TWI396432B - Image sensor module and method for manufacturing the same - Google Patents

Image sensor module and method for manufacturing the same Download PDF

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Publication number
TWI396432B
TWI396432B TW99111957A TW99111957A TWI396432B TW I396432 B TWI396432 B TW I396432B TW 99111957 A TW99111957 A TW 99111957A TW 99111957 A TW99111957 A TW 99111957A TW I396432 B TWI396432 B TW I396432B
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TW
Taiwan
Prior art keywords
light
shielding spacer
lens
layer
image sensor
Prior art date
Application number
TW99111957A
Other languages
Chinese (zh)
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TW201138429A (en
Inventor
Chuan Hui Yang
Hsin Chang Hsiung
Yi Chuan Lo
Han Yi Kuo
Original Assignee
Himax Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Himax Semiconductor Inc filed Critical Himax Semiconductor Inc
Priority to TW99111957A priority Critical patent/TWI396432B/en
Publication of TW201138429A publication Critical patent/TW201138429A/en
Application granted granted Critical
Publication of TWI396432B publication Critical patent/TWI396432B/en

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Description

Image sensing module and manufacturing method thereof

The invention relates to an image sensing module and a manufacturing method thereof, and in particular to an image sensing module with high structural strength and a manufacturing method thereof.

With the trend of miniaturization and low price of electronic products, the emergence of Wafer Level Module (WLM) technology has attracted much attention. The technology of wafer level modules is mainly to use wafer level manufacturing technology to miniaturize the size of electronic products and reduce costs. Among them, the technology of the wafer level module can also be applied to the lens of the image sensing module, so that the lens module can be reduced in volume compared with the conventional lens module, and can be applied to electronic devices (such as On the camera module of a notebook computer, mobile phone, etc.).

1 is a cross-sectional view of a conventional image sensing module using wafer level module technology. Referring to FIG. 1 , a conventional image sensing module 100 has an image sensing component 110 , a spacer 120 , and a lens component 130 . The spacer 120 has a through hole 122 for illuminating the lens component 130 . The image sensing element 110 can be illuminated via the via 122.

Since the joint area between the conventional image sensing element 110 and the spacer 120 or between the spacer 120 and the lens element 130 is small, there is a problem that the adhesion force is insufficient between each other. Therefore, during the subsequent processing or transportation process, the image sensing module 100 is easily damaged by the image sensing module 100 and the spacer 120 (or the spacer 120 and the lens component 130) is generated. The displacements are even separated from one another such that the imaging quality of the image sensing module 100 is reduced or the image sensing module 100 is damaged. In addition, the conventional separator 120 is usually made of a light-transmitting material such as glass or plastic. Therefore, when performing optical imaging, the flare easily penetrates the separator 120, so that the image sensing module 100 The proportion of noise is too large when imaging, which reduces the image quality.

The invention provides an image sensing module with high structural strength.

The invention provides a method for manufacturing an image sensing module, which can effectively fix components in the image sensing module.

The present invention provides an image sensing module having a light collection area and a non-light collection area. The image sensing module includes an image sensor, a first light shielding spacer, a lens layer, and a fixed housing. The first light shielding spacer is disposed on the image sensor and located in the non-light collecting region, and the first light shielding spacer has a first through hole, and the first through hole exposes the image sensor in the light collecting region part. The lens layer is disposed on the first light shielding spacer and covers the first through hole. The lens layer includes a transparent substrate and a first lens. The first lens is disposed on the transparent substrate and located in the light collecting region. The fixed housing continuously covers the image sensor, the first light shielding spacer and the sidewall of the lens layer, and the fixed housing is located in the non-light collecting region, and the material of the fixing housing comprises a thermosetting material.

In an embodiment of the invention, the fixed housing conformally covers the image sensor, the first light-shielding spacer and the sidewall of the lens layer.

In an embodiment of the invention, the fixed housing is a single layer structure or a multilayer structure.

In one embodiment of the invention, the thermoset material is an opaque material.

In an embodiment of the invention, the stationary housing includes a layer of opaque material.

In one embodiment of the invention, the fixed housing has a thickness greater than about 10 microns.

In an embodiment of the invention, the transparent substrate has a first surface and a second surface, and the first surface faces the image sensor, and the lens layer further includes a second lens, the first lens and the second The lenses are disposed on the first surface and the second surface, respectively.

In an embodiment of the invention, the first lens is a concave lens or a convex lens.

In an embodiment of the invention, the material of the first light shielding spacer comprises an opaque material.

In an embodiment of the present invention, the image sensing module further includes a second light-shielding spacer and a transparent cover, wherein the second light-shielding spacer is disposed on the transparent substrate and located in the non-light-collecting region. The second light shielding spacer has a second through hole, the second through hole exposing a portion of the transparent substrate located in the light collecting region, and the transparent cover plate is disposed on the second light shielding spacer and covering the second through hole The fixed housing further covers the second light shielding spacer and the sidewall of the transparent cover.

In an embodiment of the invention, the transparent cover has a third surface away from the transparent substrate, and the fixed housing further covers a portion of the third surface that is not in the light collecting region.

In an embodiment of the present invention, the image sensing module further includes an aperture structure disposed on a third surface of the transparent cover plate remote from the transparent substrate, and the aperture structure has an opening, and the opening exposes the light transmission The portion of the substrate that is located in the collection region.

In an embodiment of the invention, the image sensing module further includes an adhesive layer disposed between the transparent substrate and the first light shielding spacer.

The invention provides a method for fabricating an image sensing module as follows. The image sensing module has a collecting region and a non-collecting region. First, an image sensor, a first light-shielding spacer, and a lens layer are provided. The first light shielding spacer is disposed on the image sensor and located in the non-light collecting region, and the first light shielding spacer has a first through hole, and the first through hole exposes the image sensor in the light collecting region The lens layer is disposed on the first light-shielding spacer and covers the first through-hole. The lens layer includes a transparent substrate and a first lens. The first lens is disposed on the transparent substrate and located in the light collecting region. Then, a fixed housing is formed on the sidewalls of the image sensor, the first light shielding spacer and the lens layer, and the fixed housing is located in the non-light collecting region, and the material of the fixing housing comprises a thermosetting material.

In one embodiment of the invention, a method of forming a fixed housing includes spraying a thermoset material over the sidewalls of the image sensor, the first light-shielding spacer and the lens layer, and heat curing the thermoset material.

In one embodiment of the invention, the thermosetting material conformally and continuously covers the image sensor, the first light-shielding spacer, and the sidewalls of the lens layer when the thermosetting material is sprayed.

In an embodiment of the present invention, the method for fabricating the image sensing module further includes forming a protective layer on a surface of the lens layer away from the first light-shielding spacer before the thermosetting material is sprayed, and the protective layer is at least in the set In the light zone, and after spraying the thermoset material, the protective layer is removed.

In an embodiment of the present invention, the method for fabricating the image sensing module further includes: providing a second light-shielding spacer and a transparent cover plate before forming the fixed housing, wherein the second light-shielding spacer is disposed in the light-transmitting On the substrate, and in the non-light collecting region, the second light shielding spacer has a second through hole, the second through hole exposes a portion of the transparent substrate located in the light collecting region, and the transparent cover plate is disposed in the second The light shielding spacer covers the second through hole, wherein the method of forming the fixed housing comprises spraying on the sidewalls of the image sensor, the first light shielding spacer, the lens layer, the second light shielding spacer and the transparent cover plate Thermoset material.

In an embodiment of the invention, a method of forming a fixed housing includes spraying an opaque material on a sidewall of the image sensor, the first light-shielding spacer and the lens layer to form an opaque material layer, and A thermosetting material is sprayed on the sidewalls of the image sensor, the first light-shielding spacer and the lens layer to form a layer of thermosetting material, and the layer of thermosetting material overlaps with the layer of opaque material.

Based on the above, since the fixed case of the present invention can effectively restrain all the components of the cover (such as image sensor, light-shielding spacer, lens layer and transparent cover), the image sensing of the present invention can be increased. The structural strength of the module ensures the image quality of the image sensing module.

The above described features and advantages of the present invention will be more apparent from the following description.

2A-2C are cross-sectional views showing processes of an image sensing module according to an embodiment of the invention. 3 is a cross-sectional view of an image sensing module in accordance with an embodiment of the present invention. 4 is a cross-sectional view of an image sensing module according to another embodiment of the present invention.

First, an image sensor 210, a first light-shielding spacer 220, and a lens layer 230 are disposed. The first light-shielding spacer 220 is disposed on the image sensor 210, and the first light-shielding spacer 220 is disposed. The material includes an opaque material. The first light-shielding spacer 220 has a first through hole 222. The first through hole 222 defines a light collecting area A1, and the first light blocking space 220 is disposed in a non-light collecting area A2 surrounding the light collecting area A1. . The first through hole 222 exposes a portion of the image sensor 210 located in the light collecting area A1.

The lens layer 230 is disposed on the first light shielding spacer 220 and covers the first through hole 222 . In the embodiment, the lens layer 230 includes a transparent substrate 232, a first lens 234 and a second lens 236. The transparent substrate 232 has a first surface 232a and a second surface 232b opposite to each other, and the first surface 232a faces the image sensor 210. The first lens 234 and the second lens 236 are respectively disposed on the first surface 232a and the second surface 232b and located in the light collecting area A1.

In other embodiments, the number of the lens layers 230 may be a single layer or multiple layers, and each lens layer 230 may have only the first lens 234 or the second lens 236, or may have both The first lens 234 and the second lens 236. The number of the first lens 234 or the second lens 236 of each lens layer 230 may be one or more.

In this embodiment, the first lens 234 and the second lens 236 are convex lenses. In other embodiments, at least one of the first lens 234 and the second lens 236 may be a concave lens.

In this embodiment, in order to protect the second lens 236 from external impact or scratch, a second light-shielding spacer 240 and a transparent cover 250 may be selectively provided. The second light shielding spacer 240 is disposed on the transparent substrate 232 and located in the non-light collecting area A2, and the second light shielding spacer 240 has a second through hole 242, and the second through hole 242 exposes the lens layer 230. A portion of the collection area A1. The transparent cover plate 250 is disposed on the second light shielding spacer 240 and covers the second through hole 242 .

In addition, in the embodiment, in order to make the transparent substrate 232 and the first light-shielding spacer 220 more stably joined, an adhesive layer D1 may be disposed between the transparent substrate 232 and the first light-shielding spacer 220. Similarly, an adhesive layer D2 can be disposed between the transparent substrate 232 and the second light-shielding spacer 240, and an adhesive layer D3 can be disposed between the second light-shielding spacer 240 and the transparent cover 250. An adhesive layer D4 is disposed between the light shielding spacer 220 and the image sensor 210. The adhesive layers D1, D2, D3, and D4 may be adhesives having good adhesion such as double-sided tape or ultraviolet-curable adhesive.

Then, in the embodiment, a surface 252 of the transparent cover 250 away from the second light-shielding spacer 240 and a surface 212 of the image sensor 210 remote from the first light-shielding spacer 220 are respectively formed. Protective layers 262, 264.

Then, referring to FIG. 2B, a fixed housing 270 is formed on the sidewall S of the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250, and is fixed. The housing 270 is located in the non-light collecting area A2, and the material of the fixed housing 270 includes a thermosetting material. In the present embodiment, the fixed housing 270 has a thickness T greater than about 10 microns (e.g., 40 to 50 microns). The material of the fixed case 270 is, for example, a material that can withstand high temperatures (250 ° C or higher).

Then, referring to FIG. 2C, the protective layers 262, 264 are removed to remove the portions of the fixed housing 270 on the protective layers 262, 264. At this time, the image sensing module 200 of the present embodiment has been initially formed. In addition, a plurality of conductive bumps B can be selectively formed on the surface 212 of the image sensor 210 so that the image sensor 210 can be electrically connected to other electronic components (eg, lines by the conductive bumps B). board).

In detail, the method of forming the fixed housing 270 is, for example, spraying the thermosetting material on the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240, and the sidewall S of the transparent cover 250. After that, the thermosetting material is cured by heating.

When the thermosetting material is sprayed, the thermosetting material conformally and continuously covers the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240 and the side wall S of the transparent cover 250, and the image sense. The surface of the detector 210 facing the first light-shielding spacer 220 is 214.

After heating and curing the thermosetting material, the cured thermosetting material can effectively restrain all the components of the coating (image sensor 210, first light-shielding spacer 220, lens layer 230, second light-shielding spacer 240, and transparent cover) The plate 250) avoids the displacement of these components, thereby increasing the structural strength of the image sensing module 200 of the present embodiment, and ensuring the image quality of the image sensing module 200. In detail, the fixed housing 270 can resist the lateral force and the vertical pulling force applied to the image sensing module 200, thereby ensuring that the components covered by the fixed housing 270 can be firmly engaged.

Furthermore, the fixed housing 270 of the present embodiment is directly formed on the sidewall S of the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250. Therefore, regardless of the appearance of the aforementioned components (the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250), the fixed housing 270 can be effectively packaged. Over the aforementioned components.

In addition, in the embodiment, the fixed housing 270 can be an opaque material layer. Therefore, the fixed housing 270 can effectively shield the external environment from light, thereby avoiding the problem of stray light, thereby improving the image sensing module. 200 image quality. In this embodiment, the thermosetting material may be an opaque material.

In addition, since the fixed housing 270 of the embodiment can withstand high temperatures (above 250 ° C), the image sensing module 200 of the embodiment can be electrically connected to other electronic components (such as a circuit board) through a tin furnace. .

In addition, in order to prevent stray light from entering the second through hole 242, an aperture structure 290 may be disposed on the surface 252 of the transparent cover plate 250, and the aperture structure 290 has an opening 292 exposing the lens layer 230 in the set. Part of the light zone A1.

In another embodiment, a protective layer (not shown) may expose a portion of the surface 252 of the transparent cover 250. Therefore, after the protective layer is removed, the fixed housing 270 may cover a portion of the surface 252 (as shown in FIG. 3). Show). In this way, the fixed housing 270 can block the stray light from entering the second through hole 242 by shielding the partial transparent cover plate 250, and the fixed housing 270 can be more firmly fixed by covering the portion of the surface 252. Light transmissive cover plate 250.

In another embodiment, the method of forming the fixed housing 270 may be first in the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the sidewall S of the transparent cover plate 250. An opaque material is sprayed thereon to form an opaque material layer 272 (shown in Figure 4). Thereafter, a thermosetting material is sprayed on the opaque material layer 272 to form a thermosetting material layer 274, and then the thermosetting material layer 274 is heated and cured. In other words, the fixed housing 270 of the present embodiment has a multi-layered structure. In other embodiments, the thermosetting material layer 274 may be formed first, and then the opaque material layer 272 may be formed.

Of course, the present invention does not limit that the fixed housing 270 can only have the opaque material layer 272 and the thermosetting material layer 274. For example, the fixed housing 270 can have multiple layers of different color materials and multiple layers of each other according to actual needs. A layer of material with different materials or a layer of material with different strengths from each other.

In summary, since the fixed casing of the present invention can effectively restrain all the components (such as image sensors, light-shielding spacers, lens layers and transparent cover plates) that are covered by the present invention, the image of the present invention can be increased. Sensing the structural strength of the module and ensuring the imaging quality of the image sensing module. In addition, since the fixed casing of the present invention is directly formed on the side walls of the image sensor, the light shielding spacer, the lens layer, and the transparent cover, etc., the fixed casing of the present invention regardless of the shape of the foregoing components Both of the above components can be effectively coated. Moreover, since the fixed casing of the present invention can block light, the fixed casing can prevent stray light from entering the image sensing module, thereby improving the imaging quality of the image sensing module.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 200. . . Image sensing module

110. . . Image sensing component

120. . . Separator

122. . . Through hole

130. . . Lens element

210‧‧‧Image Sensor

212, 214, 252‧‧‧ surface

220‧‧‧First light-shielding spacer

222‧‧‧ first through hole

222a‧‧‧ inner wall

230‧‧‧ lens layer

232‧‧‧Transparent substrate

232a‧‧‧ first surface

232b‧‧‧second surface

234‧‧‧First lens

236‧‧‧second lens

240‧‧‧Second shade spacer

242‧‧‧Second through hole

250‧‧‧Transparent cover

262, 264‧‧ ‧ protective layer

270‧‧‧Fixed housing

272‧‧‧ opaque material layer

274‧‧‧The layer of thermosetting material

290‧‧‧ aperture structure

292‧‧‧ openings

A1‧‧‧Light collection area

A2‧‧‧ Non-light collection area

B‧‧‧conductive bumps

D1, D2, D3, D4‧‧‧ adhesive layer

S‧‧‧ side wall

T‧‧‧ thickness

1 is a cross-sectional view of a conventional image sensing module using wafer level module technology.

2A-2C are cross-sectional views showing processes of an image sensing module according to an embodiment of the invention.

3 is a cross-sectional view of an image sensing module in accordance with an embodiment of the present invention.

4 is a cross-sectional view of an image sensing module according to another embodiment of the present invention.

200. . . Image sensing module

210. . . Image sensor

212, 214, 252. . . surface

220. . . First light shielding spacer

222. . . First through hole

222a. . . Inner wall

230. . . Lens layer

232. . . Light transmissive substrate

240. . . Second light shielding spacer

242. . . Second through hole

250. . . Transparent cover

270. . . Fixed housing

290. . . Aperture structure

292. . . Opening

A1. . . Light collection area

A2. . . Non-collecting zone

B. . . Conductive bump

S. . . Side wall

Claims (4)

  1. A method for manufacturing an image sensing module, wherein the image sensing module has a light collecting area and a non-light collecting area, comprising: providing an image sensor, a first light shielding spacer and a lens layer, wherein The first light-shielding spacer is disposed on the image sensor and located in the non-light-collecting region, and the first light-shielding spacer has a first through hole, and the first through hole exposes the image sensor. a portion of the light collecting region, the lens layer is disposed on the first light shielding spacer and covers the first through hole, the lens layer includes a transparent substrate and a first lens, and the first lens is disposed on the first lens a transparent housing is disposed in the light collecting region; and a fixed housing is formed on the image sensor, the first light shielding spacer and the sidewall of the lens layer, and the fixed housing is located in the non-light collecting region The material of the fixed housing includes a thermosetting material, and the method for forming the fixed housing comprises: spraying an opaque material on the image sensor, the first light shielding spacer and the sidewall of the lens layer, Forming a layer of opaque material; Image sensor, the first light shielding spraying spacer on sidewalls of the lens layer and the thermosetting material to form a layer of thermosetting material, thermosetting material and the opaque material layer and the overlapping layers.
  2. The method for fabricating an image sensing module according to claim 1, wherein when the thermosetting material is sprayed, the thermosetting material conformally and continuously covers the image sensor, the first light shielding spacer and The sidewall of the lens layer.
  3. The method for fabricating the image sensing module of claim 1, further comprising: forming a protective layer on a surface of the lens layer away from the first light-shielding spacer before spraying the thermosetting material, And the protective layer is located at least in the light collecting region; and after spraying the thermosetting material, the protective layer is removed.
  4. The method for manufacturing the image sensing module of claim 1, further comprising: providing a second light-shielding spacer and a transparent cover before forming the fixed housing, wherein the second light-shielding interval The second light-shielding spacer has a second through hole, and the second through-hole exposes the light-transmitting substrate in the light collecting region. The transparent cover is disposed on the second light shielding spacer and covers the second through hole.
TW99111957A 2010-04-16 2010-04-16 Image sensor module and method for manufacturing the same TWI396432B (en)

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Application Number Priority Date Filing Date Title
TW99111957A TWI396432B (en) 2010-04-16 2010-04-16 Image sensor module and method for manufacturing the same

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TWI396432B true TWI396432B (en) 2013-05-11

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449546B (en) * 2016-09-26 2019-12-20 苏州晶方半导体科技股份有限公司 Image sensing chip packaging structure and packaging method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200601823A (en) * 2004-05-31 2006-01-01 Canon Kk Imaging device and electronic apparatus
US7227236B1 (en) * 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20090095893A1 (en) * 2007-07-02 2009-04-16 Avi Strum Imager module packaging
US20100053318A1 (en) * 2008-08-28 2010-03-04 Hironori Sasaki Camera module and method of producing the same
US20100128350A1 (en) * 2008-11-25 2010-05-27 Stmicroelectronics (Research & Development) Limited Imaging assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200601823A (en) * 2004-05-31 2006-01-01 Canon Kk Imaging device and electronic apparatus
US7227236B1 (en) * 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20090095893A1 (en) * 2007-07-02 2009-04-16 Avi Strum Imager module packaging
US20100053318A1 (en) * 2008-08-28 2010-03-04 Hironori Sasaki Camera module and method of producing the same
US20100128350A1 (en) * 2008-11-25 2010-05-27 Stmicroelectronics (Research & Development) Limited Imaging assembly

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