TWI264444B - Polyamic acid composition and laminated polyimide/Cu material - Google Patents

Polyamic acid composition and laminated polyimide/Cu material

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Publication number
TWI264444B
TWI264444B TW94124347A TW94124347A TWI264444B TW I264444 B TWI264444 B TW I264444B TW 94124347 A TW94124347 A TW 94124347A TW 94124347 A TW94124347 A TW 94124347A TW I264444 B TWI264444 B TW I264444B
Authority
TW
Taiwan
Prior art keywords
soft
monomers
polyamic acid
acid composition
diamine
Prior art date
Application number
TW94124347A
Other languages
Chinese (zh)
Other versions
TW200704674A (en
Inventor
Tang-Jie Huang
Jau-Chin Juang
Huei-Jen Ye
Original Assignee
Microcosm Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microcosm Technology Co Ltd filed Critical Microcosm Technology Co Ltd
Priority to TW94124347A priority Critical patent/TWI264444B/en
Application granted granted Critical
Publication of TWI264444B publication Critical patent/TWI264444B/en
Publication of TW200704674A publication Critical patent/TW200704674A/en

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Abstract

The present invention relates to a polyamic acid composition and laminated polyimide/Cu material. The polyamic acid composition comprises polar, aprotic solvent and made of the copolymerization of a plurality of diamine monomers and dianhydride monomers. Among the diamine monomers, there is at least one rigid molecule and at least one soft molecule; similarly, among the dianhydride monomers, there is at least one rigid molecule and at least one soft molecule. The polyamic fragment, combined by a soft diamine monomer, a soft dianhydride monomer is defined as a soft fragment. Relative to the total mole numbers of monomers constituting the polyamic acid molecules, the proportion of the monomers constituting the soft fragment is not more than 10%, and the definition of rigid and soft diamine and dianhydride monomer is disclosed in the specification.
TW94124347A 2005-07-19 2005-07-19 Polyamic acid composition and laminated polyimide/Cu material TWI264444B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94124347A TWI264444B (en) 2005-07-19 2005-07-19 Polyamic acid composition and laminated polyimide/Cu material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94124347A TWI264444B (en) 2005-07-19 2005-07-19 Polyamic acid composition and laminated polyimide/Cu material

Publications (2)

Publication Number Publication Date
TWI264444B true TWI264444B (en) 2006-10-21
TW200704674A TW200704674A (en) 2007-02-01

Family

ID=37969348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94124347A TWI264444B (en) 2005-07-19 2005-07-19 Polyamic acid composition and laminated polyimide/Cu material

Country Status (1)

Country Link
TW (1) TWI264444B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8266797B2 (en) 2007-06-22 2012-09-18 Princo Middle East Fze Method of manufacturing a multi-layer substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8266797B2 (en) 2007-06-22 2012-09-18 Princo Middle East Fze Method of manufacturing a multi-layer substrate
US8278562B2 (en) 2007-06-22 2012-10-02 Princo Middle East Fze Multi-layer substrate and manufacturing method thereof

Also Published As

Publication number Publication date
TW200704674A (en) 2007-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees