1309883 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有鏡像結構之記憶體堆疊連接方 法及應用該方法所形成之高容量記憶體模組，尤指一種將 二記憶體單元分別電性連接固定於硬質材料製成印刷電路 板之上下表面，再藉由二可撓性軟質材料製成之印刷電路 板墊性連結於該硬質材料印刷電路板兩侧邊緣之記憶體模 組連接方法及其結構。 【先前技術】 按，電腦設備之處理速度隨著科技進步而不斷提升， 除了中央處理器之效率影響整體效能外，記憶體之運算能 力及容量也是相當重要的因素之一，早期記憶體模組包含 複數個記憶體晶片，且各記憶體晶片以平面排列組裝於載 體，例如印刷電路板上，整體體積龐大且容量小，隨著技 術演進，記憶體模組也逐漸符合輕薄短小之電子產品設計 趨勢。 堆疊式多層記憶體模組乃是目前符合高容量、體積小 之記憶體設計概念之一，如我國專利案申請案號第 091123613、091221281號，其所揭露者主要係為：各記憶 體模組係將一記憶體單元直接以上下堆疊方式組裝固定於 另一記憶體單元，且各記憶體單元之複數個腳位相互適當 地電性連接，使信號可傳輸於記憶體單元之間，各記憶體 單元之腳位朝向同一方向，封裝主要係利用晶片上板型封 1309883 裝(Board-on-chip packages)技術，適合應用於高速度之動態 隨機存取記憶模組（Dynamic Random Access Memory， DRAM)或類似記憶體模組，尤其是具有高速度、高容量之 雙列 §己憶體模組(Dual Inline Memory Module, DIMM)，此類 堆疊式多層記憶體模組間之技術主要改良在於二記憶體單 元間腳位連接固定方式。 然而’此種習用記憶體堆疊方法之信號線長度不均， 鲁 且彳&號線負載可能隨著堆疊結構改變而提高’進而將影響 到信號傳遞之精準度，甚至造成信號之不穩定，再者，習 用堆疊式記憶體模組應用於雙列記憶體模組時，其封裝須 考慮二記憶體晶片之接腳排列須符合鏡像對稱，故線路設 計及封裝過程在在都提高製造成本。 職是’本案之發明人累積多年設計製造之經驗，解決 上述現有技術的缺失與不便，乃特潛心研究並配合學理之 運用’提出一種新穎、效率高之具有鏡像結構之記憶體堆 • 疊連接方法及利用該方法組裝之高容量記憶體模組，以改 進習用方法或結構所存在之問題。 【發明内容】 本發明之主要目的係提供一種具有鏡像結構之記憶體 堆疊連接方法，使組裝步驟簡化易於生產，大幅降低 成本。 本發明之另一目的係提供一種堆疊式南容量記憶體模 、组’其具有鏡像式結構以使信號線配置分布更均勻，進而 1309883 提高信號傳遞品質。 秘晶Ϊ了達到上述目的，本發明之具有鏡像結構之記憶體 隹3!連接方法包含以下步驟： ⑴將f 5己憶體單元之腳位電性連接於一第一印 刷電路板之上表面； 笛」冗憶體單70之腳位以鏡像方式對應於該 °己單元之聊位而電性連接於該第-印刷電路板之 下表面；以及 (3)將二第二印刷電路板分別電性連接於該第一印刷 接ti 2兩側’ 4第二印刷電路板之邊緣上設複數個導電 接片連接於第二印刷電路板之線路。 垃義翻上述連接方法進行製造而紅以鏡像方式 接之:憶體模組包含-第-記憶體單元、-第二記 :由Η第—印刷電路板、二第二印刷電路板及複數 -記憶：單:2板邊緣延！出之導電接片’其中，該第 篦-：蒯當：—己憶體單兀之腳位分別電性連接於該 以鏡像方式對應於該第軍第—认體早元之腳位 接片對應連接4 =Γ電路板之兩側’各導電 牧仏弟—印刷電路板之線路上。 【實施方式】 為了使胃審查委員能更進—步瞭解 定目的所採取之枯淋*<η 1 斗分a馬運成預 n、手段及功效，請參閱以下有關本發 1309883 =之詳細說明與附圖，相信本發明之目的、 虽可由此得一深入且具體之 麸 、*、特點， 考與說明用，並非用來對本發明加㈣制：圖式僅提供參 如第一圖所示，其為本發明之具有鏡 堆疊連接枝步驟之—較佳實_，首先，二讀體 1 系將—第-記憶體單元之腳位電性連接於 =上表面’該第—印刷電路板鋪設有適當之電子1309883 IX. Description of the Invention: [Technical Field] The present invention relates to a memory stack connection method having a mirror image structure and a high-capacity memory module formed by the method, in particular, a memory unit The electrical connection is fixed on the lower surface of the printed circuit board made of a hard material, and the printed circuit board made of two flexible flexible materials is padded to the memory module connection of the two sides of the hard printed circuit board. Method and its structure. [Prior Art] Press, the processing speed of computer equipment is increasing with the advancement of technology. In addition to the efficiency of the central processing unit affecting the overall performance, the computing power and capacity of the memory is also a very important factor. Early memory modules The memory module includes a plurality of memory chips, and each memory chip is assembled on a carrier in a planar arrangement, such as a printed circuit board. The overall volume is large and the capacity is small. As the technology evolves, the memory module gradually conforms to the design of a light and short electronic product. trend. The stacked multi-layer memory module is one of the current memory design concepts that meet the high-capacity and small size. For example, in the patent application No. 091123613 and 091221281, the disclosed ones are mainly: each memory module. A memory unit is directly assembled and fixed to another memory unit in a stacking manner, and a plurality of pins of each memory unit are electrically connected to each other so that signals can be transmitted between the memory units. The body unit is oriented in the same direction. The package is mainly based on the board-on-chip packages technology. It is suitable for high-speed dynamic random access memory (DRAM). ) or similar memory modules, especially dual-in-line memory modules (DIMMs) with high speed and high capacity. The main technical improvement between such stacked multi-layer memory modules lies in The pin position connection between the memory units is fixed. However, the length of the signal line of such a conventional memory stacking method is uneven, and the load of the Lu and the line may increase as the stack structure changes, which may affect the accuracy of signal transmission and even cause signal instability. Moreover, when the conventional stacked memory module is applied to the dual-column memory module, the package must consider that the pin arrangement of the two memory chips must conform to the mirror symmetry, so the circuit design and the packaging process are both increasing the manufacturing cost. The job is 'the inventor of this case has accumulated many years of experience in designing and manufacturing, to solve the above-mentioned lack of inconvenience and inconvenience, and has devoted himself to research and cooperate with the application of theory to propose a novel and efficient memory stack with mirror structure. Methods and high volume memory modules assembled using the method to improve problems with conventional methods or structures. SUMMARY OF THE INVENTION The main object of the present invention is to provide a memory stack connection method having a mirror image structure, which simplifies the assembly process and is easy to produce, and greatly reduces the cost. Another object of the present invention is to provide a stacked south-capacity memory module, group having a mirror structure to make the signal line arrangement more uniform, and thus 1309883 to improve signal transmission quality. In order to achieve the above object, the memory 隹3! connection method having the mirror image structure of the present invention comprises the following steps: (1) electrically connecting the pin of the f5 memory unit to the upper surface of a first printed circuit board. ; the flute "resonant body 70's foot position is mirrored to correspond to the lower cell position and is electrically connected to the lower surface of the first printed circuit board; and (3) the second and second printed circuit boards are respectively Electrically connected to the two sides of the first printed circuit board ti 2 on the edge of the second printed circuit board, a plurality of conductive tabs are connected to the circuit of the second printed circuit board. The connection method is manufactured by the above method and the red image is connected by the mirror: the memory module includes a - memory unit, and the second: the first printed circuit board, the second printed circuit board, and the plurality - Memory: Single: 2 board edge extension! Out of the conductive tabs, wherein the third 蒯-: 蒯:: 己 体 兀 兀 兀 兀 兀 脚 脚 脚 脚 脚 — 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚 脚Corresponding to the connection 4 = 两侧 on both sides of the board 'each conductive priest-printed circuit board line. [Embodiment] In order to make the stomach review committee more able to understand the purpose of the drenching *<η 1 fighting points a horse into a pre-n, means and efficacy, please refer to the following for the detailed description of this issue 1309883 = The drawings, it is believed that the objects of the present invention, as well as the in-depth and specific characteristics of the bran, *, features, test and description, are not intended to be used in the context of the present invention. The drawings are only provided as shown in the first figure. It is the step of the mirror stacking branch of the present invention - preferably, the second reading body 1 is electrically connected to the foot of the first memory unit to the upper surface of the first printed circuit board. Have appropriate electronics
，’步驟二(S1G5)為將-第二記憶體單元之腳位以爱 方式對應於該第-記憶體單元之腳位而電性連接於 印刷電路板之下表面，使第二記憶體 、Ά發„ 干凡&貝抖傳輸可透 ^ 17刷電路板之電子電路與第一記憶體單元對應。 々步驟三(S11G)係將二第二印刷電路板分別電性&接於 該第一印刷電路板之兩侧，各第二印刷電路板上電子電路 適當地與第一印刷電路板之電子電路相連接而適於傳輸信 號或資料，該第二印刷電路板之邊緣設複數個俗稱金手^ 之導電接片對應連接於第二印刷電路板之線路上，以供^ 其他電子元件進行電性連接。 ^ 本發明之連接方法之第一印刷電路板係由硬質材料 製成’例如等級FR4之玻璃樹脂材料或其他適於進行電路 印刷之材質’該第二印刷電路板係可撓性軟質材料製成， 例如軟板(Flexible Printed Circuits，FPC)，使其第二印刷電 路板受外力後可彈性彎折變形又不影響訊號傳輸，而固定 於第二印刷電路板邊緣之各導電接片進—步設有導電介 質’以供與其他電子零件、載體、電子電路或印刷電路板 1309883 作電性連接之用，例如鍚球、錫膠。 上述第一及第二記憶體單元之腳位可由金屬導線、粒 狀導電體或其他導電材料所組成，其中，該粒狀導電體目 前以錫球之使用最為普遍，再者，各記憶體單元之腳位可 為球柵陣列(Ball Grid Array, BGA)、排列雙邊排列或其他適 當方式。 藉由上述本發明之連接方法進行記憶體之鏡像式堆 φ 疊來替代習知技術’將可有效地降低信號線之負载，且使 信號傳輸路徑更為均等而達到較佳之信號精確度，提高電 腦之整體性能。 然而’上述本發明之連接方法係以其所需達成之步驟 作敘述’並非限制其實際製造過程之順序，實行本發明之 步驟順序需視現場實務製造流程而定。 接著請參閱第二至四圖所示，其係為本發明之鏡像方 式堆疊連接之記憶體模組之第一實施例，本實施例之記憶 馨體模組係利用上述本發明之記憶體堆疊連接方法進行製造 而成，该記憶體模組（1)包含一第一記憶體單元（u)、一第 -吕己憶體單元（12)、-第-印刷電路板(13)、二第二印刷電 路板（I4)及複數個由第二印刷電板邊緣延伸出之導電接片 (15)，其中，s亥第一記憶體單元⑴)及第三記憶體單元（12) 之腳位（111)、（121)分別電性連接於該第一印刷電路板（13) 之上下表面’該第二記憶體單元（12)之腳位（ΐ2ι)以鏡像 方式對應於δ亥第一記憶體單元⑼之腳位（ιιι)，藉此使第 。己憶體早tl(11)與第二記憶體單元（12)間之資料或訊號 1309883 透過第一印刷電路板（13)之印刷電路可相互傳輸對應。 本發明之二第二印刷電路板（14)分別電性連接於該第 一印刷電路板（13)之兩側，各導電接片（丨5)對應連接於第二 印刷電路板（14)之線路上，各導電接片（15)可為俗稱金手指 之結構或其他適當尺寸及形狀之可導電元件，各導電接片 U5)進一步設有導電介質（16)以供電性連接之用，例如連接 於其他電子零件、載體、電子電路或印刷電路板，於本實 施例，該導電介質（16)係為球狀顆粒，例如錫球。 鲁 如本發明之連接方法所述’本發明之第一印刷電路板 (13)結構可由硬質材料製成，例如等級FR4i玻璃樹脂材料 或其他適於進行電路印刷之材質’該第二印刷電路板（14) 為可撓性軟質材料製成，例如軟板(FPC)，當導電接片（15) 欲固定於其他電子元件時，第二印刷電路板（14)可適當的 彎折以利於固接。 於本實施例，該第一記憶體單元（11)及第二記憶體單 元（12)之腳位（in)、（121)係由粒狀導電體所組成，尤其是， 籲 該粒狀導電體係為目前普遍使用之錫球，且該粒狀導電體 係以球栅陣列(Ball Grid Array，BGA)方式排列封裝而固定 於第一印刷電路板（13)上，除此之外，第一記憶體單元（11) 及第二記憶體單元（12)之腳位（111)、（121)亦可由粒狀導電 體以其他適當之方式排列於第一印刷電路板（13)，並達到 電性連結及封裝固定之目的。 請參閱第五圖所示，其為本發明之以鏡像方式堆疊連 接之記憶體模組之第二實施例，該記憶體模組(2)同樣係將 1309883 第一記憶體單元(21)及第二記憶體單元(2 2)分別電性連結 於一第一印刷電路板(23)上，且二記憶體單元(21)、（22)之 腳位(211)係以鏡像方式對應固定，與第一實施例不同之處 在於：各記憶體單元(21)、（22)之腳位(211)係由金屬導線製 成且整齊排列於記憶體單元(21)、（22)兩侧，藉由此腳位 (211)之延伸以供焊接或膠粘固定於第一印刷電路板(23)Step 2 (S1G5) is to electrically connect the pin of the second memory cell to the lower surface of the printed circuit board in a love manner corresponding to the pin of the first memory cell, so that the second memory, Ά „ 干 & & 贝 贝 贝 贝 贝 贝 17 17 17 17 17 17 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷 刷On both sides of the first printed circuit board, the electronic circuits on the second printed circuit board are appropriately connected to the electronic circuit of the first printed circuit board to transmit signals or data, and the edges of the second printed circuit board are plural The conductive tabs, commonly known as the gold handles, are connected to the lines of the second printed circuit board for electrical connection with other electronic components. ^ The first printed circuit board of the connection method of the present invention is made of a hard material. For example, a glass resin material of the grade FR4 or other material suitable for circuit printing 'The second printed circuit board is made of a flexible soft material, such as Flexible Printed Circuits (FPC), such that the second printed circuit board Subject to outside After the elastic bending deformation does not affect the signal transmission, the conductive tabs fixed to the edge of the second printed circuit board are further provided with a conductive medium for supplying other electronic parts, carriers, electronic circuits or printed circuit boards 1309883 For electrical connection, such as spheroidal ball, tin glue. The above-mentioned first and second memory unit pins can be composed of metal wires, granular conductors or other conductive materials, wherein the granular conductors are currently The use of solder balls is most common. Further, the positions of the memory cells may be a Ball Grid Array (BGA), a bilateral arrangement, or other suitable