1373821 九、發明說明： 【發明所屬之技術領域】 本發明係關於—種基板移载裝置及方法，㈣是關於製 程機台之製作過程中之基板移载裝置及方法。 、 【先前技術】1373821 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate transfer device and method, and (4) relates to a substrate transfer device and method in a process of manufacturing a process machine. [Prior Art]
液晶顯示器現已廣泛應用於監視器、筆記型電腦、數位 相機及投影機等具成長潛力之電子產品，在液晶顯示面板 的製造過程中，需經多道製程將顯示面板之電路製作於玻 璃基板上。玻璃基板主要應用在平面顯示器上的薄膜電晶 體及彩色滤光片二處。在液晶顯示面板製作過程中，玻璃 基板需經過拋光、研磨等加工步驟，以去除不必要之應力 集中現象’進而確保玻璃基板之品質。 圖1顯示一習知之玻璃基板移載裝置之示意圖，其係應 用於玻璃基板研磨後之傳送，且主要係利用真空吸取方式 移送玻璃基板。為求圖式簡潔，圖丨僅繪示相關之主要構 件’而以示意圖方式表示。 玻璃基板移載裝置10包含移載桿U '撈爪12、載台13 及傳送桿（Conveyor) 14。玻璃基板移載裝置1〇包含3個移 載桿11，各移載桿11上設有複數個均勻分佈之真空吸孔 16，用以吸附玻璃基板15。撈爪12用以夹取玻璃基板15 之兩側，進一步確保玻璃基板15不致掉落。移載桿u搭 配撈爪12將置放於載台13之玻璃基板15拾起後，移動至 傳送桿14上方，之後將玻璃基板15置放於傳送桿14上， 1373821 完成將玻璃基板15自 送桿14再將玻璃基板 面板之製作。 载台U換載至傳送桿μ。之後，輸 傳送至後續機台，繼續液晶顯示 如前述，移載捍11係採用真孔吸孔^6之設言十，用以吸 取玻璃基板15。因此，真空吸孔…必須另外搭配真 及相關配管(圖未示)，以產生真空吸附的效果。 丨Liquid crystal displays are now widely used in monitors, notebook computers, digital cameras, projectors and other electronic products with potential for growth. In the manufacturing process of liquid crystal display panels, the circuit of the display panel is required to be fabricated on a glass substrate through multiple processes. on. The glass substrate is mainly used in the thin film electro-crystal and the color filter on the flat display. In the process of fabricating a liquid crystal display panel, the glass substrate is subjected to processing steps such as polishing and polishing to remove unnecessary stress concentration, thereby ensuring the quality of the glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing a conventional glass substrate transfer device which is applied to the transfer of a glass substrate after polishing, and mainly uses a vacuum suction method to transfer the glass substrate. For the sake of simplicity, the figure is only shown as the relevant main component' and is represented schematically. The glass substrate transfer device 10 includes a transfer lever U's claw 12, a stage 13, and a conveyor 14 (Conveyor) 14. The glass substrate transfer device 1A includes three transfer rods 11, and each of the transfer rods 11 is provided with a plurality of uniformly distributed vacuum suction holes 16 for adsorbing the glass substrate 15. The claws 12 are used to grip both sides of the glass substrate 15, further ensuring that the glass substrate 15 does not fall. The transfer rod u is matched with the claw 12 to pick up the glass substrate 15 placed on the stage 13, and then moved to the upper side of the transfer rod 14, and then the glass substrate 15 is placed on the transfer rod 14, 1373821 completes the glass substrate 15 The rod 14 is then used to fabricate the glass substrate panel. The stage U is loaded to the transfer rod μ. After that, the transmission is transmitted to the subsequent machine, and the liquid crystal display is continued. As described above, the transfer 捍 11 is a design of the true hole suction hole ^6 for sucking the glass substrate 15. Therefore, the vacuum suction holes... must be additionally matched with genuine and related piping (not shown) to produce a vacuum adsorption effect.丨
隨著世代演進，目前玻璃基板15之尺寸相當龐大且仍 將逐漸加大其尺寸H f要利用制機構驅動移載桿 11及撈爪12，以將玻璃基板15移送至傳送桿14之上。如 此一來，以撈爪搭配真空吸附方式移載玻璃基板15所需之 機構不僅龐大而且複雜，而將增加玻璃基板15破片的可能 及機構的建置成本。 b 【發明内容】 為解決上述問題，本發明提供一種基板移载裝置，可簡 • 化移載機構之複雜度，進而有效降低相關機構之建置成 本，且可降低因機器故障造成基板毁損之機率。 本發明揭示一種基板移載裝置，其主要包含一載台及一 移載機構。該載台具有至少一承載面，以承載自製程機台 送出之基板（例如玻璃基板），該移載機構具有至少一移載 面，並利用移載機構之移載面與載台之承載面之間於垂直 於該移載面之垂直方向交錯移動，將該基板自該載台換載 至該移載機構。 本創作之基板移載方法可大致歸納為包含以下步驟：首 1373821 先，將基板自製程機台移載至載台，且該基板係由該載台 包含之-承載面承載。之後利用移載機構之一移載面與: 載台之承載面之間於垂直於該移載面之垂直方向交錯移 動，將6玄基板自該載台換載至該移載機構上。 【實施方式】 以下將搭配圖式詳細說明本發明之基板移載裝置及方法 之技術特徵。卩下實施例之基板係關於&晶顯#面板之應 用，特別是關於液晶顯示面板製作過程中，玻璃基板經研 磨後之相關移載技術β惟以下實施例僅係例示，並不限制 本發明之請求範圍。 圖2係繪示本發明一實施例之基板移載裝置汕之上視示 意圖。本實施例中，基板22係經製程機台21完成製程後 送出至載台23。在載台23之後設置有移載機構24，用以 將基板22#送移載至後續處理機台，以進行液晶顯示面板 之下道製程。本實施例之基板22係玻璃基板，該製程機 台21為研磨機台，且其製作流程中，基板22係由右向左 移動。 —實施例中，載台23包含兩側桿231及一中央桿232 , 中央柃232之長度短於側桿23丨。側桿23丨作為主要承载基 板22之構件。移載機構24包含兩傳送桿241，傳送桿241 之縱向方向與側桿23 1之縱向方向相互平行，且兩傳送桿 241之間距A大於兩側桿23 1形成之寬度b。 圖3繪示圖2之載台23及傳送裝置以之立體示意圖， 1373821 此^基板22係由恭a ο，/ it 係由載D 23之側桿231及中央桿攻 申吕之’兩側桿231之頂部構成承載面25， ° 之頂部則構成移載面26，以承載及移載該基板22 = 24 1之周綾母古播、"姚 延才干 之m又有傳达帶242，可沿傳送桿241 輸送其上之承載件。轉而 平行。 載件其中承載面25與移載面26可為相互 丞极β位於載 食磨)As the generation evolves, the size of the glass substrate 15 is currently quite large and will gradually increase its size Hf. The transfer mechanism 11 and the claws 12 are driven by the mechanism to transfer the glass substrate 15 onto the transfer rod 14. As a result, the mechanism required to transfer the glass substrate 15 by means of the claws in a vacuum adsorption manner is not only bulky but complicated, but also increases the possibility of fragmentation of the glass substrate 15 and the cost of construction of the mechanism. In order to solve the above problems, the present invention provides a substrate transfer device, which can simplify the complexity of the transfer mechanism, thereby effectively reducing the construction cost of the related mechanism, and reducing the damage of the substrate caused by machine failure. Probability. The invention discloses a substrate transfer device, which mainly comprises a loading platform and a transfer mechanism. The loading platform has at least one bearing surface for carrying a substrate (for example, a glass substrate) sent by the self-made machine table, the transfer mechanism having at least one transfer surface, and utilizing the transfer surface of the transfer mechanism and the bearing surface of the stage The substrate is staggered in a direction perpendicular to the transfer surface, and the substrate is transferred from the stage to the transfer mechanism. The substrate transfer method of the present invention can be roughly summarized as follows: First 1373821 First, the substrate self-made machine table is transferred to the stage, and the substrate is carried by the bearing surface included in the stage. Then, the transfer surface of one of the transfer mechanisms and the load-bearing surface of the stage are alternately moved in a direction perpendicular to the transfer surface, and the 6-base substrate is transferred from the stage to the transfer mechanism. [Embodiment] The technical features of the substrate transfer device and method of the present invention will be described in detail below with reference to the drawings. The substrate of the embodiment is related to the application of the & crystal display panel, in particular, the related transfer technology of the glass substrate after the liquid crystal display panel is produced. However, the following examples are merely illustrative and not limiting. The scope of the invention. Fig. 2 is a schematic view showing the substrate transfer device of the embodiment of the present invention. In the present embodiment, the substrate 22 is sent to the stage 23 after the process is completed by the process machine 21. After the stage 23, a transfer mechanism 24 is provided for transferring the substrate 22# to the subsequent processing machine for performing the lower process of the liquid crystal display panel. The substrate 22 of the present embodiment is a glass substrate, and the processing machine 21 is a polishing machine, and in the manufacturing process, the substrate 22 is moved from right to left. In the embodiment, the stage 23 includes two side bars 231 and a center bar 232 having a length shorter than the side bars 23A. The side bars 23 are used as members of the main carrier substrate 22. The transfer mechanism 24 includes two transfer rods 241, the longitudinal direction of which is parallel to the longitudinal direction of the side bars 23, and the distance A between the two transfer bars 241 is greater than the width b formed by the side bars 23 1 . 3 is a perspective view of the stage 23 and the transport device of FIG. 2, 1373821. The substrate 22 is composed of a side bar 231 of the D 23 and a central pole of the D. The top of the rod 231 constitutes the bearing surface 25, and the top of the ° constitutes the transfer surface 26 to carry and transfer the substrate 22 = 24 1 week, the mother-in-law, and the "Yao Yancai m" has a communication belt 242 The carrier on which the transfer rod 241 can be transported. Turn to parallel. In the carrier, the bearing surface 25 and the transfer surface 26 may be mutually dipped β in the food grinder)
帶242之頂面。載Α 2 °又〉兩於傳送 ° 4由如導螺桿’滑執等機械驅動 、^ 向左移動。據此，因兩傳送桿241之間距 A大於兩侧桿231形成之寬度B，且基板22之水平高声含 於傳送帶242之頂面’如此一來兩側桿231和中央桿：: I移動至料送桿241之間，此時基板22被傳送至兩傳送 桿241上方。 參照圖5,兩傳送桿241係由—垂直傳送機構（圖未示: 向上移動頂起基板22’亦即基板.22脫離兩侧桿231及中央 杯232。申言之，該承載面25與該移載面％之間於垂直於 該移载面之垂直方向交錯移動，將該基板22自該載台23 換載至該移載機構24。 一實施例中，傳送桿241上設置之傳送帶242可將基板 22向左或向後傳送，如圖6所示。之後，基板…專送至後 續機台以進行後續製程。 按圖6所示，基板22經換载至移載機構以後，基板22 破傳送至不同之平面高度（本實施例中，基板22被提高）。 因此若後續製程之機台接受基板之高度與製程機台之高度 1373821 . 2 &圖1及6之設計可將移載基板22與變換高度於同 /驟中π成，具有簡化流程，提昇製作效率之效果。 右後啰製程之機台接受基板之高度與製程機台之高度相 同’移载機構24亦可將基板22頂起後，載台_向右回 ,、 置之後，再降低移載機構24，即可將基板22 調正至相當於載台23所承載之基板22之高度。 復參圖2’該兩傳送桿241之間距A可依基板22之大小 .· 作調整。若基板22較大或較寬，可増加兩傳送桿241之間 距A。反之’則減小其之間距。 右基板22之寬度更寬時，其中心處可能因其自身的重量 而產生撓曲（deflection)。為防止此現象，料機構24可採 包含三條傳送桿241搭配傳送帶242之設計，其中傳送桿 241頂面係構成移載面26，如圖7所示。 三條移載桿於實際運作時，載台之二側桿可移至相 傳送桿之間，將基板移至該三傳送桿上方。 ❿ 上述實施例之基板移載可大致歸納為如圖8所示之流程 圖。步驟S81中，首先基板自製程機台21移載至載台η。 v驟S 82中’載台23於水平方向移動將基板22移至移載 機構24上方。步驟S83中，移載機構24之移載面％及載 台23之承載面25於垂直於該移載面％之垂直方向交錯移 動，例如向上頂起基板22,使基板22自載台23換載至移 載機構24。步驟S84中，移載機構24移送基板22向後移 動，以進行後續製程。 實際操作上，載台23和移載機構24間係採水平向和垂 1 1373821 直向之相對運動，藉此即可將其 1 J將基板22由载台23換載至移 載機構24，之後再進一步移伊 、 移运至後續機台進行後續製程。 上述實施例僅係例示，並未限宏士 木丨民疋由移載機構24頂起承載基 板22,或由載台23朝移載機構24方向移動。換言之，載 。23亦可下降讓基板22換載至移載機構w移載機構μ 亦可朝載台23方向移動。 按習知技術利用真空吸取之方式，萬一真空幫浦斷電，With the top surface of the belt 242. Load Α 2 ° and 〉2 in transmission ° 4 is driven by a mechanical drive such as a lead screw, and moved to the left. Accordingly, since the distance A between the two transfer rods 241 is larger than the width B formed by the side rods 231, and the level of the substrate 22 is high on the top surface of the conveyor belt 242, the two sides of the rod 231 and the center rod are: Between the feed pins 241, the substrate 22 is transferred to the upper of the two transfer bars 241. Referring to FIG. 5, the two transfer rods 241 are separated by a vertical transfer mechanism (not shown: the upwardly raised top substrate 22', that is, the substrate .22 is separated from the side rods 231 and the central cup 232. In other words, the carrying surface 25 is The transfer surface % is staggered in a direction perpendicular to the vertical direction of the transfer surface, and the substrate 22 is transferred from the stage 23 to the transfer mechanism 24. In one embodiment, the transfer belt is disposed on the transfer rod 241. 242 can transport the substrate 22 to the left or the back, as shown in Fig. 6. After that, the substrate is exclusively sent to the subsequent machine for subsequent processing. As shown in Fig. 6, after the substrate 22 is loaded to the transfer mechanism, the substrate 22 broken transmission to different plane heights (in this embodiment, the substrate 22 is improved). Therefore, if the machine of the subsequent process accepts the height of the substrate and the height of the processing machine 1373821. 2 & The design of Figures 1 and 6 can be The transfer substrate 22 and the conversion height are π in the same/decision, which has the effect of simplifying the flow and improving the production efficiency. The height of the substrate of the right rear boring process is the same as the height of the processing machine. After the substrate 22 is lifted up, the stage _ is turned back to the right, and By lowering the transfer mechanism 24, the substrate 22 can be adjusted to the height corresponding to the substrate 22 carried by the stage 23. Referring to Figure 2, the distance A between the two transfer rods 241 can be determined by the size of the substrate 22. If the substrate 22 is larger or wider, the distance between the two transfer rods 241 can be increased. Otherwise, the distance between them is reduced. When the width of the right substrate 22 is wider, the center may be due to its own weight. In order to prevent this, the material mechanism 24 can adopt a design including three transfer rods 241 and a conveyor belt 242, wherein the top surface of the transfer rod 241 constitutes a transfer surface 26, as shown in Fig. 7. Three transfer When the rod is actually in operation, the two side rods of the stage can be moved between the phase transfer rods to move the substrate above the three transfer rods. 基板 The substrate transfer in the above embodiment can be roughly summarized as the flow shown in FIG. In step S81, first, the substrate-made machine table 21 is transferred to the stage η. In step S82, the stage 23 is moved in the horizontal direction to move the substrate 22 above the transfer mechanism 24. In step S83, the transfer is performed. The transfer surface % of the mechanism 24 and the bearing surface 25 of the stage 23 are perpendicular to the transfer The vertical direction of % is staggered, for example, the substrate 22 is lifted up, and the substrate 22 is loaded from the stage 23 to the transfer mechanism 24. In step S84, the transfer mechanism 24 transfers the substrate 22 to move backward to perform subsequent processes. In the upper stage, the stage 23 and the transfer mechanism 24 are moved in a straight direction of the horizontal direction and the vertical direction 1333721, whereby the substrate 22 can be loaded from the stage 23 to the transfer mechanism 24, and then Further moving and transporting to the subsequent machine for subsequent processes. The above embodiments are merely illustrative, and are not limited to the Hongshimu 丨 folk 疋 by the transfer mechanism 24 to lift the carrier substrate 22, or the stage 23 toward the transfer mechanism Move in 24 directions. In other words, loading. 23 can also be lowered to transfer the substrate 22 to the transfer mechanism w transfer mechanism μ or to move in the direction of the stage 23. According to the conventional technology, vacuum suction is used, in case the vacuum pump is powered off,
可能導致基板掉落。本發明之基板移载裝置之基板係採用 本身重力置放於移载機構上方，因此即使運送過程中斷 電’雖然移載機構之動作停止，基板仍將置放於移載機構 上’而不可能掉落毀損。 本發明之基板移縣置係制基板自身之重力承載該基 板’無須真空幫浦及管線等複雜設計，而可降低建置的成 本0 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 貪離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者’而應包括各種不背離本發明之 替換及修倚，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係習知之基板移載裝置之示意圖。 圖2係本發明之基板移載裝置之上視示意圖。 圖3至ό係本發明一實施例之基板移載裝置於各運作步 1373821 驟之狀態示意圖。 圖7係本發明另一實施例之基板移載裝置之移載機構。 圖8係本發明一實施例之基板移載方法之流程示意圖。 【主要元件符號說明】 10 玻璃基板移載裝置 11 移載桿 12 撈爪 13 載台 14 傳送桿 15 玻璃基板 16 真空吸孔 20 基板移載裝置 21 製程機台 22 基板 23 載台 24 移載機構 25 承載面 26 移載面 231 側桿 232 中央桿 241 傳送桿 242 傳送帶 S81 〜S84 步驟May cause the substrate to fall. The substrate of the substrate transfer device of the present invention is placed above the transfer mechanism by gravity itself, so even if the transportation process is interrupted, the substrate will be placed on the transfer mechanism even though the operation of the transfer mechanism is stopped. May fall and damage. The substrate of the present invention is capable of carrying the substrate itself without the complicated design of the vacuum pump and the pipeline, and can reduce the cost of the construction. The technical content and technical features of the present invention have been disclosed above, but are familiar with the present disclosure. The person skilled in the art may still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention is not to be construed as being limited to the details of BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional substrate transfer device. 2 is a top plan view of the substrate transfer device of the present invention. 3 is a schematic view showing the state of the substrate transfer device according to an embodiment of the present invention in each operation step 1373821. 7 is a transfer mechanism of a substrate transfer device according to another embodiment of the present invention. FIG. 8 is a schematic flow chart of a substrate transfer method according to an embodiment of the present invention. [Description of main components] 10 Glass substrate transfer device 11 Transfer bar 12 Fishing claw 13 Stage 14 Transfer rod 15 Glass substrate 16 Vacuum suction hole 20 Substrate transfer device 21 Process table 22 Substrate 23 Carrier 24 Transfer mechanism 25 Bearing surface 26 Transfer surface 231 Side rod 232 Center rod 241 Transfer rod 242 Conveyor belt S81 ~ S84 Steps