TWI279879B - Method for bonding two objects by positioning with two cameras - Google Patents

Method for bonding two objects by positioning with two cameras Download PDF

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Publication number
TWI279879B
TWI279879B TW95117508A TW95117508A TWI279879B TW I279879 B TWI279879 B TW I279879B TW 95117508 A TW95117508 A TW 95117508A TW 95117508 A TW95117508 A TW 95117508A TW I279879 B TWI279879 B TW I279879B
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Taiwan
Prior art keywords
image
objects
cameras
positioning
camera
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TW95117508A
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Chinese (zh)
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TW200744148A (en
Inventor
Bing-Huan Li
Shiun-Jang Jang
Je-Jung Huang
Mei-Ya Li
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Contrel Technology Co Ltd
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Priority to TW95117508A priority Critical patent/TWI279879B/en
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Publication of TW200744148A publication Critical patent/TW200744148A/en

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Abstract

The present invention relates to a method for bonding two objects by positioning with two cameras, the method includes: (a) preparing two cameras, a display device, and two objects to be bonded; (b) capturing the image for twp first positioning marks on the first object; (c) capturing the image for two second positioning marks on the second object; (d) obtaining the displacement between two objects; (e) moving one of the two objects based on the displacement; and, (f) bonding. The present invention employs these steps and the image processing to position two objects for alignment and bonding.

Description

1279879 九、發明說明: 【發明所屬之技術領域】 本發明係與二物件在結合時之定位 指一種使用雙攝影機定位使二物件結合之關,特別是 【先前技術】 知:,習知技術中,對於二物件士人 =’Γ :(積體電路)與電路板或基板結合時丄^ 則會=&腳位連接錯誤而產生誤動作甚至短路的ί題 而習知之對準定位的技術中,大多以 2一邊緣靠抵於-基準面,再以經過校準位置的機= 來抓取1C並置放於電路板/基板上^ 於電路板/基板上。板基板上献可準確的將1C置 15 ^前述技術誠然可解決某些對準定位的需求。然而,當 〔又置之基板/電路板沒有可用來抵靠基準面的邊緣時,則前 述方式即不適用。例如,對於將10結合於玻璃基板或液晶 面板上的狀況,由於玻璃基板或液晶面板因製程需要,有 在裁切前或裁切後才進行與IC結合的可能性,因此,必須 有另種定位對準的方式,來使此二種物件順利對準定位結 合。 有鑑於此,本案發明人在經過不斷之試作與實驗後, 終於發展出本發明之技術。 20 1279879 【發明内容】 -物主要目的在於提供一種❹雙攝影機定位使 二你二之方法,其可在抑用邊緣對準基準面的條件 下,使一物件定位對準結合。 本灰月之次一目的在於提供一種使用雙攝影機定位使 二物件結合之方法,其可二攝影機透過影像處理的方 式來使二物件定位後進行結合。 15 緣是,為了達成前述目的,依據本發明所提供之一 使用雙攝影機定位使二物件結合之方法,包含有下列步 驟· Α·備置二攝影機 '一顯示裝置以及待結合之二物件: 其中丄第一物件上具有相隔預定距離D之二第一定位標 記,第二物件上具有相隔預定距離D之二第二定位標記了 該二攝影機之取像區域係大致相隔預定距離D,而可藉以 對準該二物件上的二定位標記來進行取像,並將取得之二 影像顯示於該顯示裝置上;Β·對該第一物件上之該二第: 定位標記取像··將該第-物件置於該二攝影機之取像 中,使該二攝影機之取像區域分別對準該二第一定位標 來進行取像,而於该顯示裝置上顯示出二第一影像,、、,,衾 錄該二第-影像在該顯示裝置上的影像位置^對己 物件上之該二第二定位標記取像:將該第—物: 攝影機-航距離,再㈣第二物件移至該 = 像區域中,使該二攝影機之取像區域分卿料 位標記來進行取像,而於該顯示I置上顯示/ = 像,並紀錄該二第二影像在該顯示裝置上的影像位置;^ 5 20 1279879 取得該二物件間之位移量:藉由該二第—影像㈣ =,,計算出該二物件中之一物件移二-物; 移里,E•依前述位移量移動該二物件間之-物件:依 ,位動該二物件中之—物件,使該二物件重疊;以 口 亥/ 一物件由步驟c.中移離的方向反向移 =而與料二物件進行結合。藉由前述步驟 像處理的方式來使二物件進行定位對準結 【實施方式】 為了洋細說明本發明之技術特點所在,茲舉以下之一 車父佳貫施例並配合圖式說明如后,其中: 第一圖係本發明一較佳實施例之流程圖。 第二圖係本發明一較佳實施例之示意圖。 第二圖係本發明一較佳實施例之另一示意圖。 f四圖係本發明—較佳實施例之側視動“。 第五圖係本發明一較佳實施例之再一示音圖。 如第-圖至第五圖所示,本發明第一則圭實施例所提 供之-種制雙攝影機定位使二物件結合之方法,主要具 有下列步驟: A.備置二攝影機u、一顯示裝置13以及待結合之二物 =15 17 .其中’第一物件15於本實施例中係為1C(積體 電路)’其上具有相隔預定輯D之二第-定位標記16,第 物件17於本只;^例中係為玻璃基板,其上具有相隔預定 距離D之二第二定位標記18,該二攝影機u之取像區域 1279879 係大致相隔預定距離D,而可藉以對準該二物件15,17上 的二定位標記16,18來進行取像,並將取得之影像顯示於 該顯示裝置13上。該二攝影機11係相對位於該二物件 17之上方,而由上方向下取像。 5 Β·對該第一物件15上之該二第一定位標記16取像: 將該第一物件15置於該二攝影機11之取像區域中,使誃 二攝影機11之取像區域分別對準該二第一定位標記16 = 進行取像,而於該顯示裝置13上顯示出二第一影像16,, 並紀錄該二第一影像16,在該顯示裝置13上 ίο置,其狀態如第二圖所示。 〜 c·對該第二物件17上之該二第二定位標記18取像: 將該=一物件15向下移離該二攝影機11 一預定距離,再 將該第二物件17移至該二攝影機11之取像區域中,使該 二攝影機11之取像區域分別鮮該二第二定位標記18來 15進行取像,而於該顯示裝置13上顯示出二第二影像18,, 並紀錄該二第二影像18,找顯示裝置13上的影 置,其狀悲如第三圖及第四圖所示。 D•取件該二物件間之位移量:藉由該二第-影像16, 與3一第—影像18,之位置差,計算出該二物件U,口 20 物件移向另—物件之位移量(例如第〆物件15移向該 =一物件17的位移量),本實施例中,係為水平方向的位移 E.依前述位移量 量移動該二物件15, 移動該二物件間之一物件:依該位移 P中之一物件(例如將該第一物件15 1279879 移向該第二物件〗 F.結合·將二)’使該二物件15,17重叠。 移回(即向上r:/—物件15由轉C.中移離的方向反向 如第五圖所^。’而與該第二物件17進行結合,其狀態 前述步驟A $ 是固定不變的。v”、F•中,該二攝影機11的相隔距離均 經由上述+辨 、 上的影像)來進 可透過影像處理的方式(顯示裝置13 的計算,有糾物件15與該第二物件17間位移量 ίο i5(ic)t^^^^^ n_L , ^由此可知,本發明可不需使用到習知技術中之基準面 ^位的技術,而可透過二攝影機藉由影像處理的方式來使 二物件定位對準結合。 二 1279879 【圖式簡單說明】 第一圖係本發明一較佳實施例之流程圖。 第二圖係本發明一較佳實施例之示意圖。 第三圖係本發明一較佳實施例之另一示意圖。 第四圖係本發明一較佳實施例之側視動作圖。 第五圖係本發明一較佳實施例之再一示意圖。 13顯示裝置 16第一定位標記 17第二物件 18’第二影像 【主要元件符號說明】 11攝影機 ίο 15第一物件 16’第一影像 18第二定位標記1279879 IX. Description of the Invention: [Technical Field] The present invention relates to the positioning of two objects when combined, and refers to the use of dual camera positioning to combine two objects, in particular [Prior Art]: In the prior art For the two objects of the person = 'Γ: (integrated circuit) when combined with the board or the substrate 丄 ^ will = & pin connection error and cause a malfunction or even a short circuit and the conventional alignment technology Most of them rely on the 2 - edge to the - reference plane, and then grab the 1C with the machine at the calibration position and place it on the circuit board / substrate on the circuit board / substrate. The board substrate can accurately set 1C. The above technology can certainly solve some of the requirements of alignment positioning. However, the above method is not applicable when the substrate/board is not used to abut the edge of the reference plane. For example, in the case of bonding 10 to a glass substrate or a liquid crystal panel, since the glass substrate or the liquid crystal panel is required to be processed by the process, it is possible to bond with the IC before or after cutting. Therefore, it is necessary to have another species. The positioning is aligned so that the two objects are smoothly aligned and positioned. In view of this, the inventors of the present invention finally developed the technology of the present invention after continuous trials and experiments. 20 1279879 SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for positioning a dual camera, which can align and align an object under the condition that the edge is aligned with the reference surface. The second purpose of this gray moon is to provide a method of combining two objects by using dual camera positioning, which allows the two cameras to be positioned and combined by image processing. 15 is, in order to achieve the foregoing object, a method for combining two objects using a dual camera positioning according to the present invention, comprising the following steps: 备 备 备 摄影 摄影 摄影 摄影 摄影 摄影 摄影 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一The first object has two first positioning marks spaced apart by a predetermined distance D, and the second object has a second positioning mark spaced apart by a predetermined distance D. The image capturing areas of the two cameras are substantially separated by a predetermined distance D, and may be Positioning the two positioning marks on the two objects to perform image capturing, and displaying the obtained two images on the display device; Β·taking the second: positioning marks on the first object. The object is placed in the image capturing of the two cameras, and the image capturing areas of the two cameras are respectively aligned with the two first positioning targets for image capturing, and the first image is displayed on the display device, and, Recording the image position of the second image-on-image on the display device to image the two second positioning marks on the object: moving the first object: camera-voyage distance, and then (four) moving the second object to the = Image area , the image capturing area of the two cameras is divided into blank mark for image capturing, and the display image is displayed on the display I, and the image position of the second image on the display device is recorded; ^ 5 20 1279879 Obtaining the displacement between the two objects: by the two-image (four) =, calculating that one of the two objects moves two objects; in the movement, E• moves the two objects according to the displacement amount - object: according to the position of the object in the two objects, so that the two objects overlap; in the mouth / an object moved backwards in the direction of step c. = combined with the two objects. The two objects are positioned and aligned by the foregoing steps. [Embodiment] In order to explain the technical features of the present invention, one of the following examples will be described and the following description will be followed. 1 is a flow chart of a preferred embodiment of the present invention. The second drawing is a schematic view of a preferred embodiment of the invention. The second drawing is another schematic view of a preferred embodiment of the invention. f is a side view of the preferred embodiment of the present invention. The fifth figure is still another sound map of a preferred embodiment of the present invention. As shown in the first to fifth figures, the first aspect of the present invention The method for the dual camera positioning to combine the two objects is mainly provided with the following steps: A. preparing two cameras u, a display device 13 and two things to be combined = 15 17 . In the present embodiment, the object 15 is a 1C (integrated circuit) having a second-position mark 16 spaced apart from the predetermined set D, and the object 17 is in the form of a glass substrate having a distance therebetween. The second positioning mark 18 of the predetermined distance D, the image capturing area 1279879 of the two cameras u is substantially separated by a predetermined distance D, and the two positioning marks 16, 18 on the two objects 15, 17 can be aligned for image capturing. And displaying the obtained image on the display device 13. The two cameras 11 are located above the two objects 17 and take images from above. 5 Β·The second object on the first object 15 A positioning mark 16 takes an image: the first object 15 is placed on the image of the two cameras 11 In the area, the image capturing area of the second camera 11 is aligned with the two first positioning marks 16 to perform image capturing, and the first image 16 is displayed on the display device 13, and the two first images are recorded. 16, on the display device 13, the state is as shown in the second figure. ~ c. The second second positioning mark 18 on the second object 17 is taken: the object 15 is moved downward A predetermined distance from the two cameras 11, the second object 17 is moved to the image capturing area of the two cameras 11, so that the image capturing areas of the two cameras 11 are respectively taken by the second positioning marks 18 to 15 For example, the second image 18 is displayed on the display device 13, and the second image 18 is recorded, and the image on the display device 13 is found. The shape is as shown in the third and fourth figures. D•Removal of the displacement between the two objects: by the difference between the position of the second image 16 and the image of the first image 18, the displacement of the object U and the movement of the object 20 to the other object is calculated. The amount (for example, the displacement amount of the first object 15 to the object 17), in this embodiment, the displacement in the horizontal direction E. moving the two objects 15 according to the displacement amount, and moving one of the objects between the two objects: according to one of the displacements P (for example, moving the first object 15 1279879 to the second object) F. 2) 'to make the two objects 15, 17 overlap. Move back (ie up r: / - object 15 is reversed in the direction of the shift C. as shown in the fifth figure.) and the second object 17 In the state of the combination, the foregoing step A$ is fixed. In the v", F•, the distance between the two cameras 11 is transmitted through the image of the above-mentioned + discrimination, and the image processing is possible (display device) The calculation of 13 has the displacement amount ίο i5(ic)t^^^^^ n_L between the object correcting member 15 and the second object 17, so that the present invention can be used without using the reference surface in the prior art. The technology can be used to align and align the two objects by image processing through the two cameras. II 1279879 BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of a preferred embodiment of the present invention. The second drawing is a schematic view of a preferred embodiment of the invention. The third drawing is another schematic view of a preferred embodiment of the invention. The fourth figure is a side view of a preferred embodiment of the present invention. Figure 5 is a further schematic view of a preferred embodiment of the present invention. 13 display device 16 first positioning mark 17 second object 18' second image [main element symbol description] 11 camera ίο 15 first object 16' first image 18 second positioning mark

Claims (1)

1279879 ~、申請專利範圍: 有下使时攝影機定位使二物件結合之方法,包含 其中有7顯示裝置以及待結合之二物件: 物件上具有相隔預定距離D之二 記’第二物件上具有相隔狀距離 該二攝影機之取像區域係大 =二 對準該二物件上的二定_/广預疋距離D ’而可藉以 影像顯示於賴^置上、轉妨取像,聽取得之二 第一定位標記取像··將該第 B·對該第一物件上之該二 一物件置於該二攝影機之 像區域分卿準該-第 ’使該二攝影機之取 而於該顯 顯 示裝置上顯示出二二;:f進棘像,而於該 示裝置上的影像位置; 、己、彔i弟-影像在該 C·對該第二物件上之兮二 —a 15 -物件移離該二攝影機一預c記取像:將該第 該二攝影機之取像區域中,使^攝=該第二物件移至 對:該:第:r標記來進行;= 影像位置 "出一弟—讀,並紀錄該二第二影像在該顯示裝置上的 于物件間之位移量 物件之位移量; 第二影像之位置差讀與该 一 十异出戎一物件中之-物件移向另 量二:依該位移 以及 10 20 1279879 F·釔口·將戎第—物件由步驟c·中移離的方向反向移 回,而與該第二物件進行結合。 2·依據申請專利範圍第1項所述之使用雙攝影機定位 使二物件結合之方法,其中··於步驟Α·中,該二攝影機係 5相對位於该二物件之上方,而由上方向下取像。 3·依據申請專利範圍第2項所述之使用雙攝影機定位 使二物件結合之方法,其中:於步驟c·中,該第一物件係 向下移離該二攝影機。 4·依據申請專利範圍第1項所述之使用雙攝影機定位 ίο使二物件結合之方法,其中:該第一物件係為IC(積體電 路),該第二物件係為玻璃基板。 5·依據申請專利範圍第1項所述之使用雙攝影機定位 使二物件結合之方法,其中:在步驟A·至步驟F·中,該二 攝影機之相隔距離係為固定。1279879 ~, the scope of patent application: There is a method for positioning the camera to make two objects combined, including 7 display devices and two objects to be combined: the object has a predetermined distance D between the two objects, and the second object has a separation The image capturing area of the two cameras is large=two aligned with the two fixed _/wide pre-distance distance D′ on the two objects, and the image can be displayed on the display, and the image can be captured and captured. The first positioning mark takes the image and the second object on the first object is placed in the image area of the two cameras, and the second camera is used to display the two cameras. The device displays two or two;:f enters the ratchet image, and the image position on the display device; 、, 彔i brother-image on the C· the second object--a 15 - object shift Taking a pre-c image from the two cameras: in the image capturing area of the second camera, moving the second object to the pair: the: r: mark; = image position " Brother-read, and record the second image on the display device The amount of displacement between the objects is the displacement of the object; the position difference of the second image is read and the object in the object is moved to the other two: according to the displacement and 10 20 1279879 F·钇口·戎The first object is reversely moved back from the direction in which the step c· is removed, and is combined with the second object. 2. According to the method of claim 1, the method of using two cameras to position two objects, wherein in the step Α, the two camera systems 5 are located above the two objects, and from above Take the image. 3. A method of combining two objects using a dual camera positioning as described in claim 2, wherein: in step c, the first object is moved downwardly away from the two cameras. 4. A method of combining two objects according to claim 1 of the scope of the patent application, wherein the first object is an IC (integrated circuit) and the second object is a glass substrate. 5. The method of using two cameras to position two objects according to claim 1 of the scope of the patent application, wherein: in step A· to step F·, the distance between the two cameras is fixed.
TW95117508A 2006-05-17 2006-05-17 Method for bonding two objects by positioning with two cameras TWI279879B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116313971A (en) * 2023-05-17 2023-06-23 拓荆键科(海宁)半导体设备有限公司 Wafer bonding alignment method through edge detection

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496090B (en) 2012-09-05 2015-08-11 Ind Tech Res Inst Method and apparatus for object positioning by using depth images

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116313971A (en) * 2023-05-17 2023-06-23 拓荆键科(海宁)半导体设备有限公司 Wafer bonding alignment method through edge detection
CN116313971B (en) * 2023-05-17 2023-10-20 拓荆键科(海宁)半导体设备有限公司 Wafer bonding alignment method through edge detection

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