TW531474B - High accuracy blast processing method and high accuracy blast processing apparatus - Google Patents

High accuracy blast processing method and high accuracy blast processing apparatus Download PDF

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Publication number
TW531474B
TW531474B TW090126929A TW90126929A TW531474B TW 531474 B TW531474 B TW 531474B TW 090126929 A TW090126929 A TW 090126929A TW 90126929 A TW90126929 A TW 90126929A TW 531474 B TW531474 B TW 531474B
Authority
TW
Taiwan
Prior art keywords
nozzle
injection
spraying
blast processing
intermittent
Prior art date
Application number
TW090126929A
Other languages
English (en)
Chinese (zh)
Inventor
Moriyasu Izawa
Noboru Watanabe
Yasuo Hobo
Shigekazu Sakai
Original Assignee
Sintobrator Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintobrator Ltd filed Critical Sintobrator Ltd
Application granted granted Critical
Publication of TW531474B publication Critical patent/TW531474B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/18—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions
    • B24C3/20—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions the work being supported by turntables
    • B24C3/22—Apparatus using nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B24C5/04—Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0046—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
    • B24C7/0053—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier with control of feed parameters, e.g. feed rate of abrasive material or carrier
    • B24C7/0061—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier with control of feed parameters, e.g. feed rate of abrasive material or carrier of feed pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nozzles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW090126929A 2000-10-31 2001-10-30 High accuracy blast processing method and high accuracy blast processing apparatus TW531474B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332306A JP2002137167A (ja) 2000-10-31 2000-10-31 高精度ブラスト加工法及び高精度ブラスト加工装置

Publications (1)

Publication Number Publication Date
TW531474B true TW531474B (en) 2003-05-11

Family

ID=18808530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126929A TW531474B (en) 2000-10-31 2001-10-30 High accuracy blast processing method and high accuracy blast processing apparatus

Country Status (4)

Country Link
US (1) US20020077042A1 (ja)
JP (1) JP2002137167A (ja)
KR (1) KR20020033564A (ja)
TW (1) TW531474B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103302598A (zh) * 2012-03-09 2013-09-18 海纳微加工股份有限公司 真空压差式微加工装置及方法
TWI462801B (ja) * 2012-02-24 2014-12-01

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001505B1 (ko) * 2003-01-30 2010-12-14 선아로 가부시키가이샤 투광성 재료제의 키 탑에의 마킹을 뒤로 보낼 수 있는 키 유닛의 제조 방법
CN103084984B (zh) * 2011-11-01 2015-07-08 上海科秉电子科技有限公司 一种用于沟槽刻蚀设备零件的清洗方法
KR101334387B1 (ko) * 2012-04-13 2013-11-29 한국기계연구원 열처리 기능을 갖는 미세입자 분사가공 장치
KR101416942B1 (ko) * 2012-10-25 2014-07-08 주식회사 나무공작소 자동화된 목재용 샌드 블래스터
CH707657A1 (de) * 2013-02-21 2014-08-29 Waterjet Robotics Ag C O Matthias Straubhaar Verfahren zum Bohren mindestens eines Loches in einem Werkstück mittels eines Bearbeitungsstrahls aus Flüssigkeit.
CN104589221B (zh) * 2015-01-21 2018-05-29 滁州汽车与家电技术及装备研究院 一种混合喷丸方法
JP6570581B2 (ja) * 2017-07-13 2019-09-04 株式会社不二製作所 セラミックスの表面処理方法及びセラミックス成品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462801B (ja) * 2012-02-24 2014-12-01
CN103302598A (zh) * 2012-03-09 2013-09-18 海纳微加工股份有限公司 真空压差式微加工装置及方法
CN103302598B (zh) * 2012-03-09 2016-06-08 海纳微加工股份有限公司 真空压差式微加工装置及方法

Also Published As

Publication number Publication date
KR20020033564A (ko) 2002-05-07
JP2002137167A (ja) 2002-05-14
US20020077042A1 (en) 2002-06-20

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