TW540139B - High voltage MOS-transistor - Google Patents

High voltage MOS-transistor Download PDF

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TW540139B
TW540139B TW091105883A TW91105883A TW540139B TW 540139 B TW540139 B TW 540139B TW 091105883 A TW091105883 A TW 091105883A TW 91105883 A TW91105883 A TW 91105883A TW 540139 B TW540139 B TW 540139B
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scope
ion implantation
substrate
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TW091105883A
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Peter Olofsson
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Ericsson Telefon Ab L M
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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    • H01L29/107—Substrate region of field-effect devices
    • H01L29/1075—Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/761—PN junctions
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    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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    • H01L29/107—Substrate region of field-effect devices
    • H01L29/1075—Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
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    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Element Separation (AREA)

Description

540139 五、發明説明 一範例來不範，本發明卻不應受此限制。所有之圖式顯示 -基板在-製程中不同階段之放大、示意之橫剖面圖了特 別在某些垂直之尺寸上來說，放大程度相當大。圖式中： -圖1為一具有蝕刻之淺溝隔離（STI)溝渠的卜基板之剖面 圖， -圖2為一剖面圖，顯示在已進行CMp處理後，填充溝渠等 所造成之結構， -圖3為該基板之一剖面圖，示範植入一深卜井， -圖4為在一植入額外之高電壓卜井步驟中，該基板之一剖 面圖， 圖5為該.基板之一剖面圖，示範將卜井區域之植入使用做 該深η -井之接觸區域， -圖6為該基板之一剖面圖，示範包括該等卜井與卜井區域 所造成之結構， -圖7為遠基板之一剖面圖 -圖8為該基板之一剖面圖 -圖9為該基板之一剖面圖 道形成的方法， -圖1 0為在形成一植入之延伸汲極區域後該結構之剖面 圖， -圖11為該基板之一剖面圖，示範_NLDD與微弱摻雜之η_ 區域袋狀植入之步驟， ••圖12為該基板之一剖面圖，示範將一p+區之植入使用做 後閘極區等之接觸， ’示範形成一通道區之步驟， ’示範閘極區等之形成， ’示範另一種使用角度植入之通 丨X 297公釐）
裝 訂
線 540139 A7
-圖1 3為該基板之一剖面圖 觸區等之植入，以及 示範源極、汲極與深n•井接 及具有碎化物形成 -圖1 4為包括源極、汲極及閘極區等 於邊等接觸區上之完成結構的剖面圖 發明詳細說明
以下將以一特別之範例來說明，以便了解本發明之相關 技術。對此項技藝熟悉之人士所熟知之該等細節已省略: 不言可喻，雖然脫離此特別說明中之特定細節，本發明仍 有許多其他之具體實施例。一個例子即為藉由將所^之摻 雜反向進行所製造之一 P—型裝置。 裝
在圖1中，示範一高電阻率P-型矽基板丨，預備做一淺溝 隔離（STI)處理，並包含蝕刻之溝渠2。該等溝渠把將在其 中形成一MOS電晶體之一區包圍。在溝渠外，製作進一 ^ 蝕刻區，也使得一非蝕刻條紋延伸於該電晶體將形成之區 周圍。一 STI襯裡（liner)氧化物3已生長在該基板之表面 上，而一氮化矽之遮罩4也應用於其上，以提供後續以氧 化矽填充該等溝渠2，如圖2中所示。在已填充該氧化物、 分別產生STI氧化物内區5，與外區5，，之後，對該基板表面 進行化學機械平坦化（CMP)在該CMP步驟之後，於該曝光 之矽區上生長一薄氧化物6，如圖3中所示。 圖3中也示範接著應用另一遮罩7，於該m〇s電晶體將形 成之區中具有一窗口，以及相當高能量（9〇〇 keV)之磷，以 2xlOncm·2之劑量植入，如箭頭9所示。該植入以傳統之方 式貫施’以對該基板I表面之法線以一小傾斜角如7。的方 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 540139 A7 B7 五 發明説明（ 向植入，以避免通道效應。該植入於該遮罩窗口中製成一 深η -井1 1。該η -井峰值剖面（profile)之深度約為1微米 (V m )，其由該植入能量來決定。然後移除該遮罩7。 如圖4中所示，接著應用一遮罩1 5，定義該深n -井區域 1 1先前遮罩7内部之一開口，該開口，舉例來說，具有邊 緣，位於該STI氧化物内區5 ’上表面近中心線處。然後以 1 X 1013cnT2之劑量、220 keV之能量及一 7。之傾斜角植入 硼，如箭頭1 7所指示。此植入步驟之諸參數因而設定來製 成一高電塵HV、位於該深η -井11上之p -井19，如圖4中 所示。以此方法，該p -井1 9便與該摻雜區等之外的電流與 電壓等具·高度之電隔離。還有，在稍後說明之延伸汲極將 會保護該電晶體之閘極與源極，不致受到該P -井之高電 壓。該p -井可以將其垂直之諸邊置於該STI内區5 ’下表面 近中心線處。然後移除該遮罩層1 5。 接下來’根據圖5來應用一遮罩21。該遮罩只有在該深 η-井區域11，包含位於該内區5’與外區5，，STI區之間的基 板表面的部分，僅位於端部分之上的區域内具有開口。磷 穿過該遮罩的該等開口植入，見箭頭2 3。此植入步驟分成 不同特徵之二個子步驟。在第一子步驟中，以一摻雜劑劑 量2xl013cnT2、能量為490 keV及一0。之傾斜角植入憐， 且深入該基板中；在第二子步驟中，以一摻雜劑量 4x l〇12CnT2、能量為140 keV及一 7。之傾斜角植入磷；在 第三子步驟中，為3.7xl〇i2cm·2、能量50 keV及7。。此植 入步驟因此製成相當高程度之n _摻雜區2 5，位於該p -基板 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) -8-
裝 訂
線 540139
的表面區域中，在該等STI内區5，與外區5 ”間，並延伸至 孩深η-井11，並做該深卜井之接觸填塞物。移除該遮罩層 2 1後之結果顯示於圖6中。η+型之接觸區域將植入於該等 填塞物區域之上，將一偏壓連接至該深卜井丨丨，說明如 下。當將该裝置之製造與一標準之CM〇s處理流程合併 時，該η-型之摻雜步驟與該卜井之形成完全一樣。 接著說明另兩種形成閘極與相關之通道的方法。第一種 方法根據圖7，始於應用一遮罩2 7來形成該通道。該遮罩 曝光延伸在該内STI氧化物區5，與之後放置該閘極區之間 的條紋狀區域，該等區域也延伸於該内STI氧化物區上一 段距離。其植入分成兩個子步驟，見箭頭2 9。在第一子步 驟中，只有使用硼進行植入，而在第二子步驟中使用二氟 化硼，B F 2。該等植入之諸特徵為，僅為硼者，摻雜劑量 為6x10 2cm 2，能量為6〇 keV，及傾斜角7。，而使用二氟 化硼者為5xl〇12cm·2、50 keV與7。。該等植入產生p_摻雜 通道區3 1，與該内STI場域氧化物區5，的内邊緣自對準。 然後移除該遮罩2 7。在此階段，該裝置所需要之井區都已 形成，且該薄氧化物6已由該表面全部去除（stripped off)。在以上所說明之該等每個植入步驟實施之前，已將 該等曝光區中之該氧化物層更新。 然後，如圖8所示，一薄閘極氧化物3 3生長於該基板之 整個表面上，並在其上沉積一高度摻雜之多晶矽層做閘 極。使用一遮罩（圖未示）以定義該等閘極3 5。在圖8中之 剖面圖中，可見兩個位置對稱之閘極區，皆為兩單獨之 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公爱)
裝 訂
線 540139 五、發明説明（7 A7 B7
MOS電晶體之部分，或是結合以 触+ 时 成屬於相同之MOS電逼 月豆又一早一、連接區。該等閘極 研1^蚀茅孩遮罩的開口摩 ，生’然後移除該遮罩。保留了位於該閉極外部之編 極乳化物層，以保護在㈣與源極以極間不致有擊穿踢 象。 在弟—個方法中，如圖9中所+ ,、人，、 、r…、 甲4 口"干所不，於孩閘極形成後接著 、仃该通運植入。該後步驟與圖8中所說明相@，但是不 包括該等卜通道區域。至於接下來之通道形成，使用一延 伸至該等閘極35中心線之遮罩37，以保護該沒極區。使用 斜角植入硼36，以將該接合邊緣放置於該閘極“之下。此 方法的好.處是，對由植入能量與角度所決定之該通道長度 义控制得以改善。在此可以將在該相對基板表面之法線的 四個獨立方向之傾斜角實質上選為48。，即是該傾斜角可 以用所渭之四元配置（quad arrangement)而得。否則該植入 万式以兩個子步驟的方式進行，該第一子步驟之劑量為 6xl012Cm·2，能量為60 keV，而第二子步驟之劑量為 4xl012cnT2，能量為 1〇 keV。 在進行了另兩種通道形成方法之一後，應用一新的遮罩 39於其上，將一窗口實質上置於該卜井19上中央的位 置’其邊緣位於該等閘極區3 5上，如圖1 0中所示。接著， 植入鱗於該窗口中，如該等箭頭4丨所指示，該植入之摻雜 劑劑量為6x l〇12cm·2，粒子能量為50 keV與1 〇。之傾斜 角，用以上所定義之四元配置。該植入之結果為一延伸之 沒極區域4 5，其為一位於表面之微弱摻雜n -區域，位於該 ___ -10- i紙張尺度適财s a家標準(CNS) Α4規格(—297公爱)~^
裝 訂
線 540139 A7 五、發明説明（ P-井中央5 位於其間， 冰度相當小。 47:2孩遮罩39之後’如圖U中所示，應用-新遮罩 47末=-„_摻雜之微量摻㈣極，虹⑽，及微 區域之-袋狀植入，該遮罩之開口定義該源極、沒極 與接收極連接的位置。因此，磷in，2 .2 纤先植入，其劑量為5xcm 、把量為30 keV及傾斜角1〇。，為四元配田 然後植入神，其劑量為2xlQl4em.2、能量為2Qk^傾 斜角7° ’也是四S配置，該植人如該等箭頭49指示。在圖 1 1中可見分別將源極、汲極與接收極製成為n_區域Η、 5 3與5 5。然後移除該遮罩4 7。 配合該等源極、汲極與接收極區域之植入，薄氧化物向 來沉積於該等曝光之區域中。現在也沉積氮化石夕，但是步 驟未示。接著以非等向性蝕刻移除該氮化物之大部分，= 留下墊片（Spacer)56於該等閘極區之邊牆上。接著進行另' -使用-遮罩57之選擇步驟，如圖12中所示，接下來將硼 以P -型植入於該遮罩之開口中，由箭頭5 9所指示。該 植入之特徵資料為摻雜劑劑量2xi〇i5cm-2、能量5 keV ^ 四元傾钭角7 ◦。結果，得到與通道區6丨之接觸。此植入 法與“準之CMOS處理流程中之p +源極/汲極植入完全一 樣。然後移除遮罩5 7。 之後應用一遮罩6 3做組合之n+植入與擴散。現在植入 坤，見圖1 3，以箭頭6 5指示，製成該等源極5 i、汲極5 3 並部分位於該等 之邊延伸，在範例中顯示 閘極區35之下，該摻雜區域之 -11 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公愛） 裝 訂 線 540139 A7 B7 五 發明説明（9
與接收極5 5區域最終之形狀。此時，其對應之植入特徵為 4x 1015cm 2 ’ 60 keV與四元傾斜角7。。
將該遮罩63移除後之最終結構顯示於圖14中。將一層石夕 化物、一金屬矽化合物產生於該等植入之閘極、源極:^ 極與接收極區域之上是有好處的。藉由使用，例如L SaHcide(自對準切化物）處理，料化物變成料前 之塾片自對準，而且對覆蓋之區域的串聯電阻也降低。 裝 後，將接觸等應用於該等閘極、源極、沒極與接收梓區。 如以上所述，在該p_基板之表面區域中相當高程度之η样 雜區25做為該··井之接觸區域。因此，藉由提供―‘ 值、+V“電壓給卜區域25上之接收極接觸，由該 19'該深η-井Η與該Ρ-基板〖所定義之該寄生 變成反向偏壓’其改良了 M0S結構之隔離特徵。 - 訂
線 -12-

Claims (1)

  1. 540139 A8 B8 C8 D8
    第091105883號專利申請案 中文申請專利範圍修正本(91年/0月） 六、申請專利範圍 ^ 1· 一種製造一向電壓、高速M0S電晶體之方法，包含以下 步驟： -提供一半導體基板（1 )，其係無摻雜或是微弱摻雜一 第一導電型； -形成一嵌入該基板中一第二導電型之深、第一井區 域（1 1); -形成一第一導電型之第二井區域（19)於該基板之表 面與該第一井區域間； -形成該第一導電型之一通道區（31)於該第二井區域 (1 9)内部； 、 -形成閘極氧化物區（33)於該基板之表.面上；於其上 沉積一層半導體材料；並圖樣化該層以形成該閘極區域 (35)； •形成一微弱摻雜延伸汲極區域（4 5 )於該第二井區域 (19)内；及 -形成具大量摻雜該第二導電型之源極（65)、汲極 (67)及接收極（69)區域，該源極區域形成於該通道區 (31)之内， 其特徵在於形成該深、第一井區域（11)之步驟中，該 深、第一井區域係以一高能量植入（9)穿過一第一遮罩 (7)的開口等而製成，以得到一深入於該基板中之區 域。 2·如申請專利範圍第1項之方法，其特徵在於該深、第一 井區域（1 1 )係以離子植入磷製成。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 540139 A8 B8 C8
    申請專利範圍 補充 3·如申請專利範圍第丨或2項之方法，其特徵在於該深、第 一井區域（1 1 )係以離子植入磷製成，其劑量實質上為 2 X 1013cnT2。 4.如申請專利範圍第1或2項之方法，其特徵在於該深、第 一井區域（11)係以離子植入製成，其能量實質上為9〇〇 keV 〇 5·如申凊專利範圍第丨或2項之方法，其特徵在於該深、第 一井區域（11)係以離子植入製成，其植入方向為在一相 裝 對於與該基板（1)表面垂直之方向實質上為7。的角度 上。 訂 6·如申請專利範圍第i項之方法，其特徵在於該第二井區 域（19)之形成係以一高能量植入（4)進行穿過一第二遮 罩（15)之開口等，以於位於該基板表面與該深、第一井 區域（11)之間，得到該第一導電型之一區域。 7·如申請專利1¾圍第6項之方法，其特徵在於該第二井區 域（1 9)係以離子植入爛製成。 8. 如申4專利範圍第6或7項之方法，其特徵在於該第二井 區域（1 9)以離子植入硼之劑量實質上為i 〇 製成。 9. 如申請專利範圍第6或7項之方法，其特徵在於該第二井 區域（19)以離子植入之能量實質上為220 keV製成。 1〇·如申請專利範圍第6或7項之方法，其特徵在於該第二井 區域（19)以離子植人之植人方向角度’以相對該基板⑴ 表面垂直方向實質上為7。製成。 11·如申請專利範圍第lil6項之方法，其特徵在於該第二導 -2 -
    540139 修正 補充 A8 B8 C8 一 丨_ 1 - ___D8 六、申請專利範園 私型在篇基板（1 )中之接觸區（2 5 )的形成，係以離子植 入（23)進行穿過一第三遮罩（21)之開口。 12. 如申#專利範圍第i或6項之方法，其特徵在於該接觸區 (25)係以連續三步騾離子植入磷而製成。 13. 如申凊專利範圍第1或6項之方法，其特徵在於該接觸區 (25)=以連續三步驟，分別以實質上為2xlOncm_2、 4x10 cm及3.7xl〇12cm-2之劑量離子植入而製成。 14·如申叫專利範圍第1或6項之方法，其特徵在於該接觸區 (25)係以連續三步驟，分別以實質上為490 keV、140 keV及50keV之能量離子植入而製成。 15·如申請專㈣圍第146項之方法，其特徵在於該接觸區 (25)以連續三步驟，將基板（1)相對植入方向以實質上 分別為0。、7。及10。之傾斜角度離子植入而製成。 16.如申請專利範圍第“戈6項之方&，其特徵在於在該第二 井區域（19)中之該第_導電型之通道區（31)的形成，係 以離子植入法（29)穿過一第四遮罩（27)之開口來進行。 Μ申請專利範圍第項之方&，其特徵在於在該通道 區（3 1)係以使用硼與氟化硼（BF〇離子植入之連續步驟 而製成。 18·如申請專利第1或6項之方法，其特徵在於在該通道 區（3 1)係以離子植入之連續步驟製成，其劑量實質上分 別為 6xl〇i2cm-、5xl〇12cm.2。 19·如申請專利範圍第1或6項之方法，其特徵在於在該通道 區（3 1)係以離子植入之連續步驟製成，其能量實質上分 -3 -
    540139
    _月^修 申請專利範圍 別為 6 0 keV與 5 0 keV。 20.如申#專利範圍第i或6項之方法，其特徵在於在該通道 區（3 1)係以離子植入之連續步驟製成，該基板（ι)相對 植入方向角度在所有步騾中實質上傾斜7。。 21·如申明專利範圍第！或6項之方法，其特徵在於在該第二 井區域（19)之第二導電型外汲極區（45)的形成，係以離 子植入（4 1)穿過一第五遮罩（39)之開口來進行。 22·如申請專利範圍第！或6項之方法，其特徵在於該外汲極 區（4 5 )係以離子植入磷所製成。 23_如申叫專利範圍第i或6項之方法，其特徵在於該外汲極 區（45)係以離子植入劑量實質上為6xl〇12cmd所製成。 24·,申請專利範圍第i或6項之方法，其特徵在於該外汲極 區（45)係以離子植入能量實質上為5〇 keV所製成。 25.如申明專利範圍第i或6項之方法，其特徵在於該外汲極 區（4 5)係以離子植入所製成，該基板相對該植入方向實 質上為1〇。之角度，並在一四元配置中，旋轉成四個對 稱之方向。 -4- 本紙張尺度適财@ jg家標準(CNS) 規格(別〉〈挪公董)
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