TWI325168B - - Google Patents

Download PDF

Info

Publication number
TWI325168B
TWI325168B TW095147439A TW95147439A TWI325168B TW I325168 B TWI325168 B TW I325168B TW 095147439 A TW095147439 A TW 095147439A TW 95147439 A TW95147439 A TW 95147439A TW I325168 B TWI325168 B TW I325168B
Authority
TW
Taiwan
Prior art keywords
substrate
cooling
transport
temperature
unit
Prior art date
Application number
TW095147439A
Other languages
English (en)
Chinese (zh)
Other versions
TW200739843A (en
Inventor
Yasutaka Souma
Mitsuhiro Sakai
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739843A publication Critical patent/TW200739843A/zh
Application granted granted Critical
Publication of TWI325168B publication Critical patent/TWI325168B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)
TW095147439A 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium TW200739843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (ja) 2006-01-24 2006-01-24 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW200739843A TW200739843A (en) 2007-10-16
TWI325168B true TWI325168B (https=) 2010-05-21

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147439A TW200739843A (en) 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium

Country Status (4)

Country Link
JP (1) JP4537324B2 (https=)
KR (1) KR101299763B1 (https=)
CN (1) CN100521078C (https=)
TW (1) TW200739843A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2009158792A (ja) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100921523B1 (ko) * 2008-05-30 2009-10-12 세메스 주식회사 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법
JP4675401B2 (ja) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 基板搬送装置
JP5635378B2 (ja) * 2010-11-30 2014-12-03 日東電工株式会社 半導体ウエハ搬送方法および半導体ウエハ搬送装置
KR101105387B1 (ko) * 2010-12-13 2012-01-16 주식회사 에스아이이 기판 건조장치
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP2013098300A (ja) * 2011-10-31 2013-05-20 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
CN113272462B (zh) * 2019-01-17 2023-03-10 住友电工运泰克株式会社 导体软化处理装置以及导体软化处理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS6119131A (ja) * 1984-07-06 1986-01-28 Toshiba Corp レジスト処理装置
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
KR100479642B1 (ko) * 1999-04-27 2005-03-30 미쓰비시덴키 가부시키가이샤 레이저가공기의 가공조건 제어방법 및 이를 위한프로그램을 기록한 컴퓨터 판독가능한 기록매체
JP3416078B2 (ja) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
TW449802B (en) * 1999-07-19 2001-08-11 Tokyo Electron Ltd Method and apparatus of substrate treatment
JP4380966B2 (ja) * 2002-05-20 2009-12-09 富士フイルム株式会社 感光層転写方法および装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
TW200739843A (en) 2007-10-16
CN101009210A (zh) 2007-08-01
KR101299763B1 (ko) 2013-08-23
KR20070077793A (ko) 2007-07-27
JP2007200994A (ja) 2007-08-09
CN100521078C (zh) 2009-07-29
JP4537324B2 (ja) 2010-09-01

Similar Documents

Publication Publication Date Title
TWI325168B (https=)
TWI401545B (zh) 常壓乾燥裝置及基板處理裝置及基板處理方法
JP2009076547A (ja) 常圧乾燥装置及び基板処理装置及び基板処理方法
KR101269748B1 (ko) 가열 처리 장치
JP2012124309A (ja) 現像方法、現像装置、およびこれを備える塗布現像処理システム
KR101299898B1 (ko) 기판 냉각 장치
JP3483376B2 (ja) 基板処理装置
TWI377452B (en) Substrate processing method and resist surface processing apparatus
JP4813583B2 (ja) 基板処理装置
JP4672538B2 (ja) 加熱処理装置
JP3874960B2 (ja) 基板処理装置
JP2006110541A (ja) 基板の処理装置及び処理方法
KR20100026985A (ko) 기판 반송 장치
JP7058549B2 (ja) 基板処理装置および基板処理方法
JP5400751B2 (ja) 加熱処理装置、およびこれを備える塗布現像装置
JP4436271B2 (ja) 基板露光方法および基板加熱装置ならびに基板露光装置
CN111383975A (zh) 基片处理装置和基片处理方法
JP4954642B2 (ja) 現像処理装置及び現像処理方法
JP2008159768A (ja) ベーキング装置及び基板処理装置
JP4472647B2 (ja) 加熱処理装置、加熱処理方法、コンピュータ読取可能な記憶媒体
JP3625707B2 (ja) 基板現像装置および基板現像方法
JP2019207961A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees