TWI237881B - Package structure of surface mount device (SMD) LED - Google Patents

Package structure of surface mount device (SMD) LED Download PDF

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Publication number
TWI237881B
TWI237881B TW092130990A TW92130990A TWI237881B TW I237881 B TWI237881 B TW I237881B TW 092130990 A TW092130990 A TW 092130990A TW 92130990 A TW92130990 A TW 92130990A TW I237881 B TWI237881 B TW I237881B
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Taiwan
Prior art keywords
emitting diode
light
metal
metal pattern
patent application
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TW092130990A
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Chinese (zh)
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TW200516738A (en
Inventor
Wen-Lung Su
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Lighthouse Technology Co Ltd
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Publication of TWI237881B publication Critical patent/TWI237881B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A surface mount device (SMD) LED package structure has a first metal pattern, a second metal pattern, and a LED mounted on the surface of the first metal pattern. The first metal pattern has a welding area, a collar area, and a mount area. The width of the collar area is smaller than the width of the welding area, and the thickness of the collar area is smaller than the thickness of the welding area and the mount area. The bottom of the mount area contacts with a printed circuit board (PCB) such the heat dissipation increases.

Description

1237881 五、發明說明（1) 【技術領域】 本發明係提供一種表面黏著型（SMD)發光二極體之封裝結 構，尤指一種具高度散熱性及高封裝強度之表面黏著型發 光二極體之封裝結構。 【先前技術】1237881 V. Description of the invention (1) [Technical Field] The present invention provides a surface-adhesive (SMD) light-emitting diode packaging structure, especially a surface-adhesive light-emitting diode with high heat dissipation and high packaging strength. Its packaging structure. [Prior art]

照明光源在現代生活中是不可或缺的，而世界各國隨著現 代化層次和生活品質的需求不同，對照明光源的需求程度 亦不同。鎢絲燈泡和水銀燈管是目前最普遍使用的照明光 源，然而鎢絲燈的發光過程係將大部份的電能轉換成輻射 熱，發光效率並不高。此外，水銀燈管的發光效率雖然優 於鎢絲燈，但燈管内壁所塗抹的水銀，在燈管被丟棄時會 造成環境污染。因此，如何改善發光效率，並且符合環保 要求，即成為開發新照明光源必備之條件。Lighting sources are indispensable in modern life, and countries around the world have different levels of demand for lighting sources with different levels of modernization and quality of life. Tungsten filament bulbs and mercury lamps are currently the most commonly used sources of illumination light. However, the tungsten light bulb's lighting process converts most of the electrical energy into radiant heat, and the luminous efficiency is not high. In addition, although the luminous efficiency of the mercury lamp is better than that of the tungsten filament lamp, the mercury applied to the inner wall of the lamp will cause environmental pollution when the lamp is discarded. Therefore, how to improve the luminous efficiency and meet the environmental protection requirements becomes the necessary condition for the development of new lighting sources.

發光二極體（light emitting diode, LED)即為符合上述 省電以及環保要求之一新照明光源。發光二極體是一種半 導體元件，可以提供較長的使用壽命，而且其材料由電轉 換為光的效率高，更可以大幅降低耗電量。和一般的照明 光源比較起來，發光二極體光源的壽命較一般照明光源高 出5 0〜1 0 0倍，且其耗費的電量卻約是一般照明光源的1 /3 〜1 / 5。此外，由於發光二極體元件是一種極小的發光A light emitting diode (LED) is one of the new lighting sources that meets the aforementioned power saving and environmental protection requirements. A light emitting diode is a semiconductor component that can provide a long service life, and its material is efficiently converted from electricity to light, which can significantly reduce power consumption. Compared with the general lighting source, the life of the light-emitting diode light source is 50 ~ 100 times longer than that of the general lighting source, and its power consumption is about 1/3 to 1/5 of the general lighting source. In addition, since the light emitting diode element is a very small light emitting

第6頁 1237881 五、發明說明（2) 源’具有配合各種應用設備小型化之優點，因此可望取代 鶴絲燈和水銀燈，成為新照明光源之主流。 請參考圖一與圖二’圖一為.習知一表面黏著型（surface m 〇 u n t d e v i c e，S M D )發光二極體封裝結構1 〇之上視圖，而 圖二為圖一所示之表面黏著型發光二極體封裝結構丨〇沿 11方向之剖面圖。如圖一與圖二所示，表面黏著型發光 二極體封裝結構1〇包含有一由二τ字型金屬板12A與12B組 成之金屬支架型基板、一發光二極體晶粒14固定於金屬板 1 2 A之表面、以及一封膠ι 6包覆金屬板丨2 A與1 2β。發光二 極體晶粒1 4包含有一正電極丨8與一負電極2 〇，分別利用一 導線22與24連接至金屬板12B與12A。另外，金屬板12A與 1 2 B係分別利用焊錫2 6，固定於一電路板2 8之上。 時其表 與封膠 封裝結 方式來 使發光 嚴重影 封裝結 14產生 面並包含* 1 6之間之接 構1 0之結構 完全包覆金 二極體元件 響發光二極 構1 0散熱途 之熱能僅能 金屬支架型基板主要係由銅所構成，同 層銀薄膜以增加其導電性，然而由於銀 合能力不佳，因此為了加強發光二極體 強度，習知都利用封膠1 6以上下包覆的 屬支架型基板。然而此種封裝方式不僅 厚度增加，更使其散熱效果大打折扣， 體的壽命。習知表面黏著型發光二極體 徑如圖二之箭號所示，發光二極體晶粒 透過焊錫26散發至電路板28 (圖一未%、 1237881 五、發明說明 由於發光 使用，然 熱的環境 光二極體 更顯重要 也可以避 壞。此外 或是發光 接影響發 成為設計 (3) 二極體 而產生 又會減 集合在 i良好 免發光 ，發光 二極體 係利 光能 少發 一起 的散 二極 二極 光源 光二極體的 用電 之同 光二 發光 熱可 體的 體的 產品 使用 子電洞快速作用產生光能以供 時卻會伴隨著熱能的產生，而過 極體的壽命。特別是當多顆的發 以應用於照明時，散熱的問題就 以提升發光二極體的發光效率， 工作溫度過高而將發光二極體燒 使用環境或光源的工作溫度，亦 本身的散熱性好壞，都間接或直 壽命或時數。因此如何有效散熱 結構上一重要課題。 内容 私#本毛明之主要目的在於提供一種具高度散熱性之表面 型發光二極體之封裝結構，以解決習知表面黏著型發 光二極體封裝結構散熱效果不佳之問題。 根據本發明之申請專利範圍，係揭露一種表面黏著型 (SMD)發光二板體之封裝結構。該表面黏著型發光二極體 之封裝結構’包含有一金屬支架型（1 e a d f r a m e )基板、一 發光二極體晶粒固定於該金屬支架型基板表面、以及一封 膠。該金屬支架型基板包含有一第一金屬圖案與一第二金 屬圖案。該第一金屬圖案包含有一焊接區、一頸部區及一 晶粒黏著區，該頸部區之寬度小於該焊接區之寬度，該頸 1237881 五、發明說明（4) ~ 部區^厚度小於該焊接區與該晶粒黏著區之厚度，且該晶 粒黏著區之底部與一電路板接觸，以發揮散熱效果。該發 光二極體晶粒係黏著並固定於該第一金屬圖案之該晶粒黏 著區表面，且該發光二極體晶粒包含有一第—電極連接於 該第一金屬圖案，以及一第二電極連接於該第二金屬圖 案。該封膠包覆該發光二極體晶粒且環繞該頸部區，同時 接合該第一金屬圖案與該第二金屬圖案。 由於本發明之表面黏著型發光二極體封裝結構包含有一頸 部區與一晶粒黏著區。該頸部區由於寬度較小且厚度較 薄，因此可減小封膠的厚度卻能增加表面黏著型發光二極 體的封裝結構強度。而晶粒黏著區之底部由於與一電路板 接觸，因此可增加散熱面積以有效提高散熱效果。 【實施方法】 ^ ?三及圖四，圖三為本發明一較佳實施例之表面黏 者聖發光一極體封裝結構5〇之上視圖，而圖四為圖三所示 之表面黏著型發光二極體封襄結構沿切線33,方向之剖面 3二ί 5圖四所示，本發明表面黏著型發光二極體封Page 6 1237881 V. Description of the invention (2) The source ’has the advantage of miniaturization in conjunction with various application equipment, so it is expected to replace crane lamps and mercury lamps and become the mainstream of new lighting sources. Please refer to Fig. 1 and Fig. 2 '. Fig. 1 is a top view of a surface mount type (SMD) light emitting diode package structure 10, and Fig. 2 is a surface mount type shown in Fig. 1 A cross-sectional view of the light emitting diode packaging structure along the 11 direction. As shown in Figures 1 and 2, the surface-attached light-emitting diode package structure 10 includes a metal bracket-type substrate composed of two τ-shaped metal plates 12A and 12B, and a light-emitting diode die 14 fixed to the metal. The surface of the plate 1 2 A and a piece of glue 6 cover the metal plate 2 A and 1 2β. The light-emitting diode die 14 includes a positive electrode 8 and a negative electrode 20, which are connected to the metal plates 12B and 12A by a lead wire 22 and 24, respectively. In addition, the metal plates 12A and 12B are respectively fixed on a circuit board 28 using solder 26. At the time, the surface and the sealing method of the encapsulation are used to make the light-emitting severe shadow encapsulation junction 14 produce a surface and the structure including the connection structure between 10 and 10 is completely covered with the gold diode element and the light emitting diode structure is cooled. Thermal energy can only be used for metal stent-type substrates, which are mainly made of copper, with the same layer of silver thin film to increase its conductivity. However, due to poor silver bonding ability, in order to enhance the strength of light-emitting diodes, it is customary to use sealants. 16 The upper and lower layers are bracket-type substrates. However, this packaging method not only increases the thickness, but also greatly reduces its heat dissipation effect, and its life span. The diameter of the conventional surface-attached light-emitting diode is shown by the arrow in Fig. 2. The light-emitting diode grains are emitted to the circuit board 28 through the solder 26. (Fig. 1%, 1237881 V. Description of the invention Due to the use of light, it is hot Ambient light diodes are more important and can be avoided. In addition, the light-emitting diode may affect the design. (3) Diodes produced by the light-emitting diodes will reduce the collection of light in i. The products of the light-emitting diode and the light-emitting diode which are used to disperse the two-diode light source are the same as those of the two-light-emitting thermal body. The use of sub-holes to quickly generate light energy for the time will be accompanied by the generation of thermal energy and the life of the polar body. Especially when multiple hairs are used in lighting, the problem of heat dissipation is to improve the luminous efficiency of the light emitting diodes. If the operating temperature is too high, the light emitting diodes will be burned using the operating environment or the operating temperature of the light source. The quality is good or bad, all indirectly or directly life or hours. Therefore, how to effectively dissipate the structure is an important issue. 内容 私 # 本 毛 明 's main purpose is to provide a high degree of heat dissipation. The surface-type light-emitting diode packaging structure solves the problem of poor heat dissipation effect of the conventional surface-adhesive light-emitting diode packaging structure. According to the scope of the patent application of the present invention, a surface-adhesive (SMD) light-emitting diode board is disclosed. The packaging structure of the surface-attached light-emitting diode includes a metal frame type (1 eadframe) substrate, a light-emitting diode die fixed on the surface of the metal frame-type substrate, and a piece of glue. The metal The stent-type substrate includes a first metal pattern and a second metal pattern. The first metal pattern includes a welding region, a neck region, and a die adhesion region. The width of the neck region is smaller than the width of the solder region. The neck 1237881 V. Description of the invention (4) ~ The thickness of the partial region is smaller than the thickness of the soldering region and the die bonding area, and the bottom of the die bonding area is in contact with a circuit board to exert the heat dissipation effect. The polar crystal grains are adhered and fixed on the surface of the crystal adhesion region of the first metal pattern, and the light emitting diode crystal includes a first electrode connected to the first electrode pattern. A metal pattern and a second electrode are connected to the second metal pattern. The sealant covers the light-emitting diode grains and surrounds the neck region, and simultaneously joins the first metal pattern and the second metal pattern. The surface-adhesive light-emitting diode packaging structure of the present invention includes a neck region and a die adhesion region. The neck region has a small width and a thin thickness, so the thickness of the sealant can be reduced but the surface adhesion can be increased. The packaging structure strength of the light-emitting diode. The bottom of the die attach area is in contact with a circuit board, so the heat dissipation area can be increased to effectively improve the heat dissipation effect. [Implementation method] 3 and Figure 4, Figure 3 is based on A top view of the surface-adhered light-emitting diode package structure 50 of a preferred embodiment of the invention, and FIG. 4 is a cross-section 3 of the surface-adhesive light-emitting diode seal structure shown in FIG. 3 along the tangent line 33 and the direction 3 As shown in FIG. 5, the surface-attached light-emitting diode seal of the present invention is shown in FIG. 4.

、、1琉固=各有二不相接觸之一第一金屬圖案52八及一第 二金屬圖案^2Β組成之金屬支架型基板，以及一發光二極 體晶2 54黏著於第一金屬圖案52Α之一晶粒黏著區68表 面。發光二極體晶粒54包含有一正電極56及一負電極58,， 1, Lugu = Metal scaffold substrate consisting of two first metal patterns 52 8 and one second metal pattern ^ 2B, and a light-emitting diode 2 54 each adhered to the first metal pattern. One surface of a grain adhesion region 68 of 52A. The light emitting diode grain 54 includes a positive electrode 56 and a negative electrode 58.

第9頁 1237881 五、發明說明（5) —— — 分別利用導線60及62連接至第二金屬圖宰5 圖案52A’並利用一外部電源(圖未示匕== 光能。此外，第一金屬圃茔、人之電壓以產生 3部區66。其中，頸部區W《寬度^、3於^^ Ϊ Π 一焊接區7〇,且第二金屬圖案52B與第—金 接於一電路板74(圖三未示）上。同時晶粒黏$ ^^ 與電=板74(圖三未示）相接觸以增加散熱此發^ 晶：:4產i之熱能可傳導至電… 效如升另外，弟一金屬圖案52A與第二金屬圖宰5 二 用-封膠76(-般係由環氧樹脂所組成）（=2B= 覆封裝’且封膠76(圖三未示）環繞第一金屬圖未宰^力;^包 6^ =強化表面黏著型發光二極體封裝結構50之‘裝 〜構。另外，為進一步加強封裝之结構強度， 麗 第f金屬圖案52^各包含有至少—貫穿之鑽孔77 m·未τ)’使封勝76(圖三未示）能故入鑽孔77内以加強 ⑺構強度，而鑽孔77之數目及形狀可視實際需要加以調整 更改’不侷限於本實施例所揭露之作法。 ^ 值得1意的是，由於頸部區6 6之1度較薄且寬度較小，因 此封膠76之厚度較習知技術之封膠為小，但卻可發揮更強 的接合效果。此外，第一金屬圖案52A之頸部區66與焊接 區64底部之交界處以及第二金屬圖案52B之底部分別包含Page 91237881 V. Description of the invention (5) —— Use wires 60 and 62 to connect to the second metal figure 5 pattern 52A ′ and use an external power source (not shown in the figure == light energy. In addition, the first The metal tomb and the human voltage generate three areas 66. Among them, the neck area W <width ^, 3 to ^^ Ϊ Π a welding area 70, and the second metal pattern 52B and the first gold are connected to a circuit Plate 74 (not shown in Figure 3). At the same time, the die sticks to contact with electricity = Plate 74 (not shown in Figure 3) to increase heat dissipation. Crystal :: The heat produced by 4 can be transmitted to electricity ... Rusheng In addition, the first metal pattern 52A and the second metal figure 5 are used for two purposes-sealant 76 (usually composed of epoxy resin) (= 2B = encapsulation and sealant 76 (not shown in Figure 3) ^ Pack 6 ^ = enhanced surface-adhesive light-emitting diode packaging structure 50. In addition, in order to further strengthen the structural strength of the package, the Lidi f metal pattern 52 ^ each Contains at least-through holes 77 m · wei τ 'so that Feng Sheng 76 (not shown in Figure 3) can be inserted into the holes 77 to strengthen the structural strength, and the number and shape of the holes 77 can be based on actual conditions Need to be adjusted and changed 'is not limited to the method disclosed in this embodiment. ^ It is worth noting that, because the neck region 66 is thinner and smaller in width, the thickness of the sealant 76 is greater than that of conventional techniques. The sealant is small, but it can exert a stronger joining effect. In addition, the junction of the neck portion 66 of the first metal pattern 52A and the bottom of the welding region 64 and the bottom of the second metal pattern 52B include

第10頁 1237881 五、發明說明（6) 一~、 ^一'' ------------------------------- ί ί Ξ Ϊ ?上凹槽78及80，使得第—金屬圖案52A與第二 ί ί ΐ f 2部之封膠76可欲人凹槽78及80而進一步加 二妙Γ，封裳結構50。如圖四中之箭號所示，發光 ΐ ί γ: Γί t之熱能可藉由烊錫72與晶粒黏著區68底 ^Ιίί：； 另外’更值得注意的是，晶粒黏著區6 8之二側包含有一延 又:參考圖五，圖五為本發明金屬支架型基板之示意 ，。如圖五所不，由於金屬支架型基板係由表面鍍有銀g (圖未不）上之别係為複數個連接在一 —金屬圖案52A上並利用封膠76(巧 3圖耒4 ϊ Ξ ί 一個一個封裝結構’最後再利用焊錫 m )知接於電路板74(圖未示）上’因此於製作過程 I ϊ = f延伸區82連接在一起以加強結構強度，否則第一 ^^案52人易於製作過程中斷裂，且延伸區82由於 74接觸，纟具有增加散熱面積的作用。然、而在材質電 ，^ ^結構強度允許的情況下，第一金、 包含有延伸區82。 〜J J不 ϊ ί ί圖六與圖七，圖六為本發明另一實施例之表面黏著 I發光一極體封裴結構50之上，視圖，而圖七為圖六所示之 1237881 五、發明說明（7) 表面黏著型發光二極體封裝結構沿切線6 6，方向之剖面 圖。為方便說明圖六及圖七中與圖三及圖四中相同的元件 使用相同的標號。 如圖六及圖七所示，本發明表面黏著型發光二極體封裝結 構5 0包含有二不相鄰之一第一金屬圖案5 2 A及一第二金屬 圖案5 2 B組成之金屬支架型基板，以及一發光二極體晶粒 5 4黏著於第一金屬圖案5 2 A之表面。發光二極體晶粒5 4包 含有一正電極5 6及一負電極5 8，分別利用導線6 〇及6 2連接 至第二金屬圖案52B及第一金屬圖案52A。第一金屬圖案 5 2 A及第二金屬圖案5 2 B係利用一由環氧樹脂組成之封膠7 6 加以包覆封裝，且為了增加封膠76與第一金屬圖案52八及 第二金屬圖案5 2 B之接合能力，第一金屬圖案5 2 A及第二金 屬圖案52B之表面包含有複數個孔洞84，使得封膠76可參 =第一金屬圖案52A及第二金屬圖案52B内並形成複數個夕卡 銷0 如此一來，封膠76不需要環繞第一金屬圖案 屬圖案52B之底部亦可有效包覆第一金屬圖案^第二-金 屬圖案52B。同時由於第一金屬圖案52A及第、_ 一至 52B利用焊錫72焊接於一電路板74上，在此一金屬圖案 屬圖案52A之底部可完全接觸電路板74藉此二，下第一金 積，因此本發明表面黏著型發光二極體封n散熱面 能力可有效提升。如圖七中之箭號所示，t :構50之散熱 I九二極體晶粒Page 10, 1237881 V. Description of the invention (6) I ~, ^ 一 '' ------------------------------- ί ί Ξ Ϊ The upper grooves 78 and 80 are made, so that the first-metal pattern 52A and the second ΐ 之 f 2 sealant 76 can be added to the grooves 78 and 80 to further add two wonderful Γ, the seal structure 50. As shown by the arrow in Figure 4, the light-emitting ΐ γ: Γί t's thermal energy can be through the tin 72 and the grain adhesion area 68 ^ Ιίί: In addition, 'more notably, the grain adhesion area 6 8 The other side includes an extension: Refer to FIG. 5, which is a schematic diagram of a metal bracket-type substrate according to the present invention. As shown in Figure 5, since the metal support type substrate is coated with silver on the surface (not shown in the figure), it is connected to a metal pattern 52A and uses a sealant 76 (Figure 3, Figure 4 and Figure 4). ί One by one packaging structure 'last reused solder m) is known to be connected to the circuit board 74 (not shown), so during the manufacturing process I ϊ = f extension area 82 is connected together to strengthen the structural strength, otherwise the first ^^ case 52 people are easy to break during the production process, and the extension area 82 has an effect of increasing the heat dissipation area due to 74 contact. However, if the material strength and structural strength allow, the first gold, including the extension region 82. ~ JJ 不 ϊ ί Figure 6 and Figure 7, Figure 6 is a view of another embodiment of the present invention, the surface is adhered to the light-emitting polar body seal structure 50, a view, and Figure 7 is shown in Figure 6 1237881 5. Description of the invention (7) A cross-sectional view of the surface-attached light-emitting diode packaging structure along the tangent line 66. For the convenience of explanation, the same elements in FIGS. 6 and 7 as those in FIGS. 3 and 4 are denoted by the same reference numerals. As shown in FIG. 6 and FIG. 7, the surface-attached light-emitting diode packaging structure 50 of the present invention includes a metal support composed of two non-adjacent first metal patterns 5 2 A and a second metal pattern 5 2 B. And a light emitting diode die 54 are adhered to the surface of the first metal pattern 5 2 A. The light-emitting diode die 5 4 includes a positive electrode 56 and a negative electrode 58, which are connected to the second metal pattern 52B and the first metal pattern 52A by wires 60 and 62, respectively. The first metal pattern 5 2 A and the second metal pattern 5 2 B are encapsulated with a sealant 7 6 composed of epoxy resin, and in order to increase the sealant 76 and the first metal pattern 52 and the second metal The bonding ability of the pattern 5 2 B. The surfaces of the first metal pattern 5 2 A and the second metal pattern 52B include a plurality of holes 84, so that the sealant 76 can be connected to the first metal pattern 52A and the second metal pattern 52B. A plurality of latches are formed. In this way, the sealant 76 does not need to surround the bottom of the first metal pattern metal pattern 52B and can effectively cover the first metal pattern ^ second-metal pattern 52B. At the same time, since the first metal pattern 52A and the first through 52B are soldered to a circuit board 74 using solder 72, the bottom of the metal pattern 52A can completely contact the circuit board 74, and thus the first gold deposit, Therefore, the surface-attached light-emitting diode of the present invention can effectively improve the ability to seal the n heat dissipation surface. As shown by the arrow in Figure 7, t: heat dissipation of structure 50 I diode crystal grains

1237881 五、發明說明（8) — 能可藉由第一金屬圖案⑽底部與焊錫72傳導 二：案：:明表…^ f ^ ^ ^ € ^ ^ ^ i J J J J J J ^ ^ ^ ? ^ ^ ^ 熱效果，，由於丄;明: 厗度部此柁加表面黏著型發光二極體的封裝結構強度。1237881 V. Description of the invention (8)-Can be conducted through the first metal pattern ⑽ bottom and solder 72 Second: Case :: Ming table ... ^ f ^ ^ ^ € ^ ^ ^ i JJJJJJ ^ ^ ^? ^ ^ ^ Heat Effect, due to 丄; Ming: the 厗 degree of this plus the surface-attached light-emitting diode package structure strength.

利範 專蓋 請涵 第13頁 I237881 圖式簡單酬 81式之簡單說明 圖 圖 知一表面黏著型發光二極體封裝結構之上視圖。 圖 結 i，方4圖一所示之表面黏著型發光二極體封装結構沿 々向之剖面圖。 忑，明一較佺實施例之表面黏著型發光二極體封裝 〈上視圖。 iWj 义 33,方所示之表面黏著型發光二極體封裂結構沿切線 乃向之剖面圖。 圖^為本發明金屬支架型基板之示意圖。 構2 ί ΐί T另一實施例之表面黏著型發光二極體封裝結 方4向表面黏著型發光二極體封裝結構沿切線 圖式之符號說明 10 14 18 22 28 f 2二極體封裝結才』 發光二極體晶粒 正電極 24 導線 電路板 52 A第一金屬圖案 54發光二極體晶板 1 2 A，1 2 B 金屬板 16封膠 20 負電極 26 焊錫 5 0 發光二極體封裝結構 52B第二金屬圖案 5 6 正電極Lee Fan Cover Please refer to page 13 I237881 Simple diagrams and simple explanations of 81 diagrams Diagrams Figure Top view of a surface-adhesive light-emitting diode package structure. Fig. 4 is a cross-sectional view of the surface-attached light-emitting diode package structure shown in Fig. 1 along the direction of the arrow. That is, the surface-adhesive light-emitting diode package of the first embodiment of the first embodiment. <Top view. iWj Y 33, A cross-sectional view of the surface-attached light-emitting diode sealing structure shown in the square along the tangential direction. FIG. ^ Is a schematic diagram of a metal bracket-type substrate of the present invention. Structure 2 ΐ ΐ T Another embodiment of the surface-attached light-emitting diode packaging structure 4 4-way surface-attached light-emitting diode packaging structure Symbol description along the tangent pattern 10 14 18 22 28 f 2 Diode packaging structure ”LED diode positive electrode 24 lead circuit board 52 A first metal pattern 54 light emitting diode crystal plate 1 2 A, 1 2 B metal plate 16 sealant 20 negative electrode 26 solder 5 0 light emitting diode Package structure 52B second metal pattern 5 6 positive electrode

1237881 圖式簡單說明 58 負電極 60 導線 62 導線 64 焊接區 66 頸部區 68 晶粒黏 70 焊接區 72 焊錫 74 電路板 76 封膠 77 鑽孔 78 凹槽 80 凹槽 82 延伸區 84 孔洞1237881 Brief description of drawings 58 Negative electrode 60 Lead 62 Lead 64 Soldering area 66 Neck area 68 Die bonding 70 Welding area 72 Solder 74 Circuit board 76 Sealant 77 Drilling 78 Groove 80 Groove 82 Extension area 84 Hole

第15頁Page 15

Claims (1)

1237881 六、申請專利範圍 •了種表面黏著型（SMD)發光二極體之封裝結構 有·· 一金屬支 一第一金 部區及一 度，部分 厚度，且 熱效果； 第二金 發光二 粒黏著區 於該第一 包含 案 以及 一封膠， 合該第一 架型屬圖 晶粒 該頸 該晶 以及 屬圖 極體 表面 金屬 包覆 金屬 (lead frame)基板，包含有： 案，該第一金屬圖案包含有一焊接 黏著區，該頸部區之寬度小於該焊 部區之厚度小於該焊接區與該晶粒 粒黏著區之底部與一電路板接觸， 案； 晶粒’黏著並固定於該第一金屬圖 ’該發光二極體晶粒包含有一第一 圖案’以及一第二電極連接於該第 該發光二極體晶粒且環繞該頸部區 圖案與該第二金屬圖案。 區、一頸 接區之寬 黏著區之 以發揮散 案之該晶 電極連接 二金屬圖 ，同時接 •如申请專利範圍第1項所述之表面黏著型發光二極體 封裝結構，其中該金屬支架型基板包含有銅。 3·如申請專利範圍第2項所述之表面黏著型發光二極體 封裳結構，其中該金屬支架型基板表面包含有一銀薄膜 4 ·如申請專利範圍第2項所述之表面黏著型發光二極體之 封褒結構，其中該金屬支架型基板表面包含有一錄銀|薄1237881 6. Scope of patent application • The package structure of a surface-adhesive (SMD) light-emitting diode includes: a metal branch, a first gold section and a degree, a partial thickness, and a thermal effect; The adhesion area in the first inclusion case and a glue, combined with the first frame type crystal grain, the neck crystal, and the metal frame metal lead frame on the surface of the polar body, includes: the case, the first A metal pattern includes a solder adhesion region, the width of the neck region is smaller than the thickness of the solder joint region, and the bottom of the solder region and the crystal grain adhesion region is in contact with a circuit board. The first metal pattern 'the light emitting diode die includes a first pattern' and a second electrode connected to the first light emitting diode die and surrounding the neck region pattern and the second metal pattern. The wide adhesion area of the region and the neck connection area is used to connect the two metal patterns of the crystalline electrode, and at the same time, the surface-adhesive light-emitting diode packaging structure described in item 1 of the patent application scope, wherein the metal The stent-type substrate contains copper. 3. The surface-adhesive light-emitting diode sealing structure described in item 2 of the scope of the patent application, wherein the surface of the metal bracket-type substrate includes a silver film 4 · The surface-adhesive light-emitting structure described in item 2 of the patent scope Encapsulation structure of a diode, wherein the surface of the metal bracket-type substrate includes a silver recording | thin 第16頁 1237881 六、申請專利範圍 一一一 m 〇 5·如申請專利範圍第1項所述之表面黏著型發光二極體之 =裳結構，其中該第二金屬圖案包含有一焊接區，且該金 屬支架型基板於該第一金屬圖案之該焊接區與該第二金屬 圖案之該焊接區利用焊錫焊接於該電路板上。 6 ·如申請專利範圍第5項所述之表面黏著型發光二極體之 ，裝結構，其中該黏著型發光二極體產生之熱能可藉由該 知錫與該晶粒黏著區底部傳.導至該電路板。 7·如申凊專利範圍第1項所述之表面黏著型發光二極體之 f裝結構/其中該第一金屬圖案之該頸部區與該焊接區之 父界處包含有一圓弧型之凹槽供該封膠嵌入以強化該表面 黏著型發光二極體之封裳結構。 8 · ^申請專利範圍第1項所述之表面黏著型發光二極體之 ，裳結其中該第二金屬圖案包含有一圓弧型之凹槽供 該封膠嵌入以強化該表面黏著型發光二極體之封裝結構。 9 ·如申請專利範圍第1項所述之表面黏著型發光二極體之 封裝結構’其中該封膠係為一環氧樹脂。 1 0 ·如申請專利範圍第1項所述之表面黏著型發光二極體之Page 161237881 VI. Application scope of patent -11 m 〇5. The surface-attached light-emitting diode described in item 1 of the scope of patent application = skirt structure, wherein the second metal pattern includes a welding area, and The metal bracket-type substrate is soldered to the circuit board by soldering the soldering area of the first metal pattern and the soldering area of the second metal pattern. 6 · The surface-attached light-emitting diode as described in the scope of the patent application, the mounting structure, wherein the thermal energy generated by the adhesive-type light-emitting diode can be transmitted by the know tin and the bottom of the crystal adhesion zone. Lead to the board. 7. The f-mount structure of the surface-attached light-emitting diode as described in item 1 of the patent claim / wherein the neck area of the first metal pattern and the father boundary of the welding area include a circular arc The groove is used for embedding the sealant to strengthen the seal structure of the surface-adhesive light-emitting diode. 8 · ^ For the surface-adhesive light-emitting diode described in item 1 of the scope of patent application, the second metal pattern of the skirt knot includes an arc-shaped groove for the sealant to embed to strengthen the surface-adhesive light-emitting diode. Packaging structure of polar body. 9 · The surface-attached light-emitting diode packaging structure according to item 1 of the scope of the patent application, wherein the sealant is an epoxy resin. 1 0 · The surface-attached light-emitting diode described in item 1 of the patent application 第17頁 1237881 六、申請專利範圍 — —〜％ 封裝結構，其中該晶粒黏著區進一步包含有一延 以強化該表面黏著型發光二極體之封裝二構並$ 2，，轎 積。 曰口散熱面 11·如申請專利範圍第1項所述之表面黏著型發一 封裝結構，其中該第一電極與該弟二電極係分別^極體之 屬導線連接至該第一金屬圖案與該第二金屬圖案。用〜金 1 2 ·如申請專利範圍第丨項所述之表面黏著型弁— 封裝結構，其中該第一金屬圖案與該第二金屬圖f ^ ?之 有，少一個上下貫穿之鑽孔，供該封膠嵌人以增二二含 黏著型發光二極體之封裝結構的結構強度。 面 ^3··—種表面黏著型（SMD)發光二極體之封裝結構，包含 屬支架型（lead frame)基板，包含有： 以#二ί f圖案，該第一金屬圖案底部與一電路板接觸， 赞揮散熱效果；以及 :與該第一金屬圖案不相接觸之第二金屬圖案，· 發，二極體晶粒，黏著並固定於該第一金屬圖案之表 屬si ί發光二極?晶粒包含有一第一電極連接於該第一金 一封^，以及一第二電極連接於該第二金屬圖案；以及 宰邀^常包覆ΐ金屬支架型基板表面以連接該第一金屬圖 系興该第二金屬圖案。Page 17 1237881 6. Scope of patent application — ~% Package structure, in which the die attach area further includes a package structure that extends to strengthen the surface-adhesive light-emitting diode, which is $ 2, and product. The cooling surface 11 · The surface-adhesive type package structure as described in item 1 of the scope of the patent application, wherein the first electrode and the second electrode are respectively connected to the first metal pattern and the first metal pattern. The second metal pattern. Use ~ Gold 1 2 · Surface-adhesive type —package structure as described in item 丨 of the patent application scope, wherein the first metal pattern and the second metal pattern f ^ are there, and one less drilled through, The sealant is used for embedding to increase the structural strength of the packaging structure containing the adhesive light-emitting diode. Surface ^ 3 ·· —A kind of package structure of surface-adhesive type (SMD) light-emitting diodes, including a lead frame substrate, including: # 二 ίf pattern, the bottom of the first metal pattern and a circuit Plate contact, praising the effect of heat dissipation; and: a second metal pattern that is not in contact with the first metal pattern, hair, a diode crystal, adhered and fixed to the surface of the first metal pattern. The electrode chip includes a first electrode connected to the first metal plate, and a second electrode connected to the second metal pattern; and the metal substrate is usually coated on the surface of the metal frame type substrate to connect the first electrode. The metal pattern is the second metal pattern. I23788l 〜--------------------—____— 一— — 、、申請專利顧 — — 申請專利範圍第丨3項所述之表面黏著型發光二極體 子敦結構，其中該金屬支架基板包含有銅。 1 5 4n tfc ^ 甲請專利範圍第1 3項所述之表面黏著型發光二極體 媒封破結構，其中該金屬支架塑基板表面包含有一銀薄 之·如申請專利範圍第丨4項所述之表面黏著型發光二極體 膜封裝結構，其中該金屬支架贺基板表面包含有一鎳銀薄 1 7·如申請專利範圍第13項所述之表面黏著型發光二極體 之封裝結構，其中該封膠係為一環氧樹脂。 1 8 ·如申請專利範圍第1 3項所述之表面黏著型發光二極體 之封裝結構，其中該第一電極與該第二電極係分別利用一 金屬導線連接至該第一金属圖案與該第二金屬圖案。 1 9 ·如申請專利範圍第丨3項所述之表面黏著型發光二極體 之封裝結構’其中該第一金屬圖案另包含有一焊接區、一 頸部區與一晶粒黏著區，該頸部區之寬度小於該焊接區之 寬度’該頸部區之厚度小於該焊接區與該晶粒黏著區之厚 度，且該晶粒黏著區之底部與該電路板接觸，以發揮散熱I23788l ～ --------------------—____— One — — ,, patent application — — Surface-adhesive type two described in the scope of patent application No. 丨 3 The polar body structure, wherein the metal support substrate includes copper. 1 5 4n tfc ^ The surface-attached light-emitting diode medium sealing structure described in item 13 of the patent scope, wherein the surface of the plastic substrate of the metal bracket contains a thin silver layer. The surface-attached light-emitting diode film packaging structure described above, wherein the surface of the metal holder substrate includes a thin nickel-silver package structure as described in item 13 of the patent application scope, wherein The sealant is an epoxy resin. 1 8 · The surface-attached light-emitting diode package structure described in item 13 of the scope of patent application, wherein the first electrode and the second electrode are connected to the first metal pattern and the first electrode by a metal wire, respectively. Second metal pattern. 19 · The surface-attached light-emitting diode packaging structure according to item 3 of the patent application scope, wherein the first metal pattern further includes a soldering region, a neck region, and a die adhesion region. The neck The width of the partial region is smaller than the width of the soldering region. The thickness of the neck region is smaller than the thickness of the soldering region and the die bonding region, and the bottom of the die bonding region is in contact with the circuit board to exert heat dissipation. 1237881 六、申請專利範圍 效果。 2 0 .如申請專利範圍第1 9項所述之表面黏著型發光二極體 之封裂結構，其中該第二金屬圖案包含有一焊接區，且該 第—金脣圖案之該焊接區與該第二金脣圖案之該焊接區係 利用焊錫焊接於一電路板上。 2 1 ·如申請專利範圍第2 〇項所述之表面黏著型發光二極體 裝結構，其中該黏著型發光二極體產生之熱能可藉由 Λ k錫與该晶粒黏著區底部傳導至該電路板。 2 第 圍 範 利 專 請 中 如 光 發 型 著 黏 面 表 之 述 烊化 該強 與以 區入 部嵌 頸膠 該封 之該 案供。 圖槽構 彡屬凹結 Μ金之裝 19J1型封 1第弧之 該圓體 中一極 其有二 ，含光 構包發 結處型 裝界著 封交黏 之之面 骨 &amp; 區表 接該 封申請專利範圍第1 9項所述之表面黏著型發光二極體 批蚌f Ϊ構’其中該第二金屬圖案包含有一圓旅型之凹榫 ς以、&gt; 嵌入以強化該表面黏著型發光二極體之封裝妗9 之封^申μ請專利範圍第1 9項所述之表面黏著型發光二極體 區，^結構 其中該封膠環繞該第一金屬圖案之該頸部 &quot;U強化該表面黏著型發光二極體之封裝結構。1237881 6. Scope of Patent Application Effect. 20. The surface-sealed light-emitting diode sealing structure according to item 19 of the scope of the patent application, wherein the second metal pattern includes a welding area, and the welding area of the first-gold lip pattern and the The bonding area of the second gold lip pattern is soldered to a circuit board by solder. 2 1 · The surface-attached light-emitting diode mounting structure described in item 20 of the scope of the patent application, wherein the thermal energy generated by the adhesive light-emitting diode can be conducted to Λ k tin and the bottom of the adhesion area of the crystal grains to The circuit board. 2 Fan Li specially asked the statement of Zhongru Guangfa's cohesive surface to blunt the case and the case to embed the neck glue into the case. Figure slot structure is a concave knot M gold package 19J1 type 1 first arc of this round body is extremely two, containing the light structure of the package at the junction of the bounding surface of the face bone & area surface connection The surface-attached light-emitting diode batch clamshell structure described in item 19 of the application for patent application, wherein the second metal pattern includes a round-shaped tenon, &gt; embedded to enhance the surface adhesion Encapsulation of a light-emitting diode 妗 9, application of the surface-attached light-emitting diode region described in item 19 of the patent scope, ^ structure wherein the sealant surrounds the neck of the first metal pattern & quot U strengthens the packaging structure of the surface-adhesive light-emitting diode. 第20 .頁Page 20. 1237881 六、申請專利範圍 2 5 .如申請專利範圍第1 9項所述之表曹1T箸型發光二極體 之封裝結構，其中該晶粒黏著區進一步包含有一延伸區， 藉以強化該表面黏著型發光二極體之封裝結構並增加散熱 面積。 2 6 .如申請專利範圍第1 3項所述之表面黏著型發光二極體 之封裝結構，其中該金屬支架型基板上表面包含有複數個 孔洞使該封膠滲入該等孔洞而與該金屬支架型基板緊密接 合0 2 7.如申請專利範圍第2 6項所述之表面黏著型發光二極體 之封裝結構，其中該封膠僅包覆該金屬支架型基板上表 面，該第一金屬圖案另包含有一焊接區，且該第一金屬圖 案底部除焊接區以外之區域均與該電路板接觸，以加強散 熱效果。1237881 VI. Application scope of patent 25. The package structure of the table 1T 箸 type light emitting diode described in item 19 of the scope of patent application, wherein the die adhesion area further includes an extension area to strengthen the surface adhesion The packaging structure of the light-emitting diode and increases the heat dissipation area. 26. The surface-attached light-emitting diode packaging structure described in item 13 of the scope of the patent application, wherein the upper surface of the metal bracket-type substrate includes a plurality of holes to allow the sealant to penetrate the holes and communicate with the metal. The bracket-type substrate is tightly bonded 0 2 7. The surface-attached light-emitting diode packaging structure described in item 26 of the patent application scope, wherein the sealant only covers the upper surface of the metal bracket-type substrate, and the first metal The pattern further includes a soldering region, and all regions except the soldering region at the bottom of the first metal pattern are in contact with the circuit board to enhance the heat dissipation effect. 第21頁Page 21
TW092130990A 2003-11-05 2003-11-05 Package structure of surface mount device (SMD) LED TWI237881B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7897974B2 (en) 2005-05-20 2011-03-01 Industrial Technology Research Institute Solid-state light emitting display and fabrication method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7897974B2 (en) 2005-05-20 2011-03-01 Industrial Technology Research Institute Solid-state light emitting display and fabrication method thereof
US7998764B2 (en) 2005-05-20 2011-08-16 Industrial Technology Research Institute Solid-state light emitting display and fabrication method thereof

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