1274012 ^ 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種固定半導體載板之方法’尤指片式軟板帶狀包 裝方法。 【先前技術】 SMT (Surface Mounting Technology)是種新一代電子表面貼裝 技術的英文縮寫。它將傳統的電子元器件壓縮成爲原體積的十分 之一左右，而實現了電子産品組裝的高密度、高可靠、小型化、 低成本，成爲電子資訊化産業的基礎。 簡略而言，SMT由表面貼裝元器件（SMD)、貼裝技術、貼裝設備三 個部分組成。由於SMD的組裝密度高，使現有的電子産品、系統 在體積上縮小40%—60%，重量上減輕6〇%—80%，成本上降低 30%—50%，同時也帶有SMD的可靠性高和高頻特性好等特點，所 以SMT表面貼裝工藝技術及其設備的選擇和配置成爲電子產品、 系統質量保證的關鍵。 為了進仃表面貼裝，在進行SMT前仍需要進行對位程序。只是， 傳統對位方式太過依賴人卫進行，導致有諸多缺點存在。 請參閱第1㈣m〜κ：圖為習知對健序之事意圖。如第 ία圖所示’首先準備好具有複數個凹槽ia的載具i，且此凹槽 5 1274012 的大小均依據即將承載的軟板2而開設的。然後，將已事先製作 凡成的軟板2放入載具1的凹槽la中，如第ιΒ圖所示。接著， 在已經放入的軟板2、3、4上下兩端的邊緣上，以如第iC圖所示 的耐熱膠帶8a、8b黏貼固定住。在固定好之後，就可以開始進行 一 SMT程序。 ' 然而，在如1β圖所示之對位程序中，除了必須藉著人工方式將軟 ， 板2、3、4放入載具1以外，在完成SMT程序後仍需要撕除原先 _ 細侧定料。所以，傳統的對錄序不但成核高，效率也 、 低0 【發明内容】 本發明之主要目的在提供—種片式軟板帶狀包裝方法，主要藉著 單面膠㈣帶錄板_麵熱板上，樣代人工對位、貼嶋 些半導體載板至耐驗上，轉低成本、提高產量與精確度。 基於上述目的’本發明以軟板帶狀包裝方法，主錢藉著單面 膠帶將帶錄板_树熱板上，並沿著帶練板上的該些半導 體載板彼此的邊界，_成各自社的載板，且已各自獨立的每 一半導體載板仍被單面膠帶固定在耐熱板上。 關於本發明之優點無神可以藉由町的發卿述及所附圖式得 到進一步的瞭解。 、 6 1274012 【實施方式】 請參閱第2A〜2D圖，第2A〜2D圖為本發明片式軟板帶狀包裝方法 之示意圖。如第2A圖所示，在進行本發明的對位程序前，首先提 供帶狀軟板10(在未衝切前，其具有如半導體載板1〇a的複數個載 板）、耐熱板12，並在耐熱板12上塗佈黏性物質13。在帶狀軟板 10上的數個虛線方框（如邊界l〇b所標示），僅用來表示在方框内 ， 部屬於帶有線路的載板，並不代表非得在帶狀軟板1〇上標示出框 ® 線。 簡略而έ，本發明片式軟板帶狀包裝方法中，主要是是如第沈圖 所示藉著單面膠们4黏貼固定帶狀軟板1〇，並沿著帶狀軟板 上的該些半導體載板彼此的如邊界廳（第2Α圖衫2β圖所示之 虛線），藉著連續衝切的方式在載板1Ga的周邊（/亦即原先的邊界 10b處)切出細縫10d’而將半導體載板1〇a切割成各自獨立的載 板’如弟2C圖所示。如此一來，雖然半導體載板i〇a已從帶狀軟 板10被分離出來’但由於在轉體載板1〇a底下的單面膠帶， 使細畔導體她仍觀定在耐熱板14上，如第2D圖所示。 在^第2A圖所示之帶狀軟板1〇，可使其兩側邊帶有如齒孔服 的複數個孔洞。此齒孔此是如同膠捲底片的孔洞，而其用途也 大致相同。_由於帶錄板1G的材f如晴捲底片般雜有彈性， =進行如2B〜2C圖所示之製程步驟前’可如_底片般將 ▼人反1〇捲成—捲。在需要進行如2B〜2C圖所示之製程步驟， 7 1274012 .特殊的自動化裝置就可藉著齒孔10c從這捲帶狀軟板10抽出所需 的長度，而達到自動化作業的效果。當然在帶狀軟板1〇並非一定 要具有齒孔10c，只是這樣的設計會比較便利於自動化作業。另 外，帶狀軟板10中非為該些半導體載板(如半導體載板1〇a)的部 ' 分為軟板邊料。 '具體而S，本發明片式軟板帶狀包裝方法巾，在提供如以上所述 、之帶狀軟板10、耐熱板12後，就可以抽出在長度上大致符合耐熱 鲁板12的帶狀軟板1〇，並如2β圖所示貼附在軍面踢帶Μ上。為了 讓半體載板10a從帶狀軟板1〇獨立出來，但又希望半導體載板 -10a仍被固定在單面膠帶14上，所以在沿著如第2B_示邊界 l〇b衝切時，僅切斷帶狀軟板1〇的部分，而單面膠帶μ盡量不被 切割到（如第3圖所示之側視圖），如第2C圖所示。接著，如第2D 圖所示，在從單面膠帶14上撕除軟板邊料後，可再如第2β圖所 示將下一段的帶狀軟板1〇貼附在單面膠帶14上，並如以上所述 • 進行2C〜2D圖所示之製程，而達成自動化作業。 在要進行SMT組裝作業前，就將如第2D圖所示成品（與帶狀軟板 10黏性結合的單面膠帶14)中單面膠帶14的那姑 、 1曲，轉黏貼至作 為軟板的治具的耐熱板12。由於，單面膠帶14與耐熱板12之門 的接著力大於單面膠帶14與帶狀軟板10之間的接著力，所以可 以進行準確的轉貼附的目地。 藉由以上紐具體實_之詳述，鱗魏以妓描述本發明 1274012 之特徵與精神，而並_上述_露陳佳賤實酬來對本發 明之麟加以限制。相反地，其目的是希望能涵蓋各種改變及具 相等性的安排於本發明所欲申請之專利範圍的範略内 【圖式簡單說明】 第1A〜1C圖為習知對位程序之示意圖。 之不意圖 第2A〜2D圖為本發明片式軟板帶狀包裝方去 第3圖為本發明片式軟板帶狀包裝 之 側視 示意圖 【主要元件符號說明】 1載具 la凹槽 2 ' 3 ' 4軟板 φ 8a、8b耐熱膠帶 10帶狀軟板 10a载板 10b邊界 l〇c齒孔 10d細縫 12耐熱板 1274012 13黏性物質 14單面膠帶1274012 ^ IX. Description of the Invention: [Technical Field] The present invention relates to a method of fixing a semiconductor carrier, particularly a method for packaging a flexible sheet. [Prior Art] SMT (Surface Mounting Technology) is an abbreviation of a new generation of electronic surface mount technology. It compresses traditional electronic components into about one-tenth of the original volume, and achieves high density, high reliability, miniaturization, and low cost of electronic product assembly, and becomes the basis of the electronic information industry. Briefly speaking, SMT consists of three parts: surface mount component (SMD), placement technology, and placement equipment. Due to the high assembly density of SMD, the existing electronic products and systems are reduced by 40%-60% in volume, 6〇%-80% in weight, 30%-50% in cost, and reliable in SMD. The characteristics of high performance and high frequency characteristics, so the selection and configuration of SMT surface mount technology and its equipment become the key to electronic product and system quality assurance. In order to facilitate surface mounting, the alignment procedure is still required before SMT is performed. However, the traditional method of aligning is too dependent on the people, resulting in many shortcomings. Please refer to the 1st (4)m~κ: The figure is the intent of the customary order. As shown in Fig. Δ, the carrier i having a plurality of grooves ia is prepared first, and the size of the groove 5 1274012 is opened according to the soft board 2 to be carried. Then, the soft board 2 which has been prepared in advance is placed in the groove la of the carrier 1, as shown in Fig. Next, on the edges of the upper and lower ends of the soft sheets 2, 3, and 4 which have been placed, the heat-resistant adhesive tapes 8a, 8b as shown in Fig. iC are adhered and fixed. Once fixed, you can start an SMT program. However, in the alignment program as shown in the 1β diagram, in addition to the manual placement of the soft, plates 2, 3, and 4 into the carrier 1, it is necessary to tear off the original _ thin side after completing the SMT procedure. Ordering. Therefore, the traditional recording sequence is not only high in nucleation, but also low in efficiency. [Inventive content] The main purpose of the present invention is to provide a method for packaging a flexible sheet strip, mainly by a single-sided adhesive (four) with a recording board _ On the hot plate, the sample is artificially aligned, and some semiconductor carriers are attached to the test, which reduces the cost and improves the yield and precision. Based on the above purpose, the present invention adopts a flexible strip packaging method, and the main money uses a single-sided tape to bring the tapeboard to the tree hot plate, and along the boundary of the semiconductor carrier plates on the belt training board, Each of the carrier boards of the respective companies, and each of the semiconductor carriers that have been independent, is still fixed to the heat-resistant board by a single-sided tape. Regarding the advantages of the present invention, the gods can learn more from the description of the drawings. 6 1274012 [Embodiment] Please refer to FIGS. 2A to 2D, and FIGS. 2A to 2D are schematic views showing a strip-shaped packaging method for a sheet type flexible board according to the present invention. As shown in FIG. 2A, before performing the alignment process of the present invention, a strip-shaped flexible board 10 (having a plurality of carrier sheets such as a semiconductor carrier 1a before uncut), and a heat-resistant board 12 are provided. And the viscous substance 13 is applied on the heat-resistant plate 12. The several dashed boxes on the strip-shaped flexible board 10 (as indicated by the boundary l〇b) are only used to indicate that the part is in the box, and the part belongs to the carrier board with the line, and does not mean that it is in the strip-shaped soft board. The frame ® line is marked on the 1〇. Briefly, in the method of the strip-shaped flexible packaging method of the present invention, the main method is to fix the strip-shaped flexible board 1 借 by the single-sided glue 4 as shown in the first sinking diagram, and along the strip-shaped flexible board. The semiconductor carrier plates are cut out of the periphery of the carrier 1Ga (ie, the original boundary 10b) by continuous punching as in the boundary hall (the dotted line shown in the 2β figure of the second figure). 10d' and the semiconductor carrier board 1A is cut into separate carrier boards as shown in Fig. 2C. As a result, although the semiconductor carrier i〇a has been separated from the strip-shaped flexible board 10, but due to the single-sided tape under the rotating carrier board 1〇a, the thin-walled conductor is still viewed on the heat-resistant board 14 Above, as shown in Figure 2D. In the strip-shaped flexible plate 1 shown in Fig. 2A, a plurality of holes such as perforated holes may be provided on both sides. This perforation is a hole like a film negative, and its use is also substantially the same. _Because the material f with the recording board 1G is as flexible as the reel negative film, = before the process step as shown in Fig. 2B to 2C, the film can be rolled into a roll like a film. In the process step required as shown in Fig. 2B to 2C, 7 1274012. A special automatic device can extract the required length from the tape-like flexible board 10 through the perforation 10c, thereby achieving the effect of automation. Of course, it is not necessary to have the perforation 10c in the strip-shaped flexible board, but such a design is more convenient for automation. Further, the portion of the strip-shaped flexible board 10 which is not the semiconductor carrier (e.g., the semiconductor carrier 1a) is classified into a soft board. Specifically, in the case of the strip-shaped flexible packaging method of the present invention, after the strip-shaped flexible sheet 10 and the heat-resistant sheet 12 as described above are provided, the strip having a length substantially conforming to the heat-resistant flat sheet 12 can be extracted. The soft board is 1 〇 and attached to the military kick belt as shown in the 2β diagram. In order to allow the carrier board 10a to be separated from the strip-shaped flexible board 1 but it is desired that the semiconductor carrier board 10a is still fixed on the single-sided tape 14, it is die-cut along the boundary l〇b as shown in the 2nd. At this time, only the portion of the strip-shaped flexible sheet 1 切断 is cut, and the single-sided tape μ is not cut as much as possible (as shown in the side view of Fig. 3), as shown in Fig. 2C. Next, as shown in FIG. 2D, after the soft board material is removed from the single-sided tape 14, the strip-shaped flexible sheet 1 of the next stage can be attached to the single-sided tape 14 as shown in FIG. And as described above • Perform the process shown in 2C to 2D to achieve automation. Before the SMT assembly work is carried out, the finished product (the single-sided tape 14 viscously bonded to the strip-shaped flexible sheet 10) as shown in Fig. 2D is transferred to the soft and soft one of the single-sided tape 14 as a soft one. The heat-resistant plate 12 of the fixture of the board. Since the adhesion of the door of the single-sided tape 14 to the heat-resistant plate 12 is larger than the adhesion between the single-sided tape 14 and the band-shaped flexible plate 10, accurate reattachment can be performed. By the above details, the scales and the spirit of the invention 1274012 are described, and the above-mentioned _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Rather, the purpose of the present invention is to provide a schematic representation of various modifications and equivalent arrangements within the scope of the patent application to which the present invention is intended. [Simplified illustration of the drawings] Figures 1A to 1C are schematic diagrams of conventional alignment procedures. 2A~2D is a side view of the strip type flexible packaging of the present invention. Fig. 3 is a side view of the strip type packaging of the present invention. [Main component symbol description] 1 carrier la groove 2 ' 3 ' 4 soft board φ 8a, 8b heat-resistant tape 10 strip-shaped soft board 10a carrier board 10b boundary l〇c perforation 10d slit 12 heat-resistant plate 1274012 13 viscous material 14 single-sided tape