TWI336528B - - Google Patents

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Publication number
TWI336528B
TWI336528B TW096100210A TW96100210A TWI336528B TW I336528 B TWI336528 B TW I336528B TW 096100210 A TW096100210 A TW 096100210A TW 96100210 A TW96100210 A TW 96100210A TW I336528 B TWI336528 B TW I336528B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
red
layer
blue light
Prior art date
Application number
TW096100210A
Other languages
English (en)
Chinese (zh)
Other versions
TW200735423A (en
Inventor
Tomokazu Okazaki
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006000256A external-priority patent/JP5013713B2/ja
Priority claimed from JP2006000210A external-priority patent/JP4943005B2/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200735423A publication Critical patent/TW200735423A/zh
Application granted granted Critical
Publication of TWI336528B publication Critical patent/TWI336528B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
TW096100210A 2006-01-04 2007-01-03 Thin-type light emitting diode lamp, and its manufacturing TW200735423A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006000256A JP5013713B2 (ja) 2006-01-04 2006-01-04 発光装置及びその製造方法
JP2006000210A JP4943005B2 (ja) 2006-01-04 2006-01-04 薄型発光ダイオードランプとその製造方法

Publications (2)

Publication Number Publication Date
TW200735423A TW200735423A (en) 2007-09-16
TWI336528B true TWI336528B (ko) 2011-01-21

Family

ID=38228223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100210A TW200735423A (en) 2006-01-04 2007-01-03 Thin-type light emitting diode lamp, and its manufacturing

Country Status (5)

Country Link
US (2) US8004002B2 (ko)
EP (1) EP1976030A1 (ko)
KR (1) KR101019765B1 (ko)
TW (1) TW200735423A (ko)
WO (1) WO2007077869A1 (ko)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5197368B2 (ja) * 2006-08-30 2013-05-15 京セラ株式会社 発光装置
US9048400B2 (en) * 2006-10-12 2015-06-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device with a wavelength converting layer and method for manufacturing the same
KR100930171B1 (ko) 2006-12-05 2009-12-07 삼성전기주식회사 백색 발광장치 및 이를 이용한 백색 광원 모듈
DE102008029191A1 (de) * 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung
DE202008018060U1 (de) * 2008-03-19 2011-05-12 Samsung LED Co., Ltd., Suwon Weißlicht-emittierende Vorrichtung und Weißlichtquellenmodul, das diese Vorrichtung verwendet
TWI449996B (zh) * 2009-01-23 2014-08-21 Au Optronics Corp 高色彩飽合度之顯示裝置及其使用之色彩調整方法
TWI463708B (zh) * 2009-02-24 2014-12-01 Advanced Optoelectronic Tech 側面出光型發光元件封裝結構及其製造方法
AU2010245042A1 (en) * 2009-04-27 2011-11-24 Manufacturing Resources International, Inc. White LED for liquid crystal display backlights
JP2012529081A (ja) 2009-06-03 2012-11-15 マニュファクチャリング・リソーシズ・インターナショナル・インコーポレーテッド Ｌｅｄバックライトの動的減光
CN101916806A (zh) * 2010-06-18 2010-12-15 深圳市瑞丰光电子股份有限公司 Led封装方法及采用该方法封装成的led封装结构
JP5863291B2 (ja) * 2011-06-28 2016-02-16 株式会社小糸製作所 平面発光モジュール
JP5893888B2 (ja) * 2011-10-13 2016-03-23 シチズン電子株式会社 半導体発光装置
US9365766B2 (en) * 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
EP2831932B1 (en) 2012-03-30 2020-09-30 Lumileds Holding B.V. Light emitting device with wavelength converting side coat
WO2013144798A1 (en) * 2012-03-30 2013-10-03 Koninklijke Philips N.V. Optical cavity including a light emitting device and wavelength converting material
WO2013144927A1 (en) * 2012-03-30 2013-10-03 Koninklijke Philips N.V. Optical cavity including a light emitting device and wavelength converting material
AT13372U1 (de) * 2012-04-30 2013-11-15 Tridonic Jennersdorf Gmbh LED-Modul mit hoher Lichtstromdichte
US9348174B2 (en) 2013-03-14 2016-05-24 Manufacturing Resources International, Inc. Rigid LCD assembly
DE102013103416A1 (de) * 2013-04-05 2014-10-23 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe
US9690137B2 (en) 2013-07-03 2017-06-27 Manufacturing Resources International, Inc. Airguide backlight assembly
US10191212B2 (en) 2013-12-02 2019-01-29 Manufacturing Resources International, Inc. Expandable light guide for backlight
JP6191453B2 (ja) 2013-12-27 2017-09-06 日亜化学工業株式会社 発光装置
US10527276B2 (en) 2014-04-17 2020-01-07 Manufacturing Resources International, Inc. Rod as a lens element for light emitting diodes
US10649273B2 (en) 2014-10-08 2020-05-12 Manufacturing Resources International, Inc. LED assembly for transparent liquid crystal display and static graphic
JP6354626B2 (ja) * 2015-03-09 2018-07-11 豊田合成株式会社 発光装置の製造方法
US10261362B2 (en) 2015-09-01 2019-04-16 Manufacturing Resources International, Inc. Optical sheet tensioner
WO2017176213A1 (en) * 2016-04-08 2017-10-12 Heptagon Micro Optics Pte. Ltd. Thin optoelectronic modules with apertures and their manufacture
TWI751274B (zh) * 2017-06-14 2022-01-01 大陸商光寶光電（常州）有限公司 紫外線發光二極體封裝結構及其製造方法
CN108133982B (zh) * 2017-12-20 2021-12-10 射阳拉曼半导体科技有限公司 基于SiC的多色LED芯片的制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501091B1 (en) 1998-04-01 2002-12-31 Massachusetts Institute Of Technology Quantum dot white and colored light emitting diodes
JP4625997B2 (ja) * 1999-07-22 2011-02-02 日亜化学工業株式会社 発光ダイオード
JP3589187B2 (ja) * 2000-07-31 2004-11-17 日亜化学工業株式会社 発光装置の形成方法
EP1179858B1 (en) * 2000-08-09 2009-03-18 Avago Technologies General IP (Singapore) Pte. Ltd Light emitting devices
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
JP4222017B2 (ja) * 2001-12-18 2009-02-12 日亜化学工業株式会社 発光装置
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
JP2005167079A (ja) 2003-12-04 2005-06-23 Toyoda Gosei Co Ltd 発光装置
JP2005228996A (ja) 2004-02-13 2005-08-25 Matsushita Electric Works Ltd 発光装置
JP4451178B2 (ja) 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
JP4229447B2 (ja) 2004-03-31 2009-02-25 スタンレー電気株式会社 半導体発光装置及び製造方法
JP2005317820A (ja) * 2004-04-30 2005-11-10 Korai Kagi Kofun Yugenkoshi 発光ダイオードパッケージ構造
JP3994094B2 (ja) * 2004-05-27 2007-10-17 ローム株式会社 発光ダイオードランプ
JP2006135225A (ja) * 2004-11-09 2006-05-25 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
US20110284904A1 (en) 2011-11-24
EP1976030A1 (en) 2008-10-01
US8004002B2 (en) 2011-08-23
KR101019765B1 (ko) 2011-03-04
KR20080074972A (ko) 2008-08-13
US20090206353A1 (en) 2009-08-20
TW200735423A (en) 2007-09-16
WO2007077869A1 (ja) 2007-07-12
US8405112B2 (en) 2013-03-26

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Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees