TWI409002B - Electronic apparatus - Google Patents
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- TWI409002B TWI409002B TW99141797A TW99141797A TWI409002B TW I409002 B TWI409002 B TW I409002B TW 99141797 A TW99141797 A TW 99141797A TW 99141797 A TW99141797 A TW 99141797A TW I409002 B TWI409002 B TW I409002B
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本發明是有關於一種電子裝置，且特別是有關於一種可防止漏電流逆流至殼體上的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device that prevents leakage current from flowing back to the housing.
圖1A為傳統之電子裝置的示意圖。請參考圖1A，電子裝置100a包括一金屬殼體110、一主機板120及一電源線130。主機板120位於金屬殼體110內，並與金屬殼體110電性連接。電源線130連接主機板120，用以傳遞電能於主機板120上。1A is a schematic diagram of a conventional electronic device. Referring to FIG. 1A , the electronic device 100 a includes a metal housing 110 , a motherboard 120 , and a power cord 130 . The motherboard 120 is located in the metal housing 110 and is electrically connected to the metal housing 110. The power line 130 is connected to the motherboard 120 for transmitting electrical energy to the motherboard 120.
一般來說，電源線130通常會具有一接地端GN，且主機板120的接地端會與電源線130的接地端GN電性連接，如此一來，當主機板120產生漏電流Ic時，漏電流Ic便可透過電源線130的接地端GN流向大地而被釋放。Generally, the power line 130 usually has a grounding end GN, and the grounding end of the motherboard 120 is electrically connected to the grounding end GN of the power cord 130. Thus, when the motherboard 120 generates a leakage current Ic, the leakage occurs. The current Ic can be released through the ground terminal GN of the power line 130 to the ground.
然而，電源線130在安插於插座時，若電源線130的接地端GN並未接地，則漏電流Ic便無法得到釋放而會逆流回主機板120上，此時，由於主機板120與金屬殼體110電性連接，因此漏電流Ic便會流向金屬殼體110上，如此一來，使用者在觸碰金屬殼體110時便能會產生觸電的感覺。However, when the power line 130 is inserted into the socket, if the ground terminal GN of the power line 130 is not grounded, the leakage current Ic cannot be released and will flow back to the motherboard 120. At this time, due to the motherboard 120 and the metal shell The body 110 is electrically connected, so that the leakage current Ic flows to the metal casing 110, so that the user can feel the electric shock when the metal casing 110 is touched.
圖1B為傳統之另一電子裝置的示意圖。請參考圖1B，為了改善前述電子裝置100a所可能產生的問題，電子裝置100b更包括了一絕緣材料140，其中絕緣材料140位於主機板120與金屬殼體110之間。如此一來，漏電流Ic若逆流回主機板120時，由於主機板120與金屬殼體110已被絕緣材料140所電性絕緣，因此漏電流Ic便無法流向金屬殼體110上。然而，在主機板120與金屬殼體110非平面處的地方可能會發生漏電的問題，或是主機板與金屬殼體相距過短時會產生感應起電，從而影響到電性表現。FIG. 1B is a schematic diagram of another conventional electronic device. Referring to FIG. 1B , in order to improve the problems that may occur in the foregoing electronic device 100 a , the electronic device 100 b further includes an insulating material 140 , wherein the insulating material 140 is located between the motherboard 120 and the metal casing 110 . As a result, when the leakage current Ic flows back to the motherboard 120, since the motherboard 120 and the metal casing 110 are electrically insulated by the insulating material 140, the leakage current Ic cannot flow to the metal casing 110. However, leakage may occur at the non-planar surface of the motherboard 120 and the metal casing 110, or when the motherboard is too short from the metal casing, induced electrification may occur, thereby affecting electrical performance.
此外，為了避免使用者發生觸電的感覺，亦可將絕緣材料塗滿整個金屬殼體110上，然而此舉將會造成製作成本的增加，以及降低金屬殼體110的整體質感。In addition, in order to avoid the user's feeling of electric shock, the insulating material may be coated on the entire metal casing 110. However, this will result in an increase in manufacturing cost and a reduction in the overall texture of the metal casing 110.
本發明提供一種電子裝置，其可避免使用者在觸碰機殼時產生觸電的感覺。The present invention provides an electronic device that avoids the feeling of electric shock when a user touches the casing.
本發明提出一種電子裝置，其至少包括一機殼、一電路板及一具高頻導通性之電子元件。電路板具有一第一部份與一第二部分，其中第一部份與機殼電性連接，而第二部分電性連接於一接地端。具高頻導通性之電子元件跨接於電路板之第一部分與第二部分之間。第一部份與第二部份之間除具高頻導通性之電子元件所建立之電性連接之外無電性連接。The invention provides an electronic device comprising at least a casing, a circuit board and an electronic component with high frequency conductivity. The circuit board has a first portion and a second portion, wherein the first portion is electrically connected to the casing, and the second portion is electrically connected to a ground. The high frequency conductive electronic component is connected between the first portion and the second portion of the circuit board. There is no electrical connection between the first part and the second part except for the electrical connection established by the electronic component with high-frequency conductivity.
在本發明之一實施例中，具高頻導通性之電子元件為一電容、一暫態電壓抑制器、一突波抑制器或一突波吸收器。In an embodiment of the invention, the electronic component with high frequency conductivity is a capacitor, a transient voltage suppressor, a surge suppressor or a surge absorber.
在本發明之一實施例中，當一交流電訊號傳遞至具高頻導通性之電子元件時，具高頻導通性之電子元件為一短路狀態，以讓交流電訊號通過具高頻導通性之電子元件。In an embodiment of the present invention, when an AC signal is transmitted to an electronic component having high-frequency conductivity, the electronic component having high-frequency conductivity is in a short-circuit state, so that the AC signal passes through the electron having high-frequency conductivity. element.
在本發明之一實施例中，當一直流電訊號傳遞至具高頻導通性之電子元件時，具高頻導通性之電子元件為一開路狀態，以使直流電訊號無法通過具高頻導通性之電子元件。In an embodiment of the present invention, when the galvanic signal is transmitted to the electronic component having high-frequency conductivity, the electronic component with high-frequency conductivity is in an open state, so that the DC signal cannot pass the high-frequency conductivity. Electronic component.
在本發明之一實施例中，機殼為一金屬機殼。In an embodiment of the invention, the casing is a metal casing.
在本發明之一實施例中，電路板包括一第一子電路板與一第二子電路板，其中第一子電路板與第二子電路板實體分離，且第一子電路板為第一部份，而第二子電路板為第二部分。In an embodiment of the invention, the circuit board includes a first sub-board and a second sub-board, wherein the first sub-board is physically separated from the second sub-board, and the first sub-board is first Part, and the second sub-board is the second part.
在本發明之一實施例中，電子裝置為一筆記型電腦。In an embodiment of the invention, the electronic device is a notebook computer.
基於上述，本發明之電子裝置透過將具高頻導通性之電子元件跨接於電路板之第一部分與第二部分之間，其中第一部份與第二部分電性不連接，且具高頻導通性之電子元件可用以吸收或濾除直流電訊號，如此可避免屬於直流電訊號的漏電流逆流回電路板時而流向機殼上，從而減少使用者碰觸機殼時產生觸電的機會。另外，由於具高頻導通性之電子元件可用以讓交流電訊號通過，因此機殼上屬於交流電訊號的靜電荷便可通過第一部份與具高頻導通性之電子元件而傳遞至第二部分上，順利地將靜電荷經由機殼之接地端導出。Based on the above, the electronic device of the present invention is connected between the first portion and the second portion of the circuit board by connecting the electronic component with high-frequency conductivity, wherein the first portion and the second portion are electrically disconnected and have a high The frequency-conducting electronic component can be used to absorb or filter the DC signal, so that the leakage current belonging to the DC signal flows back to the circuit board when flowing back to the circuit board, thereby reducing the chance of electric shock when the user touches the casing. In addition, since the electronic component with high-frequency conductivity can be used to pass the AC signal, the static charge of the AC signal on the casing can be transmitted to the second part through the first part and the electronic component with high-frequency conductivity. On the top, the static charge is smoothly discharged through the ground of the casing.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
一般來說，採用金屬作為電子裝置(如：筆記型電腦)的殼體時，容易受到外部的影響或是電子裝置內部的漏電流逆流回殼體的影響，而使得殼體表面上累積過多的靜電荷。如此一來，使用者在使用電子裝置而觸碰殼體時，殼體上累積過多的靜電荷便會流向使用者進行釋放，而造成使用者產生觸電的感覺。然而，分佈於殼體表面的靜電荷通常為交流電訊號，而電子裝置內部的漏電流通常為直流電訊號，因此針對此特性，本實施例可透過使用一具高頻導通性之電子元件，其中交流電訊號可通過此具高頻導通性之電子元件，而直流電訊號則會被此具高頻導通性之電子元件所吸收或濾除，如此一來便可避免屬於直流電訊號的漏電流逆流回殼體上，或者是可適當地釋放殼體上屬於交流電訊號的靜電荷從而可避免使用者在接觸殼體時產生觸電的感覺，以下將詳細說明本實施例之結構及其作動方式。In general, when a metal is used as a casing of an electronic device (such as a notebook computer), it is susceptible to external influences or leakage current inside the electronic device flows back to the casing, and excessive accumulation of the casing surface is caused. Static charge. In this way, when the user touches the casing by using the electronic device, excessive static charge accumulated on the casing will flow to the user for release, causing the user to feel the electric shock. However, the static charge distributed on the surface of the casing is usually an alternating current signal, and the leakage current inside the electronic device is usually a direct current signal. Therefore, for this characteristic, the embodiment can use a high-frequency conductive electronic component, wherein the alternating current The signal can pass through the high-frequency conductive electronic component, and the DC signal is absorbed or filtered by the high-frequency conductive electronic component, so that the leakage current belonging to the DC signal can be prevented from flowing back to the housing. In the above, the electrostatic charge belonging to the alternating current signal on the casing can be appropriately released to avoid the feeling of electric shock when the user touches the casing. The structure of the embodiment and the manner of its operation will be described in detail below.
圖2為本發明一實施例之電子裝置的局部剖示圖，而圖3為圖2之具高頻導通性之電子元件配置於電路板上的局部俯視圖，其中本實施例之電子裝置是以筆記型電腦作為舉例，但不限於此，其亦可以是其他可能的電子裝置。請參考圖2，本實施例之電子裝置200至少包括一機殼210、一電路板220及一具高頻導通性之電子元件230。在本實施例中，機殼210是採用一金屬機殼，其材質例如是質地輕盈的鋁鎂合金、或是其他質感佳且成本低廉的金屬材料，在此，本發明並不特別限定機殼的材質。2 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention, and FIG. 3 is a partial plan view of the high-frequency-conducting electronic component of FIG. 2 disposed on a circuit board, wherein the electronic device of the embodiment is The notebook computer is exemplified by, but not limited to, other possible electronic devices. Referring to FIG. 2, the electronic device 200 of the embodiment includes at least a casing 210, a circuit board 220, and a high-frequency conductive electronic component 230. In this embodiment, the casing 210 is made of a metal casing, and the material thereof is, for example, a lightweight aluminum-magnesium alloy or other metal materials having good texture and low cost. Here, the invention is not particularly limited to the casing. Material.
另外，位於電子裝置200內的電路板220具有一第一部份222與一第二部分224，其中第一部份222與機殼210電性連接，而第二部分224電性連接於一接地端GN，如圖2所示。一般來說，電路板220在電子裝置200被使用時或是電子裝置200處於待機的狀態時，電路板220上通常會產生漏電流Ic，而此漏電流Ic通常會被導向第二部分224電性連接於一電源線240的接地端GN上，以進行釋放，其中若此電源線240的接地端GN接地時，則此漏電流Ic便可流向大地而被釋放掉。反之，此電源線240的接地端若未接地時，則此漏電流Ic便會逆流回電路板220上。此外，若漏電流Ic逆流回電路板220，且電路板220本身若與機殼210電性連接時，便會造成前述之使用者產生觸電的感覺。In addition, the circuit board 220 located in the electronic device 200 has a first portion 222 and a second portion 224. The first portion 222 is electrically connected to the casing 210, and the second portion 224 is electrically connected to a ground. End GN, as shown in Figure 2. Generally, when the electronic device 200 is used or when the electronic device 200 is in the standby state, the leakage current Ic is usually generated on the circuit board 220, and the leakage current Ic is usually directed to the second portion 224. The connection is made to the ground terminal GN of a power line 240 for release. If the ground terminal GN of the power line 240 is grounded, the leakage current Ic can flow to the ground and be released. Conversely, if the ground terminal of the power line 240 is not grounded, the leakage current Ic will flow back to the circuit board 220. In addition, if the leakage current Ic flows back to the circuit board 220, and the circuit board 220 itself is electrically connected to the casing 210, the user may feel the electric shock.
因此，本實施例先將電路板220區分為與機殼210電性連接的第一部份222以及與電源線240之接地端GN電性連接的第二部份224，其中第一部份222與第二部分224電性不連接，如此便可先避免屬於直流電訊號的漏電流Ic逆流回電路板220時而流向機殼210上，從而造成使用者碰觸時產生觸電的問題。另外，為了同時避免機殼210受到外部影響而累積累積過多的靜電荷，而造成使用者在碰觸機殼210時仍會產生觸電的可能性，因此本實施例便透過使用一具高頻導通性之電子元件230，使得機殼210上屬於交流電訊號的靜電荷得以被釋放至電路板220上，而逆流回電路板220的漏電流Ic無法流至機殼210上，以下將詳細說明具高頻導通性之電子元件230用於本實施例之電子裝置200的作動機制。Therefore, in this embodiment, the circuit board 220 is first divided into a first portion 222 electrically connected to the casing 210 and a second portion 224 electrically connected to the ground end GN of the power line 240, wherein the first portion 222 The second portion 224 is electrically disconnected, so that the leakage current Ic belonging to the DC signal can be prevented from flowing back to the circuit board 210 when it flows back to the circuit board 220, thereby causing a problem of electric shock when the user touches. In addition, in order to prevent the external capacitance of the casing 210 from being accumulated and accumulating excessive static charges, the possibility of electric shock is still generated when the user touches the casing 210. Therefore, the present embodiment uses a high-frequency conduction. The electronic component 230 causes the static charge belonging to the alternating current signal on the casing 210 to be released onto the circuit board 220, and the leakage current Ic flowing back to the circuit board 220 cannot flow to the casing 210, which will be described in detail below. The frequency-conducting electronic component 230 is used in the actuation mechanism of the electronic device 200 of the present embodiment.
請繼續參考圖2與圖3，具高頻導通性之電子元件230跨接於電路板220之第一部分222與第二部分224之間。在本實施例中，具高頻導通性之電子元件230例如是採用一電容、一暫態電壓抑制器、一突波抑制器或一突波吸收器，其中具高頻導通性之電子元件230可使得交流電訊號通過其中，並同時可吸收或濾除直流電訊號，換言之，第一部份222與第二部份224之間除具高頻導通性之電子元件230所建立之電性連接之外無電性連接。Referring to FIG. 2 and FIG. 3 , the high frequency conductive electronic component 230 is connected between the first portion 222 and the second portion 224 of the circuit board 220 . In this embodiment, the high-frequency-conducting electronic component 230 is, for example, a capacitor, a transient voltage suppressor, a surge suppressor or a surge absorber, wherein the high-frequency conductive electronic component 230 The alternating current signal can be passed through, and at the same time, the direct current signal can be absorbed or filtered. In other words, the electrical connection between the first portion 222 and the second portion 224 except the electronic component 230 having high-frequency conductivity is established. No electrical connection.
詳細而言，當機殼210上的靜電荷(如：交流電訊號)透過與其電性連接的第一部分222而傳遞至具高頻導通性之電子元件230時，具高頻導通性之電子元件為一短路狀態，因此交流電訊號便會通過具高頻導通性之電子元件230，如此一來，機殼210上的靜電荷便可通過具高頻導通性之電子元件230而傳遞第二部分224上。意即是，對於交流電訊號(如：機殼210上的靜電荷)而言，第一部份222與第二部分224是呈現電性連接(電性導通)的狀態。基於上述可知，本實施例可透過具高頻導通性之電子元件230的特性使得機殼210上的靜電荷得以被釋放至電路板220上，從而可減少使用者在碰觸機殼210時產生觸電的機會。In detail, when the static charge (eg, an alternating current signal) on the casing 210 is transmitted to the electronic component 230 having high-frequency conductivity through the first portion 222 electrically connected thereto, the electronic component having high-frequency conductivity is In a short circuit state, the alternating current signal passes through the electronic component 230 having high frequency conductivity, so that the static charge on the casing 210 can be transmitted to the second portion 224 through the electronic component 230 having high frequency conductivity. . That is, for the alternating current signal (eg, static charge on the casing 210), the first portion 222 and the second portion 224 are in a state of being electrically connected (electrically conductive). Based on the above, the present embodiment can transmit the static charge on the casing 210 to the circuit board 220 through the characteristics of the high-frequency conductive electronic component 230, thereby reducing the occurrence of the user when the chassis 210 is touched. The chance of electric shock.
反之，當電源線240的接地端未接地而造成漏電流Ic(如：直流電訊號)逆流回電路板220之第二部分224上並傳遞至具高頻導通性之電子元件230時，具高頻導通性之電子元件為一開路狀態，因此直流電訊號被具高頻導通性之電子元件230所吸收或濾除，如此一來，逆流回電路板220之第二部分224上的漏電流Ic便無法通過具高頻導通性之電子元件230而傳遞第一部分222上，亦即是，對於直流電訊號(漏電流)而言，第一部份222與第二部分224是呈現電性不連接(開路狀態)。因此，具高頻導通性之電子元件230跨接於電路板220之第一部分222與第二部分224之間，便可避免漏電流Ic逆流回電路板220時，而流向機殼210上，從而降低使用者在碰觸機殼210時產生觸電的機會。On the other hand, when the ground terminal of the power line 240 is not grounded, the leakage current Ic (eg, the DC signal) flows back to the second portion 224 of the circuit board 220 and is transmitted to the electronic component 230 having high-frequency conductivity. The conductive electronic component is in an open state, so that the DC signal is absorbed or filtered by the high-conductivity electronic component 230, so that the leakage current Ic on the second portion 224 of the circuit board 220 is not returned to the circuit board 220. The first portion 222 is transferred through the electronic component 230 having high-frequency conductivity, that is, for the DC signal (leakage current), the first portion 222 and the second portion 224 are electrically disconnected (open state) ). Therefore, the high-frequency-conducting electronic component 230 is connected between the first portion 222 and the second portion 224 of the circuit board 220 to prevent the leakage current Ic from flowing back to the circuit board 220 and flowing to the casing 210. The chance of electric shock when the user touches the casing 210 is reduced.
在本實施例中，上述的電路板220可以是包括有一第一子電路板B1與一第二子電路板B2，其中第一子電路板B1與第二子電路板B2實體分離，且第一子電路板B1為第一部份222，而第二子電路板B2為第二部分224，如圖2與圖3所示。也就是說，電路板220可以是採用兩個子電路板B1、B2用來分別代表前述的第一部份222與第二部分224。在另一實施型態中，上述的第一子電路板B1與第二子電路板B2亦可以是實體連接，如圖4所繪示之電子裝置200’。在電子裝置200’中，第一子電路板B1與第二子電路板B2可以是屬於同一塊電路板，其中第一子電路板B1與第二子電路板B2之間具有一絕緣體250，以使第一子電路板B1與第二子電路板B2不直接接觸。In this embodiment, the circuit board 220 may include a first sub-board B1 and a second sub-board B2, wherein the first sub-board B1 and the second sub-board B2 are physically separated, and first The sub-board B1 is the first portion 222 and the second sub-board B2 is the second portion 224, as shown in FIGS. 2 and 3. That is, the circuit board 220 may employ two sub-circuit boards B1, B2 for respectively representing the aforementioned first portion 222 and second portion 224. In another embodiment, the first sub-board B1 and the second sub-board B2 may also be physically connected, such as the electronic device 200' illustrated in FIG. In the electronic device 200', the first sub-board B1 and the second sub-board B2 may belong to the same circuit board, wherein the first sub-board B1 and the second sub-board B2 have an insulator 250 therebetween. The first sub-board B1 and the second sub-board B2 are not in direct contact.
綜上所述，本發明之電子裝置至少具有下列優點及特點。首先，將電路板區分為與機殼電性連接的第一部份以及與電源線之接地端電性連接的第二部份，並將具高頻導通性之電子元件跨接於電路板之第一部分與第二部分之間，其中第一部份與第二部份之間除具高頻導通性之電子元件所建立之電性連接之外無電性連接。換言之，透過具高頻導通性之電子元件可用以吸收或濾除直流電訊號之特性，便可避免屬於直流電訊號的漏電流逆流回電路板時而流向機殼上，從而減少使用者碰觸機殼時產生觸電的機會。另外，由於具高頻導通性之電子元件可用以讓交流電訊號通過，因此機殼上屬於交流電訊號的靜電荷便可通過第一部份與具高頻導通性之電子元件而傳遞至第二部分上，順利地將靜電荷經由機殼之接地端導出。In summary, the electronic device of the present invention has at least the following advantages and features. First, the circuit board is divided into a first part electrically connected to the casing and a second part electrically connected to the ground end of the power line, and the electronic component with high-frequency conductivity is connected to the circuit board. Between the first portion and the second portion, there is no electrical connection between the first portion and the second portion except for the electrical connection established by the electronic component having high-frequency conductivity. In other words, the electronic component with high-frequency conductivity can be used to absorb or filter the characteristics of the DC signal, so that the leakage current belonging to the DC signal can be prevented from flowing back to the circuit board when flowing back to the circuit board, thereby reducing the user's touch on the casing. There is an opportunity for electric shock. In addition, since the electronic component with high-frequency conductivity can be used to pass the AC signal, the static charge of the AC signal on the casing can be transmitted to the second part through the first part and the electronic component with high-frequency conductivity. On the top, the static charge is smoothly discharged through the ground of the casing.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100a、100b、200‧‧‧電子裝置100a, 100b, 200‧‧‧ electronic devices
110‧‧‧金屬殼體110‧‧‧Metal housing
120‧‧‧主機板120‧‧‧ motherboard
130、240‧‧‧電源線130, 240‧‧‧ power cord
140‧‧‧絕緣材料140‧‧‧Insulation materials
210‧‧‧機殼210‧‧‧Shell
220‧‧‧電路板220‧‧‧Circuit board
222‧‧‧第一部份222‧‧‧ first part
224‧‧‧第二部分224‧‧‧Part II
230‧‧‧具高頻導通性之電子元件230‧‧‧High-conductivity electronic components
250‧‧‧絕緣體250‧‧‧Insulator
B1‧‧‧第一子電路板B1‧‧‧ first sub-board
B2‧‧‧第二子電路板B2‧‧‧Second sub-board
GN‧‧‧接地端GN‧‧‧ grounding terminal
Ic‧‧‧漏電流Ic‧‧‧ leakage current
圖1A為傳統之電子裝置的示意圖。1A is a schematic diagram of a conventional electronic device.
圖1B為傳統之另一電子裝置的示意圖。FIG. 1B is a schematic diagram of another conventional electronic device.
圖2為本發明一實施例之電子裝置的局部剖示圖。2 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention.
圖3為圖2之具高頻導通性之電子元件配置於電路板上的局部俯視圖。3 is a partial plan view showing the high-frequency-conducting electronic component of FIG. 2 disposed on a circuit board.
圖4為本發明另一實施例之電子裝置的局部剖示圖。4 is a partial cross-sectional view of an electronic device according to another embodiment of the present invention.
200．．．電子裝置200. . . Electronic device
210．．．機殼210. . . cabinet
220．．．電路板220. . . Circuit board
222．．．第一部份222. . . first part
224．．．第二部分224. . . the second part
230．．．具高頻導通性之電子元件230. . . High-frequency conductive electronic components
240．．．電源線240. . . power cable
B1．．．第一子電路板B1. . . First sub board
B2．．．第二子電路板B2. . . Second sub-board
GN．．．接地端GN. . . Ground terminal
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99141797A TWI409002B (en) | 2010-12-01 | 2010-12-01 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99141797A TWI409002B (en) | 2010-12-01 | 2010-12-01 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201225744A TW201225744A (en) | 2012-06-16 |
| TWI409002B true TWI409002B (en) | 2013-09-11 |
Family
ID=46726286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99141797A TWI409002B (en) | 2010-12-01 | 2010-12-01 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI409002B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060072298A1 (en) * | 2004-09-29 | 2006-04-06 | Ng Kok S | Ground plane having opening and conductive bridge traversing the opening |
| TW200721917A (en) * | 2005-11-25 | 2007-06-01 | Asustek Comp Inc | Electronic device capable of releasing ESD |
| US20080316118A1 (en) * | 2005-03-15 | 2008-12-25 | Fractus, S.A. | Slotted Ground-Plane Used as a Slot Antenna or Used For a Pifa Antenna |
-
2010
- 2010-12-01 TW TW99141797A patent/TWI409002B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060072298A1 (en) * | 2004-09-29 | 2006-04-06 | Ng Kok S | Ground plane having opening and conductive bridge traversing the opening |
| US20080316118A1 (en) * | 2005-03-15 | 2008-12-25 | Fractus, S.A. | Slotted Ground-Plane Used as a Slot Antenna or Used For a Pifa Antenna |
| TW200721917A (en) * | 2005-11-25 | 2007-06-01 | Asustek Comp Inc | Electronic device capable of releasing ESD |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201225744A (en) | 2012-06-16 |
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