TWI311779B - Substrate processing apparatus and processing method thereof - Google Patents

Substrate processing apparatus and processing method thereof Download PDF

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Publication number
TWI311779B
TWI311779B TW092116810A TW92116810A TWI311779B TW I311779 B TWI311779 B TW I311779B TW 092116810 A TW092116810 A TW 092116810A TW 92116810 A TW92116810 A TW 92116810A TW I311779 B TWI311779 B TW I311779B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
liquid
recovery
processed
Prior art date
Application number
TW092116810A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405451A (en
Inventor
Matsuzawa Minoru
Magasaka Michio
Original Assignee
Sipec Corporatio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sipec Corporatio filed Critical Sipec Corporatio
Publication of TW200405451A publication Critical patent/TW200405451A/zh
Application granted granted Critical
Publication of TWI311779B publication Critical patent/TWI311779B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW092116810A 2002-06-21 2003-06-20 Substrate processing apparatus and processing method thereof TWI311779B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002181151A JP2004031400A (ja) 2002-06-21 2002-06-21 基板処理装置及びその処理方法

Publications (2)

Publication Number Publication Date
TW200405451A TW200405451A (en) 2004-04-01
TWI311779B true TWI311779B (en) 2009-07-01

Family

ID=29996621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092116810A TWI311779B (en) 2002-06-21 2003-06-20 Substrate processing apparatus and processing method thereof

Country Status (7)

Country Link
US (1) US20050244579A1 (https=)
EP (1) EP1536460A4 (https=)
JP (1) JP2004031400A (https=)
KR (1) KR100704594B1 (https=)
CN (1) CN100380601C (https=)
TW (1) TWI311779B (https=)
WO (1) WO2004001828A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100466190C (zh) * 2004-03-12 2009-03-04 禧沛股份有限公司 基片处理装置
JP4531612B2 (ja) * 2005-03-31 2010-08-25 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR100752246B1 (ko) 2005-03-31 2007-08-29 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP4692785B2 (ja) * 2005-04-01 2011-06-01 エフエスアイ インターナショナル インコーポレイテッド 一つ又はそれ以上の処理流体を用いた、半導体ウエハー又は他のマイクロエレクトロニクス用の基板に使用されるツール用の移動かつ入れ子化できる、コンパクトなダクトシステム
JP4796902B2 (ja) * 2005-07-11 2011-10-19 芝浦メカトロニクス株式会社 基板のスピン処理装置
JP2009520362A (ja) * 2005-12-16 2009-05-21 ソリッド ステイト イクイップメント コーポレイション 化学的分離の装置及び方法
JP4637741B2 (ja) * 2005-12-28 2011-02-23 株式会社ジェイ・イー・ティ 基板処理装置
JP2007311446A (ja) * 2006-05-17 2007-11-29 Realize Advanced Technology Ltd 洗浄装置
KR101191337B1 (ko) 2006-07-07 2012-10-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체로 마이크로일렉트로닉 워크피스를 처리하는데 사용되는 장치용 배리어 구조물 및 노즐장치
KR100797081B1 (ko) * 2006-08-24 2008-01-22 세메스 주식회사 기판 처리 장치 및 방법
JP4763567B2 (ja) * 2006-10-03 2011-08-31 大日本スクリーン製造株式会社 基板処理装置
JP2008141010A (ja) * 2006-12-01 2008-06-19 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100824306B1 (ko) * 2006-12-22 2008-04-22 세메스 주식회사 기판 처리 장치
KR100872877B1 (ko) * 2007-03-06 2008-12-10 세메스 주식회사 기판 처리 장치
CN101802975B (zh) 2007-08-07 2012-10-03 Fsi国际公司 在用于通过一种或多种处理流体来处理微电子工件的工具中的阻挡板和文氏管容纳系统的漂洗方法以及相关装置
KR20130083940A (ko) 2008-05-09 2013-07-23 티이엘 에프에스아이, 인코포레이티드 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
CN101958228B (zh) * 2009-07-13 2012-06-20 弘塑科技股份有限公司 具有移动式泄液槽的清洗蚀刻机台
JP2012044213A (ja) * 2011-10-26 2012-03-01 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5693438B2 (ja) 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
CN107093567B (zh) * 2016-02-18 2019-08-06 顶程国际股份有限公司 环状液体收集装置
TWI656594B (zh) * 2016-12-15 2019-04-11 辛耘企業股份有限公司 基板處理裝置
WO2018200398A1 (en) 2017-04-25 2018-11-01 Veeco Precision Surface Processing Llc Semiconductor wafer processing chamber
CN109570126B (zh) * 2018-12-27 2021-06-22 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 多级药品回收的单片清洗装置
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

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JPH0434902Y2 (https=) * 1987-01-13 1992-08-19
JPH0724396A (ja) * 1993-07-12 1995-01-27 Dainippon Screen Mfg Co Ltd 基板処理装置
US5608943A (en) * 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
TW306011B (https=) * 1995-04-19 1997-05-21 Tokyo Electron Co Ltd
US5843527A (en) * 1995-06-15 1998-12-01 Dainippon Screen Mfg. Co., Ltd. Coating solution applying method and apparatus
US5725663A (en) * 1996-01-31 1998-03-10 Solitec Wafer Processing, Inc. Apparatus for control of contamination in spin systems
TW357389B (en) * 1996-12-27 1999-05-01 Tokyo Electric Ltd Apparatus and method for supplying process solution to surface of substrate to be processed
JP4043593B2 (ja) * 1998-04-30 2008-02-06 東芝松下ディスプレイテクノロジー株式会社 基板処理装置
JPH11333354A (ja) * 1998-05-27 1999-12-07 Sumitomo Precision Prod Co Ltd 回転式基板処理装置
JP3929192B2 (ja) * 1998-12-21 2007-06-13 大日本スクリーン製造株式会社 基板処理装置
TW504776B (en) * 1999-09-09 2002-10-01 Mimasu Semiconductor Ind Co Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
JP4426036B2 (ja) * 1999-12-02 2010-03-03 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20050016598A (ko) 2005-02-21
CN100380601C (zh) 2008-04-09
EP1536460A4 (en) 2009-07-29
JP2004031400A (ja) 2004-01-29
CN1672245A (zh) 2005-09-21
EP1536460A1 (en) 2005-06-01
WO2004001828A1 (ja) 2003-12-31
US20050244579A1 (en) 2005-11-03
TW200405451A (en) 2004-04-01
KR100704594B1 (ko) 2007-04-10

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