1294921 A7 B7 五、發明説明（i ) 技術範疇 本發明係有關含銀組成物，特別係有關光可固化含銀 (請先閱讀背面之注意事項再填寫本頁) 組成物，製造及施用光可固化含銀組成物於基板上成為塗 層之方法。 背景技藝 有許多情況需要或期望施用銀或含銀化合物塗層、鍍 覆或層至基板上。此等應用範例包括開關之電極鍍覆，例 如用於感壓開關或控制面板之電極鑛覆，例如用於微波 爐、習知烤爐等電器設施。此種銀鍍覆也常用於半導體製 造業來施用銀金屬化於銀或鍺半導體晶圓上。其它基板例 如但非限於聚酯類、聚碳酸酯類、乙烯系類、陶究、玻璃 等。 至目前為止主要用於銀至基板之辦法涉及使用以溶劑 為主之銀溶液至基板，以化學或熱方式固化溶液而蒸發去 除溶劑。如此留下固體銀鍍覆於基板上。 此種習知辦法之缺點有多項。或許最令人憂心者為目 前用於此項用途的溶劑有毒。需要特硃處理及廢棄設施與 技術’相對的也造成效果的下降與成本的升高。即使於觀 察特殊處理技術，此等技術也對使用毒性物質之工作人員 造成風險。以溶劑為主之組成物及方法也有缺點在於難以 預測溶劑蒸發去除後，結果所得銀鍍覆之均勻度及厚度。 如此導致品質與性能多變。 發明概述 士此本务明之目的係提供一種無需有毒溶劑之銀組成 本紙張尺度適用中國國家標準A4規格（21〇χ297公釐） 4 1294921 A7 _：-1_—- B7 _ 五、發明説明（2 ) 物以及銀可無需有毒溶劑施用於基板上之方法。 本I明之另一目的係提供一種銀組成物及方法，其中 銀層可比先前技藝以溶劑為主之技術更快速有效地施用。 本毛明之另一目的係提供一種銀組成物及方法，其中 可形成比較先前技藝以銀為主之系統，具有更為可預測且 更均勻的層厚度之銀塗層。 為了達成前述目的，根據本文件具體說明及廣義敘述 之發明目的，提供一種銀組成物沉積於基板上形成塗層、 鍵覆、薄膜或層。本文件中塗層、鏟覆、薄膜及層等詞概 略用以表示基板表面上之覆蓋，該覆蓋依據應用用途及設 計目的決定可有多種不同厚度。 發明揭示 根據本發明之一方面，提供一種光可固化含銀組成 物。銀組成物包含光可固化有機混合物、光引發劑、銀粉、 及銀薄片組成物。銀薄片組成物係以占組成物内存在之銀 粉重置之至少20%數量存在。攙混至少2〇%數量之銀薄片 組成物，可獲得具有優異導電性之薄膜。達成於丨密耳時低 抵0·03歐姆/平方之電阻率。 光可固化含銀組成物較好包含脂肪族丙稀酸化寡聚 物，其中該脂肪族丙烯酸化寡聚物之存在量係占銀組成物 重里至約3 %至8 %。除非另行陳述，否則本文件表示之全 部銀組成物百分比係指於標準溫度及壓力條件下所述組成 分對銀組成物於其流體未固化態之總質量之質量百分比。 銀組成物較好也包含丙烯酸化環氧寡聚物，其中該丙 本紙張尺度適用中國國家標準（CNS) Α4規格（21〇><297公釐） (請先閲讀背面之注意事項再填寫本頁)1294921 A7 B7 V. INSTRUCTIONS (i) Technical Field The present invention relates to a silver-containing composition, in particular to a photocurable silver-containing composition (please read the back of the back sheet and fill out this page) composition, manufacture and apply light. A method of curing a silver-containing composition to form a coating on a substrate. BACKGROUND OF THE INVENTION There are many situations in which it is desirable or desirable to apply a coating, plating or layer of silver or a silver-containing compound onto a substrate. Examples of such applications include electrode plating of switches, such as electrode coatings for pressure sensitive switches or control panels, such as those used in microwave ovens, conventional ovens, and the like. Such silver plating is also commonly used in the semiconductor manufacturing industry to apply silver metallization to silver or germanium semiconductor wafers. Other substrates are, for example, but not limited to polyesters, polycarbonates, vinyls, ceramics, glass, and the like. The method mainly used for silver to substrates up to now involves the use of a solvent-based silver solution to the substrate, chemically or thermally curing the solution to evaporate the solvent. The solid silver is thus left to be plated on the substrate. There are a number of shortcomings of this conventional approach. Perhaps the most worrying is that the solvents currently used for this purpose are toxic. The need for special treatment and disposal of facilities and technology is also associated with a decline in effectiveness and an increase in costs. Even when special handling techniques are observed, these technologies pose a risk to workers who use toxic substances. Solvent-based compositions and methods also have the disadvantage that it is difficult to predict the uniformity and thickness of the resulting silver plating after evaporation of the solvent. This leads to changes in quality and performance. SUMMARY OF THE INVENTION The purpose of this service is to provide a silver composition that does not require toxic solvents. This paper scale applies to the Chinese National Standard A4 specification (21〇χ297 mm). 4 1294921 A7 _:-1_—- B7 _ V. Invention Description (2 The method and the silver can be applied to the substrate without using a toxic solvent. Another object of the present invention is to provide a silver composition and method wherein the silver layer can be applied more quickly and efficiently than prior art solvent based techniques. Another object of the present invention is to provide a silver composition and method in which a silver-based system having a more predictable and uniform layer thickness can be formed as compared to prior art silver-based systems. In order to achieve the foregoing objects, a silver composition is deposited on a substrate to form a coating, a bond, a film or a layer, in accordance with the purpose of the invention as specifically described and broadly described. The terms coating, shovel, film and layer in this document are used to refer to the coverage on the surface of the substrate. The coverage may vary depending on the application and design. Disclosure of the Invention According to one aspect of the invention, a photocurable silver-containing composition is provided. The silver composition comprises a photocurable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition is present in an amount of at least 20% of the silver powder replacement present in the composition. A film having excellent conductivity can be obtained by mixing at least 2% by mass of the silver flake composition. When it is reached, it is less than 0. 03 ohms/square. The photocurable silver-containing composition preferably comprises an aliphatic acrylated oligomer, wherein the aliphatic acrylated oligomer is present in an amount of from about 3% to about 8% by weight of the silver composition. Unless otherwise stated, the percentage of total silver composition referred to in this document refers to the mass percentage of the total mass of the composition of the silver composition in its fluid uncured state under standard temperature and pressure conditions. The silver composition preferably further comprises an acrylated epoxy oligomer, wherein the size of the paper is applicable to the Chinese National Standard (CNS) Α4 specification (21〇><297 mm) (please read the notes on the back first) Fill in this page)
1294921 、發明說明（ 婦酸化環氧寡聚物之存在量係占銀組成物之約2%至4%。 (請先閲讀背面之注意事項再填寫本頁) 銀組成物較好也包含占銀組成物約4%至8%之丙烯酸 異冰片酯單體，占銀組成物約3〇/〇至6%之光引發劑，占銀 、、且成物約0.1%至2%之流動促進劑，占銀組成物約5〇%至 6〇%之銀粉以及占銀組成物約25%至35%之銀薄片組成物。 根據本發明之此一方面，脂肪族丙烯酸化寡聚物較好 包含胺甲酸酯寡聚物。於本銀組成物較佳版本，脂肪族丙 婦酸化养聚物之存在量係占銀組成物之約8%。 丙烯酸化環氧寡聚物之較佳存在量係占銀組成物之約 3〆〇丙烯酸異冰片酯單體之較佳存在量係占銀組成物之約 5%。光引發劑之較佳存在量係占銀組成物之約5%。流動 促進劑之較佳存在量係占銀組成物之約1〇/〇。 根據本發明之此一方面之較佳具體實施例中，銀粉較 佳視需要地係以占銀組成物之約52%之量存在。此等較佳 具體實施例中，銀粉的粒徑係於約5微米至約15微米之範 圍。更佳具體實施例中，銀粉之粒子分佈為約5%至2〇%粒 子具有粒徑小於約4.7微米，約30%至6〇%粒子具有粒徑小 於約7.6微米以及約70%至95%粒子具有粒徑小於約ΐ4·9微 米。最佳具體實施例中，銀粉之粒子分佈為約1〇%粒子具 有粒徑小於約4·7微米，約5〇%粒子具有粒捏小於約Μ微米 以及約90%粒子具有粒徑小於約14·9微米。 根據較佳具體實施例，銀薄片之存在量係占銀組成物 之約3〇%。較好銀薄片之粒子大小係於約5微米至約μ微米 之範圍。銀薄片之薄片分佈為腦粒子具有粒徑小於約Μ 紙張尺度適用中國國家標準（咖）Α4規格（2腦297公 1294921 A7 ' ：~二---B7 _ 五、發明説明（4 ) " ---- 微米’約5G%粒子具有粒徑小於約12.5微米’及約90%粒子 具有粒徑小於約32.0微米。 (請先閲讀背面之注意事項再填窝本頁) v U之又另一例中，黏著促進劑之存在量 係占組成物之約1至4%。進一步修飾例可改良對以透明導 體如銦錫氧化物（ITO)塗覆之基板之黏著性。 “根據本發明之另一方面，提供一種適合用於製造可遮 蔽電磁轄射之塗層之光可固化銀組成物。此具體實施例較 好係藉噴霧施用於基板。銀組成物包含丙婦酸化環氧寡聚 =，其中丙烯酸化環氧募聚物之存在量係占銀組成物之約 2%至8%。銀組成物較好包含占銀組成物約丨5%至3〇%含量 之丙烯酸異冰片酯單體，占銀組成物約3%至7%含量之光 引發劑，占銀組成物約〇.1%至2%含量之流動促進劑，占銀 組成物約20%至40%含量之銀粉以及占銀組成物約2〇%至 40%含量之銀薄片組成物。 根據本發明之另一方面，提供一種適合用於製造塗層 而該塗層可於電路板上形成電阻鏈路之光可固化銀組成 物。本發明之此一具體實施例較好不含任何胺甲酸酯。銀 組成物包含丙烯酸化環氧寡聚物，其中該丙烯酸化環氧募 聚物之存在量係占銀組成物之約16〇/。至2〇%。銀組成物也 包含占銀組成物約8%至14%之丙稀酸異冰片酯單體，占銀 組成物約4%至8%之光引發劑，占銀組成物約〇1〇/〇至2〇/〇之 流動促進劑，占銀組成物約25%至38%之銀粉以及占銀組 成物約20%至40%之銀薄片組成物。 根據本發明之又另一方面，提供一種適合用於製造塗 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 B7 五、發明説明（5 ) 層而該塗層可於電路板上形成電阻鏈路之光可固化銀組成 物。本具體實施例含有胺甲酸酉旨。銀組成物包含脂肪族丙 烯酸化寡聚物（胺甲酸酯），其中該脂肪族丙烯酸化寡聚物 之存在量係占銀組成物之約7%至11%。銀組成物進一步包 含丙烯酸化環氧寡聚物，其中該丙稀酸化環氧寡聚物之存 在量係占銀組成物之約1%至4%。銀組成物也包含占銀組 成物約12〇/〇至25%之丙烯酸異冰片酯單體，占銀組成物約 2%至4%之光引發劑，占銀組成物約〇〇%至4%之流動促進 劑，含17%至19%之銻錫氧化物，占銀組成物約24%至3〇% 之銀粉以及占銀組成物約15%至3〇%之銀薄片組成物。本 具體實施例之又一修飾例中，銀組成物額外包含約5%至 1 〇%之聚丙烯酸寡聚物/丙烯酸酯單體攙合物。 根據本發明之又另一方面，提供一種適合用於製造塗 層，而該塗層可於電路板上形成黑色電阻鏈路之光可固化 銀組成物。銀組成物包含脂肪族丙烯酸化寡聚物，其中該 脂肪族丙烯酸化募聚物之存在量係占銀組成物之約7%至 11°/。。銀組成物進一步包含丙烯酸化環氧寡聚物，其中該 丙稀g欠化環氧养聚物之存在量係占銀組成物之約至 4%。銀組成物也包含占銀組成物約1〇%至14%之丙稀酸異 冰片醋單體，占銀組成物約130/0至15%之光引發劑，占銀 組成物約0.1%至2%之流動促進劑，5%至12%導電碳黑粉 末，占銀組成物約0.5%至3%之濕潤劑，以及占銀組成物約 15%至25%之銀薄片組成物。 根據本發明之另一方面，提供一種製造光可固化銀組 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 8 0 (請先閲讀背面之注意事項再填窝本頁)1294921, invention description (the presence of the acidified epoxy oligomer is about 2% to 4% of the silver composition. (Please read the note on the back and fill out this page.) Silver composition also contains silver. The composition is about 4% to 8% of isobornyl acrylate monomer, and the photoinitiator is about 3 〇/〇 to 6% of the silver composition, and the flow promoter is about 0.1% to 2% of the silver. a silver powder comprising from about 5% to about 5% by weight of the silver composition and from about 25% to about 35% of the silver composition. According to this aspect of the invention, the aliphatic acrylated oligomer preferably comprises A urethane oligomer. In a preferred version of the silver composition, the aliphatic acetoanated oligomer is present in an amount of about 8% of the silver composition. The preferred amount of acrylated epoxy oligomer is present. Preferably, the amount of about 3 Å of the isobornyl acrylate monomer is about 5% of the silver composition. The photoinitiator is preferably present in an amount of about 5% of the silver composition. Preferably, the promoter is present in an amount of about 1 Å/Å of the silver composition. In a preferred embodiment of this aspect of the invention, the silver powder is preferably The desired amount is present in an amount of about 52% of the silver composition. In these preferred embodiments, the particle size of the silver powder is in the range of from about 5 microns to about 15 microns. More preferably, the silver powder is The particle distribution is from about 5% to about 2% of the particles having a particle size of less than about 4.7 microns, from about 30% to about 6% of the particles having a particle size of less than about 7.6 microns and from about 70% to about 95% of the particles having a particle size of less than about ΐ4·9. In a preferred embodiment, the silver powder has a particle distribution of about 1% by particle having a particle size of less than about 4.7 microns, about 5% of the particles have a particle size of less than about Μ microns, and about 90% of the particles have a particle size less than About 14.9 microns. According to a preferred embodiment, the silver flakes are present in an amount of about 3% by weight of the silver composition. Preferably, the silver flakes have a particle size in the range of from about 5 microns to about μ microns. The distribution of the flakes is that the brain particles have a particle size of less than about Μ. The paper scale is applicable to the Chinese national standard (cafe) Α 4 specifications (2 brain 297 gong 1294492 A7 ': ~ two - B7 _ five, invention description (4) " -- - micron 'about 5G% particles have a particle size of less than about 12.5 microns' and about 90% of the particles have a particle size less than About 32.0 microns. (Please read the note on the back and fill in this page.) In another example of U, the adhesion promoter is present in an amount of about 1 to 4% of the composition. Further modifications can be improved. Adhesion of a transparent conductor such as an indium tin oxide (ITO) coated substrate. "According to another aspect of the present invention, there is provided a photocurable silver composition suitable for use in the manufacture of a coating that can shield electromagnetic interference. The specific embodiment is preferably applied to the substrate by spraying. The silver composition comprises acetoacetated epoxy oligomer = wherein the acrylated epoxy polymer is present in an amount of from about 2% to about 8% of the silver composition. Preferably, the composition comprises an isobornyl acrylate monomer in an amount of from about 5% to about 3% by weight of the silver composition, and a photoinitiator in an amount of from about 3% to 7% by weight of the silver composition, which constitutes a silver composition of about 〇.1. A flow promoter of a % to 2% content, a silver powder having a content of about 20% to 40% of the silver composition, and a silver flake composition having a content of about 2% to 40% of the silver composition. In accordance with another aspect of the invention, a photocurable silver composition suitable for use in the manufacture of a coating which forms a resistive link on a circuit board is provided. This particular embodiment of the invention preferably does not contain any carbamate. The silver composition comprises an acrylated epoxy oligomer, wherein the acrylated epoxy polymer is present in an amount of about 16 Å/min of the silver composition. To 2〇%. The silver composition also comprises from about 8% to 14% of the silver composition of isobornyl acrylate monomer, from about 4% to about 8% of the silver composition of the photoinitiator, and the silver composition is about 〇1〇/〇. A flow promoter of up to 2 Å/〇, about 25% to 38% of the silver powder of the silver composition and about 20% to 40% of the silver composition of the silver composition. According to still another aspect of the present invention, there is provided a layer suitable for use in the manufacture of coated papers in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 B7 5. The invention (5) layer and the coating can be A light-forming silver composition that forms a resistive link on the board. This embodiment contains urethane formate. The silver composition comprises an aliphatic acrylated oligomer (urethane), wherein the aliphatic acrylated oligomer is present in an amount of from about 7% to 11% of the silver composition. The silver composition further comprises an acrylated epoxy oligomer, wherein the aminated epoxy oligomer is present in an amount from about 1% to about 4% of the silver composition. The silver composition also comprises from about 12 Å to about 25% of the silver composition of isobornyl acrylate monomer, from about 2% to 4% of the silver composition of the photoinitiator, from about 〇〇% to about 4% of the silver composition. The flow promoter of % contains 17% to 19% of antimony tin oxide, about 24% to 3% by weight of the silver composition, and about 15% to 3% of the silver composition of the silver composition. In still another modification of this embodiment, the silver composition additionally comprises from about 5% to about 1% by weight of the polyacrylic acid oligomer/acrylate monomer composition. In accordance with still another aspect of the present invention, a photocurable silver composition suitable for use in the manufacture of a coating which forms a black resistive link on a circuit board is provided. The silver composition comprises an aliphatic acrylated oligomer wherein the aliphatic acrylated polymer is present in an amount from about 7% to about 11% of the silver composition. . The silver composition further comprises an acrylated epoxy oligomer, wherein the propylene-glow epoxide oligomer is present in an amount of up to about 4% of the silver composition. The silver composition also comprises from about 1% to about 14% of the silver composition of the isobornyl acetonate monomer, and the silver composition comprises from about 130/0 to 15% of the photoinitiator, accounting for about 0.1% of the silver composition. 2% of the flow promoter, 5% to 12% of the conductive carbon black powder, about 0.5% to 3% of the humectant of the silver composition, and about 15% to 25% of the silver foil composition of the silver composition. According to another aspect of the present invention, there is provided a method for manufacturing a photocurable silver group. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 8 0 (Please read the back note and refill the page)
、可I 1294921I 1294921
發明説明 成物之方法。該方法包含組合與混合丙烯酸異冰片酯單體 及光引發劑而形成第一混合物之步驟。丙烯酸異冰片酯單 體之存在量係占銀組成物之約4%至8%，光引發劑之存在 量係占銀組成物之約3%至6%。 該方法包括組合及混合脂肪族丙烯酸化寡聚物及丙烯 酸化環氧寡聚物而形成第二混合物之第二步驟。脂肪族丙 烯酸化寡聚物之存在量係占銀組成物之約3%至8%，丙婦 酸化壞氧寡聚物之存在量係占銀組成物之約2%至4%。 該方法包括組合與混合銀粉與銀薄片組成物而形成第 三混合物之第三步驟。該銀粉之存在量係占銀組成物之約 50 /〇至60 /〇’銀薄片組成物之存在量係占銀組成物之約μ% 至35% 〇 。亥方法進一步包括以占銀組成物約〇1%至之數量 組合與混合流動促進劑之第四步驟，以及組合第一、第二、 苐一及弟四此合物而形成銀組成物之第五步驟。 係 於 /較好但視情況需要，第一、第二、第三及第四步驟 循序進行。各種形式之方法可以分批方式例如於適合用 分批處理之混合容H或類似之處理設備以分批方式進行。 也較好以其它形式例如連續流方案進行。 該 0 (請先閲讀背面之注意事項再填寫本頁) 、τ 根據本發明之另一方面，提供另-種製造光可固化銀 組成物之方法。此種方法包含第一步驟，組合及混合丙烯 酸異冰片酯單體及光引發劑而形成第一組成物，其中該丙 烯酸異冰片酯單體之存在量係占銀組成物之約4%至8%， 以及光引發劑之存在量係占銀組成物之約3%至6% 本紙張尺度適财關家標準（CNS) M規格（2歡撕公楚） 1294921 A7 _, _ B7 五、發明説明（7 ) 法也包括第二步驟，與第一組成物組合以及混合脂肪族丙 烯酸化寡聚物及丙烯酸化環氧寡聚物而形成第二混合物。 該脂肪族丙嫦酸化寡聚物之存在量係占銀組成物之約3〇/〇 至8%，以及丙烯酸化環氧募聚物之存在量係占銀組成物之 約2%至4%。 該方法進一步包括第三步驟，與第二組成物組合及混 合銀粉及銀薄片組成物而形成第三組成物。該銀粉之存在 量係占銀組成物之約50%至60%，以及銀薄片組成物之存 在量係占銀組成物之約25%至35%。 該方法進一步包括第四步驟，與第三組成物組合以及 混合占銀組成物約0.1 %至2%數量之流動促進劑。 此種方法也係以分批模式進行例如於一個混合容器或 一系列混合容器進行；以連續流方案或以某種組合方案進 行。 根據本發明之又另一方面，提供一種沉積銀塗層於基 板之方法。該方法包含第一步驟，於基板施用一種含銀流 體相組成物（「銀組成物」）。銀組成物包含脂肪族丙婦酸 化寡聚物，其中該脂肪族丙烯酸化寡聚物之存在量係占銀 組成物之約3 %至8 %。銀組成物進一步包括丙嫦酸化環氧 寡聚物。丙烯酸化環氧寡聚物之存在量係占銀組成物之約 2%至4%。銀組成物也包括含量占銀組成物之約4%至8%之 丙婦酸異冰片酯單體，含量占銀組成物之約3〇/〇至6〇/〇之光 引發劑以及含量占銀組成物之約〇. 1%至2〇/〇之流動促進 劑。銀組成物又包括含量占銀組成物約5〇%至6〇%之銀 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公董） 10 (請先閲讀背面之注意事項再填窝本頁) •訂丨 1294921 A7 . >_B7_五、發明説明（8 ) 粉，以及含量占銀組成物約25%至35%之銀薄片組成物。 該方法也包括以適合造成銀組成物固化成為銀塗層之 薄層之光，照射基板上之銀組成物之第二步驟。較好光具 有於電磁譜紫外光區之波長。 根據此種方法，銀組成物可選擇性沉積於基板之期望 鍍銀之特定位置。無需施用至整片基板。如此使用銀塗層 於半導體晶圓、印刷電路板、感壓或加壓活化開關等上形 成為金屬化。 根據本發明之另一方面，提供一種製備液相含銀組成 物用以提供含銀塗層或鑛覆於基板之方法。 執行本發明之最佳模式 銀組成物 現在對目前較佳本發明組成物或具體實施例及方法之 細節做說明，該等組成物或具體實施例及方法構成實施發 明人目前已知本發明之最佳模式。 根據本發明之一方面，提供較佳光可固化銀組成物 (「銀組成物」）。本較佳具體實施例中，銀組成物包括脂 肪族丙烯酸化寡聚物。脂肪族丙烯酸化寡聚物之存在量係 占銀組成物之約3%至8%且較好約8%。脂肪族丙烯酸化寡 聚物較好包含胺甲酸酯寡聚物。適當脂肪族丙烯酸化寡聚 物包括瑞德可爾（Radcure)依比丘（Ebecryl)244、依比丘264 及依比丘284胺甲酸酯，市面上得自喬治亞州史密那 (Smyrna)瑞德可爾 UCB 公司；沙妥馬（Sartomer)CN961、 CN963、CN964、CN966、CN982及CN983市面上得自賓州 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS〉A4規格（210X297公釐） 11 1294921 A7 _· ._B7_五、發明説明（9 ) 伊士頓沙妥馬公司；塔伯（TAB)費拉德（FAIRAD)8010、 8179、8205、8210、8216、8264、M-E-15、UVU-316、市 面上得自伊利諾州芝加哥塔伯化學公司；以及艾科（Echo) 樹脂ALU-303，市面上得自密蘇里州凡赛爾艾科樹脂公 司；以及基諾瑪（Genomer)4652，市面上得自伊利諾州阿羅 拉萊恩（Rahn)輻射固化公司。較佳脂肪族丙烯酸化寡聚物 包括依比丘264及依比丘284。依比丘264為呈於二丙烯酸己 二醇酯之85%溶液供應之脂肪族胺甲酸酯三丙烯酸酯。依 比丘284為分子量1200以二丙烯酸1，6-己二醇酯稀釋之脂 肪族胺甲酸酯二丙烯酸酯。熟諳技藝人士顯然易知此處也 可採用此等材料之組合。 此種較佳銀組成物進一步包括丙烯酸化環氧寡聚物。 丙烯酸化環氧寡聚物之存在量係占銀組成物之約2%至4% 且較好約3%。適當丙烯酸化環氧寡聚物包括瑞德可爾依比 丘3603，市面上得自依比丘UCB公司；沙妥馬CN120及 CN124，市面上得自沙妥馬公司；以及艾科樹脂TME9310 及9345，市面上得自艾科樹脂公司。較佳丙烯酸化環氧寡 聚物為依比丘3603，其為三官能丙烯酸化環氧酚醛清漆樹 脂。也可使用此等材料的組合。 較佳銀組成物也包括丙烯酸異冰片酯單體，其含量係 占銀組成物之約4%至8%且較好約5%。適當丙烯酸異冰片 酯單體包括沙妥馬SR423 IBOMA及SR506 IBOA;瑞德可 爾IBOA，市面上得自瑞德可爾公司；IBOA及IBOMA市面 上得自CPS化學公司；以及基諾瑪1121，市面上得自萊恩 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 12 1294921 A7 . ,_B7_五、發明説明（l〇) 輻射固化公司。較佳丙烯酸異冰片酯單體包括沙妥馬 SR423 IBOMA及SR506 IBOA ;瑞德可爾IBOA，市面上得 自瑞德可爾公司；IBOA及IBOMA，市面上得自CPS化學公 司；以及基諾瑪1121，市面上得自萊恩輻射固化公司。 此種較佳銀組成物也包括占銀組成物約3%至6%且計 傲好約4%含量之光引發劑。適當光引發劑包括伊卡丘 (Irgacure)184(l-羥環己基苯基甲酮）、907(2-甲基-1-[4·(甲 硫基）苯基]-2-嗎啉丙-1-酮）、369(2·苄基-2-Ν，Ν-二甲胺基 -1-(4-嗎啉苯基）-1-丁酮）、500(1-羥環己基苯基甲酮與二苯 甲酮之組合）、65 1 (2,2-二甲氧-2-苯基苯乙酮）、1700(貳（2,6-二甲氧苯甲醯基）-2,4，-三甲基戊基膦氧化物與2-羥-2_甲基 -1-苯基-丙-1-酮之組合（汽巴嘉基1700及達拉丘爾 (DAROCUR)1173(2-羥-2-曱基-1-苯基-1-丙烷）及 4265(2,4,6-三甲基苯甲醯基二苯膦氧化物與2-羥-2-甲基 -1-苯基-丙-1-酮之組合），市面上得自紐約州泰瑞鎮汽巴嘉 基公司；賽拉丘爾（CYRACURE)UVI-6974(三芳基六氟銻酸 磺鏺混合鹽）以及UVI-6990(三芳基六氟磷酸磺鏺混合 鹽），市面上得自康乃迪克州丹博利永備化學塑膠公司以及 基諾丘（Genocure)CQ、基諾丘BOK及基諾丘MBF市面上得 自萊恩輻射固化公司。較佳光引發劑為伊卡丘1700紐約州 泰瑞鎮汽巴嘉基公司。 較佳銀組成物更進一步包括含量占銀組成物約〇. 1 % 至2%且較好約1.0%之流動促進劑。適當流動促進劑包括基 諾拉（Genorad) 17，市面上得自萊恩輻射固化公司；以及莫 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 13 1294921 A7 B7 五、發明説明（η ) "~一 ' " "~ 達福羅（M〇daflow)市面上得自密蘇里州聖路易孟山都公 司。較佳流動促進劑為莫達福羅，其為丙婦酸乙醋與丙稀 酸2-乙基己酯共聚物，其可改良組成物流動性及此等材料 之組合也可用於此處。 幸乂仏銀組成物也包括占銀組成物約5〇Q/❶至且較好 約52%含量之銀粉。銀粉包含多數粒子。本較佳銀組成物 中，銀粉之粒徑係於5微米至約丨5微米粒子之範圍。某些具 體實施例中銀粉具有粒徑於約4·7微米至約149微米:範 圍。較好銀粉粒子具有粒徑分佈，其中約1〇%粒子具有粒 徑小於約4.7微米，約50%粒子具有粒徑小於約76微米以及 約90%粒子具有粒徑小於約14·9微米。較佳銀粉為銀粉 EG-ED及銀粉C-ED，市面上得自紐澤西州南平原市德古莎 公司。 較佳銀組成物又包括占銀組成物約2 5 %至3 5 %且較好 約30%含量之銀薄片組成物。銀薄片組成物包含多數薄 片’溥片係包含銀且較好主要係由銀組成。根據本具體實 施例之銀薄片組成物具有粒徑於約5微米至約32微米之範 圍。更好銀薄片組成物具有粒徑於約5.5微米至約32.0微米 之範圍。銀薄片粒子大小分佈為約1 0〇/〇粒子具有粒徑小於 約5.5微米，約50%粒子具有粒徑小於約12.5微米以及約 90%粒子具有粒徑小於約32 〇微米。較佳銀薄片組成物為 銀薄片25號、銀薄片丨號及銀薄片7Α號，市面上得自紐澤 西州南平原市德古莎公司。 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公爱） 14 (請先閲讀背面之注意事項再填寫本頁) 訂· 1294921 A7 . B7 五、發明説明（l2) 實施例1 本實施例提供根據本發明之較佳銀組成物，其可用於 沉積於基板例如聚合物膜表面，例如用作為感壓開關之電 接點。銀組成物係由下列組成分製成： 組成分 約略質量％ 依比丘264 7.2 依比丘3603 2.4 IBOA 4.7 銀粉EGED 53.4 銀薄片#25 27.6 伊卡丘1700 3.9 莫達福羅 0.8 總量 100.00 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘264、依 比丘3603及莫達福羅引進盤内及以1000 rpm速度混合1至2 分鐘。於次一步驟，EGED銀粉及銀薄片25號引進盤内， 且於1000 rpm速度混合1至2分鐘。最後混合速度提高至 10,000 rpm及又混合5分鐘。 