TWI416204B - Method of fabricating a capacitive touch panel - Google Patents

Abstract

The present invention relates to a method of fabricating a capacitive touch panel. The method comprises: providing a substrate; forming a plurality groups of first conductive patterns that stretch along a first direction, a plurality groups of second conductive patterns that stretch along a second direction and a plurality of first connection components; forming a plurality of curved insulation mounds that covers the first connection components; then forming a plurality of second connection components to electrically connect each second conductive patterns of the same group.

Description

Capacitive touch screen manufacturing method

The invention provides a method for manufacturing a touch screen, in particular to a control method for a capacitive touch screen with high accuracy and simple steps.

In today's consumer electronics market, portable digital products such as personal digital assistants (PDAs), mobile phones, and notebooks are even personal computers and digital home appliances. The touch panel has been gradually used as a data communication interface tool between the user and the electronic device. When using the touch panel, the user can directly operate and release commands through the objects displayed on the screen, thereby providing a more user-friendly operation interface. In addition, the design of electronic products is light, thin, short, and small. Therefore, in product design, it is hoped to save the installation space of traditional input devices such as buttons, keyboards, and mouse. Therefore, the display device with the touch panel has been It has gradually become one of the key components of various electronic products.

According to the detection method, the conventional touch panel can be roughly classified into a capacitive, resistive or wave-type touch screen, each having different advantages and disadvantages and applicable fields. The resistive touch panel is formed by stacking two upper and lower transparent conductive films. When the user presses the touch, the upper and lower electrodes are turned on, and the position of the touch point can be calculated through the measurement of the voltage change. The wave-type touch screen is equipped with a wave source on the X-axis and Y-axis side of the screen, usually infrared or ultrasonic, and the receiving source is set on the other side. When the user touches, the waveform is affected. Interference, the interference pattern is sensed by the receiving source to calculate the touch position. The capacitive touch screen provides a uniform electric field at the four corners of the panel, and detects the input coordinates by using the capacitance change caused by the user's touch.

Generally, capacitive touch screens are widely used in various electronic portable products because of their advantages of dustproof, high temperature resistance and multi-touch. However, the conventional capacitive touch screen requires at least five layers of film stacking, which cannot be obtained. To a good product transmittance, its display quality is degraded, and its heavy volume is difficult to integrate into the current thin and light electronic devices. In addition, the structure of the multilayer film is more cumbersome in the process, especially if the sensed conductive films are respectively located on both sides of the transparent substrate, and the process difficulty is further improved.

The invention provides a method for manufacturing a capacitive touch screen, which solves the problem that the light transmittance of the product produced by the multi-layer stack in the prior art is reduced and the process is troublesome.

In accordance with the scope of the present invention, the present invention discloses a method of making a touch screen. The method includes the following steps, first providing a substrate, and then forming a first array of conductive patterns arranged in a first direction, a second conductive pattern arranged in a second direction, and a plurality of connecting portions on the substrate, wherein Each of the first conductive patterns in the same group is electrically connected to each of the adjacent first conductive patterns through the connecting portions therebetween, and the second conductive patterns of each group are misaligned with the first conductive patterns of each group and are mutually arranged Electrical insulation. A plurality of insulating hills having a curvature are then formed to cover at least portions of the joints. Finally, a plurality of bridging elements are formed on the insulating mound such that the second conductive patterns in the same group are electrically connected to the adjacent second conductive patterns through the bridging elements.

The present invention also provides another method of making a touch screen. The method includes the steps of: first providing a substrate, and then forming a first array of conductive patterns arranged in a first direction and a plurality of connecting portions on the substrate, wherein each of the first conductive patterns in the same group passes through the respective connections The portion is electrically connected to each of the adjacent first conductive patterns. A plurality of insulating hills having a curvature are then formed to cover at least portions of the joints. Finally, a second conductive pattern arranged in a second direction and a plurality of bridging elements are formed on the substrate, wherein the second conductive patterns of each group are offset from each other and electrically insulated from each other, and Each of the bridging elements is formed on each of the insulating mounds such that the second conductive patterns in the same group are electrically connected to the adjacent second conductive patterns through the respective bridging elements.

The present invention also provides another method of making a touch screen. The method includes the steps of first providing a substrate and then forming a plurality of bridging elements on the substrate. A plurality of insulating hills having a curvature are then formed to cover the bridging elements, respectively, and to expose portions of the bridging elements. And forming a first conductive pattern arranged in a first direction, a second conductive pattern arranged in a second direction, and a plurality of connecting portions on the substrate, wherein each of the first conductive patterns in the same group is transmitted through Each of the connecting portions is electrically connected to each of the adjacent first conductive patterns, and the second conductive patterns of each group are offset from each other and electrically insulated from each other, and are located in the second group of the same group. The conductive pattern is electrically connected to each adjacent second conductive pattern through each of the bridging elements buried under each insulating dome.

According to the manufacturing method of the capacitive touch screen provided by the invention, a capacitive touch screen with a small stack and high transmittance can be fabricated, which is not only simple in process, but also can be made with materials of various connecting components, and provides An arc-shaped insulating hill structure ensures the integrity of the bridge structure and greatly improves the yield and service life of the product.

Please refer to FIG. 1 to FIG. 8 . FIG. 1 to FIG. 8 illustrate a first embodiment of a method for fabricating a capacitive touch screen according to the present invention. Referring to FIG. 1, a substrate 301 is first provided. The substrate 301 may comprise an organic material or an inorganic material such as glass, quartz, plastic, resin, acrylic or other suitable transparent material. Then, a transparent conductive layer (not shown) is formed on the substrate 301, which may be a single layer or a multilayer structure, and the material includes various transparent conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide. Aluminum (AZO), zinc gallium oxide (GZO), and indium magnesium oxide (MIO).

Then, as shown in FIG. 1 , a photo-etching-process (PEP) is performed to pattern the transparent conductive layer, so that the transparent conductive layer simultaneously forms a complex array of first conductive patterns 303 on the surface of the substrate 301. The second conductive pattern 307 and a plurality of connecting portions 305 are disposed. The first conductive patterns 303 of each group are respectively arranged along a first direction 309. The second conductive patterns 307 of each group are arranged along a second direction 311, respectively. The first conductive patterns 303 in the same group are electrically connected to the adjacent first conductive patterns through the connecting portions 305 therebetween and integrally formed with each other. In addition, each of the second conductive patterns 307 is disposed offset from the first conductive patterns 303 of each group and electrically insulated from each other.

As shown in FIG. 1 , in the embodiment of the present invention, the first direction 309 and the second direction 311 are perpendicularly intersected, but the arrangement of the conductive patterns may be changed such that the first direction 309 and the second direction 311 are one. Non-vertical angle. It should be understood by those of ordinary skill in the art that if the substrate 301 is rotated 90 degrees counterclockwise or clockwise, for example, the first conductive patterns 303 of each group are arranged along the second direction 311. The manner in which the second conductive patterns 307 of the respective groups are arranged along the first direction 309, which are still equivalent variations and modifications of the present invention, are all within the scope of the present invention.

A plurality of wires 308 are then formed at the edges of the substrate 301. One end of each of the wires 308 is connected to the first conductive pattern 303 of each group (row) and the second conductive pattern 307 of each group (column), and the other end extends to the edge of the substrate 301 for subsequent connection to the outside of the panel. Control circuit is used. The step of forming each set of wires 308 may further include forming at least one alignment mark 310 at the edge of the substrate 301 to assist in positioning calibration of each process on the subsequent panel. The step of forming the wire 308 and the alignment mark 310 is not limited to the formation of the first conductive pattern 303, the second conductive pattern 307, and the connecting portion 305, and may be performed on the first conductive pattern 303, the second conductive pattern 307, and the connecting portion. The 305 is formed before or at the same time, or is disposed between other steps without affecting other processes.

Referring to FIG. 2, FIG. 2 is divided into two parts of the left half L and the right half R, the left half L is an enlarged schematic view of the block A in FIG. 1, and the right half R is along the block A. A schematic cross-sectional view of the tangent line BB', whereby the manufacturing process of the detailed component of the present invention is more clearly shown. As shown in FIG. 2, a photoresist layer (not shown) or other photosensitive insulating layer is formed on the substrate 301, and the photoresist layer is subjected to a lithography process after being aligned with the alignment mark 310, for example, Exposure and development to form a plurality of photoresist patterns 313, and each of the photoresist patterns 313 respectively covers the corresponding connection portions 305, preferably at least covering the connection portions 305 and the first conductive patterns connected thereto Part 303, as shown in Figure 2.

Referring now to Figure 3, a baking process (not shown) is carried out having a baking temperature in the range of 200 to 300 ° C, preferably 220 ° C, for about 1 hour. When baking, each photoresist pattern 313 generates a cohesion phenomenon, so that each photoresist pattern 313 forms an insulating hill 315 having a curvature.

It is worth noting that, compared with the conventional photoresist layer, it will be removed after the lithography and etching process. The insulating mound 315 of the present invention is directly formed by baking the photoresist pattern 313, so that the selected material is photosensitive. In addition to its nature, its durability and stability must also be considered to provide the stability and support of the insulating mound 315.

In addition to forming the insulating mound 315 directly with a photoresist layer as described above, it can also be prepared by using a photolithography and etching process. For example, an insulating layer is formed on the substrate, and then the insulating layer is etched to form a plurality of insulating patterns and partially cover the respective connecting portions. Finally, a thermal reflow process is performed such that each of the insulating patterns forms an insulating mound 315 having a curvature. Alternatively, the insulating mound 315 of the present invention can also be fabricated by ink jet printing.

After forming the insulating mound 315, referring to FIG. 4, a photoresist layer 317 is deposited on the substrate 301. The photoresist layer 317 is made of a lift-off photoresist material, followed by a soft bake (soft bake). )Process. And an exposure step is performed by aligning the alignment mark 310, and then a baking process 319 is performed on the substrate 301. In particular, the baking process 319 is to bake the back of the substrate 301, that is, to heat the bottom of the photoresist layer 317 through the substrate 301 in a thermally conductive manner. The baking temperature ranges from 80 to 120 ° C, preferably 100 ° C, for a time of about 90 seconds. A development process and a hard bake process are then performed to form a plurality of holes 321 in the photoresist layer 317. Each hole Each of the 321 portions exposes a portion of the corresponding insulating mound 315 and each of the second conductive patterns 307. Because of the baking step 319 of the bottom surface of the pair of substrates 301 before the development process, each of the holes 321 formed by the photoresist layer 317 has an opening structure which is tapered from the bottom to the top and has an inclined inner wall 323. As shown in Figure 4. In an embodiment of the invention, the angle θ between the inclined inner wall 323 and the surface of the substrate 301 is less than 90 degrees, preferably 45 degrees ≦ θ < 90 degrees.

Referring to FIG. 5, a conductive film 325 is formed on the substrate 301. The conductive film 325 may include various transparent conductive materials such as ITO, IZO, etc., or various metal materials such as copper, aluminum, and the like. In particular, the step of forming the conductive film 325 in the present invention is carried out by an anisotropic deposition method such as a sputtering or evaporation process. Therefore, in the present invention, the conductive film 325 can be formed on the substrate 301 by a directional deposition method in the case where each of the holes 321 has an opening structure of "upper and lower", so whether it is ITO or metal. The conductive film 325 is formed only on the surface of the photoresist layer 317 and the portions of the insulating hills 315 and the second conductive patterns 307 in the holes 321 and is shielded by the photoresist layer 317 in the holes 321 There is no formation of the conductive film 325 on the inclined inner wall 323. As shown in FIG. 5, each of the conductive films 325 is formed along the arc of the corresponding insulating mound 315, and is connected to and electrically connected to the two adjacent second conductive patterns 307a, 307b.

Next, referring to FIG. 6, the photoresist layer 317 is stripped, for example, the photoresist layer 317 is removed with a suitable cleaning solution. Since the conductive film 325 is not covered on the inclined inner wall 323 of the hole 321, the portion of the photoresist layer 317 is thus exposed to the external environment. Therefore, the cleaning liquid can smoothly contact the photoresist layer 317 and remove it, and the conductive film 325 covering the photoresist layer 317 is removed, but the conductive film 325 is not removed on each of the insulating hills 315. In this way, the adjacent second conductive patterns 307a, 307b of each group (column) can be electrically connected through the conductive film 325 therebetween, so that the conductive film 325 across the insulating hills 315 forms a bridge. Element 327.

By the above steps, a complex array (row) of first conductive patterns 303 and a plurality of arrays (columns) of second conductive patterns 307 arranged in two different directions can be formed on the same side of the substrate 301, as shown in FIG. Each of the first conductive patterns 303 of the same group (rows) extends through the respective connection portions 305 in the first direction 309, and the second conductive patterns 307 of the same group (columns) extend through the respective bridge members 327 in the second direction 311. The bridging elements 327 are connected across the insulating mounds 315, so that the first conductive patterns 303 and the second conductive patterns 307 can be electrically insulated from each other. In this way, the layouts formed by the first conductive patterns 303 and the second conductive patterns 307 on the same side surface of the substrate 301 can be used as the sensing electrodes of the capacitive touch screen to respectively sense the touch position of the user. The coordinate axis of the first direction 309 and the second direction 311 are both to detect the touch position.

In addition, when the material constituting the bridge member 327 is metal, the metal process for forming the bridge member 327 does not affect the first conductive pattern 303, the second conductive pattern 307, and the connection portion 305 formed by the ITO due to the difference in etching rate. Therefore, a conventionally patterned metal process can be directly performed instead of the steps of FIGS. 4 and 5. For example, after the step of forming the insulating mound 315 in FIG. 3, referring to FIG. 8, a metal layer 329 is formed on the substrate 301 in a comprehensive manner, and the metal layer 329 is directly patterned to form the bridging elements 327 as shown in FIG. . Since the area of the bridging element 327 disposed between the second conductive patterns 307 is small, the opaque metal material does not affect the transmittance of the touch screen, and the second conductive can be compensated by the low resistance of the metal. The effect of the pattern 307 and the series interface of the bridging elements 327 results in a good electrical conductivity.

In the second embodiment of the present invention, the first conductive pattern and the connecting portion may be formed first, then the insulating mound is formed, and finally the second conductive pattern and the bridging element are formed. Please refer to FIG. 9 to FIG. 11 , which are schematic diagrams showing a second embodiment of a method for fabricating a capacitive touch screen according to the present invention. Referring to FIG. 9 , a substrate 401 is first provided, and then a first conductive pattern 403 and a plurality of connecting portions 405 arranged in a first direction 409 are formed on the substrate 401. The first conductive patterns 403 located in the same group are electrically connected to the adjacent first conductive patterns 403 through the respective connecting portions 405. Preferably, the first conductive patterns 403 and the connecting portions 405 are simultaneously formed. The material of the first conductive pattern 403 and the connecting portion 405 includes various transparent conductive materials such as ITO, and the like is formed in the same manner as described above, and details are not described herein again.

A plurality of insulating hills 415 having a curvature are then formed to cover at least portions of the connecting portions 405. The manner in which the insulating mounds 415 are formed is the same as described above and will not be described here.

Next, a second conductive pattern 407 and a bridging element 427 are formed on the substrate 401. The step of forming the second conductive pattern 407 and the bridging element 427 may be formed by using the aforementioned lift-off type photoresist, please refer to FIG. 4 to FIG. 6, the difference is only that the range of the hole 321 is from the original bridging element. The range of 327 is extended to the extent of the second conductive pattern 407 plus the bridging element 427, the details of which are the same as previously described and will not be described here. Alternatively, please refer to FIG. 10. FIG. 10 is an enlarged view of a region C in FIG. 9. The left half L is a schematic view of the reticle pattern 414 used in the region C (described in detail below), and the right half R is a solid portion of the region C. schematic diagram. First, a transparent conductive film (not shown) is deposited on the substrate 401, and then a photoresist layer (not shown) is deposited thereon, followed by a lithography and etching process, and the reticle pattern 414 is used as shown in FIG. The left half L is shown. The reticle pattern 414 includes four regions, the region 4141 corresponds to the first conductive pattern 403, the region 4142 corresponds to the connection portion 405, the region 4143 corresponds to the second conductive pattern 407, and the region 4144 corresponds to the bridging element 427. Wherein the region 4142 is opposite to the connecting portion 405 which has been formed on the substrate 401 and covered by the insulating mound 415, and the region covered by the region 4142 protrudes slightly inward from the insulating mound (the position of the insulating mound, which is dotted in FIG. 10) Displayed as area D). Therefore, after the lithography and etching process, the conductive film forms the second conductive pattern 407, the bridging element 427, the auxiliary first conductive pattern 404 and the auxiliary connecting portion 406, respectively corresponding to the four regions of the reticle pattern 414. As shown in the right half of Figure 10R. In particular, the auxiliary first conductive pattern 404 is formed on the existing first conductive pattern On the case 403, the auxiliary connecting portion 406 is formed on the connecting portion 405 which is not covered by the insulating mound 415, and presents a double-layered conductive structure as shown in the right half R of FIG. And since the region 4142 of the reticle pattern 414 protrudes slightly from the insulating mound, the corresponding auxiliary connecting portion 406 is formed on the connecting portion 405, and a portion is formed on the insulating mound 415. The structure can ensure that the auxiliary connection portion 406 is electrically connected to the lower connection portion 405 to avoid disconnection thereof.

In addition, the second conductive pattern 407 and the bridging element 427 can also be formed in two steps. For example, when the bridging element 427 is made of a metal conductive material, the second conductive pattern 407 can be formed in the above two manners, and then the metal process is performed. A bridging element 427 is formed. The metal process is as shown in FIG. 8 of the first embodiment, and details are not described herein again.

Referring to FIG. 11 , a second conductive pattern 407 and a bridging element 427 can be formed on the substrate 401 by using the above method, wherein the second conductive patterns 407 of each group are misaligned with the first conductive patterns 403 of each group and Electrically insulated from each other. Each of the bridging elements 427 is formed on each of the insulating mounds 415 such that the second conductive patterns 407 in the same group are electrically connected to the adjacent second conductive patterns 407 through the bridging elements 427.

The capacitive touch screen of this embodiment can also be configured such that both the first direction 409 and the second direction 411 are double-layered ITO. That is, while forming the first conductive pattern 403 and the connecting portion 405 by using a lithography and etching process, a second auxiliary conductive pattern (not shown) insulated from each other may be formed in the second direction 411, and then an insulating hill is formed. The method is the same as described above, and finally the second conductive pattern 407, the auxiliary first conductive pattern 404 and the auxiliary connecting portion 406 are formed by using the mask shown in the left half of FIG.

In addition, the first direction 409 and the second direction 411 of the embodiment are perpendicularly intersected, but the arrangement of the conductive patterns may be changed such that the first direction 409 and the second direction 411 form a non-perpendicular angle. Alternatively, in another embodiment of the present invention, the substrate 401 is rotated 90 degrees counterclockwise or clockwise, for example, the first conductive patterns 403 of each group are extended along the second direction 411. The second conductive patterns 407 of each group extend in the first direction 409. The step of the embodiment may further include forming a plurality of wires 408 and at least one alignment mark 410 on the edge of the substrate 401. For example, before forming each of the first conductive patterns 403 and the connecting portion 405, a plurality of strips are formed by a conventional metal process. The wire 408 is aligned with the alignment mark 410, but may be disposed between other steps without affecting other processes.

In the third embodiment of the present invention, the bridging element may be formed first, then the insulating mound is formed, and finally the first conductive pattern, the second conductive pattern and the connecting portion are simultaneously formed. 12 to FIG. 14 are schematic diagrams showing a third embodiment of a method for fabricating a capacitive touch screen according to the present invention, wherein FIG. 12 and FIG. 13 are divided into a left half L and a right half R, and a right half R is left. A schematic cross-sectional view of the half L along the tangent line EE'. Referring to FIG. 12, a plurality of bridging elements 527 are formed on a substrate 501, and then a plurality of insulating mounds 515 having a curvature are formed on the substrate 501 to cover the corresponding bridging elements 527, respectively, and the bridging elements are exposed. Part of both ends of 527. The material constituting the bridging member 527 may include a transparent conductive layer material or a metal material, and the formation thereof includes a conventional exposure and development process. The manner of forming the insulating mound 515 is the same as that described above, and will not be described here.

Referring to FIG. 13, a transparent conductive layer (not shown) is formed on the substrate 501, and the transparent conductive layer is patterned to simultaneously form a complex array of first conductive patterns 503, a plurality of second conductive patterns 507, and a plurality of connections. 505, the arrangement and location of the components are the same as those in FIG. 7. The first conductive patterns 503 located in the same group (rows) are electrically connected to the adjacent first conductive patterns 503 through the connecting portions 505 therebetween. The second conductive patterns 507 of each group are disposed offset from the first conductive patterns 503 of each group and electrically insulated from each other. Since a plurality of bridging elements 527 have been formed on the surface of the substrate 501, the adjacent second conductive patterns 507c, 507d can be electrically connected to each other through the bridging elements 527 located under the insulating mounds 515. As shown in FIG. 14, each of the first conductive patterns 503 in the same group extends through the respective connecting portions 505 in the first direction 509, and is located in the second group of the same group. The electrical pattern 507 extends through the bridging elements 527 buried under the insulating domes 515 in the second direction 511, and the array of detecting electrodes can provide a good touch screen structure.

Similarly, the first direction 509 and the second direction 511 of the embodiment are perpendicular to each other, but the arrangement of the conductive patterns may be changed such that the first direction 509 and the second direction 511 form a non-perpendicular angle. Alternatively, the substrate 501 is rotated 90 degrees counterclockwise or clockwise, for example, the first conductive patterns 503 of the respective groups are extended in the second direction 511, and the second conductive patterns 507 of the respective groups are extended along the first direction 509. The step of the embodiment may further include forming a plurality of wires 508 and at least one alignment mark 510 on the edge of the substrate 501. For example, when the bridge member 527 is made of metal, the bridge member 527 can be formed at the same time as the substrate. The 501 edge forms the wire 508 with the alignment mark 510, which eliminates a single step and assists in the positional correction of subsequent lithography processes. Of course, the formation of the individual wires 508 and the alignment marks 510 can also be disposed between other steps without affecting other processes.

Therefore, the capacitive touch screen according to the third embodiment of the present invention, as shown in FIG. 13 and FIG. 14, includes a substrate 501, a plurality of arrays of first conductive patterns 503, and a plurality of arrays of second conductive patterns 507. A plurality of connecting portions 505, a plurality of bridging members 527, and a plurality of insulating mounds 515 are disposed on the same side of the substrate 501. Each of the insulating mounds 515 covers each of the bridging elements 527 and exposes portions of the bridging elements 527, and the connecting portions 505 are bridged over the insulating mounds 515. Each of the insulating mounds 515 is not limited to the arcuate insulator formed by the above-described manufacturing method, but should also include insulating blocks of various shapes. Each set of first conductive patterns 503 are respectively arranged along the first direction 509, and each set of second conductive patterns 507 are respectively arranged along the second direction 511. The first conductive patterns 503 in the same group are electrically connected to the adjacent first conductive patterns 503 through the connecting portions 505; and the second conductive patterns 507 in the same group are buried in the insulating layers. The bridging elements 527 below the 515 are electrically connected to the adjacent second conductive patterns 507.

In summary, the present invention provides a method for fabricating a capacitive touch screen with a small number of layers and high transmittance, which has a special bridging structure, can effectively reduce the thickness and the number of stacked layers, and solve the conventional technology. The problem of low light transmittance and complicated process.

In addition, the insulating mound structure used in the manufacturing process of the present invention has a curved curvature, so that the connecting portion or the bridging element is formed along the mound surface thereof to produce a circular arc-shaped bridging structure. In this way, it can be avoided that the conventional bridging device is likely to cause breakage or poor contact under a vertical or angular bottom structure, which can greatly improve the product yield and service life.

In addition, the present invention contemplates compatibility of the first conductive pattern, the second conductive pattern, the connection portion and the bridging element with each other in the process, thus providing various forms of formation of the bridging element and being applicable to various bridging element materials. When the first conductive pattern, the second conductive pattern and the connecting portion are transparent conductive materials such as ITO, and the bridging element is also ITO, since the patterning process cannot be directly performed with the same etching liquid, the first embodiment of the present invention 4 and FIG. 5, a manner of forming a bridging element is provided to form a hole having an inclined inner wall, so that when the conductive film is sputtered, the conductive film is not deposited on the inner wall of the hole, so that the photoresist layer can be directly removed. Instead of the conductive film thereon, the bridging elements are obtained, which do not affect the first conductive patterns, the second conductive patterns and the connecting portions under the photoresist layer.

When the bridging element is made of a metal material, the present invention provides an embodiment of the third embodiment in addition to the manner provided by the first embodiment. Since the metal and the ITO layer have an etching selectivity ratio, when the first conductive pattern, the second conductive pattern and the connecting portion are ITO, and the second conductive film is made of a metal material, the metal can be directly transmitted through a conventional patterned metal. The process of forming the bridging element does not affect the formation of the first conductive pattern, the second conductive pattern and the connection portion. Moreover, the conductivity of the metal is much higher than that of the conventional transparent film such as ITO. Therefore, the metal material is used as the material of the bridge component, which can reduce the resistance value of each connection electrode and greatly improve the sensitivity of the touch panel.

Based on the above advantages, the present invention not only provides a structure and a manufacturing method of a low-layer high-transmittance capacitive touch screen with simple steps, but also considers various manufacturing levels, is suitable for materials of various bridging components, and provides a good circle. The arc structure ensures the integrity of its bridging structure, making the process an excellent usability.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

301,401,501‧‧‧substrate

303,403,503‧‧‧first conductive pattern

404‧‧‧Assisted first conductive pattern

305, 405, 505 ‧ ‧ connection

406‧‧‧Auxiliary Connections

307,407,507‧‧‧second conductive pattern

308,408,508‧‧‧ wire

414‧‧‧mask pattern

4141, 4142 4143, 4144‧‧‧ Area

315,415,515‧‧‧Insert Hill

317‧‧‧Photoresist layer

319‧‧‧Bake process

321‧‧‧ hole

323‧‧‧ sloping inner wall

309,409,509‧‧‧First direction

310,410,510‧‧‧ alignment marks

311,411,511‧‧‧second direction

313‧‧‧resist pattern

325‧‧‧Electrical film

327,427,527‧‧‧Bridge components

329‧‧‧metal layer

FIG. 1 to FIG. 8 illustrate a first embodiment of a method for fabricating a capacitive touch screen according to the present invention.

FIG. 9 to FIG. 11 illustrate a second embodiment of a method for fabricating a capacitive touch screen according to the present invention.

12 to FIG. 14 illustrate a third embodiment of a method for fabricating a capacitive touch screen according to the present invention.

301‧‧‧Substrate

303‧‧‧First conductive pattern

305‧‧‧Connecting Department

307‧‧‧Second conductive pattern

308‧‧‧Wire

309‧‧‧First direction

310‧‧‧ alignment mark

311‧‧‧ second direction

315‧‧‧Insert Hill

327‧‧‧Bridge components

Claims (42)

A method for manufacturing a touch panel, comprising: providing a substrate; forming, on the substrate, a first conductive pattern arranged in a first direction, a second conductive pattern arranged in a second direction, and a plurality of a connecting portion, wherein each of the first conductive patterns in the same group is electrically connected to each adjacent first conductive pattern through each of the connecting portions, and the second conductive pattern of each of the groups and the first of the groups The conductive patterns are misaligned and electrically insulated from each other; a plurality of insulating hills having a curvature are formed on the substrate to cover at least a portion of each of the connecting portions; and a plurality of bridging elements are formed on each of the insulating hills so that the plurality of bridging elements are located Each of the second conductive patterns of the same group is electrically connected to each of the adjacent second conductive patterns through each of the bridging elements; wherein the step of forming the bridging elements comprises: forming a patterned mask on the substrate a layer, wherein the patterned mask layer has a plurality of holes that are tapered from bottom to top, and each of the holes respectively exposes each of the insulating mounds and portions of the second conductive patterns; Forming a conductive film covering the patterned mask layer and each of the insulating mounds and portions of the second conductive patterns in the holes respectively; and removing the patterned mask layer and the conductive film thereon Wherein each of the holes which are tapered from the bottom to the top has an inclined inner wall, and the angle between the inclined inner wall and the surface of the substrate is less than 90 degrees. The method of claim 1, wherein each of the first conductive patterns in the same group is formed simultaneously with each of the connecting portions. The method of claim 1, wherein the step of forming the insulating hills comprises: forming a photoresist layer; Performing a lithography process on the photoresist layer to form a plurality of photoresist patterns respectively covering the connection portions; and performing a baking process such that each of the photoresist patterns forms each of the insulating hills having an arc. The method of claim 3, wherein the baking process temperature ranges from 200 to 300 °C. The method of claim 3, wherein the baking process has a baking time of 1 hour. The method of claim 1, wherein the forming the insulating hills comprises: forming an insulating layer on the substrate; etching the insulating layer to form a plurality of insulating patterns respectively covering the connecting portions; and performing a The thermal reflow process is such that each of the insulating patterns respectively forms each of the insulating mounds having an arc. The method of claim 1, wherein the step of forming the insulating mounds comprises an inkjet coating process. The method of claim 1, wherein the first conductive patterns, the second conductive patterns, and the connecting portions are made of a transparent conductive material. The method of claim 1, wherein the step of forming the bridging elements comprises: forming a metal layer on the substrate; and patterning the metal layers to form the bridging elements, respectively. The method of claim 1, wherein the step of forming the patterned mask layer comprises: forming a photoresist layer on the substrate; performing an exposure process on the photoresist layer; performing a baking process; A photoresist process is performed on the photoresist layer to form the patterned mask layer. The method of claim 10, wherein the baking process heats the photoresist layer through the substrate in a thermally conductive manner. The method of claim 10, wherein the photoresist layer comprises a peel-off photoresist material. The method of claim 10, wherein the baking process has a temperature in the range of 80 to 120 °C. The method of claim 10, wherein the baking process has a baking time of 90 seconds. The method of claim 1, wherein the material constituting the conductive film comprises a metal or a transparent conductive material. The method of claim 1, wherein the method of forming the conductive film comprises an anisotropic deposition process. The method of claim 1, further comprising: forming a plurality of wires on the edge of the substrate, wherein one end of each of the wires is connected to each of the first conductive patterns and the second conductive patterns, and the other end is extended to The edge of the substrate. The method of claim 17, wherein the step of forming each of the wires further comprises forming at least one alignment mark on an edge of the substrate. The method of claim 1, wherein the first direction has an angle with the second direction. The method of claim 19, wherein the included angle is a right angle. A method for manufacturing a touch panel, comprising: providing a substrate; forming, on the substrate, a first conductive pattern arranged in a first direction and a plurality of connecting portions, wherein each of the first conductive patterns in the same group The first conductive pattern is electrically connected to each adjacent through the connecting portion; a plurality of insulating hills having a curvature are formed on the substrate, at least a portion of each of the connection portions; and a second conductive pattern arranged in a second direction and a plurality of bridging elements on the substrate, wherein the second conductive pattern of each of the groups and the first of the groups The conductive patterns are misaligned and electrically insulated from each other, and each of the bridging elements is formed on each of the insulating mounds such that each of the second conductive patterns in the same group passes through each of the bridging elements and the adjacent second The conductive pattern is electrically connected; wherein the step of forming the bridging elements and the second conductive patterns comprises: forming a patterned mask layer on the substrate, wherein the patterned mask layer has a plurality of bottom-up a tapered hole, wherein each of the holes respectively exposes a region where the bridging element and the second conductive patterns are to be formed; forming a conductive film on the substrate, respectively covering the patterned mask layer and forming the layer And a second conductive pattern; and removing the patterned mask layer and the conductive film thereon; wherein each of the bottom-up tapered holes has an inclined inner wall, and the tilt Wall and the substrate surface an angle of less than 90 degrees. The method of claim 21, wherein each of the first conductive patterns in the same group is formed simultaneously with each of the connecting portions. The method of claim 21, wherein the forming the insulating hills comprises: forming a photoresist layer; performing a lithography process on the photoresist layer to form a plurality of photoresist patterns respectively covering the connections And performing a baking process such that each of the photoresist patterns respectively forms each of the insulating mounds having an arc. For example, the method of claim 23, wherein the baking process temperature The range is from 200 to 300 °C. The method of claim 23, wherein the baking process has a baking time of 1 hour. The method of claim 21, wherein the forming the insulating hills comprises: forming an insulating layer on the substrate; etching the insulating layer to form a plurality of insulating patterns respectively covering the connecting portions; and performing a The thermal reflow process is such that each of the insulating patterns respectively forms each of the insulating mounds having an arc. The method of claim 21, wherein the step of forming the insulating mounds comprises an inkjet coating process. The method of claim 21, wherein the first conductive patterns, the second conductive patterns, and the connecting portions are made of a transparent conductive material. The method of claim 21, wherein the forming the bridging elements comprises: forming a metal layer on the substrate; and patterning the metal layers to form the bridging elements, respectively. The method of claim 21, wherein the step of forming the patterned mask layer comprises: forming a photoresist layer on the substrate; performing an exposure process on the photoresist layer; performing a baking process; The photoresist layer is subjected to a development process to form the patterned mask layer. The method of claim 30, wherein the baking process heats the photoresist layer through the substrate in a thermally conductive manner. The method of claim 30, wherein the photoresist layer comprises a peel-off photoresist material. The method of claim 30, wherein the baking process has a temperature in the range of 80 to 120 °C. The method of claim 30, wherein the baking process has a baking time of 90 seconds. The method of claim 21, wherein the material constituting the conductive film comprises a transparent conductive material. The method of claim 21, wherein the method of forming the conductive film comprises an anisotropic deposition process. The method of claim 21, wherein the forming the first conductive pattern and the plurality of connecting portions comprises: forming an auxiliary second conductive pattern in the second direction, wherein the second conductive patterns are located in the auxiliary On the two conductive patterns. The method of claim 37, wherein the step of forming the bridging element and the second conductive pattern comprises: depositing a conductive film on the substrate; depositing a photoresist layer on the conductive film; And the etching process, the conductive film respectively forming the second conductive patterns, the bridging elements, the plurality of auxiliary first conductive patterns, and the plurality of auxiliary connecting portions, wherein the auxiliary first conductive patterns are correspondingly formed on And the auxiliary connecting portions are correspondingly formed on the connecting portions not covered by the insulating mounds; and the photoresist layer is removed. The method of claim 21, further comprising: forming a plurality of wires on the edge of the substrate, wherein one end of each of the wires is connected to each of the first conductive patterns and each of the second conductive patterns, and the other end is extended to The edge of the substrate. The method of claim 39, wherein the step of forming each of the wires further comprises forming at least one alignment mark on an edge of the substrate. The method of claim 21, wherein the first direction has an angle with the second direction. The method of claim 41, wherein the included angle is a right angle.