TW592386U - Mounting structure of semiconductor chip and semiconductor device - Google Patents

Mounting structure of semiconductor chip and semiconductor device

Info

Publication number
TW592386U
TW592386U TW091213650U TW91213650U TW592386U TW 592386 U TW592386 U TW 592386U TW 091213650 U TW091213650 U TW 091213650U TW 91213650 U TW91213650 U TW 91213650U TW 592386 U TW592386 U TW 592386U
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
mounting structure
insulated substrate
semiconductor
semiconductor device
Prior art date
Application number
TW091213650U
Other languages
English (en)
Inventor
Kazutaka Shibata
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW592386U publication Critical patent/TW592386U/zh

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    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
TW091213650U 2000-02-07 2001-02-07 Mounting structure of semiconductor chip and semiconductor device TW592386U (en)

Applications Claiming Priority (1)

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JP2000028818A JP2001217354A (ja) 2000-02-07 2000-02-07 半導体チップの実装構造、および半導体装置

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KR (1) KR100451924B1 (zh)
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WO (1) WO2001059839A1 (zh)

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JP2002261190A (ja) * 2001-02-28 2002-09-13 Sony Corp 半導体装置、その製造方法及び電子機器
JP3952963B2 (ja) * 2003-02-21 2007-08-01 ヤマハ株式会社 半導体装置及びその製造方法
FR2856517B1 (fr) 2003-06-17 2005-09-23 St Microelectronics Sa Procede de fabrication de composant semi-conducteur et composant semi-conducteur
FR2874127B1 (fr) * 2004-08-03 2006-12-08 United Monolithic Semiconduct Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier
JP2006049591A (ja) * 2004-08-05 2006-02-16 Disco Abrasive Syst Ltd ウエーハに貼着された接着フィルムの破断方法および破断装置
JP2008084959A (ja) 2006-09-26 2008-04-10 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
EP1914798A3 (en) 2006-10-18 2009-07-29 Panasonic Corporation Semiconductor Mounting Substrate and Method for Manufacturing the Same
US7838859B2 (en) * 2008-09-29 2010-11-23 Scully Signal Company Fluid overfill probe with thermal stress prevention
US8367473B2 (en) 2009-05-13 2013-02-05 Advanced Semiconductor Engineering, Inc. Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
TW201041105A (en) * 2009-05-13 2010-11-16 Advanced Semiconductor Eng Substrate having single patterned metal layer, and package applied with the same, and methods of manufacturing the substrate and package
US20100289132A1 (en) * 2009-05-13 2010-11-18 Shih-Fu Huang Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
GB0914562D0 (en) 2009-08-20 2009-09-30 Johnson Matthey Plc Catalyst layer
TWI425603B (zh) * 2009-09-08 2014-02-01 Advanced Semiconductor Eng 晶片封裝體
US8786062B2 (en) * 2009-10-14 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package and process for fabricating same
US20110084372A1 (en) 2009-10-14 2011-04-14 Advanced Semiconductor Engineering, Inc. Package carrier, semiconductor package, and process for fabricating same
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
JP2012069919A (ja) * 2010-08-25 2012-04-05 Toshiba Corp 半導体装置の製造方法
JP5624696B1 (ja) 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
JP5624699B1 (ja) * 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
WO2014097643A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
CN104603932A (zh) 2012-12-21 2015-05-06 松下知识产权经营株式会社 电子部件封装件及其制造方法
KR102377522B1 (ko) * 2015-04-16 2022-03-22 삼성디스플레이 주식회사 가요성 표시 장치

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WO2001059839A1 (en) 2001-08-16
KR20010105415A (ko) 2001-11-28
KR100451924B1 (ko) 2004-10-12
US20020173069A1 (en) 2002-11-21
US7285446B2 (en) 2007-10-23
US20050142691A1 (en) 2005-06-30
JP2001217354A (ja) 2001-08-10

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