TWI241040B - Modulized structure of the array LED and its packaging method - Google Patents

Modulized structure of the array LED and its packaging method Download PDF

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Publication number
TWI241040B
TWI241040B TW93128769A TW93128769A TWI241040B TW I241040 B TWI241040 B TW I241040B TW 93128769 A TW93128769 A TW 93128769A TW 93128769 A TW93128769 A TW 93128769A TW I241040 B TWI241040 B TW I241040B
Authority
TW
Taiwan
Prior art keywords
top substrate
substrate
led
bottom
notches
Prior art date
Application number
TW93128769A
Other versions
TW200611429A (en
Inventor
Ching-Fu Tzou
Yi-Ru Chen
Justin Chao
Original Assignee
Ching-Fu Tzou
Yi-Ru Chen
Justin Chao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ching-Fu Tzou, Yi-Ru Chen, Justin Chao filed Critical Ching-Fu Tzou
Priority to TW93128769A priority Critical patent/TWI241040B/en
Application granted granted Critical
Publication of TWI241040B publication Critical patent/TWI241040B/en
Publication of TW200611429A publication Critical patent/TW200611429A/en

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Abstract

A modulized structure of the array LED and its packaging method is disclosed, wherein the high thermal conductivity material is chosen as the material for the top substrate; a multitude of array-arranged notches are formed into the top substrate and penetration apertures are formed onto the bottom of notches; the high thermal conductivity material is chosen as the material for the bottom substrate and on the surface of bottom substrate are formed the conductor deployment patterns; the lower surface of the top substrate is fixed onto the upper surface of the bottom substrate to make each of the penetration apertures of notches respectively correspond to the contact electrode of the conductor deployment patterns; a multitude of dies of LED are respectively fixed onto the lower surface of each notch on the top substrate and the two electrodes of dies are made electrically connected to the contact electrodes through the penetration apertures; and seal each notch of the top substrate in the way of protecting LED from oxidation.
TW93128769A 2004-09-22 2004-09-22 Modulized structure of the array LED and its packaging method TWI241040B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93128769A TWI241040B (en) 2004-09-22 2004-09-22 Modulized structure of the array LED and its packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93128769A TWI241040B (en) 2004-09-22 2004-09-22 Modulized structure of the array LED and its packaging method

Publications (2)

Publication Number Publication Date
TWI241040B true TWI241040B (en) 2005-10-01
TW200611429A TW200611429A (en) 2006-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW93128769A TWI241040B (en) 2004-09-22 2004-09-22 Modulized structure of the array LED and its packaging method

Country Status (1)

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TW (1) TWI241040B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8378358B2 (en) 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
US8405105B2 (en) 2009-02-18 2013-03-26 Everlight Electronics Co., Ltd. Light emitting device
US8772802B2 (en) 2009-02-18 2014-07-08 Everlight Electronics Co., Ltd. Light emitting device with transparent plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8378358B2 (en) 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
US8405105B2 (en) 2009-02-18 2013-03-26 Everlight Electronics Co., Ltd. Light emitting device
US8772802B2 (en) 2009-02-18 2014-07-08 Everlight Electronics Co., Ltd. Light emitting device with transparent plate

Also Published As

Publication number Publication date
TW200611429A (en) 2006-04-01

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MM4A Annulment or lapse of patent due to non-payment of fees