TWI297295B - - Google Patents

Download PDF

Info

Publication number
TWI297295B
TWI297295B TW092117387A TW92117387A TWI297295B TW I297295 B TWI297295 B TW I297295B TW 092117387 A TW092117387 A TW 092117387A TW 92117387 A TW92117387 A TW 92117387A TW I297295 B TWI297295 B TW I297295B
Authority
TW
Taiwan
Prior art keywords
laser spot
glass substrate
laser
brittle material
spot
Prior art date
Application number
TW092117387A
Other languages
English (en)
Chinese (zh)
Other versions
TW200407209A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200407209A publication Critical patent/TW200407209A/zh
Application granted granted Critical
Publication of TWI297295B publication Critical patent/TWI297295B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
    • C03B37/10—Non-chemical treatment
    • C03B37/16—Cutting or severing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
TW092117387A 2002-07-01 2003-06-26 Device and method for scribing substrate of brittle material TW200407209A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002192707 2002-07-01

Publications (2)

Publication Number Publication Date
TW200407209A TW200407209A (en) 2004-05-16
TWI297295B true TWI297295B (https=) 2008-06-01

Family

ID=29996982

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092117387A TW200407209A (en) 2002-07-01 2003-06-26 Device and method for scribing substrate of brittle material

Country Status (6)

Country Link
JP (1) JP4134033B2 (https=)
KR (1) KR100647454B1 (https=)
CN (1) CN1665656A (https=)
AU (1) AU2003246209A1 (https=)
TW (1) TW200407209A (https=)
WO (1) WO2004002705A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP2007105888A (ja) * 2005-10-11 2007-04-26 Kyoto Seisakusho Co Ltd 脆性材料の初亀裂形成方法
TW200722218A (en) * 2005-12-05 2007-06-16 Foxsemicon Integrated Tech Inc Laser cutting apparatus
KR100670600B1 (ko) * 2006-02-02 2007-01-17 주식회사 에스에프에이 스크라이브 장치
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
WO2009128219A1 (ja) * 2008-04-15 2009-10-22 株式会社リンクスタージャパン 脆性材料基板の加工装置および切断方法
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20100107253A (ko) 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP5416445B2 (ja) * 2009-03-25 2014-02-12 三星ダイヤモンド工業株式会社 レーザスクライブ装置
KR101073563B1 (ko) * 2010-02-08 2011-10-14 삼성모바일디스플레이주식회사 표시 장치 및 이의 제조 방법
JP5309107B2 (ja) * 2010-10-05 2013-10-09 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
TWI651182B (zh) * 2014-06-26 2019-02-21 日商三星鑽石工業股份有限公司 脆性基板之切斷方法及劃線裝置
JP6668776B2 (ja) * 2016-01-22 2020-03-18 三星ダイヤモンド工業株式会社 ブレイク装置
CN106995274A (zh) * 2016-09-23 2017-08-01 广州市科卡通信科技有限公司 一种新式玻璃画线装置
CN114939718B (zh) * 2022-06-30 2024-02-13 广东舜元激光科技有限公司 一种激光划线装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3526175B2 (ja) * 1997-06-11 2004-05-10 三菱電機株式会社 レーザ加工装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP3439179B2 (ja) * 2000-07-28 2003-08-25 三菱重工業株式会社 レーザーエッチング方法
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

Also Published As

Publication number Publication date
AU2003246209A1 (en) 2004-01-19
KR100647454B1 (ko) 2006-11-23
KR20050005525A (ko) 2005-01-13
TW200407209A (en) 2004-05-16
CN1665656A (zh) 2005-09-07
JP4134033B2 (ja) 2008-08-13
JPWO2004002705A1 (ja) 2005-10-27
WO2004002705A1 (ja) 2004-01-08

Similar Documents

Publication Publication Date Title
TWI297295B (https=)
JP4156513B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
CN100436355C (zh) 玻璃板切割机
TWI290543B (en) Scribe line forming device and scribe line forming method
CN102026926B (zh) 脆性材料基板的加工方法
CN1298523C (zh) 脆性材料基板的划线方法及划线装置
TWI375602B (https=)
CN1264768C (zh) 脆性材料基片的划线装置以及划线方法
KR20080060253A (ko) 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치
JP2000156358A (ja) レ―ザ―を用いる透明媒質の加工装置及び加工方法
TW200936290A (en) Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
JP2011230940A (ja) 脆性材料基板の割断方法
TW200950913A (en) Method for processing fragile material substrate
CN1255858C (zh) 脆性材料基板的划线装置和脆性材料基板的划线方法
CN1242458C (zh) 脆性材料基板的划线方法及划线装置
TW200400863A (en) Scribe device
CN114669882A (zh) 红外超快激光金刚石刀头修复的方法和系统
CN1541800A (zh) 颤动激光切割装置及方法
TWI282295B (en) Substrate working device and substrate working method
JP2010089143A (ja) 脆性材料基板の割断方法及び割断装置
WO2010092964A1 (ja) 脆性材料基板の割断方法
JP2004035315A (ja) 脆性材料基板の分断方法および脆性材料基板分断装置
JP2015160769A (ja) ガラス基板の割断方法
HK1069377B (en) Device and method for scribing fragile material substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees