TWI340205B - Fastener for heat sinker and an elastic frame of the fastener - Google Patents
Fastener for heat sinker and an elastic frame of the fastenerInfo
- Publication number
- TWI340205B TWI340205B TW097145949A TW97145949A TWI340205B TW I340205 B TWI340205 B TW I340205B TW 097145949 A TW097145949 A TW 097145949A TW 97145949 A TW97145949 A TW 97145949A TW I340205 B TWI340205 B TW I340205B
- Authority
- TW
- Taiwan
- Prior art keywords
- fastener
- elastic frame
- heat sinker
- sinker
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097145949A TWI340205B (en) | 2008-11-27 | 2008-11-27 | Fastener for heat sinker and an elastic frame of the fastener |
US12/615,934 US8284555B2 (en) | 2008-11-27 | 2009-11-10 | Heat-dissipated fastener and elastic frame thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097145949A TWI340205B (en) | 2008-11-27 | 2008-11-27 | Fastener for heat sinker and an elastic frame of the fastener |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201020404A TW201020404A (en) | 2010-06-01 |
TWI340205B true TWI340205B (en) | 2011-04-11 |
Family
ID=42196059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097145949A TWI340205B (en) | 2008-11-27 | 2008-11-27 | Fastener for heat sinker and an elastic frame of the fastener |
Country Status (2)
Country | Link |
---|---|
US (1) | US8284555B2 (zh) |
TW (1) | TWI340205B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201315360A (zh) * | 2011-09-21 | 2013-04-01 | Foxconn Tech Co Ltd | 散熱裝置 |
CN103702544A (zh) * | 2012-09-27 | 2014-04-02 | 英业达科技有限公司 | 电子装置及其导热件 |
US20150184948A1 (en) * | 2013-12-31 | 2015-07-02 | Asia Vital Components Co., Ltd. | Structure for holding a heat pipe to a base |
US11570932B2 (en) * | 2020-03-24 | 2023-01-31 | Arris Enterprises Llc | Heat exchange ribbon |
US20240019009A1 (en) * | 2021-04-20 | 2024-01-18 | Nvidia Corporation | Leaf spring for an integrated circuit heat sink |
CN115556447B (zh) * | 2022-09-05 | 2023-07-18 | 河北久申防水建筑材料有限公司 | 一种耐低温抗老化弹性体改性沥青防水卷材 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2346005Y (zh) | 1998-05-19 | 1999-10-27 | 建准电机工业股份有限公司 | 中央处理器与散热件组合装置 |
US6611999B1 (en) * | 2002-03-28 | 2003-09-02 | Glacialtech, Inc. | Detent means for a heat sink |
CN2691052Y (zh) * | 2004-02-14 | 2005-04-06 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN100472399C (zh) | 2005-05-23 | 2009-03-25 | 广达电脑股份有限公司 | 具有弹片结构的散热装置及散热方法 |
-
2008
- 2008-11-27 TW TW097145949A patent/TWI340205B/zh active
-
2009
- 2009-11-10 US US12/615,934 patent/US8284555B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20100128444A1 (en) | 2010-05-27 |
US8284555B2 (en) | 2012-10-09 |
TW201020404A (en) | 2010-06-01 |
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