TWI362901B - - Google Patents

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Publication number
TWI362901B
TWI362901B TW92135000A TW92135000A TWI362901B TW I362901 B TWI362901 B TW I362901B TW 92135000 A TW92135000 A TW 92135000A TW 92135000 A TW92135000 A TW 92135000A TW I362901 B TWI362901 B TW I362901B
Authority
TW
Taiwan
Prior art keywords
antenna
plasma
ι ι
antennas
frequency power
Prior art date
Application number
TW92135000A
Other languages
Chinese (zh)
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TW200420201A (en
Inventor
Akinori Ebe
Tatsuo Shoji
Yuichi Setsuhara
Original Assignee
Japan Science & Tech Agency
Akinori Ebe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2002363989A priority Critical patent/JP3920209B2/en
Priority to JP2002363988A priority patent/JP3618333B2/en
Priority to JP2003014718A priority patent/JP2004228354A/en
Application filed by Japan Science & Tech Agency, Akinori Ebe filed Critical Japan Science & Tech Agency
Publication of TW200420201A publication Critical patent/TW200420201A/en
Application granted granted Critical
Publication of TWI362901B publication Critical patent/TWI362901B/zh

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H2001/4645Radiofrequency discharges
    • H05H2001/4652Inductively coupled
    • H05H2001/4667Coiled antennas

Description

1362901 EMBODIMENT OF THE INVENTION [Technical Field of the Invention] The present invention relates to a plasma generating apparatus which performs plasma processing or etching treatment on a surface of a substrate to be processed using a plasma to fabricate a substrate such as a semiconductor. In particular, it is a technique of producing a large-area substrate by uniformly generating plasma on a large area. [Prior Art] In recent years, a polycrystalline germanium tft_lcd which is more capable of displaying a high-luminance image than a TFT (Thin Film Transistor)-LCD using an amorphous germanium film has been gradually attracted attention. A polycrystalline slab TFT-LCD is a polycrystalline slab substrate on which a polycrystalline thin film is formed on a glass substrate. The polycrystalline germanium substrate is divided into a plurality of pixel regions in which two dimensions are arranged. A thin film transistor (TFT) is formed in each pixel region as a substrate for LCD. In order to manufacture a large-sized polycrystalline TFT-LCD, a polycrystalline germanium substrate of high quality, particularly high flatness, is required. The polycrystalline stone substrate is also attracting attention as a substrate for high-efficiency solar cells, and it is required to have a large area as demand and application are expanded. Further, in the case of a general substrate for a semiconductor device, a substrate having a large area exceeding a single crystal size has to be used. In order to manufacture substrates for use in such fields, the use of plasma is performed. The treatment using the plasma includes a process of depositing a substrate material on the surface of the substrate to be processed as a substrate, a process of etching the surface of the substrate to be processed, and the like. As the size of the substrate increases, the device for plasma treatment also needs to be enlarged, but the biggest problem with the enlargement is the unevenness of the plasma treatment. In order to solve this problem, it is necessary to cover the entire area of the substrate as much as possible.

The ground makes the electric destruction umbrella # +A A evenly. On the other hand, from the point of view of productivity, it is necessary to raise the deposition rate and the etching rate. The method of generating plasma, there are ECR (electron cyclotron resonance) electric mode, microwave Lei fang 4 _ 罨 mode, inductive coupling type plasma mode, capacitive coupling type electric polymerization mode cage: find its inductive coupling type In the plasma mode, a high-frequency voltage is applied to the induction coil of the Tianjidao & m-th line, and the electromagnetic field is applied to the plasma generating device, and the plasma is generated by the water +, *, ^. According to this configuration, it is possible to generate a high-density plasma of the pre-electropolymerization device, which is required for |φ v4_, and the eight-part requirement. On the other hand, since the electric water temperature varies depending on the distance from the antenna, the uniformity of the other one can be improved by designing the shape and position of the antenna. For example, it is described in Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. Uniformity of pulp density. In such a configuration, in order to increase the area of the substrate, it is necessary to increase the thickness of the top portion in order to secure the mechanical strength of the electric water to the top. However, in the device of the patent document, since the antenna is disposed on the outer side of the plasma generating chamber, the induced electromagnetic field radiated from the antenna is attenuated in the wall, and the induced electromagnetic field in the plasma generating chamber is not easily obtained. Strength of. That is, the method described in the patent document can show a certain degree of improvement on the uniformity of the plasma density, but it is not easy to improve the plasma density. In the Japanese Patent Publication No. 2-35697 (Patent Document 2), it is proposed that: a high-frequency antenna is provided inside the plasma generating chamber; 1362901 and a plurality of antennas are provided; and an antenna having a non-circular shape is used. . According to this configuration, since the wall of the plasma generating chamber does not become an obstacle, the induced electromagnetic field is not attenuated and is radiated in the plasma generating chamber, so that the plasma density can be sufficiently increased. Further, since a plurality of antennas are provided at equal intervals, an induced electromagnetic field is radiated, so that the uniformity can be improved, whereby the uniformity of the plasma density can be improved. Further, if a large voltage is applied to the internal antenna, abnormal discharge is likely to occur, but by providing a plurality of antennas, the inductance of each antenna is reduced, and abnormal discharge does not occur. The use of an antenna that does not have a convoluted shape is also useful for reducing the inductance of the antenna and suppressing abnormal discharge. By this effect, it is possible to perform deposition processing and etching treatment of a large-area substrate to be processed. In the following, a configuration in which a plurality of antennas are provided in Patent Document 2 is referred to as a "multi-antenna method". In the future, in order to handle a larger area of the substrate, in addition to ensuring sufficient strength of the electropolymer density, it is necessary to produce a plasma state with higher uniformity. For this reason, in the description of the multi-antenna method, it is necessary to discuss parameters such as the shape, position, and relationship between the antennas, which have not been considered yet. Further, once the standing wave of the induced electromagnetic field radiated from the antenna is formed, the uniformity of the plasma is destroyed. The intensity of the X ′ induced electromagnetic field varies with the distance from the high-frequency antenna. Even with the multi-antenna method, the electric density t near the center of the substrate is lower than the density of the electric field near the outer edge of the substrate. When the substrate area is small, the difference in plasma density near the center of the substrate and the vicinity of the outer edge portion of the substrate may fall within the range of δ y, but if the substrate area becomes Λ, the difference will become non-valley. Depending on the λ etching and deposition rate, etc., depending on the type of ion and the type of radical, the type of ion and the type of radical generated, 1362901 must also be considered. The present invention has been made to solve the problems, and an object thereof is to provide a plasma generating apparatus capable of uniformly generating a high-density plasma spatially and controlling the type of ions and radical species generated. SUMMARY OF THE INVENTION A plasma generating apparatus according to the present invention, which is provided to solve the above problems, includes: (a) a vacuum container; and (b) a substrate stage, which is disposed in the vacuum container for carrying the processed a substrate; (c) a plurality of high frequency antennas disposed in the vacuum container. Further, in addition to the above configuration, the plasma generating apparatus of the present invention preferably has any one of the following (1) to (5) or a plurality of configurations. (1) The antenna just described is composed of a conductor shorter than 1/4 of the wavelength of the aforementioned high frequency. (2) A plate-shaped conductor that is connected in parallel to the plurality of antennas. Furthermore, the connection point between the power supply of the antenna and the plate-shaped conductor, and the connection point between each antenna and the plate-shaped conductor, the distance between the two connection points is shorter than 1 / 4 of the wavelength of the higher frequency. (3) The antenna aspect ratio at a position corresponding to the target area of the substrate stage is set to a value corresponding to the target f density & plasma electron energy of the target area. Here, the "aspect ratio" refers to a value obtained by dividing the length of the antenna in the direction perpendicular to the inner wall by the length in the direction parallel to the inner wall. (4) The electrodes of the antenna are arranged substantially in parallel with the substrate stage, and adjacent electrodes of one or a plurality of adjacent antennas have the same polarity. (5) Connecting the impedance element to the antenna, preferably the impedance of the impedance element 1362901 is variable. - First, the basic configuration of the plasma generating apparatus of the present invention will be described. The electric production device of the present invention has a vacuum accommodating chamber which is internally formed into an electro-convergence chamber. Inside the vacuum vessel, a vacuum pump is used to maintain a predetermined degree of vacuum. In the vacuum valley, § history sets a number of high frequency antennas. The electrodes at one end of these antennas are connected to a separately provided power source, and the electrodes at the other end are grounded. The antenna can be mounted, for example, on the side wall and the top of the vacuum vessel. Further, a plurality of antennas are arranged in parallel with the substrate stage. When the power is supplied from the power supply to these antennas, the electromagnetic field is radiated from each antenna, thereby generating plasma. In this case, in the device of the present invention, since the antenna is disposed substantially parallel to the substrate stage, the degree of the problem from the substrate stage to the antennas is approximately equal, because the energy of the antenna can be spatially concentrated and input, so that high density can be generated. Plasma. Further, by using a planar antenna, the energy of the antenna is put into a planar region, so that a plasma having a higher density can be produced than an antenna using a three-dimensional shape. When the conductor of the antenna is placed in the vacuum container on the right, the surface of the antenna will be exposed to the generated plasma, and the conductor will deteriorate. To prevent this, it is best to use an insulator to cover the surface of the antenna. This coating also suppresses the electrostatic coupling between the conductor of the antenna and the plasma. Therefore, it also has the effect of preventing abnormal discharge and plasma disturbance. This coating is described in detail in the above Patent Document 2. Next, a plasma generating apparatus having the above configuration (1) will be described. In this device, the length of the conductor constituting the antenna is shortened to be shorter than 1/4 « of the supplied high frequency electric power 11 1362901. The conductor is not limited to be linear, and for example, even if it is a plate shape, as long as the length of the current in the direction of flow is a high frequency wave, 4 is short. With this configuration, the standing wave is prevented from being generated on the surface of the conductor, and the uniformity of the plasma in the vacuum container can be prevented.

Next, a plasma generating apparatus having the above configuration (7) will be described. In the above basic configuration, a plurality of antennas are connected in parallel with the plate-shaped conductor. The power supply is transmitted through a plate-shaped conductor that supplies high-frequency power to the antenna. In order to supply frequency power to the antenna more efficiently, the impedance at the junction between the power supply and the antenna must be reduced. The plate-shaped conductor is used for connection, and the width of the plate-shaped conductor is sufficiently increased, that is, the impedance of the connection is low. In other words, although the impedance of the conductor is increased due to the increase in the degree of power supply to the junction, the plate-shaped conductor can be used to efficiently radiate heat, so that the increase in impedance can be suppressed.

In addition, in the case of (7), if the standing wave is generated between the connection between the power source supplying the power to the antenna and the plate-shaped conductor, and the connection between the antenna and the plate-shaped conductor, the standing wave is generated. And limiting the strength of the high-frequency power of the plate-shaped conductor at the junction of the power source and the plate-shaped conductor. Therefore, the distance between the two connections is reduced to a length shorter than the 1/4 wavelength of the high frequency, that is, the standing wave is prevented from being generated in the plate-shaped conductor, and the predetermined high-frequency power can be input, and the length of the antenna conductor is preferably The sum of the distances between the two junctions is 'shrinked to be shorter than the 1/4 wavelength length of the high frequency power. Next, a plasma generating apparatus having the above configuration (3) will be described. This configuration focuses on the aspect ratio of an antenna that has not been considered in the past. The inventor of the present invention issued a certain relationship between the area indicated by the antenna (the area from the installation of the antenna to the area perpendicular to the inner wall 5 and the post-plasma degree) has a certain relationship with the aspect ratio. Example 12 1362901 For example, the height applied to the antenna When the frequency voltage is constant, the larger the aspect ratio, the higher the plasma electron energy of the area indicated by the line-day. The reason can be considered as follows. If the aspect ratio is increased, the direction of the antenna is pointed. The induced electric field generated becomes larger. The plasma electrons generated in the vicinity of the antenna are strongly accelerated in the private direction due to the potential difference, and the plasma electron energy in the region in the direction becomes higher. Because of the plasma electron energy The strength ' collides with the plasma electrons and the type of ions and radicals generated in this region will become different substances. In addition, 'the residual ratio is not @φ because the ion species differs from the radical species. Therefore, The aspect ratio of the region to which the etching rate is to be controlled is set to various values, that is, the energy of the plasma electrons can be adjusted, and the type of ions and radical species generated in the target region can be controlled to be controlled. Where the moment of contact

In the apparatus having the above configuration (3), the control of the electron energy can be carried out while maintaining the entire electron temperature in the vacuum vessel at a low temperature. Therefore, it does not increase the potential of the sheath portion of the surname and deposition, but only the electron energy of the target region. Moreover, by the aspect ratio of the twist, the accelerated plasma electrons will not be electrified: it will strike the remaining raw material gas components, and further promote the production of the plasma, thereby bk the electricity to the target area. Packing density. , aspect ratio, is defined as: if it is a rectangular and circular planar antenna 'the vertical length of the antenna and the inner wall divided by the inner flat: the value of the length ' if the antenna has a three-dimensional shape, then The value of the length of the inner wall in the vertical direction of the inner wall divided by the length of the inner wall in the plane parallel to the substrate table is divided by the length of the inner wall of the inner wall of 13 1362901. Hereinafter, in the apparatus having the configuration of (3), an example of controlling the electric energy of electrons and the density of plasma will be described. The aspect ratio of the antenna pointing to the target area is set according to the target value of the plasma electron energy and the plasma density in the area. For example, when it is desired to increase the overall electrical density of the vacuum container, the aspect ratio of all the antennas may be increased. x ‘When the plasma electron energy and plasma density of the internal partition of the vacuum vessel are to be increased, the length and width of the antenna pointing to the target area will be set to be larger than the aspect ratio of the other antennas. Oh, not only an antenna, but also the aspect ratio of a plurality of antennas. Even, in order to = the plasma electron energy and plasma density of a part of the low-vacuum container, the aspect ratio of the antenna pointing to the area can be reduced to be smaller than the aspect ratio of the other antennas, that is, higher A preferred example of the degree of freedom to control the concentration of electron energy and electricity to increase the overall plasma density in the vacuum vessel. In the conventional multi-antenna method, the substrate is used to increase the electropolymerization density lower than the outer edge portion. The method used for the density of the dielectric in the vicinity of the center of the station. Increasing the aspect ratio of the antenna near the center to be larger than the other antennas t can improve the uniformity of the plasma density of the entire plasma generating chamber. For example, a plasma having a uniform density is used to perform a substrate having high uniformity to a substrate to be processed. A method in which the valence body can make the electropolymerization density of a partial region in the second vacuum vessel, for example, is used in the case where the unevenness of the portion is controlled for some reason and the electropolymer density of the portion is corrected and corrected. So that the deposition rate of 1362901 or the etching speed is different from other parts. Next, an electric power generation device having the above configuration (4) will be described. In the same manner as described above, when a plurality of antennas are provided in a vacuum container, the electrodes of the antenna are arranged substantially parallel to the substrate stage, and adjacent electrodes of adjacent antennas have the same polarity. That is, the adjacent electrodes are all connected to the high-frequency power source, or both are grounded, for example, the -electrode is connected to the high-frequency power source, and the other electrode is grounded to the antenna, in this state (including the connection (1) parallel movement When a plurality of modes are provided, the polarities between adjacent electrodes of the adjacent antennas are different. In contrast, if the antenna itself is moved in parallel and the high-frequency power source is connected to the ground, a plurality of antennas are disposed opposite to the adjacent antennas of the disk. When the adjacent electrodes of the adjacent antennas have the same polarity, if the polarities of the adjacent electrodes of the right adjacent antenna are different, when a high-frequency voltage is applied to the antenna to generate an induced electromagnetic field, the adjacent electrodes are applied between the adjacent electrodes. The expected high-frequency voltage 'causes only the electropolymerization density of this portion is local. Therefore, for example, the central portion of the substrate stage, etc., the plasma density outside the adjacent electrodes may become lower. In contrast, according to the above ( In the case of 4), since the adjacent electrodes of the adjacent antennas are the same electrode, when the surface frequency voltage is applied to each antenna, the adjacent electrodes are always equipotential, and high frequency power is not applied. Therefore, between the adjacent electrodes, a local high-plasma region is not formed, and the electric density is uniform. Moreover, since the uniformity of the plasma density is not deteriorated, the antennas can be shortened. The distance increases the density of the antenna, so that the total power (four degrees) can be increased. Furthermore, the distribution of the plasma density can be controlled by appropriately selecting the electrodes of the same polarity. 15 1362901 Next, the description has the above (5) A plasma generating device is constructed. In this configuration, an impedance element for adjusting an antenna voltage or current is connected to each antenna. When each antenna is connected to a frequency-frequency power source, it is typically used for cost reasons. A high-frequency power supply is connected in parallel with a plurality of antennas, but a high-frequency power supply can also be connected to one antenna. When a high-frequency power source supplies high-frequency power to a plurality of antennas, the shape and length of the conductor connecting the high-frequency power source and the antenna Or the frequency distribution of the frequency-frequency power supplied to the antenna will vary from antenna to antenna. When the connecting conductor is a plate-shaped conductor, the influence of temperature distribution is particularly significant. In the plasma generating apparatus of the present invention, the impedance value of each impedance element is adjusted to reduce the difference in the high-frequency power supplied to each antenna, thereby 'equalizing the plasma density generated in the vacuum vessel. For example' When the plurality of antennas are connected in parallel with the high-frequency power source using the above-mentioned plate-shaped conductor, the temperature of the plate-shaped conductor is lower than the vicinity of the center near the end due to the influence of the surface heat release. Therefore, the antenna connected to the end of the plate-shaped conductor is high. The impedance value between the frequency power sources is smaller than the impedance value between the antenna connected to the center and the frequency power supply. Therefore, the impedance value of the impedance element connected to the antenna near the end of the plate-shaped conductor is increased. Thus, the antennas are The difference between the impedance values of the high-frequency power source becomes small, and the high-frequency power supplied to each antenna can be standardized. When the plasma density of a portion of the vacuum region rises or falls for some reason, it can be adjusted. The impedance element impedance value of the antenna pointing to the area is such that the plasma density of the region is driven closer to the values of other regions. This point is not limited to the case where a plurality of antennas are connected in parallel to one high-frequency power source. 1362901 ' can also be applied to a case where only one antenna is connected to a high-frequency power source. Also, the impedance element can be connected only to a part of the antenna, the electric dust or current of the line. For example, ° ^ sets the impedance component and always divides the antenna to not supply the maximum power. For other antennas, set a few yak and adjust the value to limit the power supply.

The impedance element connected to the antenna can be used as a fixed or variable impedance value. For example, the impedance value between each antenna and the high-frequency power source can be known in advance, and the value is reproducible. situation. In the other aspect, the variable impedance element may be used in the case where the impedance value between the antenna and the high-frequency power source is unknown, the case where the temperature is different, or the time change, in addition to the above case. The impedance value of the variable impedance 7L piece is adjusted according to various conditions and changes thereof, so that the density of the generated plasma is checked.

The adjustment of the impedance value of the variable impedance element is preferably performed by monitoring the state of the plasma inside the vacuum capacity and feeding it back. By &, it is possible to vary the time of the plasma density as a function of the temperature of the plate-like conductor. Therefore, in the plasma generating apparatus of the present invention, it is preferable to further provide: a measuring unit that measures a parameter indicating a plasma state; and a control unit that sets each variable impedance according to the parameter The impedance value of the component. The measuring part may be a direct measurement of the plasma density, or it may be a simpler method of measuring the density of the generated plasma by measuring the current or voltage of each antenna. This measuring unit' is configured, for example, in the following manner. By providing a pick-up coil near the antenna, the current of each antenna can be simply measured by measuring the induced electromotive force induced by the pick-up coil. Further, by providing a capacitor in the vicinity of the antenna, by measuring the current flowing through the capacitor, the voltage of each antenna 17 1362901 can be simply measured, and the end of the conductor constituting the antenna is projected to the outside of the vacuum container. Near the end, that is, the pickup coil and the capacitor can be disposed outside the vacuum vessel. Thereby, the current and voltage of the antenna can be measured without the pickup coil and the capacitor being eroded by the electric paddle. Since the generated plasma density is proportional to the power input to the antenna, in order to measure the plasma density more correctly, it is better to measure the current or the electric current of the antenna. That is, measure the power of the input antenna =. To this end, the signal of the antenna current obtained by the above method is multiplied by the delta hole number ' of the antenna I. For the multiplication, for example, a combination of the two can be used. Zha 5 tiger synthesizer (mixer) to carry out. Since the signal obtained by the signal synthesizer contains a two-frequency component, it is preferable to use a cylinder pass filter to remove high frequency components. In any one of the configurations described above, the signal obtained in this manner is proportional to the power input to the antenna. Preferably, the plurality of antennas can be divided into a plurality of groups consisting of one or a plurality of antennas in each group. In the group, high frequency power is supplied to each antenna in parallel. With such a configuration, the load on the high-frequency power source can be reduced as compared with the case where a high-frequency power supply is used to supply power to all the antennas, whereby the generated plasma density can be increased. Moreover, since the electropolymerization device of each of the above configurations can be used, a more uniform and high-density plasma can be realized, so that the device can be used for deposition processing and etching treatment, and the substrate having a relatively flat surface can be efficiently manufactured. . [Embodiment] 18 1362901 "First Embodiment" Fig. 1 is a vertical cross-sectional view of a first embodiment of a plasma generating apparatus of the present invention. Fig. 2 is a side view of the apparatus, and Fig. 3 is a view of the apparatus. Top view. The inside of the vacuum vessel 11 is the plasma generating chamber of the plasma generating device.

