TW513380B - Method and application for making 3-D macro elastic probe devices by MEMS technique - Google Patents

Abstract

A method and an application for making 3-D macro elastic probe devices by MEMS (micro-electro-mechanical system) technique are provided. According the method, a first photoresist layer on a substrate is developed to form blind holes. A first metal is filled into each blind hole so as to constitute a probe tip. Thereafter, a second photoresist layer is lain on the first photoresist layer and developed to form mold cavities corresponding to the blind holes. A second metal layer is formed and selectively etched so as to constitute elastic elements of the probe devices. Thus, a plurality of upside-down 3-D micro probe devices with pre-determined amount are formed at proper locations of the substrate for mounting onto a probe card simultaneously.

Description

513380 V. Description of the invention (1) [Field of the invention] The present invention relates to a method for manufacturing an elastic probe and its application, wherein the side plate pin is used for installing a detection card suitable for testing integrated circuit, especially A method for manufacturing a micro-electromechanical system (MEMS) of a 3D elastic microprobe and a 3D elastic microprobe manufactured by the method. [Previous technology] ^ The integration of integrated circuits is highly dense, and the devices used to test integrated circuits must be miniaturized urgently, and integrated circuits are conventionally manufactured in wafers [Wafer / type, used to The probe card of the touch-sensing wafer is assembled with a test device and is electrically connected to a test head. A plurality of probes [叩 〇be needle] or Conductive bump [bump]. Conventionally, U.S. Patent No. 6, 〇84,42 "Probe Assembly for Testing" [Among them, the Republic of China Patent Gazette Announcement No. 4 006 8 6 〇] A combined structure with flexible 3D microprobes [ Hereinafter referred to as "probe assembly", as shown in FIG. 11, the probe assembly 16 includes a base member 36 [base member], which is combined with ceramic, and the base member 36 is provided with a plurality of towns. The supporting members 34 are members of the material. These supporting members 34 jointly support a bridge member 32PP [bridge member]. The bridge member 32 is an alloy three-arm structure to provide elasticity. Probe end 30 made of tungsten [probe t 彳 η Ί contact of the field and the road 塾 [c〇ntac] tlPL; = actual contact pad electric act pad], but in the above patent case and 513380 V. Description of the invention (2) '--- t discloses the manufacturing method of the probe assembly 丨 6, if this probe assembly i 6 is combined with the connection pad of the ceramic substrate of the probe card (that is, the above-mentioned substrate 4 3 6 is regarded as a connection pad], the size of the connection pad is known For the manufacturing accuracy of dozens of micro-assemblies 16, it may be required to the nanometer level. In view of the size and complex structure of t16, j16, how to make tiny 3D microprobes with a simpler structure is obviously becoming The industry more needs to overcome research-5 since η * [Objective and Summary of the Invention] The main purpose of the present invention is an electrical manufacturing method. The micro-electro-mechanical technology cavity is used to form a ceramic substrate of a probe card according to the shape of the cavity. The invention provides a 3D elastic micro-probe microcomputer technology to form a tensile element of a mold probe on a photoresist layer on a substrate, and the substrate can be quickly cleaned when the resist layer is combined with the probe to peel the probe. A second objective is to provide a method for electrically manufacturing a 3D elastic microprobe, which uses micro-electromechanical technology to form a plurality of mold cavities at two positions of a photoresist layer on a substrate, and forms the probe v according to the shape of the cavity. 'Prefabrication, in the combination of the substrate and the probe substrate of a probe card, a plurality of probes = ^ = are firmly and fixedly combined with the probe card. Another aim of the leaf system is to provide a 3D elastic micro-probe support survey Ductile element The supporting feet are extended from the toughness element to the outside using the oblique direction, which makes the platform appear raised. The platform is used to elastically support the test contact and is electrically transmitted to the testing equipment. The system can be formed from a photoresist layer ^ by MEMS technology to facilitate MEMS production. 9

------ V. Description of the invention (3) 3D elastic thumb according to the present invention; κ n ^ ψ ~ ^ 1 The micro-electromechanical manufacturing method of cypress needles from cypress needles, the first I ηΕ micro-blind hole to fill 丄ΐ layer, the first light layer layer has multiple contacts, and then the first 丄 belongs to these micro-blind holes, so that the probe forming the probe to form the probe: after selectively touching the second metal layer, the right As a result, the 3D micro-probes are tied in a flat plate at an appropriate position on a substrate for binding to the detection card. The 3D elastic microprobe invented by I ^ is used to electrically measure electronic devices. Itit: conductive components, ... platform and connection. Ί: Wei ": support feet, stomach support feet by this platform Extending obliquely outwards: & ^ $ Taiwan is in a raised shape to flexibly support the contact terminal and to fly electronically, and at least one contact terminal is combined with the platform to electrically contact the electronic device, In order to facilitate the manufacture of micro-electromechanical technology [Detailed description of the invention] π k. Referring to the attached drawings, the present invention will be illustrated by the following embodiments: According to a specific embodiment of the present invention, the manufacturing process of the 3D elastic micro-probing micro-electromechanical manufacturing method of the present invention is shown in Figures 1 to 8 The detailed description is as follows: First, as shown in FIG. 1, a substrate 40 is provided, and the thermal expansion coefficient of the substrate 40 is matched with the substrate to which the microprobe is to be bonded, such as a ceramic substrate. The substrate, plastic substrate or tape, etc., or the passive surface of a discarded semiconductor wafer, is then spin-coated, printed, or pasted to form the first light. Hinder

Page 7

513380 V. Description of the invention (4) Layer 50 j first photoresist layer] On one surface of the substrate 40, the photoresist layer 50 is a photosensitive material, such as a positive photoresist [p0Sitive

Ph〇 ^ 〇reS1St] or negative photoresist [negative photoresist], in the present known example, 'the first photoresist layer 50 is a negative photoresist [that is, in the absence of photocatalyst]' Preferably, in The surface of the substrate 40 is formed in advance-a Peelable layer, which has a weak binding force with the first metal 52 (such as in the figure) or is a substance that can be easily removed, such as a positive photoresist. 1 = After that, as shown in FIG. 2, the first photoresist layer 50 is exposed and developed, so that the first photoresist layer 50 is formed with a plurality of micro-blind holes 51 [micr〇: 〇1:]. Micron to tens of micron '. Then, as shown in Fig. 3, vapor deposition [vapor dep siti〇n] and etching [] technology are used to fill hard metal materials such as cranes or crane alloys h52 The micro-blind holes 5b are used to form the probe terminal of the probe, and the second photoresist layer 60 is formed on the first photoresistance 50 dry film (dry film). : First blocking or is a photosensitive dry film, ... based on acrylic ;;: P = ΓΓ ;; Γ: PMM, as shown in Figure 4, exposure and development of this = exposure with deep ultraviolet light or X-ray irradiation, M Erguang = Ancient example should be in the mold cavity 61 of the micro-blind hole 51, and the mold cavity 61 can be opened in pairs. , Such as cone-shaped, pyramid-shaped, or bowl-shaped, etc .; 彺 external oblique test, as described in No. 5 513380 V. Description of the invention (5) The map does not use physical vapor deposition "ρνΓ) 1 χ« 3 ^ ^ ^ ^ ^, PVD, Chemical Vapor Deposition CVD, Plasma-Promoted Chemical Vapor Deposition [pFrvD], Snow. 4 Shimu, Yuetian々7, Plating [Plat11 ^] or the above techniques :: A second metal layer 62 is formed on the second photoresist layer 60. A metal layer 62 is made of copper, gold, copper, copper, copper, copper, iron, palladium, platinum, and titanium. Or an alloy layer containing any of the above-mentioned ordinary elements, and then, as shown in FIG. 6, the second metal layer 62 is engraved, such as dry-feeding with electric feeding. 丨 select "contact the cow. Therefore, according to the above method, it can be predetermined on the substrate 40. A plurality of inverted 3D elastic microprobes are formed at fixed positions (such as the first figure: no), and the mother-microprobe includes-conductive toughness elements 70 and 50), and is composed of the first genus 5 2 Test touch #, where the system is located in the above-mentioned mold cavity 61,1 has a flat A piece 70 ,,,,, and pingping mouth (1 and a plurality of branch legs 72 connected to the platform 71 The supporting legs 72 are extended from the platform 71 along the mold cavity ^ obliquely outward, and the contact end of the first metal 52 is provided in the micro-blind hole 51 and combined with the platform 71. After μ ^, as shown in FIG. 7, the substrate 4 of the 3D bomb HU probe with a plurality of inverted types is flipped, and pressed onto a ceramic circuit substrate 80 of a detection card. The position of the probe of the substrate 40 is The electrode 81, which corresponds to the ceramic circuit board 80 in advance, such as a copper pad, a copper bump, a solder bump, or other conductive contact terminals, is removed at the same time. A photoresist layer 50 and a second photoresist layer 60 can peel off the substrate 40 ′, and a plurality of 3D elastic microprobes are accurately and efficiently bonded to the electrode 81 of the ceramic circuit substrate 80 (such as the 8th and 9th The picture shows.] In the 10th figure, another type of 3D elastic microprobe of the present invention is disclosed. The 3D elastic microprobe 90 is used to electrically touch an electronic device, such as a micrometer.

Page 9 513380 V. Description of the invention (6) Processor, memory or special application product probe 9 0 contains a conductive and a plurality of support platforms 9 2 connected to the platform 9 2 extending obliquely outward, so that The bottom end of the elastically supporting contact terminal 9 1 and the electric supporting leg 9 3 are ring-shaped, and the platform 9 2 is combined with the platform 9 2 for electrically contacting electricity. With a substrate 40, it is possible to accurately simultaneously electrode 82 of various electronic components, such as an electrical transmission roll made of polyurethane. Therefore, the protection scope of the present invention is subject to f. Anyone who is familiar with this technology ^ Any change and body repair circuit [ASIC], the 3D elastic micro-toughness element, which is divided into a platform 9 2 supporting feet 93, the supporting feet 93 are raised by the platform 9 2 and used for transmission To the test equipment, it is preferable that the edge 9 4 is connected to enhance the support foot 9 3 to have at least one contact end 91, which is combined with the sub-device, and this 3D elastic microprobe 90 'is selected with a thermal expansion coefficient. Combine multiple 3D flexible microprobes 90 into similar printed circuit boards Following the board or tape. Those that are defined by the scope of the appended patent application as long as they do not depart from the spirit and modification of the present invention belong to the protection scope of the present invention.

Page 10 Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 g | Figure 7 Figure 8 Figure 9 [Figure 10 Method 11] [Figure No. Method 2 Ming 3D Elastic Micro Probe The microcomputer manufacturing: according to; k # p layer of the substrate wearing schematic diagram; the 3D flexible microprobe machine made by the United States after the light development and development and ten U 栻 electricity made this: ^ ^ Schematic diagram of the substrate cross section Ming Zhi 3D elastic micro-probe micro-electromechanical manufacturing JLi two photoresistive layer substrate wearing schematic diagram; Ming Ming 3D elastic micro-probe micro-electro-mechanical manufacturing method: ^ Tai = schematic cross-section of the substrate with a mold cavity formed on the layer 3D elastic microprobe micro-electromechanical manufacturing method of the month, ·· Schematic cross-section of the substrate of the iLi two-metal layer; etch ΘΙ & 3D elastic microprobe micro-electromechanical manufacturing method of the month, the substrate cross-section after the two-metal layer Schematic II; Ermei: Micro-electromechanical manufacturing method of two 30 elastic microprobes, • Cross-section of Μ mouth substrate to a probe card according to 31) of the present invention 2 elastic 弹 1 Μ # π Τ needle micro-electromechanical manufacturing Method: Dependence: Intention; MEMS manufacturing method of elastic microprobe, 3D elastic microprobe according to the present invention A schematic perspective view of an elastic microprobe: Machine manufacturing method, in U.S. Patent No. 6,084,420 "A test piece" in "- Test Unit DESCRIPTION needle assembly back perspective k probe.

# # Shape in 3D another 513380

Brief description of drawings on page 12 16 Probe assembly 30 Probe end 32 Bridge member 34 Support member 36 Base member 40 Substrate 41 Peelable layer 50 First photoresist layer 51 Micro-blind hole 52 First metal 60 No.-* light Resistive layer 61 Mold cavity 62 Second metal layer 70 Toughness element 71 Platform 72 Supporting leg 80 Ceramic circuit board 81 Electrode 82 Electrode 90 3D elastic microprobe 91 Contact end 92 Platform 93 Supporting leg 94 Ring edge

Claims (1)

J 丄 J 6. Application scope of patents [Scope of application for patents 1. A 3 D elastic formation of exposure blind holes; filling formation of exposure micro blind holes formation options, such as the toughness of the manufacturer, a photoresist of the manufacturer, Such as the manufacturer's film], such as the manufacturer's first light development of the first gold second light development of the cavity second metal etching please patent method, its component welding patent method, its layers and the patent method Its patent law, its patent law, its micro-electromechanical manufacturing method of wooden needles, a complex resist layer on a substrate M ^ 9 & a photoresist layer, so that the shape of the first photoresist layer belongs to a few degrees. The blind hole makes the probe resist layer on the first photoresist layer; the second photoresist layer makes the second photoresist layer forming step: forming a plurality of micro-probes; forming a corresponding layer In the second item of the second metal layer range, the second item includes: pressing to the detection card range, the second item includes: a photoresist layer. The first photoresist layer in the first item of the scope The second photoresist layer in the first item of the scope is on the photoresist layer; and, the 3D elastic micro-probe substrate and a electrode for eliminating j described above constitute a probe. After the 3D elastic microprobing is described, the 3D elastic microprobing system is a negative photoresist. The 3D elastic micro-probe is a photosensitive dry film toughness element. The micro-electromechanical card of the needle allows the micro-electromechanical device of the probe needle to simultaneously remove the micro-electromechanical device of the micro-electromechanical needle of the needle [the 3D elastic micro-probe of the dry range described in item 1 of the "filled first metal" When stepping, these micro-blinds Page 13 6. Scope of patent application The hole system is pre-formed with-n where another peelable layer is formed. 7. A 3D elastic micro-probe containing ... Wooden needles used to electrically touch electronic devices, which includes a conductive tenacity-from several support feet, these 2 excitations have f-platforms and are connected to the platform. The retrieved platform presents a rising "system: The platform extends obliquely outwards for sexual transmission to the test equipment; and evil, used to elastically support the test contact and power at least one test contact, a social device." α σ is used on the desk + for electrical contact with the 3D elastic microprobe described in item 7 of the patent application scope, and the contact end is tungsten or its alloy. The 3D elastic microprobe described by the 7th worker in the patent scope of the patent_ The toughness element is an alloy of any one of copper, button, baili, hybrid Λ, Lithium Dan T. 4 D 3 above 1 〇, a The combined structure of a 3D elastic microprobe and a substrate includes a substrate having a first photoresist layer and a second photoresist layer formed on one surface thereof, wherein the first photoresist layer has a plurality of micro-blind holes, The 72 photoresist layer has mold cavities corresponding to the micro-blind holes; and 'a plurality of 3D elastic microprobes, each The microprobe system includes a conductive toughness element and at least one contact end, wherein the toughness elements are provided in the mold cavity, and has a platform and a plurality of supporting legs connected to the platform, and the supporting legs. The platform extends obliquely outward from the platform along the mold cavity, and the contact end is provided in the above-mentioned micro-blind hole and combined with the flat a 11. The 3D elastic micro-probe and plate as described in the scope of the patent application 1 ··! The combined structure of page 14 and the scope of the patent application further includes a plutonium release layer between the substrate and the first photoresist layer. 12. The combined structure of the 3D elastic microprobe and the substrate as described in item 10 of the scope of the patent application, wherein the first photo-sensing layer is a negative photoresist. The combined structure of the 3D elastic microprobe and the substrate as described in item 10 of the patent scope of the patent, wherein the second photoresist layer is a photosensitive dr film. y 14 The combined structure of the 3D elastic microprobe and its plate as described in item 10 of the Shenjing patent scope, wherein the contact end is tungsten or its alloy.土 soil 15. The combined structure of 3D elastic micro-probing as described in the scope of the patent application, wherein the ductile element is copper, aluminum, earth iron, palladium, platinum, titanium or an alloy containing any of the above elements. ,nickel, Page 15