TWI264444B - Polyamic acid composition and laminated polyimide/Cu material - Google Patents
Polyamic acid composition and laminated polyimide/Cu materialInfo
- Publication number
- TWI264444B TWI264444B TW94124347A TW94124347A TWI264444B TW I264444 B TWI264444 B TW I264444B TW 94124347 A TW94124347 A TW 94124347A TW 94124347 A TW94124347 A TW 94124347A TW I264444 B TWI264444 B TW I264444B
- Authority
- TW
- Taiwan
- Prior art keywords
- soft
- monomers
- polyamic acid
- acid composition
- diamine
- Prior art date
Links
Abstract
The present invention relates to a polyamic acid composition and laminated polyimide/Cu material. The polyamic acid composition comprises polar, aprotic solvent and made of the copolymerization of a plurality of diamine monomers and dianhydride monomers. Among the diamine monomers, there is at least one rigid molecule and at least one soft molecule; similarly, among the dianhydride monomers, there is at least one rigid molecule and at least one soft molecule. The polyamic fragment, combined by a soft diamine monomer, a soft dianhydride monomer is defined as a soft fragment. Relative to the total mole numbers of monomers constituting the polyamic acid molecules, the proportion of the monomers constituting the soft fragment is not more than 10%, and the definition of rigid and soft diamine and dianhydride monomer is disclosed in the specification.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94124347A TWI264444B (en) | 2005-07-19 | 2005-07-19 | Polyamic acid composition and laminated polyimide/Cu material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94124347A TWI264444B (en) | 2005-07-19 | 2005-07-19 | Polyamic acid composition and laminated polyimide/Cu material |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI264444B true TWI264444B (en) | 2006-10-21 |
TW200704674A TW200704674A (en) | 2007-02-01 |
Family
ID=37969348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94124347A TWI264444B (en) | 2005-07-19 | 2005-07-19 | Polyamic acid composition and laminated polyimide/Cu material |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI264444B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8266797B2 (en) | 2007-06-22 | 2012-09-18 | Princo Middle East Fze | Method of manufacturing a multi-layer substrate |
-
2005
- 2005-07-19 TW TW94124347A patent/TWI264444B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8266797B2 (en) | 2007-06-22 | 2012-09-18 | Princo Middle East Fze | Method of manufacturing a multi-layer substrate |
US8278562B2 (en) | 2007-06-22 | 2012-10-02 | Princo Middle East Fze | Multi-layer substrate and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200704674A (en) | 2007-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |