TWD175855S - 電漿處理裝置用下腔室 - Google Patents

電漿處理裝置用下腔室

Info

Publication number
TWD175855S
TWD175855S TW104305551F TW104305551F TWD175855S TW D175855 S TWD175855 S TW D175855S TW 104305551 F TW104305551 F TW 104305551F TW 104305551 F TW104305551 F TW 104305551F TW D175855 S TWD175855 S TW D175855S
Authority
TW
Taiwan
Prior art keywords
lower chamber
treatment device
plasma treatment
article
processing device
Prior art date
Application number
TW104305551F
Other languages
English (en)
Chinese (zh)
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TWD175855S publication Critical patent/TWD175855S/zh

Links

TW104305551F 2015-06-12 2015-10-06 電漿處理裝置用下腔室 TWD175855S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13038F JP1546801S (cs) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
TWD175855S true TWD175855S (zh) 2016-05-21

Family

ID=55539625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305551F TWD175855S (zh) 2015-06-12 2015-10-06 電漿處理裝置用下腔室

Country Status (3)

Country Link
US (1) USD802545S1 (cs)
JP (1) JP1546801S (cs)
TW (1) TWD175855S (cs)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1611626S (cs) * 2017-01-20 2018-08-20
JP1584146S (cs) * 2017-01-31 2017-08-21
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
JP1638504S (cs) * 2018-12-06 2019-08-05
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング
JP1700629S (cs) * 2021-04-26 2021-11-29
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4319432A (en) * 1980-05-13 1982-03-16 Spitfire Tool And Machine Co. Polishing fixture
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6264540B1 (en) * 2000-03-30 2001-07-24 Speedfam-Ipec Corporation Method and apparatus for disposable bladder carrier assembly
WO2004033152A1 (en) * 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
EP2191936B1 (en) * 2003-11-13 2015-01-21 Applied Materials, Inc. Retaining ring with convex bottom surface
KR20080031870A (ko) * 2005-05-24 2008-04-11 엔테그리스, 아이엔씨. Ｃｍｐ 리테이닝 링
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
TWD169790S (zh) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD722966S1 (en) * 2013-08-23 2015-02-24 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD775710S1 (en) * 2015-05-19 2017-01-03 Il Han Kim End bushing for fishing reel spool
JP1546800S (cs) * 2015-06-12 2016-03-28

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD960216S1 (en) 2020-11-23 2022-08-09 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
JP1546801S (cs) 2016-03-28
USD802545S1 (en) 2017-11-14

Similar Documents

Publication Publication Date Title
TWD175852S (zh) 電漿處理裝置用上腔室
TWD175855S (zh) 電漿處理裝置用下腔室
TWD180288S (zh) 電漿處理裝置用上腔室
TWD175854S (zh) 電漿處理裝置用保護環
TWD186394S (zh) 電漿處理裝置用保護環
TWD175853S (zh) 電漿處理裝置用罩環
TWD166332S (zh) 基板處理裝置用晶舟之部分
TWD163542S (zh) 基板處理裝置用晶舟
TWD186397S (zh) 電漿處理裝置用放電腔室
TWD181303S (zh) 晶圓載具
TWD179095S (zh) 基板保持環
TWD181302S (zh) 晶圓載具
TWD181304S (zh) 晶圓載具
TWD167109S (zh) 基板保持環
TWD186244S (zh) 真空清掃機器人之部分
TWD183733S (zh) 清潔用物品之表面圖案
TWD162134S (zh) 基板洗淨用輥子軸桿之部分
TWD187175S (zh) 圖案化石英晶圓
TWD183002S (zh) 圖案化石英晶圓
TWD197753S (zh) 一組安裝裝置
TWD178778S (zh) 清潔物品之部分
TWD186171S (zh) 計量機
TWD178777S (zh) 清潔物品之部分
TWD177909S (zh) 電子鍋
TWD191627S (zh) Crystal boat side wall