TWI346034B - - Google Patents

Info

Publication number
TWI346034B
TWI346034B TW093135826A TW93135826A TWI346034B TW I346034 B TWI346034 B TW I346034B TW 093135826 A TW093135826 A TW 093135826A TW 93135826 A TW93135826 A TW 93135826A TW I346034 B TWI346034 B TW I346034B
Authority
TW
Taiwan
Prior art keywords
suction
suction pad
undulation
flexure
springs
Prior art date
Application number
TW093135826A
Other languages
English (en)
Other versions
TW200529997A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200529997A publication Critical patent/TW200529997A/zh
Application granted granted Critical
Publication of TWI346034B publication Critical patent/TWI346034B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B25B11/007—Vacuum work holders portable, e.g. handheld
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
TW093135826A 2003-11-21 2004-11-22 Vacuum suction head, and vacuum suction device and table using the same TW200529997A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003392157 2003-11-21

Publications (2)

Publication Number Publication Date
TW200529997A TW200529997A (en) 2005-09-16
TWI346034B true TWI346034B (zh) 2011-08-01

Family

ID=34616438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135826A TW200529997A (en) 2003-11-21 2004-11-22 Vacuum suction head, and vacuum suction device and table using the same

Country Status (10)

Country Link
US (1) US7665783B2 (zh)
EP (1) EP1685930B1 (zh)
JP (1) JP4724562B2 (zh)
KR (1) KR101142346B1 (zh)
CN (1) CN100445049C (zh)
AT (1) ATE420751T1 (zh)
DE (1) DE602004019132D1 (zh)
PL (1) PL1685930T3 (zh)
TW (1) TW200529997A (zh)
WO (1) WO2005049287A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561451B (zh) * 2013-05-17 2016-12-11

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CN104117989B (zh) * 2013-04-26 2015-12-09 林锡聪 玻璃面板撷取装置及其撷取玻璃面板的方法
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JP6287240B2 (ja) * 2014-01-17 2018-03-07 東京エレクトロン株式会社 真空処理装置及び真空処理方法
JP5996566B2 (ja) * 2014-02-12 2016-09-21 信越エンジニアリング株式会社 ワーク用チャック装置及びワーク貼り合わせ機並びにワーク貼り合わせ方法
CN103831835B (zh) * 2014-02-24 2015-12-09 东莞市楷德精密机械有限公司 真空吸头及具有该真空吸头的吸取装置
JP6271312B2 (ja) * 2014-03-24 2018-01-31 株式会社ディスコ 搬送装置
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JP2016088576A (ja) * 2014-11-06 2016-05-23 オムロン株式会社 吸着ヘッドおよびそれを備える貼付装置
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TWI571366B (zh) * 2015-12-01 2017-02-21 亞智科技股份有限公司 吸附組件與吸附式移載裝置
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JP7208759B2 (ja) * 2018-10-16 2023-01-19 株式会社ディスコ ウエーハ保持装置を用いたウエーハの加工方法
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CN109173873B (zh) * 2018-10-31 2020-08-18 重庆英特力科技有限公司 自动振荡混匀装置
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CN109848892B (zh) * 2019-01-23 2022-01-04 南昌航空大学 一种夹持薄壁零件的夹具单元及操作方法
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JP7315820B2 (ja) * 2019-03-28 2023-07-27 株式会社東京精密 ワーク搬送装置
CN110056566A (zh) * 2019-04-21 2019-07-26 亚米拉自动化技术（苏州）有限公司 一种用于异形表面吸附的真空吸盘
KR102055130B1 (ko) * 2019-09-24 2019-12-12 아이엔지글로벌 (주) 그리퍼 장치
KR102215994B1 (ko) * 2019-10-23 2021-02-17 (주)케이에이텍 차량 흡음재용 흡착장치
CN113840788B (zh) * 2020-01-16 2024-03-22 韩国机械研究院 软固持头、包括该软固持头的软固持单元以及包括该软固持单元的固持装置
CN113137425B (zh) * 2020-01-20 2022-07-05 杭州萤石软件有限公司 一种吸盘装置
CN113137424B (zh) * 2020-01-20 2022-05-27 杭州萤石软件有限公司 一种吸盘装置
JP7438626B2 (ja) 2020-03-31 2024-02-27 株式会社ディスコ 搬送機構及びシート拡張装置
CN114516537A (zh) 2020-11-19 2022-05-20 三赢科技（深圳）有限公司 吸附组件及吸附装置
CN113184074B (zh) * 2021-04-28 2022-10-04 北京航空航天大学 适用于爬壁机器人的变自由度吸盘结构
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TWI820518B (zh) * 2021-11-17 2023-11-01 威光自動化科技股份有限公司 輔助載具內之膠墊固定及釋放玻璃工件用的驅動裝置
CN114952646B (zh) * 2022-02-17 2024-03-29 合肥宏立电子有限公司 一种改良的工装治具
CN114654043A (zh) * 2022-03-01 2022-06-24 深圳市精博德科技有限公司 将插接件抓取至电路板上的吸附抓取结构
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Publication number Priority date Publication date Assignee Title
TWI561451B (zh) * 2013-05-17 2016-12-11

Also Published As

Publication number Publication date
JPWO2005049287A1 (ja) 2008-03-06
EP1685930B1 (en) 2009-01-14
US20070200377A1 (en) 2007-08-30
ATE420751T1 (de) 2009-01-15
DE602004019132D1 (de) 2009-03-05
KR20060126485A (ko) 2006-12-07
US7665783B2 (en) 2010-02-23
EP1685930A1 (en) 2006-08-02
EP1685930A4 (en) 2007-10-10
PL1685930T3 (pl) 2009-06-30
TW200529997A (en) 2005-09-16
WO2005049287A1 (ja) 2005-06-02
JP4724562B2 (ja) 2011-07-13
CN100445049C (zh) 2008-12-24
CN1882425A (zh) 2006-12-20
KR101142346B1 (ko) 2012-05-18

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