As shown in Fig. 3, the inside of the vacuum container 11 has a rectangular shape (longitudinal shape) in plan view. The length of the long side is 1300 mm, and the length of the short side is i 〇〇〇 mm. A vacuum pump (not shown) is connected to the vacuum vessel 11 to maintain the inside of the vacuum vessel at a predetermined degree of vacuum. In the vacuum vessel 11, a rectangular planar substrate stage 14 having a long side of 94 cm and a short side of 76 cm is provided for carrying the substrate U to be processed. The substrate stage 14 can be raised and lowered by the lifting portion Ua provided below it. Further, below the vacuum container 11, a substrate inlet and outlet 12 is provided for taking out and placing the substrate 13 to be processed. Above the inside of the vacuum vessel 11, there is a gas pipe 15 which is provided with water: a surrounding portion of the inner wall surrounding the vacuum vessel U, and is connected thereto.

The outer portion of the empty container η is connected. The surface of the surrounding portion of the gas pipe 15 is appropriately provided with a plurality of holes for uniformly introducing the gas into the real life device 1: or, it may be provided through the side wall or the top of the vacuum container; Surrounding the gas * Η " in the vacuum vessel η as in the present embodiment. In order to uniformly introduce the gas into the vacuum vessel u, y ά ^ ^ ^ . The tank 1 can be properly arranged on the side-and-top wall, and a plurality of pipelines are appropriately arranged. Among the four side walls of the vacuum container 11, the horizontal and short two products L v ♦ are long on both sides _, 'four different intervals, three ancient ginseng 固 3 solid, two-frequency antenna 11 ' ,, 'Figure 3'. The height of any antenna 16 from the substrate table M is 19 】. Of the two electrodes of the respective antennas 16, one is connected to the south frequency power source 18 as described later, and the other one is grounded. For example, if the ground-side electrode of each antenna is connected to the sidewall of the vacuum vessel nt, the ground-side electrode can be grounded β χ by grounding the sidewall, and the fixed or variable blocking capacitor can be inserted into the south-frequency power supply 18 side. The electrode is turned from ground to floating. In the present embodiment, the frequency of the power supplied by the high-frequency power source 18 is ΐ3 56 ΜΗζ. The length of the conductor between the electrodes of the antenna 16 is 45 〇-, which is shorter than 1/4 of the high-frequency wavelength applied to the antenna. As a result, no standing waves are generated and the uniformity of the poles is not broken. The portion of the conductor of the antenna 16 that is located inside the vacuum vessel 11 is surface-covered by an insulator. Moreover, the shape of the high frequency day I 16 is U-shaped, and the inductance of the antenna can be reduced by using such an antenna that does not surround. The antenna covered with an insulator and the non-surrounding antenna which are described here are described in detail in Patent Document 2. In this embodiment, three or four antennas disposed on the side wall of a vacuum vessel are connected in parallel with a high frequency power source. Each day, the connection of the line 16 to the high-frequency power source 18 is as shown in Fig. 2, and a plate-shaped conductor is used. The plate-like conductor 19' is provided along the outer side wall of the vacuum chamber 1111, for example, a copper plate. Through the impedance matching H 17, the high-frequency power source 18 is connected to one point of the copper plate (high-frequency power supply point 20), and at the same time, the electrode of the antenna (the white circle in FIG. 2) is connected to the copper plate... A black circle indicates the electrode on the ground side. The distance from the electrode connected to the copper plate to the high-frequency power supply point 20 on each day of the copper plate is shorter than the ι/4 wavelength of the high frequency applied to the antenna 16. This distance can be lengthened by expanding the width of the copper plate. 20 1362901 Next, the operation of the plasma generating apparatus of the present embodiment will be described. The lifting portion 14a is operated to lower the substrate stage 14. The substrate to be processed 13 is placed in the vacuum chamber 11 from the substrate inlet and outlet 12, and placed on the upper surface of the substrate stage 14 to raise the substrate stage 14 to a predetermined position. After reducing the inside of the vacuum vessel to the desired pressure, the raw material gas of the plasma is introduced into the gas pipe 15 with a predetermined gas force, and the predetermined high-frequency power is supplied from the four high-frequency power sources 18 to the respective two-frequency antennas.丨 6. Thereby, the plasma is generated by the induced electric field generated by the plurality of high frequency antennas 16. Hereinafter, the experimental results will be used to illustrate the plasma density and plasma electron energy generated in the primary device. In the plasma generating apparatus of the first embodiment, argon (Ar) plasma (ar gas flow rate: 5 〇 CCm, gas pressure: measured by 0 66 Pa and i 33 Pa, respectively) was generated, using Langmao probe method (Langmuir· Pr〇be), to measure the vacuum container! ! The second feeding of the center portion (vertical from the inner side of the top wall to the position of 16 mm) is shown in Fig. 4. The total value of the high-frequency power supplied to all the antennas 16 is shown in Fig. 4(a). The result of measuring the electric forging potential VP and the floating potential Vf. The data shown in (8) is measured while changing the total value of the high-frequency power described above: ion mobility Nl, plasma electron density, and plasma electron energy. The knot. The plasma potential Vp A floating potential Vf will increase with the supply of electric power == less 'plasma ion dense H electric (four) sub-density (10) and electric poly-electricity will increase with the increase of electric power. In the figure, it can be seen that 'Using the plasma generating device of the first embodiment, it is possible to produce a 1 X 1 〇 1 suitable for various electric power processes, and a plasma density of μ 乂, and 21 1362901 below 20V. Plasma with low plasma potential. Measure the plane distribution (plasma uniformity) of the plasma density from the inner side of the top wall in the vacuum vessel u, perpendicular to the height of 195 mm, and the result is shown in the fifth Fig. Here, 'the ion saturation current density obtained by the Langmao probe method is used for evaluation. The ion saturation current density corresponds to the plasma ion density. (4), from the electropolymerization device provided in the i-th embodiment The high-frequency power supply 18, when the power supply of 1000W is respectively supplied, the measured result. On the other hand, (b), the high-frequency power supply 18 connected to 54 antennas supplies '00W, and the high frequency of the three antennas from the (four) The result of the measurement when the power supply 18 supplies 7 qing. Therefore, the supplied Power total value, whether or ⑷ ⑻, are all 4_w "(b) higher than the uniformity of electrical plane of the wing ⑷ density distribution. In particular, in the figure (b), the plasma density is almost uniform in the area surrounded by the lattices B, 2, D, and 4. Thus, adjusting the power supplied to the antenna by each power supply can control the plasma density distribution. In Fig. 6, there is shown a plasma generating device having a phase function capable of adjusting the high-frequency power of each high-frequency power source. In this device, waveforms are set on the output side of the impedance integrator 19 corresponding to each of the high-frequency power sources 18d. Check °' (or phase 仏 'or device) 2 1. The waveform detector 2 1 'acquires the waveform of the frequency power supplied to the antenna 16 at any time, and transmits the waveform signal to the phase adjuster 22 phase phase adjuster 22, and detects the waveform signal to each high frequency power source 1 8 According to the result, the phase control signal is transmitted to each of the south frequency power sources so as to be a preset phase difference. Each high frequency power supply 18 . The phase of the full-frequency power is outputted after the cycle. Fig. 7 is a view showing the result of the change in the plasma density measured when the phase difference between the high frequency power sources of 22 1362901 is changed in the plasma generating apparatus of Fig. 6. In the vertical axis of Fig. 7, the plasma electrons at the measuring point near the center of the vacuum vessel are also Ne ° horizontal axis, which means that the high-frequency power source 1 8a _ 1 8b, 1 - 丨 8c, 18c 18 d Phase difference. According to the measurement results, the greater the phase difference, the higher the plasma density. This may be because electrons are accelerated between the antennas due to the phase difference between the antennas, which increases the plasma density. The intensity of such electron acceleration may vary depending on various factors such as the shape of the antenna and the distance between the antennas, the air pressure, and the size of the vacuum container 11. Therefore, the phase difference is appropriately adjusted to maximize the plasma density. Fig. 8 is a view showing an example in which the length a of the side wall direction of the antenna conductor is lengthened and the number of antennas is reduced in the plasma generating apparatus of the second embodiment. (4) An antenna 仏 having a length a of 156 times that of Fig. 3 is provided, and two inner walls of the long side of the vacuum container are provided, and two 127-fold antennas are provided, and two inner walls of the short sides are provided. (b), the lengths & are the a." times the antenna 23b' of the third figure are set to the inner wall of the long side of the vacuum container, and the 2.20 times of the antenna 24b' are each set to j on the short side. Inner wall. In these configurations, lengthening the length of the antenna conductor can increase the inductance of the antenna itself, and by reducing the number of antennas, the high-frequency power supplied to each antenna can be increased. In Fig. 9, the display is shown. The results of measuring the amplitudes of the electric potential and the floating potential in the third and eighth (4) and (8) devices. The longer the antenna conductor is, the smaller the number of antennas per power source, the amplitude of the electropolymerization potential and the floating potential. The larger the result, the higher the inductance of the antenna and the smaller the number of antennas per power supply, the higher the potential of the antenna becomes. The amplitude of the electric and floating potentials becomes larger, although it can be returned. It is effective to increase the ion damage of 23 1362901 in the plasma process, but it is effective for generating gas plasma of hydrogen ionization energy such as hydrogen and helium. [Second Embodiment] In the second embodiment, The composition of the plasma generating device described is focused on the antenna Fig. 10 is a plan view showing a second embodiment. This plasma generating apparatus is a device configuration of the first embodiment, and only the aspect ratio of the antenna 26 is changed. Therefore, Fig. 10 In the first embodiment, the same components as in the first embodiment are given the same reference numerals as in Fig. 3. The number of high-frequency power sources and the number of antennas connected to each other are also the same as those of the 帛丨. As shown in Fig. 4, the aspect ratios of all the antennas 26 are set to 2 (length: width = 2: υ. Again, the aspect ratio of the antenna 16 of the i-th embodiment is as shown in Fig. 5) It is i (length: width = 1:1). The area s ' of the enclosed area of the antenna 26 (four) of the second embodiment is the same as the area of the antenna Μ of the i-th embodiment. Hereinafter, using experimental results, The plasma density and plasma electron energy generated by the plasma generating apparatus of the second experimental example will be described. Here, in order to examine the effect of the change in the aspect ratio, the aspect ratio of all the high frequency antennas is 2 (this embodiment, the antenna of Fig. 11 (4)), 1 (the first embodiment, the antenna of the U-picture (b)), and 〇.5 (the nth picture (< The three kinds of plasma generating devices of the antenna are measured. The length of the ridge of the high-frequency antenna with a length-to-width ratio of 丨 is 15 cm. In this experiment, 133 Pa of argon gas is supplied into the vacuum vessel, and the frequency is supplied. B.56MHZ high-frequency power to high-frequency antenna to produce argon plasma. In addition, the measurement of plasma density is based on the Langmao probe method. 24 1362901 Figure 2 shows the three kinds of plasma The generating device measures the plasma density at the same height as the center of the substrate D at the same height as the high-frequency antenna. The longitudinal frequency of the vertical wheel is expressed on a logarithmic scale (the 〇garithmic scale). The strength of the high-frequency power supplied by the power supply. When the high-frequency power is the same, the device using the high-frequency antenna with an aspect ratio of 2 can be obtained by using a device with a high-frequency antenna having an aspect ratio of 1 and 0.5. High plasma density. Λ '13th order shows the results of the three kinds of devices identical to those in Fig. 12, the amount of plasma electron energy distribution directly above the center of the substrate. The intensity of the high frequency power supplied from each of the high frequency power sources is 2000 W. The parameter 'beyond the high frequency power' is the same as the parameter shown in the measurement of Fig. 12. The vertical axis is a device having a logarithmic scale and an aspect ratio of 2, and the device having a longer aspect ratio is another value, and an electric electron having an energy of 10-18 eV is added. The high-energy electron is an electron generated by the acceleration of the potential difference of the high-frequency antenna. The direction in which the electrons are generated and flies over will vary depending on the aspect ratio. In the U-shaped high-frequency antenna of the present embodiment, since high-energy electrons are generated in the long-side direction of the high-frequency antenna, when the aspect ratio is 2, when the aspect ratio is 1 and 0.5, there are more High energy electronics. Further, the result of Fig. 13 shows that the electron energy of the electric "can be controlled" by changing the aspect ratio of the high frequency antenna. Thereby, important factors can be controlled in the plasma process such as ion type and radical type. Next, (4) as shown in the top view of Fig. U, the aspect ratios of the antennas are different. The electropolymerization shown in Fig. 14 is split, and is disposed in four high-frequency antennas disposed on the long side wall of the vacuum vessel 11, two 25 1362901 high-frequency antennas in the center, and three short-side sidewalls. In the high-frequency antenna, the aspect ratio of one center-frequency antenna (for example, the frequency-frequency antenna 26a) in the center is set to 2, and the aspect ratio of the high-frequency antenna (for example, the high-frequency antenna 26b) near the four corners of the vacuum barnator 11 is set. . X is 1. This is to increase the aspect ratio of the high frequency antenna pointing to the center of the substrate in the vicinity of the substrate in the target area. Fig. 15(a) shows the results of measuring the spatial distribution of the plasma density at the same height as the high frequency antenna using the apparatus of Fig. 14. At the same time, the same measurement was performed on the device in which the aspect ratio of all the high-frequency antennas was Ϊ, and the results are shown in Fig. 15 (7) of the comparative example of the second embodiment. Here, the intensity of the high-frequency power supplied from each of the high-frequency power sources is 1 〇〇〇w, and the other conditions are not generated, which is the same as the conditions of the second embodiment. As can be seen from the fifth drawing, in the apparatus of Fig. 14, the plasma density at the center portion is higher than that of the comparative example, and the plasma density of the outer edge portion is suppressed from being increased. As a result, the uniformity of the plasma density is improved as compared with the apparatus of the comparative example. [Third Embodiment] In the third embodiment, the configuration of the plasma generating apparatus is focused on the polarity of adjacent electrodes of adjacent antennas. . Fig. 16 is a plan view showing the third embodiment. Compared with the i-th embodiment

The same components as those in Fig. 3 are assigned the same symbols. The amount of the high-frequency power source and the number of antennas connected to the respective high-frequency power sources are the same as those in the first embodiment. In the configuration of the apparatus of the first embodiment, only the polarity of the electrodes of the respective frequency antennas 16 is changed as a result of the change. Specifically, the antenna group 26 1362901 composed of three or four antennas disposed on the same side wall has the same polarity in the adjacent high frequency antenna. For example, in the antenna group 31a, in the adjacent high frequency antenna 16a and the high frequency antenna (10), the electrodes adjacent to each other are simultaneously connected to the impedance matching unit i7 - the high frequency power source 18, and the high frequency antenna 16b and In the high frequency day 2616c, the electrodes adjacent to each other are grounded. As shown in Fig. π (b), when the terminals adjacent to each other in the adjacent high-frequency antennas are set to opposite polarities, a potential difference is generated between the adjacent electrodes in the gap 32 between the adjacent antennas. Therefore, the electric power in the gap 32 becomes higher than the other positions. Also, the power (four) degrees of other locations will decrease with ^. On the other hand, in the apparatus of the third embodiment, the adjacent electrodes of the adjacent antennas have the same polarity so that a potential difference does not occur between the adjacent electrodes in the gap 32 < Since &' can prevent the "concentration rise" due to the existence of a potential difference between the terminals of the gap, and prevent the plasma concentration of other portions from decreasing, the electropolymerization generated by the plasma generating device of the embodiment of 帛3 is shown. The measurement of the density. In this experiment, "chlorine gas was supplied to the vacuum capacity I to 1.33 Pa" and high frequency power of 13 56 MHz was supplied to the respective high frequency lines to generate argon electricity. Other materials are mentioned in the description of each measurement. Further, the Lang Mao probe method is used in the measurement of the plasma density. Fig. 18 is a view showing the plasma density of the plasma generating apparatus of the third embodiment, which is measured directly above the center of the substrate stage at the same height as the high frequency antenna: Results. In this figure, for comparison, - the measurement results of the plasma generating devices for adjacent electrodes = different polarities are shown. Here, the vertical axis is the electron density expressed on a logarithmic scale, and the horizontal axis is the intensity of the high frequency power supply of 27 1362901. The value of the frequency power is no matter what the device of the present embodiment is, compared to the device of the comparative example, a higher plasma density can be obtained. Especially in the case of high frequency power of 1200 W - 2500 W, the plasma density of this embodiment is about twice that of the plasma of the comparative example. In Fig. 19, the results of measuring the spatial distribution of plasma density are shown. The measurement conditions at this time are as follows. The high frequency power is supplied only to the one antenna group 31b shown in Fig. 16. The high frequency power supply of the high frequency power supply has an intensity of 1500W. The horizontal axis of Fig. 19 of the plasma density measuring point indicates a position on a straight line which is parallel to the side wall of the antenna group 31b and has a distance of 13 cm. As can be seen from Fig. 19, in the plasma generating apparatus of the comparative example, the plasma density at the end becomes lower than the plasma density near the center, and the spatial distribution of the plasma density is partially dense. On the other hand, in the plasma generating apparatus of the present embodiment, the spatial distribution of the plasma density is densely concentrated, which is smaller than that of the plasma generating apparatus of the comparative example, and the uniformity of the plasma density distribution is improved. «Fourth Embodiment» The fourth embodiment is a configuration of a plasma generating apparatus in which an impedance element is connected to an antenna. Figure 20 is a plan view of the fourth embodiment. The same constituent elements as in the third embodiment are given the same reference numerals as in the 帛3 diagram. The number of high frequency power supplies and the number of antennas connecting the high frequency power supplies are the same as in the embodiment of 帛i. This electro-convergence generating device is constructed in the configuration of the second embodiment, and the impedance element 14 is connected between one of the electrodes of each of the high-frequency antennas 16 and the impedance matching g 17 . As the impedance element 41', for example, the variable inductance coil 42 shown in Fig. 21 can be used. Further, the adjustment of the inductance value of the variable inductance coil 42 can be performed by moving the hand 362901. However, when performing the feedback control described later, it is preferable to provide the driver to perform the automatic operation. Further, in the present embodiment, the inductance element 41 is connected to the electrode of the 咼frequency power source 20 of the antenna 16, but the impedance element 4 丨 may be connected to the electrode on the ground side. Further, in the fourth embodiment, as shown in the vertical cross-sectional view of Fig. 22, the pickup coil 44 and the capacitor 45 are provided. Since the high frequency antenna 16 is disposed so that the dog is out to the outside of the hollow container 丨1, it is preferable to arrange the pickup coil 44 and the capacitor 45 in the vicinity of the protruding portion in order to avoid erosion by the plasma. Since the pickup coil 44 is used for current measurement, it can be provided on either the ground side of the frequency-frequency antenna 16 or the connection side of the high-frequency power source. In order to convert the AC signals from the pickup coil 44 and the capacitor 45 into DC signals, the pickup coils 44 and the capacitors 45 are respectively connected to the bridge circuit 46 as shown in Fig. 23. Instead of a bridge circuit, a detector that detects an AC signal and outputs a DC signal can also be used. Further, <<>> controls Deng 47 (Fig. 20) to output a signal for inputting the signals and setting the impedance value of the impedance element 41. In the plasma generating apparatus of the present embodiment, for example, when the copper plate 19 is distributed due to the temperature distribution or the like, the electric resistance is supplied to each high frequency by adjusting the resistance value of each of the resistors 4 1 . Set to an appropriate value to homogenize the plasma density. Here, there is a good view of the plasma density distribution of the 'i! The impedance value to be set for each impedance element can be clearly determined by experiments or the like. A fixed impedance element can also be used. Further, although the electric density distribution differs depending on the conditions of the gas to be used and the power supplied, it is reproducible under the same conditions, and the variable impedance element can be used to set the compliance to 丄 901. The impedance value of the sea condition. Further, the difference in the plasma density distribution is reproduced by the condition, and the plasma density distribution is fed back to adjust the impedance value of the variable impedance element. The feedback control is performed in the following manner. Current signals from the pickup coils 44 provided in the respective antennas and/or voltage signals from the capacitors 45 are input to the control unit 47. Alternatively, when any of the signals of the antennas or the power signal formed by the product of the signals reaches a predetermined value or more, that is, when the plasma density around the antenna reaches a predetermined value or more, the control port P 47' will drive the signal $43 (located on the impedance element 41 connected to the antenna) to output a signal to increase the impedance value of the element. On the other hand, when the signal such as the current of the antenna falls below a predetermined value, the control unit 47 outputs a signal for use in the driver 43 to make the impedance value small. The driver 43 receives the signals transmitted from the control unit 47, and sets the impedance value of the impedance element to a predetermined value. Thereby, the plasma density around the impedance element can be controlled within a predetermined range. Hereinafter, the inspection of the δ is described as a measure of the plasma density distribution generated by using the plasma generating apparatus of the present embodiment. In this experiment, only the three antennas A, B, and C surrounded by a broken line in Fig. 2 are supplied with high-frequency power, and the Langmao probe method is used to measure the side of the vacuum container provided with the antenna at 13 cm. Plasma density distribution. The plasma generated here was an argon plasma, and after supplying argon gas to a pressure of 1.33 Pa, high-frequency power of 2000 W and 13.56 MHz was supplied from i high-frequency power sources connected to three antennas a, B, and c. The impedance value of the impedance element is adjusted according to the signal from the pickup coil 44, so that the current flow ratio of the three antennas A, B, and C is 1:12: i 30 1362901 , 2.1.2 , and 3 : 1 . 3 states of 3, and respectively measure the plasma density distribution. The measurement result is shown in Fig. 24. When the currents of the three high-frequency antennas are almost equal and the current ratio is 丨:2: 丨, the density of the plasma near the center becomes high, and the density of the plasma at the outer edge becomes low. On the other hand, when the current ratio of the current of the high-frequency antennas at both ends is increased to 2: 丨·· 2, the plasma density near the center is lowered, and the plasma density at the outer edge portion is increased. The homography has been improved. Then, when the current of the frequency: line is increased to a current ratio of 3:1:3, the plasma density near the center becomes lower as opposed to the current ratio i: 1.2:1. Further, the optimum current ratio of the plasma density distribution varies depending on the type and pressure of the plasma gas and the power supply of the high-frequency power source. Therefore, the impedance value of the impedance element must be appropriately adjusted so that the current ratio is the optimum value in accordance with the conditions. In each of the above embodiments, the planar shape of the vacuum container is a rectangular shape, but may be other shapes such as a circular shape. Further, in each of the above embodiments, the antenna is provided on the side wall of the vacuum container, but part or all of the antenna may be disposed on the top wall of the vacuum container. BRIEF DESCRIPTION OF THE DRAWINGS (1) Schematic portion Fig. 1 is a vertical sectional view showing a first embodiment of a plasma generating apparatus of the present invention. Fig. 2 is a side view showing the plasma generating apparatus of the first embodiment. Fig. 3 is a plan view showing the plasma generating apparatus of the first embodiment. Fig. 4 is a graph showing the state of plasma in the center portion of the vacuum vessel measured in the summer of 31 1362901 in the plasma generating apparatus of the first embodiment. Fig. 5 is a graph showing the plasma density distribution in the vacuum vessel measured in the plasma generating apparatus of the first embodiment. Fig. 6 is a schematic block diagram showing an example of a plasma generating apparatus having a phase adjustment function. Fig. 7 is a graph showing changes in plasma density when the phase difference between high frequency power sources is changed. Fig. 8 is a plan view showing an example of a plasma generating apparatus in which the length of the antenna conductor in the side wall direction and the number of antennas are different. Fig. 9 is a graph showing the difference in amplitude between the plasma potential and the floating potential due to the difference in the length of the antenna conductor in the side wall direction and the number of antennas. Fig. 1 is a plan view showing a second embodiment of the plasma generating apparatus of the present invention. Fig. 11 is a view showing a plurality of types of antennas having different aspect ratios. Fig. 12 is a graph showing the plasma density at the center of the vacuum container of the plasma generating apparatus of the second embodiment and the comparative example. Fig. 13 is a graph showing the distribution of electron energy in the center of the vacuum vessel of the plasma generating apparatus of the second embodiment and the comparative example. Fig. 14 is a plan view showing an example of a plasma generating apparatus in which the aspect ratios of the antennas are different. Fig. 15 is a graph showing the plasma density distribution of the plasma generating apparatus of Fig. 14 and the apparatus of the comparative example. 32 is a plan view showing a third embodiment of the plasma generating apparatus of the present invention. Fig. 17 is an explanatory view showing the difference between the gap between adjacent antennas and the gap. Fig. 18 is a graph showing the plasma density at the center of the vacuum vessel of the plasma generating apparatus of the third embodiment and the comparative example. Fig. 19 is a chart showing the spatial distribution of the plasma density generated in the third embodiment and the comparative example. Fig. 20 is a plan view showing a fourth embodiment of the plasma generating apparatus of the present invention. Fig. 21 shows an example of an impedance element. Fig. 22 is a vertical cross-sectional view showing the plasma generating apparatus of the fourth embodiment. Fig. 23 shows an example of a diode bridge circuit. Fig. 24 is a chart showing the spatial distribution of the plasma bulk generated by the generating apparatus of the fourth embodiment. (2) Component symbol 11 Vacuum container 12 Substrate inlet and outlet 13 Substrate to be processed 14 Substrate table 14a Lifting portion 15 Gas tube 1, 6, 16a, 16b, 26a, 26b High frequency antenna 1362901 17 Impedance matching 18 South frequency power supply 18a, 18b, 18c, 18d 13⁄4 frequency power supply 19 plate conductor 20 south frequency power 21 waveform detection 22 phase detection 23a, 23b, 24a, 24b, 26 antenna 31a, 31b antenna group 32 gap 42 variable inductance 43 driver 44 pickup coil 45 capacitor 46 bridge circuit 47 control unit supply point device

34

Claims (1)

1362901 m.: ψ' 拾> 曰修 (more satirical ρ月 if day correction replacement page board patent application scope: 1 plasma generation device, characterized by: (a) vacuum container; (b) substrate The platform is disposed in the direct space m ^ « / Xing Ergu state, and is used for carrying the processed base (a plurality of inductively coupled antennas are disposed in the vacuum container and arranged substantially in parallel with the substrate table; (d) a high-frequency power source that supplies high-frequency power to the antenna; (4) a plate-shaped conductor 'connected to the high-frequency power source and connected in parallel with at least a portion of the plurality of antennas; a connection point of the high-frequency power source and the plate-shaped conductor The distance between the two connection points of the connection point of the plate-shaped conductor and each antenna is shorter than the wavelength of the high-frequency 。. 2 · The antenna of the first item is applied to the plasma of the side wall surface of the vacuum container. a generating device, wherein the 'or top wall, or both or two of the plasma generating devices are covered. The shape or the second plasma generating device is in the shape of a plane. a slurry generating device comprising one or more antennas The complex frequency power supply will be supplied in parallel to the frequency power
3 · If the scope of the antenna is in the first part of the patent application, the surface of the antenna is insulated by the insulator 4, as in the first patent application scope, wherein the antenna is in the vacuum container 5, such as the scope of the patent patent, the plurality of antennas The system is divided into several groups, each of which is as high as each antenna. 35 1362901
3 of the 6th plasma generating device, wherein the sum of the distances between the two connection points is shorter than the high frequency 6 · As in the patent application scope, the antenna system is shorter than the high frequency 7 The length of the antenna conductor is 1/4 wavelength length of the two 5 powers.巧巧曰 Corrected the k-page _____ j or 2 plasma generator, its 1/4 wavelength length conductor. 8. The plasma generating apparatus of claim 1, comprising a phase detector, a phase; and a phase adjuster for detecting high frequency power supplied to the groups, for adjusting the high frequency power Phase. 9. The plasma generating apparatus of claim 2 or 2, wherein an antenna aspect ratio corresponding to a target area of the four substrate stage is set to correspond to a target plasma density or plasma in the target area. The value of the electron energy is 'this aspect ratio is projected on the surface parallel to the substrate table and the length in the direction perpendicular to the inner wall of the vacuum vessel divided by the length in the direction parallel to the inner wall. 10. The plasma generating apparatus according to claim 9 wherein, in order to improve the target plasma density or plasma electron energy in the target region, the aspect ratio of the corresponding antenna is set to be higher than other antennas. A large value of the aspect ratio 〇11. The plasma generating apparatus of claim 10, wherein the area includes the center of the substrate stage. 12. The plasma generating device of claim 1 or 2, wherein the electrodes of the antenna are arranged substantially parallel to the substrate, and adjacent electrodes of one or a plurality of adjacent antennas have the same polarity . 36 i lofc year} month I曰 correction, as the second patent application scope: " ϋ Θ Θ ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι 14. If the electro-convergence device of claim 1 or 2 is applied, the impedance element is connected to the antenna. & The plasma generating device of claim 14 of the patent scope, wherein a plurality of antennas are connected in parallel with one frequency power supply. 16 For example, the plasma generating device of claim 14 of the patent scope, wherein ' is connected to one high frequency power supply! Antennas. The above-mentioned plasma generating device of claim 14, wherein the impedance of the impedance element is variable. The plasma generating device of claim 17, wherein the impedance element is a variable inductance coil. For example, in the plasma generating device of claim 17 of the patent scope, Zhuang and: '..., s measuring unit is used to measure the voltage or current of each antenna; and the control part is based on the voltage obtained in the measuring part or The current value is used to set the far variable impedance value. 2. A plasma generating apparatus according to claim 19, wherein the '°Herry measuring unit has a pick-up coil' disposed near the antenna for detecting the current of the antenna. [21] The plasma generating apparatus of claim 19, wherein the measuring unit is provided with a capacitor disposed near the antenna for detecting a voltage applied to the antenna. 22 · The plasma generating device of claim 19, 37 I-------------------------------- ------» -_______^ I--------------------------------------» -_______^1362901 I gamma 9 is the day Xiu Ma ^, shai set the measurement department with bridge type when the bucket, recognize 5------------------ · ——1 A circuit or detector that converts the detected high-frequency current or voltage signal into a DC current or voltage signal. 23·If the plasma generating device of claim 19, the measuring unit of the bean has: a signal synthesizer, a system for inputting, a current signal and a voltage signal for δ into an antenna: and a low pass Filtering benefits, pass ffl xfe J- π/v jj pj.. ', used to remove the high frequency part of the signal synthesized by the sigma 唬 synthesizer. 24 plasma control methods, characterized in that: a plurality of inductive coupling antennas are provided in a vacuum vessel, a high frequency power source for supplying high frequency power to the antenna, and the high frequency power source is connected to the plurality of antennas In a plasma generating device of a part of parallel plate-shaped conductors, a distance between a connection point of the surface frequency power source and the plate-shaped conductor and a connection point of the plate-shaped conductor and each antenna is shorter than the high frequency a 1/4 wavelength length for controlling the state of the plasma formed in the vacuum vessel by adjusting the length of the antenna in the vacuum vessel; the plurality of inductively coupled antennas are disposed on the side or top of the vacuum vessel The wall or both are arranged substantially in parallel with the substrate stage carrying the substrate to be processed. [25] The plasma control method of claim 24, wherein the state of the plasma is controlled by adjusting a phase difference of the high frequency power supplied to the antenna. 26. The plasma control method according to claim 24 or 25, wherein the antenna aspect ratio corresponding to the position of the target area of the substrate stage is set to a target plasma density corresponding to the target area, or electricity Destroyed electron energy 38 1362901 I $1 The value of the ionic species or radical species produced in the target region. 27. The plasma control method according to claim 26, wherein in order to increase the target plasma density or electron energy in the target region, the aspect ratio of the corresponding high frequency twist line is adjusted to be larger than other antennas. The aspect ratio is large. 28 The plasma control method of claim 27, wherein the target area includes the center of the substrate stage. 29. The plasma control method according to claim 24 or 25, wherein the adjacent electrodes of the adjacent antennas of one or a plurality of arrays are set to have the same polarity, thereby controlling the plasma generating device Plasma density distribution. 30. The plasma control method of claim 29, wherein 'the adjacent electrodes of the adjacent antennas are all set to the same polarity 31: as in the patent application 帛 24 or 25. The control method is characterized in that the impedance elements are connected to the respective antennas, and the impedance density values of the respective impedance elements are adjusted to control the electro-concentration density distribution in the vacuum container. 32. If the application method of the patent range is $31 $, the impedance value of the components in the bean is variable, and the voltage of each high-frequency antenna can be measured by the current or both. The voltage, current, or its product is measured to control the variable impedance value. 33. A method for manufacturing a substrate, which is characterized in that: the patent application scope i-23, the patent Fantu flute "K 罨 pulp production device, or the application, and the use of a member of the electric damage control method to generate The raw material is electrically destroyed and the raw material plasma is produced. 39 1362901 : -..I·',,, 34. A method for manufacturing a substrate, which is characterized in that: plasma generation is carried out using items 1 to 23 of the patent application range. The device or the plasma generated by the plasma control method of the patents Nos. 24 to 32 is used for etching treatment.
40
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