TWI392427B - 撓性積層板之製造方法 - Google Patents

撓性積層板之製造方法 Download PDF

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Publication number
TWI392427B
TWI392427B TW096110936A TW96110936A TWI392427B TW I392427 B TWI392427 B TW I392427B TW 096110936 A TW096110936 A TW 096110936A TW 96110936 A TW96110936 A TW 96110936A TW I392427 B TWI392427 B TW I392427B
Authority
TW
Taiwan
Prior art keywords
polyimide
layer
thermal expansion
polyimine
resin
Prior art date
Application number
TW096110936A
Other languages
English (en)
Chinese (zh)
Other versions
TW200814892A (en
Inventor
Tomoyuki Suzuki
Masahiko Takeuchi
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200814892A publication Critical patent/TW200814892A/zh
Application granted granted Critical
Publication of TWI392427B publication Critical patent/TWI392427B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
TW096110936A 2006-03-31 2007-03-29 撓性積層板之製造方法 TWI392427B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006098246A JP4593509B2 (ja) 2006-03-31 2006-03-31 フレキシブル積層板の製造方法

Publications (2)

Publication Number Publication Date
TW200814892A TW200814892A (en) 2008-03-16
TWI392427B true TWI392427B (zh) 2013-04-01

Family

ID=38672178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110936A TWI392427B (zh) 2006-03-31 2007-03-29 撓性積層板之製造方法

Country Status (3)

Country Link
JP (1) JP4593509B2 (ja)
KR (1) KR101366043B1 (ja)
TW (1) TWI392427B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031396B2 (ja) * 2013-03-29 2016-11-24 新日鉄住金化学株式会社 両面フレキシブル金属張積層板の製造方法
WO2017065319A1 (ja) * 2015-10-15 2017-04-20 新日鉄住金化学株式会社 ポリイミド積層体及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200602186A (en) * 2004-03-15 2006-01-16 Kaneka Corp Novel polyimide film and use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563322A (ja) * 1984-01-27 1993-03-12 Hitachi Ltd フレキシブルプリント基板の製造方法
JPH0753801B2 (ja) * 1986-12-25 1995-06-07 住友ベークライト株式会社 フレキシブルプリント回路用基板の製造方法
JPH03145185A (ja) * 1989-10-31 1991-06-20 Sumitomo Bakelite Co Ltd フレキシブルプリント回路用基板
JP4200376B2 (ja) 2004-02-17 2008-12-24 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板及びその製造方法
KR100590719B1 (ko) * 2004-03-05 2006-06-19 주식회사 엘지화학 2층 동장 적층판의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200602186A (en) * 2004-03-15 2006-01-16 Kaneka Corp Novel polyimide film and use thereof

Also Published As

Publication number Publication date
JP4593509B2 (ja) 2010-12-08
KR101366043B1 (ko) 2014-02-21
KR20070098720A (ko) 2007-10-05
JP2007268892A (ja) 2007-10-18
TW200814892A (en) 2008-03-16

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