TWI367535B - Cdim package structure with metal bump and the forming method thereof - Google Patents
Cdim package structure with metal bump and the forming method thereofInfo
- Publication number
- TWI367535B TWI367535B TW096141131A TW96141131A TWI367535B TW I367535 B TWI367535 B TW I367535B TW 096141131 A TW096141131 A TW 096141131A TW 96141131 A TW96141131 A TW 96141131A TW I367535 B TWI367535 B TW I367535B
- Authority
- TW
- Taiwan
- Prior art keywords
- cdim
- forming method
- package structure
- metal bump
- bump
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096141131A TWI367535B (en) | 2007-11-01 | 2007-11-01 | Cdim package structure with metal bump and the forming method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096141131A TWI367535B (en) | 2007-11-01 | 2007-11-01 | Cdim package structure with metal bump and the forming method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200921810A TW200921810A (en) | 2009-05-16 |
TWI367535B true TWI367535B (en) | 2012-07-01 |
Family
ID=44727993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096141131A TWI367535B (en) | 2007-11-01 | 2007-11-01 | Cdim package structure with metal bump and the forming method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI367535B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112993137A (en) * | 2020-08-20 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Preparation method of LED display module and LED display screen |
-
2007
- 2007-11-01 TW TW096141131A patent/TWI367535B/en active
Also Published As
Publication number | Publication date |
---|---|
TW200921810A (en) | 2009-05-16 |
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