TWI318620B - Apparatus for cutting substrate - Google Patents

Apparatus for cutting substrate

Info

Publication number
TWI318620B
TWI318620B TW095144535A TW95144535A TWI318620B TW I318620 B TWI318620 B TW I318620B TW 095144535 A TW095144535 A TW 095144535A TW 95144535 A TW95144535 A TW 95144535A TW I318620 B TWI318620 B TW I318620B
Authority
TW
Taiwan
Prior art keywords
cutting substrate
cutting
substrate
Prior art date
Application number
TW095144535A
Other languages
English (en)
Other versions
TW200730447A (en
Inventor
Joon-Young Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200730447A publication Critical patent/TW200730447A/zh
Application granted granted Critical
Publication of TWI318620B publication Critical patent/TWI318620B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/32—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist
    • B28D1/327—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist for cutting or shearing easily splittable working materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
TW095144535A 2005-12-29 2006-11-30 Apparatus for cutting substrate TWI318620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050133560A KR100777983B1 (ko) 2005-12-29 2005-12-29 기판 절단 장치

Publications (2)

Publication Number Publication Date
TW200730447A TW200730447A (en) 2007-08-16
TWI318620B true TWI318620B (en) 2009-12-21

Family

ID=38059162

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144535A TWI318620B (en) 2005-12-29 2006-11-30 Apparatus for cutting substrate

Country Status (3)

Country Link
KR (1) KR100777983B1 (zh)
CN (1) CN100451756C (zh)
TW (1) TWI318620B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101562302B1 (ko) * 2009-04-30 2015-10-22 주식회사 탑 엔지니어링 글래스 패널의 더미 낙하방지장치
CN102442767B (zh) * 2011-08-19 2014-03-19 深圳市华星光电技术有限公司 切割机及其对面板进行对位的方法
KR101668778B1 (ko) * 2014-05-29 2016-10-31 주식회사 탑 엔지니어링 스크라이브 장치
KR101651253B1 (ko) * 2014-05-29 2016-08-26 주식회사 탑 엔지니어링 스크라이브 장치용 이송 밸트 및 이를 갖는 스크라이브 장치
KR102525334B1 (ko) * 2016-03-03 2023-04-27 주식회사 탑 엔지니어링 스크라이빙 장치
CN106773159B (zh) * 2016-12-12 2018-04-10 惠科股份有限公司 一种残材去除装置
KR102027136B1 (ko) * 2017-09-27 2019-10-01 주식회사 탑 엔지니어링 스크라이빙 장치
KR102176870B1 (ko) * 2019-05-10 2020-11-11 주식회사 탑 엔지니어링 스크라이빙 장치의 제어 방법
KR102267730B1 (ko) * 2019-05-14 2021-06-23 주식회사 탑 엔지니어링 스크라이브 장치의 제어 방법
KR20210021194A (ko) * 2019-08-14 2021-02-25 주식회사 탑 엔지니어링 스크라이빙 장치의 제어 방법
CN113203960A (zh) * 2021-04-26 2021-08-03 深圳市华星光电半导体显示技术有限公司 开路短路测试装置及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297334A (ja) * 1992-04-20 1993-11-12 Mitsubishi Electric Corp 液晶表示素子用ガラス基板の切断加工方法
JPH1164834A (ja) 1997-08-11 1999-03-05 Hitachi Ltd 液晶表示基板製造装置
KR100425511B1 (ko) 2000-08-23 2004-03-30 양근창 평판조명장치용 도광판 제조 장치 및 방법
WO2002057192A1 (fr) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separateur et systeme de separation
KR100789455B1 (ko) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법
KR100540632B1 (ko) * 2003-06-27 2006-01-10 엘지.필립스 엘시디 주식회사 평판표시장치 제조용 기판 절단장치
KR100943468B1 (ko) * 2003-06-27 2010-02-22 엘지디스플레이 주식회사 평판표시장치 제조용 기판 절단장치
KR100678294B1 (ko) * 2004-12-28 2007-02-02 삼성코닝정밀유리 주식회사 유리기판의 필름 스크라이빙 장치
KR101084323B1 (ko) * 2004-12-30 2011-11-16 엘지디스플레이 주식회사 액정패널 절단장치

Also Published As

Publication number Publication date
CN100451756C (zh) 2009-01-14
KR20070070731A (ko) 2007-07-04
KR100777983B1 (ko) 2007-11-21
CN1952751A (zh) 2007-04-25
TW200730447A (en) 2007-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees