TW466655B - Flip chip and the manufacturing process thereof - Google Patents

Flip chip and the manufacturing process thereof Download PDF

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Publication number
TW466655B
TW466655B TW090104144A TW90104144A TW466655B TW 466655 B TW466655 B TW 466655B TW 090104144 A TW090104144 A TW 090104144A TW 90104144 A TW90104144 A TW 90104144A TW 466655 B TW466655 B TW 466655B
Authority
TW
Taiwan
Prior art keywords
opening
plurality
flip chip
ball
manufacturing process
Prior art date
Application number
TW090104144A
Inventor
Jin-Cheng Huang
Chuen-Jie Lin
Ming-Da Lei
Mau-Shiung Lin
Original Assignee
Megic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megic Corp filed Critical Megic Corp
Priority to TW090104144A priority Critical patent/TW466655B/en
Application granted granted Critical
Publication of TW466655B publication Critical patent/TW466655B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Abstract

A flip chip comprises: a chip that the chip has an active surface and the active surface of the chip comprises a passivation and a plurality of bonding pads in which the passivation has a plurality of the first openings and each bonding pad has at least one second opening and each first opening is corresponding to the position of one of the second opening respectively and the cross-sectional area of each first opening is almost the same as the cross-sectional area of the corresponding second opening; a plurality of ball-bottom metal blocks that each ball-bottom metal blocks are embedded into the first and the second openings on one of the bonding pads respectively; and, a plurality of bumps that each bumps are allocated on one of the ball-bottom metal blocks respectively.
TW090104144A 2001-02-23 2001-02-23 Flip chip and the manufacturing process thereof TW466655B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW090104144A TW466655B (en) 2001-02-23 2001-02-23 Flip chip and the manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090104144A TW466655B (en) 2001-02-23 2001-02-23 Flip chip and the manufacturing process thereof

Publications (1)

Publication Number Publication Date
TW466655B true TW466655B (en) 2001-12-01

Family

ID=21677440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090104144A TW466655B (en) 2001-02-23 2001-02-23 Flip chip and the manufacturing process thereof

Country Status (1)

Country Link
TW (1) TW466655B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7960272B2 (en) 2002-10-24 2011-06-14 Megica Corporation Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package
US8748227B2 (en) 2001-03-30 2014-06-10 Megit Acquisition Corp. Method of fabricating chip package
US8912666B2 (en) 2001-03-30 2014-12-16 Qualcomm Incorporated Structure and manufacturing method of chip scale package
US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package
US7960272B2 (en) 2002-10-24 2011-06-14 Megica Corporation Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
US8334588B2 (en) 2002-10-24 2012-12-18 Megica Corporation Circuit component with conductive layer structure

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