為了獲得最佳結果，銀粉於添加至混合物前經洗滌。 洗滌過程包括第一步驟，粉末載入可密封容器内。17%甲 基乙基曱酮及83%銀組成物組成之混合物添加至容器，料 漿使用槳葉混合機於500 rpm混合5分鐘。倒出曱基乙基甲 酮，讓銀粉風乾。乾燥階段期間，定期混合粉末。 15 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 五、發明説明（l3) 根據本較佳組合物之銀粉包含EGED ,市面上得自紐 澤西川南平原市德古莎公司。此種銀粉也可得自其它商業 來源例如紐澤西州伊斯冷安琪哈德（Englehard)化學公司。 較佳銀粉具有粒徑分佈於約5微米至15微米之範圍。較佳銀 粉具有粒徑分佈如後。 表1銀粉粒徑分佈 <4.7 <7.6 <14.9如表中指示，於銀粉試樣中 镟米，50%顆粒之粒徑小於7·6微米及9〇%顆粒之粒徑j 14.9微米。 根據實施例1之較佳組成物之銀薄片包含SF25，市 上得自德古莎公司。本銀薄片組成物較好具有粒徑分佈 約5微米至約32微米。其粒徑分佈如後： 盘片組成物之粒徑分佑 太小範圍（微采、 百分比 <5*5 10% <12·5 50% <32.0 90%如表2指示，於銀薄片試樣中，1〇%薄片之大小小於^ ^ 微米，50%薄片之粒徑小於125微米以及9〇%之薄片之粒— 小於3 2.0微米。 、 百分比 10% 50% 90% 10%顆粒之粒徑小於4 於 面 由 (請先閲讀背面之注意事項再填寫本頁) -訂· 本紙張尺度適用中國國家標準（CNS) A4規格（21〇χ297公楚） 16 1294921 A7 _, ‘_B7_ 五、發明説明（14) 實施例2 本實施例提供另一種根據本發明之較佳銀組成物，其 可用於沉積於基板例如前述。銀組成物係由下列組成分製 成： 組成分 約略質量％ 依比丘264 4.2 依比丘3603 2.7 IBOA 7.7 銀粉EGED 53.4 銀薄片#25 27.6 伊卡丘1700 3.8 莫達福羅 0.6 總量 100.00 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘264、依 比丘3603及莫達福羅引進盤内及以1000 rpm速度混合1至2 分鐘。於次一步驟，EGED銀粉及銀薄片25號引進盤内， 且於1000 rpm速度混合1至2分鐘。最後混合速度提高至 10,000 rpm及又混合5分鐘。 實施例3 本實施例提供另一種根據本發明之較佳銀組成物，其 可用於沉積於塗覆以銦錫氧化物（ITO)之基板表面。銀組成 物係由下列組成分製成： 17 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 . . B7 五、發明説明（15) 組成分 約略質量％ 依比丘264 7.0 依比丘3603 2.3 IBOA 4.6 銀粉EGED 52.3 銀薄片#25 27.0 伊卡丘1700 3.8 莫達福羅 0.8 依比丘168 2.2 總量 100.00 (請先閲讀背面之注意事項再填寫本頁) 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘264、依 比丘3603及莫達福羅引進盤内及以1000 rpm速度混合1至2 分鐘。於次一步驟，EGED銀粉及銀薄片25號引進盤内， 且於1000 rpm速度混合1至2分鐘。於次一步驟，依比丘168 添加至盤内，組成以1 〇〇〇 rpm速度混合1至2分鐘。最後混 合速度提高至l〇,〇〇〇rpm及又混合5分鐘。 本實施例含有依比丘168添加作為黏著促進劑。本材料 為市面上得自喬治亞州史密那瑞德可爾UCB公司之甲基丙 稀酸醋衍生物。 製造可屏蔽電磁干擾之塗層用之銀組成物 根據本發明之另一方面，提供較佳光可固化銀組成物 (「銀組成物」）。此種組成物於光固化時產生可屏蔽電磁 干擾之塗層。此種塗層可施用至需要屏蔽避免電磁干擾之 18 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 B7 五、發明説明（I6 ) 基板，例如收音機機殼内部。本較佳具體實施例中，銀組 成物包括丙烯酸化環氧寡聚物。丙烯酸化環氧募聚物之存 在篁係占銀組成物之約2%至8%且較好約5%。適當丙烯酸 化環氧寡聚物同前文列舉之丙烯酸化環氧寡聚物。較佳丙 烯酸化環氧寡聚物為依比丘36〇3 ,其為三官能丙烯酸化環 氧酚醛清漆樹脂。此處也可使用此等材料的組合。 較佳銀組成物也包括含量占銀組成物約15%至3〇%且 較好約21 %之丙烯酸異冰片酯單體。適當丙烯酸異冰片酯 單體同前文列舉。較佳丙烯酸異冰片酯單體包括沙妥馬 SR423 IBOMA及SR506 IBOA ;瑞德可爾IB0A，市面上得 自瑞德可爾公司；IBOA及IBOMA，市面上得自CPS化學公 司，及基諾瑪1121，市面上得自萊恩輻射固化公司。此處 也可使用此等材料的組合。 此種較佳銀組成物也包括占銀組成物約3%至7%及較 好約5%含量之光引發劑。適當光引發劑係同前文列舉。較 佳光引發劑為伊卡丘1700，市面上得自紐約州泰瑞鎮汽巴 嘉基公司。此處也可採用此等材料的組合。 較佳銀組成物更進一步包括含量占銀組成物約〇.1% 至2%且較好約1 ·〇%之流動促進劑。適當流動促進劑係同前 文列舉者。較佳流動促進劑為莫達福羅，其為丙烯酸乙酉旨 與丙烯酸2-乙基己酯共聚物，其可改良組成物之流動。此 處也採用此等材料之組合。 較佳銀組成物也包括占銀組成物約25%至4〇%且較好 約36%含量之銀粉。較佳銀粉為銀粉eg-ED及銀粉C-ED， 本紙張尺度適用中國國家標準（〇jS) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) .、τ. 1294921 A7 . . B7 五、發明説明（I7) 市面上得自紐澤西州南平原市德古莎公司。 較佳銀組成物又包括占銀組成物約25%至40%且較好 約30%含量之銀薄片組成物。銀薄片組成物為銀薄片25 號、銀薄片1號及銀薄片7A號，市面上得自紐澤西州南平 原市德古莎公司。 實施例4 本實施例提供根據本發明之較佳銀組成物，其當施用 於表面且隨後藉紫外輻射固化時，將獲得適合屏蔽電磁干 擾之塗層。銀組成物係由下列組成分製成： 組成分 約略質量％ 依比丘3603 5.3 IBOA 21.0 銀粉EGED 31.5 銀薄片#1 35.7 伊卡丘1700 5.3 莫達福羅 1.2 總量 100.00 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘3603及莫 達福羅引進盤内及以5000 rpm速度混合5分鐘。於次一步 驟，EGED銀粉及銀薄片1號引進盤内，且於1000 rpm速度 混合1至2分鐘。最後混合速度提高至10,000 rpm及又混合5 至10分鐘。 20 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 B7 五、發明説明（l8 脑製造電阻鏈路組成物 根據本魚明之另-方面，提供較佳光可固化銀組成物 (「銀組成物」）。此種組成物於光目化時產生可於電路板 產生電阻鏈路之塗層。本較佳具體實施例中，銀組成物包 括丙烯酸化環氧寡聚物。丙烯酸化環氧寡聚物之存在量係 占銀組成物之約16%至20%且較好約18%。適當丙烯酸化環 氧募聚物同前文列舉之丙烯酸化環氧寡聚物。較佳丙烯酸 化壞氧募聚物為依比丘3603，其為三官能丙烯酸化環氧酚 醛清漆樹脂。此處也可使用此等材料的組合。 較佳銀組成物也包括含量占銀組成物約8%至14%且 較好約11〇/〇之丙烯酸異冰片酯單體。適當丙烯酸異冰片酯 單體同前文列舉。較佳丙烯酸異冰片酯單體包括沙妥馬 SR423 IBOMA及SR506 IBOA ;瑞德可爾IB〇A，市面上得 自瑞德可爾公司；IBOA及IBOMA，市面上得自CPS化學公 司；及基諾瑪1121，市面上得自萊恩輻射固化公司。此處 也可使用此等材料的組合。 此種較佳銀組成物也包括占銀組成物約4%至8%及較 好約6%含量之光引發劑。適當光引發劑係同前文列舉。較 佳光引發劑為伊卡丘1700，市面上得自紐約州泰瑞鎮汽巴 嘉基公司。此處也可採用此等材料的組合。 較佳銀組成物更進一步包括含量占銀組成物約〇. i% 至2%且較好約1 ·〇%之流動促進劑。適當流動促進劑係同前 文列舉者。較佳流動促進劑為莫達福羅，其為丙稀酸乙酉旨 與丙烯酸2-乙基己酯共聚物，其可改良組成物之流動。此 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 21 (請先閲讀背面之注意事項再填寫本頁) -、可| 1294921 A7 ----- B7_ 五、發明説明（l9) 處也採用此等材料之組合。 較佳銀組成物也包括占銀組成物約25%至35%且較好 約30%含量之銀粉。較佳銀粉為銀粉eg_ed及銀粉， 市面上得自紐澤西州南平原市德古莎公司。 較佳銀組成物又包括占銀組成物約25%至38%且較好 、、勺34 /〇含畺之銀薄片組成物。銀薄片組成物為銀薄片25 唬、銀薄片1號及銀薄片7八號，市面上得自紐澤西州南平 原市德古莎公司。 用於舉例說明，下述實施例陳述根據本發明之此一方 面之較佳銀組成物。 實施例5 本實施例提供根據本發明之較佳銀組成物，其當施用 於表面且卩边後藉束外輛射固化時，將獲得適合用於印刷電 路板上製造電阻鏈路之塗層。銀組成物係由下列組成分製 成： _組成分 約略質量％ 依比丘3603 18.3 IBOA 11.1 銀粉EGED 30.0 銀薄片#1 33.5 伊卡丘1700 6.1 莫達福羅 1.0 總量 100.00 本紙張尺度適用中國國家標準（CNS) Μ規格（210X297公楚） 22 (請先閲讀背面之注意事項再填窝本頁) 訂丨 1294921 A7 ， * B7 五、發明説明（2〇) 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘3603及莫 達福羅引進盤内及以5000 rpm速度混合5分鐘。於次一步 驟，EGED銀粉及銀薄片1號引進盤内，且於1000 rpm速度 混合1至2分鐘。最後混合速度提高至10,000 rpm及又混合5 至10分鐘。 用於製造電阻鏈路之含胺基曱酸酯之銀組成物 根據本發明之另一方面，提供較佳光可固化銀組成物 (「銀組成物」）。此種組成物於光固化時產生可於電路板 產生電阻鏈路之塗層。本較佳具體實施例中，銀組成物包 括脂肪族丙烯酸化寡聚物。脂肪族丙烯酸化寡聚物之存在 量係占銀組成物之約7%至11 %且較好約9%。脂肪族丙烯酸 化募聚物較好包含胺甲酸酯寡聚物。適當脂肪族丙烯酸化 寡聚物係同前文列舉。較佳脂肪族丙烯酸化寡聚物包括依 比丘264及依比丘284。依比丘264為呈於二丙烯酸己二醇酯 之85%溶液形式供應之脂肪族胺甲酸酯三丙烯酸酯。依比 丘284為乙二丙烯酸1，6-己二醇酯稀釋之分子量1200之脂 肪族胺甲酸酯二丙烯酸酯。也可使用此等材料的組合。 本較佳銀組成物又包括丙婦酸化環氧寡聚物。丙嫦酸 化環氧寡聚物含量占銀組成物約1°/。至4%且較好約3%之丙 嫦酸化環氧寡聚物。適當丙晞酸化環氧寡聚物同前文列 舉。較佳丙烯酸化環氧寡聚物為依比丘3603其為三官能丙 稀酸化環氧S分酸清漆樹脂。此處也可使用此等材料的組合。 較佳銀組成物也包括含量占銀組成物約12%至25%且 23 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐〉 1294921 A7 B7 五、發明説明（21) (請先閲讀背面之注意事項再填寫本頁) 較好約22%之丙烯酸異冰片酯單體。較佳丙烯酸異冰片酯 單體包括沙妥馬SR423 IBOMA及SR506 IBOA;瑞德可爾 IBOA，市面上得自瑞德可爾公司；IBOA及IBOMA，市面 上得自CPS化學公司；及基諾瑪1121，市面上得自萊恩輻 射固化公司。此處也可使用此等材料的組合。 此種較佳銀組成物也包括占銀組成物約2%至4%及較 好約3 %含量之光引發劑。適當光引發劑係同前文列舉。較 佳光引發劑為伊卡丘1700，市面上得自紐約州泰瑞鎮汽巴 嘉基公司。此處也可採用此等材料的組合。 -訂丨 較佳銀組成物又包括含量占銀組成物7%至19%且較 好約17%之錄錫氧化物粉末。較佳銻錫氧化物粉末米那太 克（Minatec)40，市面上得自紐約州霍桑EM工業公司。 較佳銀組成物更進一步包括含量占銀組成物約 至4%且較好約2.0%之流動促進劑。適當流動促進劑係同前 文列舉者。較佳流動促進劑為莫達福羅，其為丙烯酸乙酯 與丙烯酸2-乙基己酯共聚物，其可改良組成物之流動。此 處也採用此等材料之組合。 較佳銀組成物也包括占銀組成物約24%至30%且較好 約27%含量之銀粉。較佳銀粉為銀粉eg-ED及銀粉C-ED， 市面上得自紐澤西州南平原市德古莎公司。 較佳銀組成物又包括占銀組成物約15%至3〇%且較好 約17%含量之銀薄片組成物。銀薄片組成物為銀薄片25 號、銀薄片1號及銀薄片7 A號，市面上得自紐澤西州南平 原市德古沙公司。DESCRIPTION OF THE INVENTION A method of forming a product. The method comprises the steps of combining and mixing an isobornyl acrylate monomer and a photoinitiator to form a first mixture. The isobornyl acrylate monomer is present in an amount from about 4% to about 8% of the silver composition and the photoinitiator is present in an amount from about 3% to about 6% of the silver composition. The method comprises the second step of combining and mixing an aliphatic acrylated oligomer and an acrylated epoxy oligomer to form a second mixture. The aliphatic acrylated oligomer is present in an amount of from about 3% to about 8% of the silver composition and the glycerolated oligomeric oligomer is present in an amount from about 2% to about 4% of the silver composition. The method includes the third step of combining and mixing the silver powder with the silver flake composition to form a third mixture. The silver powder is present in an amount of from about 50 / Å to about 60 / Å of the silver composition. The silver flake composition is present in an amount of from about μ% to about 35% by weight of the silver composition. The method further comprises a fourth step of combining and mixing the flow promoter in an amount of about 1% by weight of the silver composition, and combining the first, second, first and fourth compounds to form a silver composition. Five steps. The first, second, third, and fourth steps are performed sequentially, preferably or as needed. The various forms of the process can be carried out in batch mode, e.g., in a batch mode suitable for batch processing H or similar processing equipment. It is also preferred to carry out in other forms such as a continuous flow scheme. This 0 (please read the note on the back before refilling this page), τ According to another aspect of the present invention, another method of producing a photocurable silver composition is provided. The method comprises the first step of combining and mixing an isobornyl acrylate monomer and a photoinitiator to form a first composition, wherein the isobornyl acrylate monomer is present in an amount of from about 4% to about 8% of the silver composition. %, and the amount of photoinitiator is about 3% to 6% of the silver composition. This paper scale is suitable for the financial standard (CNS) M specification (2 Huan Tear Gong Chu) 1294921 A7 _, _ B7 V. Invention The method of (7) also includes a second step of combining the first composition and mixing the aliphatic acrylated oligomer and the acrylated epoxy oligomer to form a second mixture. The aliphatic propionic acid oligomer is present in an amount from about 3 Å to about 8% of the silver composition, and the acrylated epoxy polymer is present in an amount from about 2% to 4% of the silver composition. . The method further includes the third step of combining with the second composition and mixing the silver powder and the silver flake composition to form a third composition. The silver powder is present in an amount of from about 50% to about 60% of the silver composition, and the silver flake composition is present in an amount of from about 25% to about 35% of the silver composition. The method further includes the fourth step of combining with the third composition and mixing the flow promoter in an amount of from about 0.1% to about 2% by weight of the silver composition. This method is also carried out in a batch mode, for example in a mixing vessel or a series of mixing vessels; in a continuous flow scheme or in some combination. According to still another aspect of the present invention, a method of depositing a silver coating on a substrate is provided. The method comprises a first step of applying a silver-containing fluid phase composition ("silver composition") to the substrate. The silver composition comprises an aliphatic acrylated oligomer wherein the aliphatic acrylated oligomer is present in an amount from about 3% to about 8% of the silver composition. The silver composition further includes a propionated epoxy oligomer. The acrylated epoxy oligomer is present in an amount from about 2% to about 4% of the silver composition. The silver composition also includes a photoinitiator and a content of about 4% to 8% of the silver isotonic acid ester of the silver composition, and the content of the silver composition is about 3〇/〇 to 6〇/〇. A silver-based composition of about 1. 1% to 2〇/〇 of a flow promoter. The silver composition also includes silver in an amount of about 5% to 6% by weight of the silver composition. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 dongdong) 10 (please read the notes on the back and fill in the nest) Page) • Order 1492492 A7 . >_B7_ V. Inventive Note (8) Powder, and a silver flake composition having a content of about 25% to 35% of the silver composition. The method also includes the second step of illuminating the silver composition on the substrate with light suitable for causing the silver composition to solidify into a thin layer of silver coating. A better optical device has a wavelength in the ultraviolet region of the electromagnetic spectrum. According to this method, the silver composition can be selectively deposited on a specific location of the substrate where silver plating is desired. No need to apply to the entire substrate. The silver coating is thus used to form a metallization on a semiconductor wafer, a printed circuit board, a pressure sensitive or pressure activated switch, or the like. According to another aspect of the present invention, there is provided a method of preparing a liquid phase silver-containing composition for providing a silver-containing coating or mineral coating on a substrate. BEST MODE FOR CARRYING OUT THE INVENTION Silver Compositions The presently preferred embodiments of the present invention, or the details of the specific embodiments and methods, which are presently known to the inventors of the present invention, are now described. The best mode. According to one aspect of the invention, a preferred photocurable silver composition ("silver composition") is provided. In a preferred embodiment, the silver composition comprises an aliphatic acrylated oligomer. The aliphatic acrylated oligomer is present in an amount of from about 3% to 8% and preferably about 8% of the silver composition. The aliphatic acrylated oligomer preferably comprises a urethane oligomer. Suitable aliphatic acrylated oligomers include Radcure Ebecryl 244, Ibeqiu 264, and Ibiko 284 urethane, available from Rembrandt, Smyrna, Georgia. UCB Company; Sartomer CN961, CN963, CN964, CN966, CN982 and CN983 are available from Penn (please read the back note first and then fill in this page) This paper scale applies to China National Standard (CNS) A4 size (210X297 mm) 11 1294921 A7 _· ._B7_5, invention description (9) Easton Shattoma Company; TAB FAIRAD 8010, 8179, 8205, 8210, 8216 , 8264, ME-15, UVU-316, available from Talbot Chemical Company of Chicago, Illinois; and Echo resin ALU-303, commercially available from Versailles, Missouri; Genomer 4652, commercially available from Rahn Radiation Curing Company, Ill. Preferred aliphatic acrylated oligomers include Ibeqiu 264 and Ibiko 284. Ibiko 264 is in diacrylic acid. Aliphatic solution of 85% solution of hexanediol ester Formate triacrylate. Ibie 284 is an aliphatic urethane diacrylate diluted with 1,6-hexanediol diacrylate at a molecular weight of 1200. It will be apparent to those skilled in the art that such materials may be employed herein. The preferred silver composition further comprises an acrylated epoxy oligomer. The acrylated epoxy oligomer is present in an amount of from about 2% to about 4%, and preferably about 3%, of the silver composition. Acrylate epoxy oligomers include Reidelbibi 3603, commercially available from Ibizu UCB; Shatoma CN120 and CN124, commercially available from Shatoma; and Aike Resin TME9310 and 9345, market It is available from Aike Resin Co., Ltd. The preferred acrylated epoxy oligomer is Ibiko 3603, which is a trifunctional acrylated epoxy novolac resin. Combinations of these materials can also be used. Preferred silver compositions also include The isobornyl acrylate monomer is present in an amount of from about 4% to about 8% and preferably from about 5% by weight of the silver composition. Suitable isobornyl acrylate monomers include stiletto SR423 IBOMA and SR506 IBOA; , available from Redcoel in the market; IBOA And IBOMA from CPS Chemical Company; and Kenoma 1121, available from Ryan on the market (please read the note on the back and fill out this page) This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 12 1294921 A7 . , _B7_5, invention description (l〇) radiation curing company. Preferred isobornyl acrylate monomers include sasoloma SR423 IBOMA and SR506 IBOA; Reidel IBOA, available from Redcoel; IBOA and IBOMA, available from CPS Chemical Company; and Kenomar 1121 It is available from Ryan Radiation Curing Company. Such preferred silver compositions also include photoinitiators which comprise from about 3% to about 6% of the silver composition and which are considered to be about 4% by weight. Suitable photoinitiators include Irgacure 184 (1-hydroxycyclohexyl phenyl ketone), 907 (2-methyl-1-[4.(methylthio)phenyl]-2-morpholine propyl -1-keto), 369 (2. benzyl-2-indole, indole-dimethylamino-1-(4-morpholinyl)-1-butanone), 500 (1-hydroxycyclohexylphenyl) a combination of ketone and benzophenone), 65 1 (2,2-dimethoxy-2-phenylacetophenone), 1700 (贰(2,6-dimethoxybenzoguanidino)-2, Combination of 4,-trimethylpentylphosphine oxide and 2-hydroxy-2-methyl-1-phenyl-propan-1-one (Ciba Gaki 1700 and Dalhouur (DAROCUR) 1173 (2 -hydroxy-2-mercapto-1-phenyl-1-propane) and 4265 (2,4,6-trimethylbenzimidyldiphenylphosphine oxide and 2-hydroxy-2-methyl-1- a combination of phenyl-propan-1-one) available from Cibajiaji, Terry Town, New York; CYRACURE UVI-6974 (triaryl hexafluorophthalic acid sulfonium mixed salt) and UVI-6990 (triaryl hexafluorophosphate sulfonium sulfonate mixed salt), available from the Danbury Lee Chemical Plastics Co., Ltd. and Genocure CQ, Kenoqi BOK and Kenochu MBF on the market from Ryan Radiation curing company. Better light initiation For Icaqiu 1700, Ciba Kaki, Terry Town, New York State. The preferred silver composition further includes a flow promoter having a content of about 1% to 2% and preferably about 1.0% of the silver composition. Accelerators include Genorad 17, commercially available from Ryan Radiation Curing Co.; and Mo (please read the notes on the back and fill out this page). This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm). 13 1294921 A7 B7 V. Invention Description (η ) "~一' ""~ Da Fu Luo (M〇daflow) is available from St. Louis Monsanto, Missouri. The preferred flow promoter is Modafu. Luo, which is a copolymer of ethyl acetoacetate and 2-ethylhexyl acrylate, which improves the fluidity of the composition and a combination of these materials can also be used here. Fortunately, silver composition also includes The silver composition has a silver powder content of about 5 〇 Q / ❶ and preferably about 52%. The silver powder contains a plurality of particles. In the preferred silver composition, the particle size of the silver powder is in the range of 5 μm to about 5 μm particles. In some embodiments, the silver powder has a particle size of about 4. 7 microns to 149 microns: range. Preferably, the silver powder particles have a particle size distribution wherein about 1% of the particles have a particle size of less than about 4.7 microns, about 50% of the particles have a particle size of less than about 76 microns and about 90% of the particles have a particle size of less than about 14 · 9 microns. The preferred silver powder is silver powder EG-ED and silver powder C-ED, which is available from Degussa, South Plains, New Jersey. Preferably, the silver composition further comprises a silver flake composition comprising from about 25% to about 35%, and preferably about 30%, of the silver composition. The silver flake composition comprises a plurality of flakes. The bracts comprise silver and preferably consist essentially of silver. The silver flake composition according to this embodiment has a particle size ranging from about 5 microns to about 32 microns. More preferred silver flake compositions have a particle size ranging from about 5.5 microns to about 32.0 microns. The silver flake particle size distribution is about 10 Å/〇 particles having a particle size of less than about 5.5 microns, about 50% of the particles having a particle size of less than about 12.5 microns and about 90% of the particles having a particle size of less than about 32 Å. The preferred silver flake composition is silver flake 25, silver flake nickname and silver flake 7 nickname, available from Degussa, South Plains, New Jersey. This paper scale applies to China National Standard (CNS) Α4 specification (210X297 public interest) 14 (Please read the note on the back and fill out this page) Order · 1294921 A7 . B7 V. Invention Description (l2) Example 1 This embodiment A preferred silver composition in accordance with the present invention is provided which can be used to deposit on a substrate, such as a polymeric film surface, for example, as an electrical contact for a pressure sensitive switch. The silver composition is made up of the following components: Group composition approximate mass% Ibiko 264 7.2 Ibiko 3603 2.4 IBOA 4.7 Silver powder EGED 53.4 Silver flakes #25 27.6 Ikachu 1700 3.9 Modafulo 0.8 Total 100.00 This example The IBOA and Ikachu 1700 were mixed in a pan using a paddle mixer at a speed of 500 to 1000 rpm for 30 seconds. Next, Ibush 264, Ibiko 3603, and Modafor were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, EGED silver powder and silver flakes No. 25 were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. The final mixing speed is increased to 10,000 rpm and mixed for another 5 minutes. For best results, the silver powder is washed before being added to the mixture. The washing process includes a first step in which the powder is loaded into a sealable container. A mixture of 17% methyl ethyl fluorenone and 83% silver composition was added to the vessel, and the slurry was mixed using a paddle mixer at 500 rpm for 5 minutes. Pour out the mercaptoethyl ketone and let the silver powder dry. The powder is mixed regularly during the drying phase. 15 (Please read the note on the back and fill out this page.) This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 V. Description of the invention (l3) The silver powder according to the preferred composition contains EGED, It is available from Degussa, New Plains, South Plains, New Jersey. Such silver powder is also available from other commercial sources such as Englehard Chemical Company, Isbrod, New Jersey. Preferably, the silver powder has a particle size distribution in the range of from about 5 microns to 15 microns. Preferably, the silver powder has a particle size distribution as described later. Table 1 Silver powder particle size distribution < 4.7 < 7.6 < 14.9 As indicated in the table, in the silver powder sample, the particle size of 50% of the particles is less than 7·6 μm and the particle size of 9〇% of the particles is j 14.9 μm. . The silver flakes according to the preferred composition of Example 1 contained SF25, which is commercially available from Degussa Corporation. The silver flake composition preferably has a particle size distribution of from about 5 microns to about 32 microns. The particle size distribution is as follows: The particle size of the disc composition is too small (micro mining, percentage < 5 * 5 10% < 12 · 5 50% < 32.0 90% as indicated in Table 2, in silver flakes In the sample, 1%% of the sheet size is smaller than ^^μm, 50% of the sheet has a particle size of less than 125 μm and 9%% of the sheet is less than 3 2.0 μm., percentage 10% 50% 90% 10% of the particles Particle size less than 4 in the face (please read the back of the note before you fill out this page) - set · This paper scale applies to China National Standard (CNS) A4 specifications (21〇χ297 public Chu) 16 1294921 A7 _, '_B7_ five DESCRIPTION OF THE INVENTION (14) Example 2 This embodiment provides another preferred silver composition according to the present invention which can be used for deposition on a substrate such as the foregoing. The silver composition is made up of the following composition: Group composition about 3% by mass Ibiko 264 4.2 Ibiu 3603 2.7 IBOA 7.7 Silver EGED 53.4 Silver Flakes #25 27.6 Ikachu 1700 3.8 Modafor 0.6 Total 100.00 In this example, IBOA and Ikachu 1700 use a paddle mixer in the pan. Mix for 30 seconds at 500 to 1000 rpm. Next, Ibiko 264, Bichon 3603 and Modaforro are introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, EGED silver powder and silver flakes 25 are introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. The speed is increased to 10,000 rpm and mixed for another 5 minutes.Example 3 This example provides another preferred silver composition according to the present invention which can be used for deposition on a substrate surface coated with indium tin oxide (ITO). The composition is made up of the following components: 17 (Please read the notes on the back and fill out this page) This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 . . B7 V. Invention (15) Group composition approximate mass% Ibiko 264 7.0 Ibiu 3603 2.3 IBOA 4.6 Silver EGED 52.3 Silver flakes #25 27.0 Ikachu 1700 3.8 Modaforo 0.8 Ibiu 168 2.2 Total 100.00 (Please read the note on the back first) In addition, in this example, IBOA and Ikaqiu 1700 are mixed in a pan using a paddle mixer at a speed of 500 to 1000 rpm for 30 seconds. Secondly, Ibiko 264, Ibiko 3603 and Modaforro are introduced. Mix in the pan and at 1000 rpm for 1 to 2 minutes. In the next step, EGED silver powder and silver flakes 25 are introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, Ibex 168 is added to the pan and the composition is mixed at 1 rpm for 1 to 2 minutes. The final mixing speed was increased to 1 〇, 〇〇〇 rpm and mixed for 5 minutes. This example contains the addition of Ibeqi 168 as an adhesion promoter. This material is a methyl acetoacetate derivative available on the market from UCB, Inc., Smithdale, Georgia. Silver Composition for Shielding Shielding Electromagnetic Interference According to another aspect of the present invention, a preferred photocurable silver composition ("silver composition") is provided. Such a composition produces a coating that shields electromagnetic interference when cured by light. This coating can be applied to the need to shield from electromagnetic interference. 18 Paper scale applicable to China National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 B7 V. Inventive Note (I6) Substrate, for example inside the radio casing. In a preferred embodiment, the silver composition comprises an acrylated epoxy oligomer. The acrylated epoxy polymer is present in the lanthanide in an amount of from about 2% to about 8%, preferably about 5%, of the silver composition. Suitable acrylated epoxy oligomers are the same as the acrylated epoxy oligomers listed above. The preferred acrylated epoxy oligomer is Ibeqiu 36〇3 which is a trifunctional acrylated epoxy novolac resin. Combinations of these materials can also be used herein. Preferably, the silver composition also comprises from about 15% to about 3%, and preferably about 21%, by weight of the silver composition of the isobornyl acrylate monomer. Suitable isobornyl acrylate monomers are listed above. Preferred isobornyl acrylate monomers include sasoloma SR423 IBOMA and SR506 IBOA; Redcoil IB0A, available from Redcoel; IBOA and IBOMA, available from CPS Chemical Company, and Kenomar 1121 It is available from Ryan Radiation Curing Company. Combinations of these materials can also be used here. Such preferred silver compositions also include photoinitiators which comprise from about 3% to about 7% and preferably from about 5% by weight of the silver composition. Suitable photoinitiators are listed above. A better photoinitiator is the Ikachu 1700, which is available from Ciba Jiaji, Terry Town, New York. Combinations of such materials may also be employed herein. The preferred silver composition further comprises a flow promoter in an amount of from about 0.1% to about 2%, and preferably from about 1% to about 5% by weight of the silver composition. Suitable flow promoters are the same as those listed above. A preferred flow promoter is modaforo, which is a copolymer of ethyl acrylate and 2-ethylhexyl acrylate which improves the flow of the composition. A combination of these materials is also used here. Preferably, the silver composition also comprises silver powder in an amount of from about 25% to about 4%, and preferably about 36%, of the silver composition. The preferred silver powder is silver powder eg-ED and silver powder C-ED. The paper size is applicable to Chinese national standard (〇jS) A4 specification (210X297 mm) (please read the note on the back and fill out this page) ., τ. 1294921 A7 . . B7 V. INSTRUCTIONS (I7) Available from Degussa, South Plains, New Jersey. Preferably, the silver composition further comprises a silver flake composition comprising from about 25% to about 40%, and preferably about 30%, of the silver composition. The silver flake composition was silver flakes No. 25, silver flakes No. 1, and silver flakes No. 7A, and was obtained from Degussa, Nanping, New Jersey. EXAMPLE 4 This example provides a preferred silver composition in accordance with the present invention which, when applied to a surface and subsequently cured by ultraviolet radiation, will result in a coating suitable for shielding electromagnetic interference. The silver composition is made up of the following components: Group composition about mass% Ibiko 3603 5.3 IBOA 21.0 Silver powder EGED 31.5 Silver flakes #1 35.7 Ikachu 1700 5.3 Modafor 1.2 Total 100.00 In this example, IBOA and The Ikachu 1700 was mixed in a pan at a speed of 500 to 1000 rpm for 30 seconds using a paddle mixer. Next, Ibiko 3603 and Modafulo were introduced into the pan and mixed at 5000 rpm for 5 minutes. In the next step, EGED silver powder and silver flakes No. 1 were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. The final mixing speed is increased to 10,000 rpm and mixed for another 5 to 10 minutes. 20 (Please read the notes on the back and fill out this page.) This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 B7 V. Invention Description (l8 Brain manufacturing resistance link composition according to this fish In a further aspect, a preferred photocurable silver composition ("silver composition") is provided. Such a composition produces a coating that produces a resistive link on the circuit board when lighted. This preferred embodiment The silver composition comprises an acrylated epoxy oligomer. The acrylated epoxy oligomer is present in an amount of from about 16% to 20% and preferably about 18% of the silver composition. Suitable acrylated epoxy concentrating The acrylated epoxy oligomers exemplified above are preferred. The preferred acrylated oxy-oligomer is Ibeqi 3603 which is a trifunctional acrylated epoxy novolac resin. Combinations of these materials can also be used herein. Preferably, the silver composition also comprises an isobornyl acrylate monomer in an amount of from about 8% to 14%, and preferably about 11 Å/Å, based on the silver composition. Suitable isobornyl acrylate monomers are as listed above. Preferred isopropyl isobornyl acrylate Ester monomers include Saudi Arabia SR423 IBO MA and SR506 IBOA; Reidel IB〇A, available from Redcoel in the market; IBOA and IBOMA, available from CPS Chemical Company; and Kenomar 1121, available from Ryan Radiation Curing Company. Combinations of such materials may also be used. Such preferred silver compositions also include photoinitiators in an amount of from about 4% to about 8%, preferably from about 6%, of the silver composition. Suitable photoinitiators are as set forth above. A preferred photoinitiator is Ikachu 1700, commercially available from Cibajiaji, Terry Town, New York. A combination of such materials may also be used herein. Preferred silver compositions further include a silver content component.约〇. i% to 2% and preferably about 1.7% of the flow promoter. Suitable flow promoters are the same as those listed above. The preferred flow promoter is modaforo, which is acetonitrile. 2-ethylhexyl acrylate copolymer, which improves the flow of the composition. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 21 (Please read the back note and fill out this page) -, 可 | 1294921 A7 ----- B7_ V. Invention description (l9) A combination of materials. The preferred silver composition also includes silver powder in an amount of from about 25% to about 35%, preferably about 30%, of the silver composition. The preferred silver powder is silver powder, eg_ed and silver powder, available from the South Plains of New Jersey. Degussa Corporation. The preferred silver composition further comprises from about 25% to 38% of the silver composition and preferably, the scoop 34/〇 silver-containing flake composition. The silver flake composition is silver flakes 25 唬, Silver Flake No. 1 and Silver Flake No. 7 No. 8 are commercially available from Degussa Corporation of South Plains, New Jersey. For purposes of illustration, the following examples illustrate preferred silver compositions in accordance with this aspect of the invention. . EXAMPLE 5 This example provides a preferred silver composition in accordance with the present invention which, when applied to a surface and cured by a beam, will provide a coating suitable for use in the fabrication of resistive links on printed circuit boards. . The silver composition is made up of the following components: _ composition is about 5% by mass. Ibiko 3603 18.3 IBOA 11.1 Silver EGED 30.0 Silver Flake #1 33.5 Ikachu 1700 6.1 Modafor 1.0 Total 100.00 This paper scale applies to China Standard (CNS) ΜSpecifications (210X297 public Chu) 22 (Please read the notes on the back and fill the nest page) Order 1492492 A7, * B7 V. Invention Description (2〇) In this embodiment, IBOA and Ika The mound 1700 was mixed in a pan at a speed of 500 to 1000 rpm for 30 seconds using a paddle mixer. Next, Ibiko 3603 and Modafulo were introduced into the pan and mixed at 5000 rpm for 5 minutes. In the next step, EGED silver powder and silver flakes No. 1 were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. The final mixing speed is increased to 10,000 rpm and mixed for another 5 to 10 minutes. Amino-based phthalate-containing silver composition for use in the manufacture of a resistive link. According to another aspect of the invention, a preferred photocurable silver composition ("silver composition") is provided. Such compositions, when cured by light, produce a coating that creates a resistive link on the board. In a preferred embodiment, the silver composition comprises an aliphatic acrylated oligomer. The aliphatic acrylated oligomer is present in an amount of from about 7% to 11% and preferably about 9% of the silver composition. The aliphatic acrylated polymer preferably comprises an urethane oligomer. Suitable aliphatic acrylated oligomers are listed above. Preferred aliphatic acrylated oligomers include Ibie 264 and Ibie 284. Ibici 264 is an aliphatic urethane triacrylate supplied as an 85% solution of hexanediol diacrylate. Ibie 284 is an aliphatic urethane diacrylate having a molecular weight of 1200 diluted with 1,6-hexanediol ethacrylate. Combinations of these materials can also be used. The preferred silver composition further comprises a acetoylated epoxy oligomer. The content of the propionate epoxy oligomer is about 1 ° / of the silver composition. To 4% and preferably about 3% of the propidylated epoxy oligomer. Suitable propionate epoxy oligos are listed above. A preferred acrylated epoxy oligomer is Ibic Hills 3603 which is a trifunctional acrylated epoxy S acid varnish resin. Combinations of these materials can also be used herein. The preferred silver composition also includes about 12% to 25% of the silver composition and 23 (please read the back of this page and then fill out this page). This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm). 1294921 A7 B7 V. INSTRUCTIONS (21) (Please read the note on the back and fill out this page.) It is better to use about 22% isobornyl acrylate monomer. Preferred isobornyl acrylate monomer includes Satyr SR423 IBOMA And SR506 IBOA; Redcoil IBOA, available from Redcoel in the market; IBOA and IBOMA, available from CPS Chemical Company; and Kenomar 1121, available from Ryan Radiation Curing Company. A combination of such materials is used. Such preferred silver compositions also include photoinitiators which comprise from about 2% to about 4%, and preferably about 3%, of the silver composition. Suitable photoinitiators are as listed above. The initiator is Ikachu 1700, which is available on the market from Cibajiaji, Terry Town, New York. A combination of these materials can also be used here. - A preferred silver composition is included in the silver composition. % to 19% and preferably about 17% of tin oxide powder. Tin oxide powder Minatec 40, commercially available from Hawthorne EM Industries, New York. The preferred silver composition further comprises a flow of from about 4% and preferably about 2.0% of the silver composition. Promoter. Suitable flow promoters are the same as those listed above. The preferred flow promoter is modaforo, which is a copolymer of ethyl acrylate and 2-ethylhexyl acrylate which improves the flow of the composition. A combination of such materials is also employed. Preferred silver compositions also include silver powders having a silver content of from about 24% to about 30%, preferably about 27%. Preferred silver powders are silver powder eg-ED and silver powder C-ED, commercially available. It is available from Degussa, South Plains, New Jersey. The preferred silver composition further comprises a silver flake composition comprising from about 15% to about 3%, and preferably about 17%, of the silver composition. It is Silver Flake No. 25, Silver Flake No. 1 and Silver Flake No. 7 A. It is available from Degussa, South Plains, New Jersey.
24 1294921 A7 • B7 五、發明説明（22) 實施例6 本實施例提供根據本發明之較佳銀組成物，其當施用 於表面且隨後藉紫外輻射固化時，將獲得適合用於印刷電 路板上製造電阻鏈路之塗層。銀組成物係由下列組成分製 成： 組成分 約略質量％ 依比丘264 8.7 依比丘3603 2.9 IBOA 22.4 銀薄片#7A 17.0 銀粉CED 26.5 米那太克40 17.2 伊卡丘1700 3.3 莫達福羅 2.0 總量 100.00 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘264、依 比丘3603及莫達福羅引進盤内及以1000 rpm速度混合1至2 分鐘。於次一步驟，CED銀粉、米那太克40及銀薄片7A號 引進盤内，且於1 〇〇〇 rpm速度混合1至2分鐘。最後混合速 度提高至l〇,〇〇〇rpm及又混合5分鐘。 實施例7 本實施例提供根據本發明之較佳銀組成物，其當施用 於表面且隨後藉紫外輻射固化時，將獲得適合用於印刷電 路板上製造電阻鏈路之塗層。銀組成物係由下列組成分製 成： 25 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 B7 五、發明説明（23 ) 組成分 約略質量％ 依比丘284 8.4 依比丘3603 1.7 依比丘754 8.4 IBOA 15.7 銀粉CED 25.0 銀薄片#7A 28.5 伊卡丘1700 2.5 米那太克40 9.8 總量 100.00 (請先閲讀背面之注意事項再填寫本頁) 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘754、依 比丘284、依比丘3603及莫達福羅引進盤内及以1000 rpm 速度混合1至2分鐘。於次一步驟，CED銀粉及銀薄片7A號 引進盤内，且於1000 rpm速度混合1至2分鐘。最後混合速 度提高至l〇,〇〇〇rpm及又混合5分鐘。 本實施例含有依比丘754作為添加劑。依比丘754為聚 丙烯酸寡聚物/丙烯酸酯單體攙合物，市面上得自喬治亞州 史密那瑞德可爾UCB公司。 用於製造電阻鏈路之黑色銀組成物 根據本發明之另一方面，提供較佳光可固化銀組成物 (「銀組成物」）。此種組成物於光固化時產生可於電路板 產生電阻鏈路之深色塗層。本較佳具體實施例中，銀組成 物包括脂肪族丙烯酸化寡聚物。脂肪族丙烯酸化寡聚物之 存在量係占銀組成物之約7%至11 %且較好约9%。脂肪族丙 26 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 青 .__—_B7_ 五、發明説明（24 ) 稀酸化寡聚物較好包含胺甲酸酯募聚物。適當脂肪族丙烯 酸化寡聚物係同前文列舉。較佳脂肪族丙烯酸化寡聚物包 括依比丘264及依比丘284。依比丘264為呈於二丙烯酸己二 醇S旨之85%溶液形式供應之脂肪族胺甲酸酯三丙烯酸酯。 依比丘284為乙二丙烯酸ι，6-己二醇酯稀釋之分子量1200 之脂肪族胺甲酸酯二丙烯酸酯。也可使用此等材料的組合。 本較佳銀組成物又包括丙烯酸化環氧募聚物。丙烯酸 化環氧寡聚物含量占銀組成物約2%至4%且較好約3%之丙 烯酸化環氧募聚物。適當丙烯酸化環氧寡聚物同前文列 舉。較佳丙烯酸化環氧寡聚物為依比丘3603其為三官能丙 烯酸化環氧酚醛清漆樹脂。 較佳銀組成物也包括含量占銀組成物約1 〇%至丨4%且 較好約12%之丙烯酸異冰片酯單體。較佳丙烯酸異冰片酯 單體包括沙妥馬SR423 IBOMA及SR506 IBOA;瑞德可爾 IBOA ’市面上得自瑞德可爾公司；ib〇a&ib〇ma，市面 上得自CPS化學公司；及基諾瑪1121，市面上得自萊恩輻 射固化公司。 此種較佳銀組成物也包括占銀組成物約13%至15 %及 較好約14%含量之光引發劑。較佳光引發劑為伊卡丘 Π00，市面上得自紐約州泰瑞鎮汽巴嘉基公司。 較佳銀組成物又包括數量占銀組成物5%至12%且較 好約7%之碳黑粉末。較佳碳黑粉末為噴太斯（printex)L市 面上得自紐約州霍桑EM工業公司。 較佳銀組成物也包括含量占銀組成物〇·5%至3%且較 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公爱） 27 (請先閲讀背面之注意事項再填寫本頁) 、τ 1294921 A7 ------：____B7 ___ 五、發明説明（25) 好約l.5%之濕潤劑。較佳濕潤劑為BYK 207L，市面上得自 康乃迪克州沃靈佛Byk·化學公司。 較佳銀組成物更進一步包括含量占銀組成物約〇1% 至2%且較好約ι·〇%之流動促進劑。較佳流動促進劑為莫達 福羅，其為丙烯酸乙酯與丙烯酸2_乙基己酯共聚物，其可 改良組成物之流動。熟諳技藝人士顯然易知此處也可使用 此專材料之組合。 較佳銀組成物也包括占銀組成物約3至且較好 約36%含量之銀粉。較佳銀粉為銀粉EG-ED及銀粉C-ED， 市面上得自紐澤西州南平原市德古莎公司。 較佳銀組成物又包括占銀組成物約15%至25%且較好 約18%含量之銀薄片組成物。銀薄片組成物為銀薄片25 號、銀薄片1號及銀薄片7 A號，市面上得自紐澤西州南平 原市德古莎公司。 實施例8 本貫施例提供根據本發明之較佳銀組成物，其當施用 於表面且隨後藉紫外輻射固化時，將獲得適合用於印刷電 路板上製造黑色電阻鏈路之塗層。銀組成物係由下列組成 分製成·· 28 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 B7 五、發明説明（26 ) 組成分 約略質量％ 依比丘264 8.8 依比丘3603 2.5 喷太斯L 7.3 Byk 207 1.5 IBOA 11.6 銀粉EGED 35.7 銀薄片#25 18.4 伊卡丘1700 13.5 莫達福羅 0.7 總量 100.00 (請先閲讀背面之注意事項再填寫本頁) 本實施例中，IBOA及伊卡丘1700於盤内使用槳葉混合 機於500至1000 rpm速度混合30秒。其次將依比丘264、依 比丘3603及莫達福羅引進盤内及以1000 rpm速度混合1至2 分鐘。於次一步驟，EGED銀粉、銀薄片#25及喷太斯L引 進盤内，且於1000 rpm速度混合1至2分鐘。最後導入BYK 207以及以10,000 rpm速度混合5分鐘。 此等實施例及說明中，敘述各種組成分時，組成物被 描述為「包含」所述組成分。較好各別組成物實質上且更 好排它地係由所述組成分且由所述來源組成。 前述含銀組成物被稱作「流體相」組成物。表示組成 物如同液體般可流動，但非限制性。較好銀組成物包含液 體。組成物通常為漿液，其中銀金屬顆粒（粉末及薄片）為 固相粒子懸浮於胺甲酸酯、環氧樹脂以及任何其它液體或 實質為液體組成分之液相。 29 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 A7 __—------ B7 _ 五、發明説明（27) 製備銀組成物 根據本务明之另一方面，提供一種製造光可固化銀組 成物之方法根據較佳版本，該方法包括第一步驟，組合 及此合丙烯酸異冰片酯單體及光引發劑而形成第一混合 物族丙稀酉文異冰片酯單體之存在量係占銀組成物之約4% 至8 /〇光引备劑之存在量係占銀組成物之約4〇/〇至6〇/〇。 車乂佳包括較好但視情況需要係使用依據期望批次大小 的適當尺寸之混合容器進行。具有已知設計且市面上可購 得之玻璃或鋼内襯批次處理容器典型即足。 較佳方法之第一步驟係將各組成分於攪拌中例如藉適 當槳葉攪拌中置於容器内。 该方法包括第二步驟，組合及混合脂肪族丙烯酸化募 聚物及丙烯酸化環氧募聚物而形成第二混合物。脂肪族丙 烯酸化寡聚物之存在量係占銀組成物之約3%至8%，丙烯 酸化環氧养聚物之存在量係占銀組成物之約2%至4%。根 據本較佳方法，第二步驟係於第一步驟之後循序進行，且 涉及將此等組成分攙混於第一混合物，亦即來自第一步驟 之第一混合物。 該方法又包含第三步驟，組合及混合銀粉及銀薄片組 成物而形成第三混合物。銀粉之存在量係占銀組成物之約 50%至60%，銀薄片組成物之存在量係占銀組成物之約25% 至35%。此步驟較好係於容器且較佳於第二步驟完成後循 序進行。 该方法又包括第四步驟，組合及混合含量占銀組成物 30 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 1294921 , A7 發明説明（28)~^ 、約㈣至2%之流動促進劑；以及第五步驟，組合第—、第 二、第三及第四混合物而形成銀組成物。 、&等步驟也較好經由使賴葉混合當中將所述組成分 添加至容器而循序進行。 如所述，較佳但視情況需要地，第一、第二、第三及 帛四步驟循序進行。但非限制性。根據該方法可使用不同 處理順序。 又如‘述，该方法之各種形式可以分批方式進行，例 如於適當容器或適合分批處理之類似處理設備進行。也可 ^ 匕幵y式如連“流方案進行，例如使用已知之連續流處 S設備以及用於混合此等組成分之配置組態，較佳但視情 況需要係以前文界定的循序順序進行。 根據本發明之另一方面，提供另一種製造紫外光可固 化銀組成物之方法。此種方法包含第一步驟，組合且混合 丙烯酸異冰片酯單體及光引發劑而形成第一組成物，其中 該丙烯酸異冰片酯單體之存在量係占銀組成物之約4%至 8%，光引發劑之存在量係占銀組成物之約3%至6%。此種 方法也包括第一步驟，與第一組成物組合，且混合脂肪族 丙烯酸化寡聚物及丙烯酸化環氧募聚物而形成第二混合 物。脂肪族丙婦酸化寡聚物之存在量係占銀組成物之約3〇/〇 至8%’丙烯酸化環氧寡聚物之存在量係占銀組成物之約 2%至 4%。 该方法又包含第三步驟，與第二組成物組合，且混合 銀粉及銀薄片組成物而形成第三組成物。銀粉之存在量係 -—— ---— _______|_ 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公楚） -31 - (請先閲讀背面之注意事項再填寫本頁)24 1294921 A7 • B7 V. INSTRUCTIONS (22) EXAMPLE 6 This example provides a preferred silver composition according to the present invention which, when applied to a surface and subsequently cured by ultraviolet radiation, will be suitable for use in printed circuit boards. A coating of the resistive link is fabricated. The silver composition is made up of the following components: Group composition approx. mass% Ibiko 264 8.7 Ibiko 3603 2.9 IBOA 22.4 Silver flakes #7A 17.0 Silver powder CED 26.5 Minatec 40 17.2 Ikachu 1700 3.3 Modaforro 2.0 Total 100.00 In this example, IBOA and Ikachu 1700 were mixed in a pan at a speed of 500 to 1000 rpm for 30 seconds using a paddle mixer. Next, Ibush 264, Ibiko 3603, and Modafor were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, CED Silver Powder, Minatec 40 and Silver Sheet 7A were introduced into the pan and mixed at 1 rpm for 1 to 2 minutes. The final mixing speed was increased to l〇, 〇〇〇rpm and mixed for another 5 minutes. EXAMPLE 7 This example provides a preferred silver composition in accordance with the present invention which, when applied to a surface and subsequently cured by ultraviolet radiation, will result in a coating suitable for use in the fabrication of resistive links on printed circuit boards. The silver composition is made up of the following components: 25 (Please read the note on the back and fill out this page) This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 B7 V. Description of invention ( 23) Group composition approximate mass% Ibiko 284 8.4 Ibiko 3603 1.7 Ibiko 754 8.4 IBOA 15.7 Silver CED 25.0 Silver flakes #7A 28.5 Ikachu 1700 2.5 Minatak 40 9.8 Total 100.00 (Please read the back note first Matters refilling this page) In this example, IBOA and Ikachu 1700 were mixed in a pan at a speed of 500 to 1000 rpm for 30 seconds using a paddle mixer. Next, Ibush 754, Ibiko 284, Ibie 3603, and Modafor were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, CED silver powder and silver foil No. 7A were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. The final mixing speed was increased to l〇, 〇〇〇rpm and mixed for another 5 minutes. This example contains Ibie 754 as an additive. Ibiya 754 is a polyacrylic acid oligomer/acrylate monomer conjugate available commercially from UCB, Smitherick, Georgia. Black Silver Composition for Fabricating a Resistive Link According to another aspect of the present invention, a preferred photocurable silver composition ("silver composition") is provided. Such compositions, when cured by light, produce a dark coating that creates a resistive link on the board. In a preferred embodiment, the silver composition comprises an aliphatic acrylated oligomer. The aliphatic acrylated oligomer is present in an amount of from about 7% to 11% and preferably about 9% of the silver composition. Aliphatic C. This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 cyan.____B7_ V. Description of invention (24) Dilute acidified oligomer preferably contains carbamate polymer . Suitable aliphatic acrylated oligomers are listed above. Preferred aliphatic acrylated oligomers include Ibie 264 and Ibie 284. Ibbic 264 is an aliphatic urethane triacrylate supplied as an 85% solution in the form of hexanediol diacrylate. Ibice 284 is an aliphatic urethane diacrylate having a molecular weight of 1200 diluted with ethane 6-hexanediol. Combinations of these materials can also be used. The preferred silver composition further includes an acrylated epoxy polymer. The acrylated epoxy oligomer has an acrylated epoxy oligopolymer content of from about 2% to about 4%, and preferably about 3%, by weight of the silver composition. Suitable acrylated epoxy oligomers are listed above. A preferred acrylated epoxy oligomer is Ibic Hills 3603 which is a trifunctional acrylated epoxy novolac resin. Preferably, the silver composition also includes an isobornyl acrylate monomer in an amount of from about 1% to about 4%, and preferably about 12%, of the silver composition. Preferred isobornyl acrylate monomers include sasoloma SR423 IBOMA and SR506 IBOA; Reidel IBOA' is commercially available from Redcoel; ib〇a & ib〇ma, commercially available from CPS Chemical; And Kenoma 1121, available from the Ryan Radiation Curing Company. Such preferred silver compositions also include photoinitiators which comprise from about 13% to about 15%, and preferably about 14%, of the silver composition. A preferred photoinitiator is Ikachu Π00, available from Cibajiaji, Terry Town, New York. Preferably, the silver composition further comprises a carbon black powder in an amount of from 5% to 12% and preferably about 7% by weight of the silver composition. A preferred carbon black powder is commercially available from Hawthorne EM Industries, New York, USA. The preferred silver composition also includes the content of the silver composition 〇·5% to 3% and is applicable to the Chinese National Standard (CNS) Α4 specification (210X297 public interest) 27 (Please read the notes on the back and fill in the form) Page), τ 1294921 A7 ------: ____B7 ___ V. Description of invention (25) Approximately 5% of the humectant. The preferred wetting agent is BYK 207L, available from Byk Chemical Company of Warringh, Connecticut. The preferred silver composition further comprises a flow promoter in an amount of from about 1% to about 2%, and preferably from about 1% to about 5% by weight of the silver composition. A preferred flow promoter is modaforo, which is a copolymer of ethyl acrylate and 2-ethylhexyl acrylate which improves the flow of the composition. It is obvious to those skilled in the art that this combination of materials can also be used here. Preferably, the silver composition also comprises silver powder in an amount of from about 3 to about 30%, preferably about 36%, of the silver composition. The preferred silver powder is silver powder EG-ED and silver powder C-ED, which is available from Degussa, South Plains, New Jersey. Preferably, the silver composition further comprises a silver flake composition comprising from about 15% to about 25%, and preferably about 18%, of the silver composition. The silver flake composition was silver flakes No. 25, silver flakes No. 1, and silver flakes No. 7 A, and was obtained from Degussa, Nanping, New Jersey. EXAMPLE 8 This example provides a preferred silver composition in accordance with the present invention which, when applied to a surface and subsequently cured by ultraviolet radiation, will result in a coating suitable for use in the manufacture of a black resistive link on a printed circuit board. The silver composition is made up of the following components. · 28 (Please read the notes on the back and fill out this page.) The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 B7 V. Description of the invention (26) Group composition approximate mass% Ibiko 264 8.8 Ibiko 3603 2.5 Pharmacy L 7.3 Byk 207 1.5 IBOA 11.6 Silver EGED 35.7 Silver flakes #25 18.4 Ikachu 1700 13.5 Modaforo 0.7 Total 100.00 (please Read the notes on the back page and fill out this page. In this example, IBOA and Ikachu 1700 were mixed in a pan at a speed of 500 to 1000 rpm for 30 seconds using a paddle mixer. Next, Ibush 264, Ibiko 3603, and Modafor were introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. In the next step, EGED silver powder, silver flakes #25 and sprays L are introduced into the pan and mixed at 1000 rpm for 1 to 2 minutes. Finally, BYK 207 was introduced and mixed at 10,000 rpm for 5 minutes. In the examples and descriptions, when various components are described, the composition is described as "comprising" the component. Preferably, the individual compositions are substantially and more preferably exclusively composed of the constituents and comprised of the source. The silver-containing composition is referred to as a "fluid phase" composition. Indicates that the composition is fluid as liquid, but not limiting. Preferably, the silver composition comprises a liquid. The composition is usually a slurry in which silver metal particles (powder and flakes) are solid phase particles suspended in a urethane, an epoxy resin, and any other liquid or substantially liquid component. 29 The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 A7 __------- B7 _ V. Description of invention (27) Preparation of silver composition According to another aspect of the present invention, A method of producing a photocurable silver composition according to a preferred version, the method comprising the first step of combining the isobornyl acrylate monomer and a photoinitiator to form a first mixture of acesulfame isobornyl esters The body is present in an amount of from about 4% to about 85% of the silver composition, and is present in an amount of from about 4 〇/〇 to about 6 〇/〇 of the silver composition. Che Yujia includes better, but depending on the situation, it is necessary to use a mixing container of the appropriate size according to the desired batch size. Glass or steel lined batch processing vessels of known design and commercially available are typically sufficient. The first step of the preferred method is to separate the components in a vessel, for example by suitable paddle agitation. The method includes a second step of combining and mixing an aliphatic acrylated polymer and an acrylated epoxy polymer to form a second mixture. The aliphatic acrylated oligomer is present in an amount of from about 3% to 8% of the silver composition and the acrylated epoxide polymer is present in an amount from about 2% to about 4% of the silver composition. According to the preferred method, the second step is carried out sequentially after the first step and involves mixing the components into the first mixture, i.e. from the first mixture of the first step. The method further includes a third step of combining and mixing the silver powder and the silver flake composition to form a third mixture. The silver powder is present in an amount of from about 50% to about 60% of the silver composition, and the silver flake composition is present in an amount of from about 25% to about 35% of the silver composition. This step is preferably attached to the container and is preferably carried out sequentially after completion of the second step. The method further includes a fourth step of combining and mixing the silver composition 30 (please read the back note first and then fill out this page). The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1294921 , A7 The invention discloses (28)~^, about (four) to 2% of a flow promoter; and a fifth step of combining the first, second, third and fourth mixtures to form a silver composition. The steps of &, etc. are also preferably carried out sequentially by adding the components to the container during the mixing of the leaves. As mentioned, preferably, but as the case may be, the first, second, third and fourth steps are performed sequentially. But not limited. Different processing sequences can be used according to this method. As further described, the various forms of the method can be carried out in a batch manner, such as in a suitable container or similar processing equipment suitable for batch processing. It can also be carried out in the form of a flow scheme, for example using a known continuous flow S device and a configuration configuration for mixing such components, preferably but as the case may require a sequential order as previously defined. According to another aspect of the present invention, there is provided another method of producing an ultraviolet curable silver composition. The method comprises the first step of combining and mixing an isobornyl acrylate monomer and a photoinitiator to form a first composition. Wherein the isobornyl acrylate monomer is present in an amount from about 4% to about 8% of the silver composition and the photoinitiator is present in an amount from about 3% to 6% of the silver composition. The method also includes In one step, in combination with the first composition, and mixing the aliphatic acrylated oligomer and the acrylated epoxy polymer to form a second mixture. The aliphatic acylate oligomer is present in the silver composition. About 3 〇 / 〇 to 8% ' acrylated epoxy oligomer is present in an amount of about 2% to 4% of the silver composition. The method further comprises a third step, combined with the second composition, and mixed with silver powder And a silver foil composition to form a third group Department was present in an amount of silver --- ---- _______ |. _ This paper scales applicable Chinese National Standard (CNS) A4 size (210X297 public Chu) -31 - (Please read the Notes on the back to fill out this page)
1294921 A7 I * I—_ _ B7 _ 五、發明説明（29) 纟銀組成物之約5〇%至6()%，銀薄片組成物之存在量係占 銀組成物之約25°/。至35%。 該方法又包括第四步驟，與第三組成物組合，且混合 含量占銀組成物之約〇.1%至2%之流動促進劑。 減本發明之另-方面，提供—種製備液相含銀組成 物用以獲得含銀塗層、鍍覆、薄膜或層於基板上之方法。 财法之目前較佳版本包括製備如前述各實施制示較佳 銀組成物。此種方法之較佳版本包括組合且混合單體及光 引發劑於混合容H之第_步驟。該方法包括於混合容器内 添加胺甲酸酯及環氧樹脂，且攙混入先前添加之各組成分 之第二步驟。該方法也包括將銀粉及銀薄片添加至混合容 | 為，以及攙混入容器内所含之組成分之第三步驟。該較佳 方法又包括將流動促進劑添加至混合容器，以及攙混入先 剷已經添加之組成分内之第四步驟。 远積銀塗層於基板之方法 根據本發明之又另一方面，提供一種沉積銀塗層於基 板之方法。該方法包含施用含銀流體相組成物（「銀組成物」) 至基板之第一步驟。前述各銀組成物適合施用至基板。 較佳具體實施例中，施用至基板之銀組成物包含脂肪 族丙烯酸化寡聚物，脂肪族丙烯酸化寡聚物之存在量係占 銀組成物之約3%至8% ;丙烯酸化環氧募聚物，丙烯酸化 環氧寡聚物之存在量係占銀組成物之約2%至4% ;存在量 係占銀組成物之約4%至8%之丙烯酸異冰片酯單體；存在 里係占銀組成物之約3 %至6 %之光引發劑；存在量係占銀 ___ 本紙張尺度適用中國國家標準（CNS) A4規格（21〇><297公^ 7 32 - (請先閲讀背面之注意事項再填寫本頁)1294921 A7 I * I__ _ B7 _ V. OBJECT DESCRIPTION OF THE INVENTION (29) About 5% to 6% of the silver composition is present, and the silver flake composition is present in an amount of about 25°/min of the silver composition. Up to 35%. The method further includes a fourth step of combining with the third composition and mixing the flow promoter in an amount of from about 0.1% to about 2% of the silver composition. In a further aspect of the invention, there is provided a method of preparing a liquid phase silver-containing composition for obtaining a silver-containing coating, plating, film or layer on a substrate. The current preferred version of the financial process involves the preparation of a preferred silver composition as described in the foregoing embodiments. A preferred version of such a process comprises the step of combining and mixing the monomer and photoinitiator in a mixed volume H. The method comprises the steps of adding a urethane and an epoxy resin to the mixing vessel and mixing the components of the previously added components. The method also includes the step of adding the silver powder and the silver flakes to the mixing volume, and the third step of mixing the components contained in the container. The preferred method further includes the step of adding a flow promoter to the mixing vessel and mixing the crucible into the component to which the first shovel has been added. Method of Coating Silver on a Substrate According to still another aspect of the present invention, a method of depositing a silver coating on a substrate is provided. The method comprises a first step of applying a silver-containing fluid phase composition ("silver composition") to a substrate. Each of the foregoing silver compositions is suitable for application to a substrate. In a preferred embodiment, the silver composition applied to the substrate comprises an aliphatic acrylated oligomer, and the aliphatic acrylated oligomer is present in an amount of from about 3% to 8% of the silver composition; acrylated epoxy The polymerized, acrylated epoxy oligomer is present in an amount from about 2% to about 4% by weight of the silver composition; and is present in an amount from about 4% to about 8% by weight of the silver composition of the isobornyl acrylate monomer; The photoinitiator is about 3% to 6% of the silver composition; the amount is in the silver ___ This paper scale applies to the Chinese National Standard (CNS) A4 specification (21〇><297 public^ 7 32 - (Please read the notes on the back and fill out this page)
1294921 A7 1 .__B7 _ 五、發明説明（3〇) 組成物之約0.1 %至2%之流動促進劑；存在量係占銀組成物 之約50%至60%之銀粉；以及存在量係占銀組成物之約25% 至3 5 %之銀薄片組成物。根據本方法之較佳銀組成物係如 此處所述，例如包括實施例所述組成物。 銀組成物可使用多種不同技術施用至基板。銀組成物 例如可措直接刷塗施用或可喷塗至基板表面施用。也可使 用網版印刷技術施用。此種網版印刷技術中，「網版」一詞 於網版印刷產業用於調整液體組成物流動至基板表面。銀 組成物典型係於網版接觸基板時施用至網版。銀組成物流 經絲網至基板，此時附著於基板期望薄膜厚度。適合用於 此項目的之網版印刷技術包括已知技術，但該方法係以熟 諳技藝人士已知方式調整俾配合液相組成物之黏度、流動 性及其它性質、基板及基板表面性質等。也可使用膠版技 術，例如使用夾緊滾軸讓銀組成物接觸捲動中的基板。 該方法也包括第二步驟，使用紫外光照射基板上之含 銀流體相組成物，俾造成含銀流體相組成物固化成為銀塗 層。此種照射可以任一種方式進行，紫外光或紫外輻射撞 擊銀組成物，讓銀組成物聚合而形成塗層、層、薄膜等， 藉此固化銀組成物。如此形成之塗層具有電阻率於丨密耳為 0.03至0·50歐姆/平方。 固化較好係藉自由基聚合反應進行，該反應係由紫外 輻射來源所引起。光引發劑較好包含前述光引發劑。 依據用途而定可使用多種紫外光源。用於多項應用用 途之較佳紫外輻射源包括能量強度設定為每平方吋125 33 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公复） 1294921 A7 • B7 五、發明説明（30 瓦、200瓦及300瓦之已知紫外光發光設備。 其它優點及修改對熟諳技藝人士顯然易知。故本發明 之較廣義方面非限於所示及所述特定細節、代表性裝置及 舉例說明之實施例。如此可未悖離本發明概略構想之精髓 或範圍對此等細節做出修改及變化。 34 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐）1294921 A7 1 .__B7 _ V. Description of the invention (3〇) A flow promoter of about 0.1% to 2% of the composition; a silver powder present in an amount of about 50% to 60% of the silver composition; A silver flake composition of about 25% to 35% of the silver composition. Preferred silver compositions according to the present method are as described herein, for example, including the compositions described in the examples. The silver composition can be applied to the substrate using a variety of different techniques. The silver composition can be applied, for example, by direct brush application or sprayable to the surface of the substrate. It can also be applied by screen printing techniques. In such screen printing technology, the term "screen" is used in the screen printing industry to adjust the flow of liquid composition to the surface of the substrate. The silver composition is typically applied to the screen when the screen is in contact with the substrate. The silver composition flows through the screen to the substrate where it is attached to the desired film thickness of the substrate. Screen printing techniques suitable for use in this project include known techniques which adjust the viscosity, flow and other properties of the liquid phase composition, the substrate and substrate surface properties, etc., in a manner known to those skilled in the art. Offset techniques can also be used, such as using a pinch roller to contact the silver composition with the substrate being rolled. The method also includes a second step of illuminating the silver-containing fluid phase composition on the substrate with ultraviolet light to cause the silver-containing fluid phase composition to solidify into a silver coating. Such irradiation may be carried out in any manner, in which ultraviolet or ultraviolet radiation strikes the silver composition, and the silver composition is polymerized to form a coating layer, a layer, a film, or the like, thereby solidifying the silver composition. The coating thus formed has a resistivity of from 0.03 to 0.50 ohms/square in the mils. Curing is preferably carried out by free radical polymerization which is caused by sources of ultraviolet radiation. The photoinitiator preferably comprises the aforementioned photoinitiator. A variety of UV sources can be used depending on the application. The preferred source of UV radiation for a variety of applications includes an energy intensity set at 125 33 per square foot (please read the back note before completing this page). This paper size applies to the Chinese National Standard (CNS) Α 4 specification (210X297) 1294921 A7 • B7 V. Description of the Invention (30 watts, 200 watts and 300 watts of known ultraviolet light illuminating devices. Other advantages and modifications will be apparent to those skilled in the art. Therefore, the broader aspects of the invention are not limited to The specific details, the representative devices, and the illustrated embodiments may be modified and changed in detail without departing from the spirit and scope of the present invention. 34 (Please read the notes on the back and then fill in the details) Page) This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm)