TW511242B - Chip structure and process for making the same - Google Patents

Chip structure and process for making the same Download PDF

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Publication number
TW511242B
TW511242B TW90131029A TW90131029A TW511242B TW 511242 B TW511242 B TW 511242B TW 90131029 A TW90131029 A TW 90131029A TW 90131029 A TW90131029 A TW 90131029A TW 511242 B TW511242 B TW 511242B
Authority
TW
Taiwan
Prior art keywords
structure body
wire structure
stacked layer
substrate
layer
Prior art date
Application number
TW90131029A
Inventor
Mau-Shiung Lin
Jin-Yuan Li
Jin-Cheng Huang
Original Assignee
Megic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megic Corp filed Critical Megic Corp
Priority to TW90131029A priority Critical patent/TW511242B/en
Application granted granted Critical
Publication of TW511242B publication Critical patent/TW511242B/en

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Abstract

A chip structure comprises a substrate; a first stacked layer; a protective layer; and a second stacked layer, in which the substrate comprises a plurality of electronic elements arranged on the surface layer of the substrate, the first stacked layer is located on the substrate and comprises a dielectric structure body and a first wire structure body, in which the first wire structure body is intertwined in the dielectric structure body of the first stacked layer and the first wire structure body and the electronic elements are electrically connected, the protective layer is located on the first stacked layer and exposes the first wire structure body, and the second stacked layer is installed on the protective layer and at least comprises a second wire structure body electrically connected to the first wire structure body, in which the line thickness, line width and cross-section of the second wire structure body are individually larger than the line thickness, line width and cross-section of the first wire structure body.
TW90131029A 2001-12-14 2001-12-14 Chip structure and process for making the same TW511242B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90131029A TW511242B (en) 2001-12-14 2001-12-14 Chip structure and process for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90131029A TW511242B (en) 2001-12-14 2001-12-14 Chip structure and process for making the same

Publications (1)

Publication Number Publication Date
TW511242B true TW511242B (en) 2002-11-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW90131029A TW511242B (en) 2001-12-14 2001-12-14 Chip structure and process for making the same

Country Status (1)

Country Link
TW (1) TW511242B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7932172B2 (en) 2005-09-23 2011-04-26 Megica Corporation Semiconductor chip and process for forming the same
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US8013449B2 (en) 2003-10-15 2011-09-06 Megica Corporation Post passivation interconnection schemes on top of the IC chips
US8018060B2 (en) 2004-09-09 2011-09-13 Megica Corporation Post passivation interconnection process and structures
US8304907B2 (en) 1998-12-21 2012-11-06 Megica Corporation Top layers of metal for integrated circuits

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8304907B2 (en) 1998-12-21 2012-11-06 Megica Corporation Top layers of metal for integrated circuits
US8013449B2 (en) 2003-10-15 2011-09-06 Megica Corporation Post passivation interconnection schemes on top of the IC chips
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US8018060B2 (en) 2004-09-09 2011-09-13 Megica Corporation Post passivation interconnection process and structures
US7932172B2 (en) 2005-09-23 2011-04-26 Megica Corporation Semiconductor chip and process for forming the same

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