TWI257147B - Method of manufacturing memory device, memory device and phase change memory device - Google Patents

Method of manufacturing memory device, memory device and phase change memory device

Info

Publication number
TWI257147B
TWI257147B TW93139303A TW93139303A TWI257147B TW I257147 B TWI257147 B TW I257147B TW 93139303 A TW93139303 A TW 93139303A TW 93139303 A TW93139303 A TW 93139303A TW I257147 B TWI257147 B TW I257147B
Authority
TW
Taiwan
Prior art keywords
memory device
phase change
chalcogenide
manufacturing
change memory
Prior art date
Application number
TW93139303A
Other languages
English (en)
Other versions
TW200623332A (en
Inventor
Hsiang-Lan Lung
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Priority to TW93139303A priority Critical patent/TWI257147B/zh
Application granted granted Critical
Publication of TWI257147B publication Critical patent/TWI257147B/zh
Publication of TW200623332A publication Critical patent/TW200623332A/zh

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  • Semiconductor Memories (AREA)
TW93139303A 2004-12-17 2004-12-17 Method of manufacturing memory device, memory device and phase change memory device TWI257147B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93139303A TWI257147B (en) 2004-12-17 2004-12-17 Method of manufacturing memory device, memory device and phase change memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93139303A TWI257147B (en) 2004-12-17 2004-12-17 Method of manufacturing memory device, memory device and phase change memory device

Publications (2)

Publication Number Publication Date
TWI257147B true TWI257147B (en) 2006-06-21
TW200623332A TW200623332A (en) 2006-07-01

Family

ID=37704215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93139303A TWI257147B (en) 2004-12-17 2004-12-17 Method of manufacturing memory device, memory device and phase change memory device

Country Status (1)

Country Link
TW (1) TWI257147B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394273B (zh) * 2008-07-16 2013-04-21 United Microelectronics Corp 相變化記憶體
TWI400771B (zh) * 2008-01-29 2013-07-01 Hitachi Ltd Nonvolatile memory device and manufacturing method thereof
TWI412124B (zh) * 2008-12-31 2013-10-11 Higgs Opl Capital Llc 相變化記憶體
TWI735482B (zh) * 2016-02-17 2021-08-11 南韓商三星電子股份有限公司 可變電阻記憶體裝置及其製造方法
CN117397387A (zh) * 2021-05-27 2024-01-12 美光科技公司 具有竖直结构中的侧壁及块体区域的存储器单元

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7969011B2 (en) * 2008-09-29 2011-06-28 Sandisk 3D Llc MIIM diodes having stacked structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400771B (zh) * 2008-01-29 2013-07-01 Hitachi Ltd Nonvolatile memory device and manufacturing method thereof
TWI394273B (zh) * 2008-07-16 2013-04-21 United Microelectronics Corp 相變化記憶體
TWI412124B (zh) * 2008-12-31 2013-10-11 Higgs Opl Capital Llc 相變化記憶體
TWI735482B (zh) * 2016-02-17 2021-08-11 南韓商三星電子股份有限公司 可變電阻記憶體裝置及其製造方法
CN117397387A (zh) * 2021-05-27 2024-01-12 美光科技公司 具有竖直结构中的侧壁及块体区域的存储器单元

Also Published As

Publication number Publication date
TW200623332A (en) 2006-07-01

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