TWI346766B - Circuit board and process for fabricating the same - Google Patents

Circuit board and process for fabricating the same

Info

Publication number
TWI346766B
TWI346766B TW097113244A TW97113244A TWI346766B TW I346766 B TWI346766 B TW I346766B TW 097113244 A TW097113244 A TW 097113244A TW 97113244 A TW97113244 A TW 97113244A TW I346766 B TWI346766 B TW I346766B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
circuit board
board
circuit
Prior art date
Application number
TW097113244A
Other languages
Chinese (zh)
Other versions
TW200942762A (en
Inventor
ming hao Wu
Chen Chuan Chang
Shao Chien Lee
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW097113244A priority Critical patent/TWI346766B/en
Publication of TW200942762A publication Critical patent/TW200942762A/en
Application granted granted Critical
Publication of TWI346766B publication Critical patent/TWI346766B/en

Links

TW097113244A 2008-04-11 2008-04-11 Circuit board and process for fabricating the same TWI346766B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097113244A TWI346766B (en) 2008-04-11 2008-04-11 Circuit board and process for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097113244A TWI346766B (en) 2008-04-11 2008-04-11 Circuit board and process for fabricating the same

Publications (2)

Publication Number Publication Date
TW200942762A TW200942762A (en) 2009-10-16
TWI346766B true TWI346766B (en) 2011-08-11

Family

ID=44868790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113244A TWI346766B (en) 2008-04-11 2008-04-11 Circuit board and process for fabricating the same

Country Status (1)

Country Link
TW (1) TWI346766B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415527B (en) * 2011-01-31 2013-11-11 Compeq Mfg Co Ltd Multi-layer circuit board with embedded thermal conductive metal block and its preparation method
TW201241969A (en) 2011-04-08 2012-10-16 Unimicron Technology Corp Method for fabricating heat dissipation substrate
CN103531484B (en) * 2012-07-06 2016-12-21 景硕科技股份有限公司 The manufacture method of chip bearing board structure

Also Published As

Publication number Publication date
TW200942762A (en) 2009-10-16

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