TWI339872B - Heat treatment unit - Google Patents

Heat treatment unit

Info

Publication number
TWI339872B
TWI339872B TW095145644A TW95145644A TWI339872B TW I339872 B TWI339872 B TW I339872B TW 095145644 A TW095145644 A TW 095145644A TW 95145644 A TW95145644 A TW 95145644A TW I339872 B TWI339872 B TW I339872B
Authority
TW
Taiwan
Prior art keywords
heat treatment
treatment unit
unit
heat
treatment
Prior art date
Application number
TW095145644A
Other languages
English (en)
Other versions
TW200737393A (en
Inventor
Yasutaka Souma
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200737393A publication Critical patent/TW200737393A/zh
Application granted granted Critical
Publication of TWI339872B publication Critical patent/TWI339872B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
TW095145644A 2005-12-08 2006-12-07 Heat treatment unit TWI339872B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005355183A JP4531690B2 (ja) 2005-12-08 2005-12-08 加熱処理装置

Publications (2)

Publication Number Publication Date
TW200737393A TW200737393A (en) 2007-10-01
TWI339872B true TWI339872B (en) 2011-04-01

Family

ID=38130875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145644A TWI339872B (en) 2005-12-08 2006-12-07 Heat treatment unit

Country Status (4)

Country Link
JP (1) JP4531690B2 (zh)
KR (1) KR101269748B1 (zh)
CN (1) CN100474507C (zh)
TW (1) TWI339872B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055862B1 (ko) * 2009-03-23 2011-08-09 주식회사 테라세미콘 인라인 열처리 장치
JP4936567B2 (ja) * 2009-09-18 2012-05-23 東京エレクトロン株式会社 熱処理装置
JP2011216572A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5226037B2 (ja) * 2010-06-04 2013-07-03 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP5165731B2 (ja) 2010-06-30 2013-03-21 東京エレクトロン株式会社 局所露光装置及び局所露光方法
JP5470236B2 (ja) 2010-12-22 2014-04-16 東京エレクトロン株式会社 局所露光方法及び局所露光装置
JP5369128B2 (ja) * 2011-03-01 2013-12-18 東京エレクトロン株式会社 浮上式塗布装置
JP5451798B2 (ja) 2011-03-15 2014-03-26 東京エレクトロン株式会社 局所露光方法及び局所露光装置
JP5773815B2 (ja) * 2011-09-12 2015-09-02 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP7265314B2 (ja) * 2017-03-03 2023-04-26 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
US11476167B2 (en) 2017-03-03 2022-10-18 SCREEN Holdings Co., Ltd. Heat treatment method and heat treatment apparatus of light irradiation type
JP7232596B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232593B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7186605B2 (ja) * 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7142566B2 (ja) 2018-12-27 2022-09-27 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102220853B1 (ko) * 2019-05-27 2021-02-26 주식회사 선코리아 열처리장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252989A (ja) * 1986-04-25 1987-11-04 日本電気株式会社 印刷配線板の製造方法
JPH0193121A (ja) * 1987-10-05 1989-04-12 Kawasaki Steel Corp 半導体ウェハベーキング装置
JPH0270426A (ja) * 1988-09-06 1990-03-09 Kawasaki Steel Corp 制振性を備えた複合鋼板
JPH04243119A (ja) * 1991-01-17 1992-08-31 Sharp Corp レジスト加熱装置
JPH0531223U (ja) * 1991-09-30 1993-04-23 日本電気株式会社 液晶デイスプレイアクテイブ素子製造用現像装置
JP3438790B2 (ja) * 1994-07-28 2003-08-18 富士通株式会社 ベーキング装置
JPH0953881A (ja) * 1995-08-11 1997-02-25 Fuji Photo Film Co Ltd 硬基板のベーク装置
JPH09310198A (ja) * 1996-05-20 1997-12-02 Dainippon Printing Co Ltd 電着レジスト乾燥装置
JPH1147668A (ja) * 1997-06-06 1999-02-23 Kansai Denshi Kk 基板乾燥装置
JP2005123284A (ja) * 2003-10-15 2005-05-12 Renesas Technology Corp 半導体製造装置

Also Published As

Publication number Publication date
KR101269748B1 (ko) 2013-05-30
KR20070061418A (ko) 2007-06-13
CN100474507C (zh) 2009-04-01
TW200737393A (en) 2007-10-01
JP4531690B2 (ja) 2010-08-25
JP2007158253A (ja) 2007-06-21
CN1979765A (zh) 2007-06-13

Similar Documents

Publication Publication Date Title
TWI339872B (en) Heat treatment unit
GB2422552B (en) Heat therapy apparatus
HK1205935A1 (zh) 非碎石性的腎結石療法
EP1908389A4 (en) MEDICAL CONTROLLER
GB0506759D0 (en) Combination treatment methods
GB0504206D0 (en) Combination therapy
EP1895575A4 (en) HEAT TREATMENT DEVICE
GB0509052D0 (en) Combination therapy
GB0507125D0 (en) Heater
GB0516068D0 (en) Well treatment
ZA200709627B (en) Combination therapy
GB0525540D0 (en) New treatment
GB0511769D0 (en) Treatment
GB0507003D0 (en) Therapeutic
GB2422769B (en) Heat therapy garment
GB0518720D0 (en) Therapeutic combination
GB0502171D0 (en) Well treatment
GB2425447B (en) Heating apparatus
PT1767880T (pt) Aparelho de aquecimento
TWI317802B (en) Heat dispreader
AU2005906275A0 (en) Heat Treatment Means
GB0502123D0 (en) Space heating unit
GB0500658D0 (en) Combination therapy
GB0526121D0 (en) Combination therapy
GB0502949D0 (en) Combination therapy

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees