奈米級表面結構的發光二極體之奈米級表面結構的再一凹槽有序排列的態樣。Figure 1 is a plan view showing the present invention having a nano-scale surface structure A preferred embodiment of a light-emitting diode; FIG. 2 is a cross-sectional view of the preferred embodiment of the light-emitting diode of the present invention having a nano-scale surface structure; FIG. 3 is a photomicrograph of an atomic force microscope. 1 is a nanometer surface structure; FIG. 4 is an electron micrograph, which assists in explaining one nanometer surface structure of FIG. 1; FIG. 5 is a current-forward voltage curve, illustrating that the present invention has Figure 6 is a current-light output intensity curve illustrating the light-emitting diode of the present invention having a nano-scale surface structure and the existing one. The light output performance of the light-emitting diode; FIG. 7 is a spectral graph illustrating the spectrum of the light-emitting diode having the nano-scale surface structure of the present invention and the existing light-emitting diode; FIG. 8 is a light output intensity in each direction The figure illustrates the light output intensity of the light-emitting diode having a nano-scale surface structure and the existing light-emitting diode of the present invention; FIG. 9 is a perspective view illustrating the light-emitting two for fabricating the nano-scale surface structure of the present invention. Polar body Figure 10 is an electron micrograph showing the structure of the imprint mold of Figure 9; Figure 11 is a plan view showing the light-emitting diode of the present invention having a nano-scale surface structure. An ordered arrangement of another groove of the nanoscale surface structure of the body; Figure 12 is a top plan view showing another groove-ordered arrangement of the nano-scale surface structure of the light-emitting diode having a nano-scale surface structure of the present invention; and Figure 13 is a plan view showing the present invention having a nai A further arrangement of the grooves of the nano-scale surface structure of the light-emitting diode of the rice-scale surface structure.

100‧‧‧同心環100‧‧‧Concentric Ring

2‧‧‧發光二極體2‧‧‧Lighting diode

3‧‧‧發光本體3‧‧‧Lighting body

31‧‧‧矽基板31‧‧‧矽 substrate

32‧‧‧磊晶膜32‧‧‧Elevation film

33‧‧‧p-n接面33‧‧‧p-n junction

34‧‧‧出光面34‧‧‧Glossy

4‧‧‧奈米級表面結構4‧‧‧Nano-scale surface structure

41‧‧‧凹槽41‧‧‧ Groove

Claims (10)

一種具有奈米級表面結構的發光二極體,包含:一發光本體,通電時以光電效應產生光,並具有一供光出射至外界的出光面;及一奈米級表面結構,包括多數形成在該出光面且排列成多數內徑成等差數列之同心環的凹槽,該等凹槽的截面形狀為多數無規則性且大小在奈米尺度範圍內的圖形,且屬於同一同心環之相鄰兩凹槽的間距在奈米尺度範圍。A light-emitting diode having a nano-scale surface structure, comprising: a light-emitting body, which generates light by photoelectric effect when energized, and has a light-emitting surface for emitting light to the outside; and a nano-scale surface structure, including majority formation a groove on the light-emitting surface and arranged in a concentric ring with a plurality of inner diameters in a series of equal numbers, the cross-sectional shape of the grooves being a pattern having a plurality of irregularities and having a size within a nanometer scale, and belonging to the same concentric ring The spacing between adjacent grooves is in the nanometer range. 依據申請專利範圍第1項所述之具有奈米級表面結構的發光二極體,其中,該等同心環的內徑成公差是50nm~1000nm的等差數列。The light-emitting diode having a nano-scale surface structure according to claim 1, wherein the inner diameter of the equivalent core ring has a tolerance of 50 nm to 1000 nm. 依據申請專利範圍第2項所述之具有奈米級表面結構的發光二極體,其中,該等凹槽的截面形狀為長條形且最大的內徑長度是50nm~1000nm,深度是50nm~1000nm。The light-emitting diode having a nano-scale surface structure according to claim 2, wherein the grooves have a long cross-sectional shape and a maximum inner diameter of 50 nm to 1000 nm and a depth of 50 nm. 1000nm. 依據申請專利範圍第3項所述之具有奈米級表面結構的發光二極體,其中,該等同心環是同心圓環。A light-emitting diode having a nano-scale surface structure according to claim 3, wherein the equivalent core ring is a concentric ring. 依據申請專利範圍第3項所述之具有奈米級表面結構的發光二極體,其中,該等同心環是同心等邊多邊形環。A light-emitting diode having a nano-scale surface structure according to claim 3, wherein the equivalent core ring is a concentric equilateral polygonal ring. 一種形成奈米級表面結構的壓印模具,適用於一奈米壓印機而將一塗佈於晶圓表面之熱固性聚合物形成對應的圖案薄膜,進而將該圖案薄膜的態樣轉移至該晶圓表面,該形成奈米級表面結構的壓印模具包含: 一模具本體,是可拆卸連結在該奈米壓印機中並具有一壓印面;及一結構圖案,包括多數形成在該壓印面且排列成多數內徑成等差數列之同心環的凸點,該等凸點的截面形狀為無規則性且大小在奈米尺度範圍內的矩形,且屬於同一同心環之相鄰兩凸點的間距在奈米尺度範圍。An imprinting mold for forming a nano-scale surface structure, which is suitable for a nano-imprinting machine to form a corresponding pattern film on a thermosetting polymer coated on the surface of the wafer, thereby transferring the pattern of the pattern film to the The wafer surface, the imprinting mold forming the nano-scale surface structure comprises: a mold body detachably coupled to the nano embossing machine and having a embossed surface; and a structural pattern including a plurality of bumps formed on the embossed surface and arranged in a concentric ring with a plurality of inner diameters in a series of equal numbers The cross-sectional shape of the bumps is a rectangle having irregularities and a size within a nanometer scale, and the pitch of adjacent two bumps belonging to the same concentric ring is in the nanometer scale range. 依據申請專利範圍第6項所述之形成奈米級表面結構的壓印模具,其中,該等同心環的內徑成公差是50nm~1000nm的等差數列。The imprinting mold for forming a nano-scale surface structure according to claim 6, wherein the inner diameter of the equivalent core ring has a tolerance of 50 nm to 1000 nm. 依據申請專利範圍第7項所述之形成奈米級表面結構的壓印模具,其中,該等凸點之截面形狀的長是50nm~1000nm,寬是50nm~1000nm,且該等凸點的高度50nm~1000nm。The imprinting mold for forming a nano-scale surface structure according to claim 7, wherein the cross-sectional shape of the bumps is 50 nm to 1000 nm in length, 50 nm to 1000 nm in width, and heights of the bumps. 50nm~1000nm. 依據申請專利範圍第8項所述之形成奈米級表面結構的壓印模具,其中,該等同心環是同心圓環。An imprint mold for forming a nano-scale surface structure according to claim 8 of the patent application, wherein the equivalent core ring is a concentric ring. 依據申請專利範圍第8項所述之形成奈米級表面結構的壓印模具,其中,該等同心環是同心等邊多邊形環。An imprinting mold for forming a nano-scale surface structure according to the invention of claim 8, wherein the equivalent core ring is a concentric equilateral polygonal ring.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200301298A (en) * 2001-12-28 2003-07-01 Tokyo Shibaura Electric Co Light-emitting device and method for manufacturing the same
TW561632B (en) * 2001-07-24 2003-11-11 Nichia Corp Semiconductor light emitting device
TW561564B (en) * 2002-10-17 2003-11-11 Uni Light Technology Inc Flip-chip like light emitting device package
TW577102B (en) * 2001-04-13 2004-02-21 Commissariat Energie Atomique Method of preparing thin film for removable substrate and the thin film-substrate assembly obtained thereby
US7192164B2 (en) * 2004-02-26 2007-03-20 Kyocera Corporation Light-emitting apparatus and illuminating apparatus
TW200824151A (en) * 2006-09-08 2008-06-01 Sanken Electric Co Ltd Semiconductor light-emitting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW577102B (en) * 2001-04-13 2004-02-21 Commissariat Energie Atomique Method of preparing thin film for removable substrate and the thin film-substrate assembly obtained thereby
TW561632B (en) * 2001-07-24 2003-11-11 Nichia Corp Semiconductor light emitting device
TW200301298A (en) * 2001-12-28 2003-07-01 Tokyo Shibaura Electric Co Light-emitting device and method for manufacturing the same
TW561564B (en) * 2002-10-17 2003-11-11 Uni Light Technology Inc Flip-chip like light emitting device package
US7192164B2 (en) * 2004-02-26 2007-03-20 Kyocera Corporation Light-emitting apparatus and illuminating apparatus
TW200824151A (en) * 2006-09-08 2008-06-01 Sanken Electric Co Ltd Semiconductor light-emitting device

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