TWI371649B - - Google Patents

Info

Publication number
TWI371649B
TWI371649B TW100127308A TW100127308A TWI371649B TW I371649 B TWI371649 B TW I371649B TW 100127308 A TW100127308 A TW 100127308A TW 100127308 A TW100127308 A TW 100127308A TW I371649 B TWI371649 B TW I371649B
Authority
TW
Taiwan
Application number
TW100127308A
Other versions
TW201144925A (en
Inventor
Michael Bisk Binnard
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US46249903P priority Critical
Priority to PCT/IB2004/001259 priority patent/WO2004090577A2/en
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW201144925A publication Critical patent/TW201144925A/zh
Application granted granted Critical
Publication of TWI371649B publication Critical patent/TWI371649B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00Photographic printing apparatus
    • G03B27/32Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52Details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
TW100127308A 2003-04-11 2004-04-09 TWI371649B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US46249903P true 2003-04-11 2003-04-11
PCT/IB2004/001259 WO2004090577A2 (en) 2003-04-11 2004-03-17 Maintaining immersion fluid under a lithographic projection lens

Publications (2)

Publication Number Publication Date
TW201144925A TW201144925A (en) 2011-12-16
TWI371649B true TWI371649B (zh) 2012-09-01

Family

ID=33159850

Family Applications (16)

Application Number Title Priority Date Filing Date
TW100127308A TWI371649B (zh) 2003-04-11 2004-04-09
TW104111404A TWI545387B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW100122562A TWI364623B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW101108066A TWI425302B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法、及元件製造方法
TW102115386A TWI437351B (zh) 2003-04-11 2004-04-09 浸沒曝光設備和浸沒曝光方法
TW093109873A TWI342036B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW107100503A TWI648589B (zh) 2003-04-11 2004-04-09 浸沒微影設備、浸沒微影方法和元件製造方法
TW104142913A TWI578091B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW096142839A TWI346345B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW100122561A TWI372309B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW103123289A TWI545386B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW096142837A TWI382270B (zh) 2003-04-11 2004-04-09 流體浸沒曝光設備和方法以及裝置製造方法
TW096142836A TWI346349B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW102115385A TWI486701B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW106103664A TWI614564B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW101108065A TWI397762B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法、及元件製造方法

Family Applications After (15)

Application Number Title Priority Date Filing Date
TW104111404A TWI545387B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW100122562A TWI364623B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW101108066A TWI425302B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法、及元件製造方法
TW102115386A TWI437351B (zh) 2003-04-11 2004-04-09 浸沒曝光設備和浸沒曝光方法
TW093109873A TWI342036B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW107100503A TWI648589B (zh) 2003-04-11 2004-04-09 浸沒微影設備、浸沒微影方法和元件製造方法
TW104142913A TWI578091B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW096142839A TWI346345B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW100122561A TWI372309B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW103123289A TWI545386B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW096142837A TWI382270B (zh) 2003-04-11 2004-04-09 流體浸沒曝光設備和方法以及裝置製造方法
TW096142836A TWI346349B (en) 2003-04-11 2004-04-09 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
TW102115385A TWI486701B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW106103664A TWI614564B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法和元件製造方法
TW101108065A TWI397762B (zh) 2003-04-11 2004-04-09 浸沒曝光設備、浸沒曝光方法、及元件製造方法

Country Status (10)

Country Link
US (18) US7372538B2 (zh)
EP (8) EP2618213B1 (zh)
JP (12) JP4315198B2 (zh)
KR (14) KR101225884B1 (zh)
CN (3) CN101980086B (zh)
HK (7) HK1087782A1 (zh)
IL (5) IL170735A (zh)
SG (12) SG10201504396VA (zh)
TW (16) TWI371649B (zh)
WO (1) WO2004090577A2 (zh)

Families Citing this family (195)

* Cited by examiner, † Cited by third party
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