TW472501B - Temperature-controlling plate manufacturing method - Google Patents

Temperature-controlling plate manufacturing method Download PDF

Info

Publication number
TW472501B
TW472501B TW089127316A TW89127316A TW472501B TW 472501 B TW472501 B TW 472501B TW 089127316 A TW089127316 A TW 089127316A TW 89127316 A TW89127316 A TW 89127316A TW 472501 B TW472501 B TW 472501B
Authority
TW
Taiwan
Prior art keywords
heat transfer
film heater
thin film
temperature control
transfer plate
Prior art date
Application number
TW089127316A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuya Kuriyama
Toru Kihara
Toshio Yoshimitsu
Original Assignee
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Mfg Co Ltd filed Critical Komatsu Mfg Co Ltd
Application granted granted Critical
Publication of TW472501B publication Critical patent/TW472501B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/40—Network security protocols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Heating Bodies (AREA)
TW089127316A 1999-12-28 2000-12-20 Temperature-controlling plate manufacturing method TW472501B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37445899A JP2001185333A (ja) 1999-12-28 1999-12-28 温度制御用プレートの製造方法

Publications (1)

Publication Number Publication Date
TW472501B true TW472501B (en) 2002-01-11

Family

ID=18503886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089127316A TW472501B (en) 1999-12-28 2000-12-20 Temperature-controlling plate manufacturing method

Country Status (4)

Country Link
US (2) US20010054469A1 (ko)
JP (1) JP2001185333A (ko)
KR (1) KR100683322B1 (ko)
TW (1) TW472501B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666903B2 (ja) * 2003-11-26 2011-04-06 京セラ株式会社 ウェハ支持部材
US8889282B2 (en) * 2007-10-27 2014-11-18 Bayerische Motoren Werke Aktiengesellschaft Apparatus for supplying power to a motor vehicle
WO2013172847A1 (en) * 2012-05-17 2013-11-21 Intel Corporation Film insert molding for device manufacture
GB2604976A (en) * 2020-12-01 2022-09-21 Em Tech Co Ltd Heater for microparticle generator and installation structure thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089346A (en) * 1989-03-23 1992-02-18 Hitachi Chemical Company, Ltd. Heat resistant adhesive composition and bonding method using the same
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal

Also Published As

Publication number Publication date
JP2001185333A (ja) 2001-07-06
KR20010062569A (ko) 2001-07-07
KR100683322B1 (ko) 2007-02-15
US20030106638A1 (en) 2003-06-12
US20010054469A1 (en) 2001-12-27

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees