TWI411570B - - Google Patents

Info

Publication number
TWI411570B
TWI411570B TW98126384A TW98126384A TWI411570B TW I411570 B TWI411570 B TW I411570B TW 98126384 A TW98126384 A TW 98126384A TW 98126384 A TW98126384 A TW 98126384A TW I411570 B TWI411570 B TW I411570B
Authority
TW
Taiwan
Prior art keywords
metal
micro
etch
interfaces
structure element
Prior art date
Application number
TW98126384A
Other languages
Chinese (zh)
Other versions
TW201105569A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98126384A priority Critical patent/TW201105569A/en
Publication of TW201105569A publication Critical patent/TW201105569A/en
Application granted granted Critical
Publication of TWI411570B publication Critical patent/TWI411570B/zh

Links

Abstract

Disclosed is a method of forming a metal micro-structure, which is suitable for micro-structure element process. Upon forming three-dimensional metal micro-structure on micro-structure elements by using the method in this invention, it needs neither to electroplate a second metal to enclose the metal periphery, nor to etch the second metal. It can decrease the residual stress caused by electroplating and residual stress is free between the metal layers, so that the substrate adhered by the metal will not deform, incurring no influence on subsequent processing of the micro-structure element. Because it is no need to etch the second metal, there is no problem of etchant infiltrating into the interfaces, thereby no fears of decreasing adhesion between the interfaces and influencing the function of micro-structure element.
TW98126384A 2009-08-05 2009-08-05 Method of forming a metal micro-structure TW201105569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98126384A TW201105569A (en) 2009-08-05 2009-08-05 Method of forming a metal micro-structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98126384A TW201105569A (en) 2009-08-05 2009-08-05 Method of forming a metal micro-structure

Publications (2)

Publication Number Publication Date
TW201105569A TW201105569A (en) 2011-02-16
TWI411570B true TWI411570B (en) 2013-10-11

Family

ID=44814071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98126384A TW201105569A (en) 2009-08-05 2009-08-05 Method of forming a metal micro-structure

Country Status (1)

Country Link
TW (1) TW201105569A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6400446B2 (en) * 2014-11-28 2018-10-03 Ｔｏｗａ株式会社 Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020142508A1 (en) * 1999-11-10 2002-10-03 Em Microelectronic-Marin Sa Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant
TW523487B (en) * 2002-01-22 2003-03-11 Ind Tech Res Inst Micro-electroforming mold core using pre-formed metal as substrate and its fabrication method
US20050000932A1 (en) * 2003-01-23 2005-01-06 Gabriel Kaigham J. Multi-metal layer MEMS structure and process for making the same
TW200621625A (en) * 2004-11-23 2006-07-01 Hewlett Packard Development Co Method of manufacturing a microstructure
CN1799986A (en) * 2004-12-30 2006-07-12 中国科学院微电子研究所 Three-layer production process for high aspect ratio, deep submicro nanometer metal structure
TWI291452B (en) * 2004-12-21 2007-12-21 Touchdown Technologies Inc Process for forming microstructures

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020142508A1 (en) * 1999-11-10 2002-10-03 Em Microelectronic-Marin Sa Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant
TW523487B (en) * 2002-01-22 2003-03-11 Ind Tech Res Inst Micro-electroforming mold core using pre-formed metal as substrate and its fabrication method
US20050000932A1 (en) * 2003-01-23 2005-01-06 Gabriel Kaigham J. Multi-metal layer MEMS structure and process for making the same
TW200621625A (en) * 2004-11-23 2006-07-01 Hewlett Packard Development Co Method of manufacturing a microstructure
TWI291452B (en) * 2004-12-21 2007-12-21 Touchdown Technologies Inc Process for forming microstructures
CN1799986A (en) * 2004-12-30 2006-07-12 中国科学院微电子研究所 Three-layer production process for high aspect ratio, deep submicro nanometer metal structure

Also Published As

Publication number Publication date
TW201105569A (en) 2011-02-16

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