manner. The memory method is implemented by the connection method of the present invention described above. The mirrored stack φ stack replaces the conventional technology', which can effectively reduce the load of the signal line and make the signal transmission path more equal to achieve better signal accuracy and improve the overall performance of the computer. However, the above connection of the present invention The method is described in terms of the steps it needs to achieve 'not limiting the order of its actual manufacturing process. The sequence of steps for carrying out the invention depends on the actual manufacturing process. The process is as follows. Referring to the second to fourth embodiments, which is a first embodiment of the memory module stacked and connected in the mirror mode of the present invention, the memory sleek module of the present embodiment utilizes the above-described invention. The memory stack connection method is manufactured. The memory module (1) comprises a first memory unit (u), a first-de-recovery unit (12), and a -th printed circuit board (13). And a second printed circuit board (I4) and a plurality of conductive tabs (15) extending from the edge of the second printed circuit board, wherein the first memory unit (1) and the third memory unit (12) The pins (111) and (121) are electrically connected to the lower surface of the first printed circuit board (13) respectively. The pin position (ΐ2ι) of the second memory unit (12) corresponds to δ in a mirror image manner. The position of the first memory unit (9) in the first place ( ιιι), thereby making the first. The data or signal between the tl (11) and the second memory unit (12) can be transmitted to each other through the printed circuit of the first printed circuit board (13). The second printed circuit board (14) of the second embodiment of the present invention is electrically connected to the two sides of the first printed circuit board (13), and the conductive tabs (丨5) are correspondingly connected to the second printed circuit board (14). In the circuit, each of the conductive tabs (15) may be a structure commonly known as a gold finger or other suitable size and shape of the conductive element, and each of the conductive tabs U5) is further provided with a conductive medium (16) for power connection, for example Connected to other electronic components, carriers, electronic circuits or printed circuit boards, in the present embodiment, the conductive medium (16) is a spherical particle, such as a solder ball. Lu's connection method according to the present invention, the first printed circuit board (13) structure of the present invention may be made of a hard material such as a grade FR4i glass resin material or other material suitable for circuit printing 'the second printed circuit board (14) Made of flexible soft material, such as soft board (FPC), when the conductive tab (15) is to be fixed to other electronic components, the second printed circuit board (14) can be appropriately bent to facilitate solidification. Pick up. In this embodiment, the positions (in) and (121) of the first memory unit (11) and the second memory unit (12) are composed of a granular electric conductor, and in particular, the granular conductive material is called The system is a commonly used solder ball, and the granular conductive system is packaged in a Ball Grid Array (BGA) manner and fixed on the first printed circuit board (13), in addition to the first memory. The pins (111) and (121) of the body unit (11) and the second memory unit (12) may also be arranged on the first printed circuit board (13) by the granular conductors in other suitable manners, and the electrical properties are achieved. The purpose of the connection and packaging is fixed. Referring to FIG. 5, which is a second embodiment of a memory module stacked and connected in a mirror image manner, the memory module (2) is also a 1309883 first memory unit (21) and The second memory unit (2 2) is electrically connected to a first printed circuit board (23), and the two memory units (21) and (22) are fixed in a mirror image manner. The difference from the first embodiment is that the positions (211) of the memory cells (21) and (22) are made of metal wires and are arranged neatly on both sides of the memory cells (21) and (22). Extending by the extension of the foot (211) for soldering or gluing to the first printed circuit board (23)
上，並且使第一記憶體單元(21)與第二記憶體單元(22)之腳 位(211)相對應。 由上可知，本發明之連接方法與記憶體模組實具有新 穎性及進步性，確實改良習用技術之缺點，尤其是採取鏡 像方式連接之記憶體堆疊可使信號或資料傳輸具有最合適 化之拓樸（optimal topology) ’使信號傳遞路徑更為等長均 -，藉此降低㈣狀貞載，大大提高錢之精準度，更 特別的疋’此鏡像方式結合之記憶體堆疊設置及接合不僅 簡單而容易生產’藉由印刷電路技術之成熟，更大幅降低 生產成本及時間。 妙職是:本發㈣能藉上逃所揭露之技術，提供-於 申：驾知者的°又计’堪能提高整體之使用價值，又: 見㈣㈣㈣使用，誠已符合發明專利之 件，爰依法提出發明專利申請。 惟’上述所揭露之圖式、〜 -a 成明，僅為本發明之實施 而已，凡精于此項技藝者當可价站 ^ ^ +#ώ 』依據上述之說明作其他種 之改良，而這些改變仍屬於太 宙立丨#丄 蜀本發明之發明精神及以下所 疋之專利範圍中。 -11 · 1309883 ' 【圖式簡單說明】 第一圖係為本發明之記憶體堆疊連接方法之步驟流 程圖。 第二圖係為本發明之第一實施例立體示意圖。 第三圖係為本發明之第一實施例正視示意圖。 第四圖係為本發明之第一實施例側視示意圖。 第五圖係為本發明之第二實施例之立體示意圖。 *【i要齡符號說明】 (1) 記憶體模組 (11) 第一記憶體單元 (ill) 腳位 (12) 第二記憶體單元 (121) 腳位 (13) 第一印刷電路板 (14) 第二印刷電路板 (15) 導電接片 (16) 導電介質 (2) 記憶體模組 (21) 第一記憶體單元 (211) 腳位 (22) 第二記憶體單元 (23) 第一印刷電路板 -12-And, the first memory unit (21) is made to correspond to the pin position (211) of the second memory unit (22). It can be seen from the above that the connection method and the memory module of the present invention are novel and progressive, and indeed improve the shortcomings of the conventional technology, especially the memory stack connected by mirroring can make the signal or data transmission most suitable. The optimal topology 'make the signal transmission path more equal--to reduce the (four) shape, greatly improve the accuracy of the money, and more specifically 疋' this image mode combined with the memory stacking and bonding not only Simple and easy to produce 'With the maturity of printed circuit technology, the production cost and time are greatly reduced. The wonderful position is: The hair (4) can borrow the technology exposed by the escape, and provide - Yu Shen: The driver's ° can also improve the overall use value, and: See (4) (4) (4) use, Cheng has already met the invention patent,提出 Submit an invention patent application in accordance with the law. However, the above-mentioned disclosures, ~-a, are only for the implementation of the present invention, and those who are skilled in this art as a price station ^ ^ + #ώ 』 are based on the above description for other kinds of improvements, And these changes are still in the scope of the invention of the invention and the scope of the patents below. -11 · 1309883 ' [Simple description of the drawings] The first figure is a flow chart of the steps of the memory stack connection method of the present invention. The second figure is a perspective view of a first embodiment of the present invention. The third figure is a front view showing a first embodiment of the present invention. The fourth figure is a side view of the first embodiment of the present invention. The fifth drawing is a perspective view of a second embodiment of the present invention. *[i description of age symbol] (1) Memory module (11) First memory unit (ill) Pin position (12) Second memory unit (121) Pin position (13) First printed circuit board ( 14) Second printed circuit board (15) Conductive tab (16) Conductive medium (2) Memory module (21) First memory unit (211) Pin position (22) Second memory unit (23) a printed circuit board-12-