TW416069B - FBT, its bleeder resistor, and device for coupling bleeder resistor - Google Patents
FBT, its bleeder resistor, and device for coupling bleeder resistor Download PDFInfo
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116069 五、發明說明(i) <發明之範圍> 本發明係關於一種FBT(即回掃變壓器),其分泄電阻 器(裝設於FBT頂部),及用以耦接分泄電阻器^裝置,fbt 係在陰極射線管内用以發生高電壓而使用於電視'監控器 或其他類似品者。尤其是本發明乃有關於一種”了,J"其"八° 泄電阻器,及用以耦接分泄電阻器之裝置,其中有二/個刀 以上之開口形成於鄰近基板上之電阻器圖型之處,而第二 與第二開口乃交替而互相面對形成。此外第一與第二門口 長度的總和大於第一與第二開口間之平均距離。'因^ : 製造未塗佈之分泄電阻器時,並不須要玻螭塗佈,烘户’ 浸潰於環氧樹脂,及固化等。不僅如此,其耐壓性質^得 加強,且製造過程得以簡化。因此可以減少成本而以簡便 方法製造分泄電阻器。 <發明之背景> 通常傳統之分泄電阻器係以下述方式製造。亦即如第 1圖所示,先準備一具由純度大約96%的八12〇3所製成的陶究 基板10。其厚度大約為0.5〜1.2mm,而其面積為4〇〇〜 1 50 0ππα^在陶瓷基板1〇上印製PbAg、PtAg、Ag或該等組 成之漿膏。然後經印製的基板大約以8 0 0 °C溫度下供培, 由是形成一印刷電路板(JPCB),然後以軟焊裝設導線。然 後印上Ru02,然後該構造在大約850 °C溫度下烘焙。由於 完成了具有一定厚度的電阻器。 但是’於此電阻器,只能在電阻器每單位長度的電阻 小於空氣接觸電阻的情形下才能有電流通過。在空氣中絕116069 V. Description of the invention (i) < Scope of invention > The present invention relates to an FBT (ie, flyback transformer), a bleeder resistor (installed on top of the FBT), and a coupling resistor ^ Device, fbt is used in the cathode ray tube to generate high voltage and used in TV 'monitor or other similar products. In particular, the present invention relates to a kind of "J" its "eight-degree bleeder resistor, and a device for coupling a bleeder resistor, in which there are two or more knife openings formed in the resistance of the adjacent substrate Where the second and second openings alternately face each other. In addition, the sum of the lengths of the first and second doorways is greater than the average distance between the first and second openings. '因 ^: Manufacture not painted It is not necessary to coat glass resistors to bleed resistors, immerse them in epoxy resin, and cure them. Not only that, their pressure resistance properties are strengthened, and the manufacturing process is simplified. Therefore, it can reduce The drain resistor can be manufactured in a simple method at a low cost. ≪ Background of the invention > Generally, a conventional drain resistor is manufactured in the following manner. That is, as shown in FIG. 1, first prepare a resistor having a purity of about 96%. The ceramic substrate 10 made of 81203. Its thickness is about 0.5 ~ 1.2mm, and its area is 400 ~ 150 0ππα ^ PbAg, PtAg, Ag or the like is printed on the ceramic substrate 10. Composition of paste. The printed substrate is then heated at approximately 80 ° C. For printing, a printed circuit board (JPCB) is formed, and then the wires are soldered. Then Ru02 is printed, and the structure is baked at about 850 ° C. Because a resistor with a certain thickness is completed. But 'In this resistor, a current can only pass if the resistance per unit length of the resistor is less than the air contact resistance.
第5頁 416069___ 五、發明說明(2) 緣破壞電壓張度為〇 5K V/mm時,假如有20KV的電壓供應於 電阻器12兩端,就須保持20KV+ 0. 5KV/mm =40mm的距離。 此外’假如考慮熱劣化及環境因素在内,安全距離必須為 上述距離的1, 8倍,亦即,40mm X 1 . 8 = 72mm。然而在電阻 器1 2以直線狀印製於陶瓷基板丨〇的場合,則陶瓷基板丨〇必 須更長’其結果整個陶瓷基板容積變成太大。 由是’在陶瓷基板1 〇上的電阻器1 2必須製成彎曲狀, 藉以減小陶.莞基板1 〇的容積。在此場合,彎曲圖型上每單 位長度的電位差超過直線狀抵抗破壞電壓強度距離 0. 5KV/mm。假如考慮環境因素及熱劣化,每單位長度的電( 位差^超過空氣中抗破壞電壓距離,其結果在彎曲狀圖型 間可能產生輝光放電。因此以傳統方式形成彎曲狀電阻器 $電阻器圖型被以玻璃塗佈絕緣,然後施以密閉烘焙, 藉此避象輝先放電發生。 f是,雖然玻璃塗佈固可將圖型絕緣,在結晶狀環氧 樹曰…、固化期間濕氣與熱衝擊會弱化絕緣, 阻器。,是在玻璃塗佈後還要浸漬於環氧樹月旨二:刀’世電 但疋,以上揭方式製造的分泄電阻器伴有下揭之缺 璃塗S':電阻器12係印製於陶竟基板1◦上,然後施以玻 以固: 後施以烘培’然後塗佈環氧樹脂15,而然後施 而Ξ高成:此由於這樣複雜的製造過程,…性降低, 第二,電阻器12係印製於陶竟基板1〇上,然後施以玻Page 5 416069___ 5. Description of the invention (2) When the edge breaking voltage is 0KV / mm, if 20KV voltage is supplied across the resistor 12, it must maintain a distance of 20KV + 0.5KV / mm = 40mm . In addition, if thermal degradation and environmental factors are taken into consideration, the safety distance must be 1, 8 times the above distance, that is, 40mm X 1.8 = 72mm. However, when the resistor 12 is printed on the ceramic substrate in a linear shape, the ceramic substrate must be longer, as a result, the entire ceramic substrate volume becomes too large. Therefore, the resistor 12 on the ceramic substrate 10 must be made curved to reduce the volume of the ceramic substrate 10. 5KV / mm。 In this case, the potential difference per unit length on the bending pattern exceeds the linear resistance to the breakdown voltage distance 0.5 KV / mm. If environmental factors and thermal degradation are taken into consideration, the electric potential per unit length (the potential difference ^ exceeds the distance of the anti-destructive voltage in the air, as a result, a glow discharge may occur between the curved patterns. Therefore, a curved resistor $ resistor is formed in a conventional manner. The pattern is coated with glass and insulated, and then hermetically baked to avoid the first discharge of the image. F is that although the glass coating can insulate the pattern, the crystalline epoxy tree is wet during curing ... Gas and thermal shock will weaken the insulation, and the resistor. It is dipped in epoxy resin after the glass is coated. The second purpose of the knife: the knife's world power, but the drain resistor manufactured by the above method is accompanied by the next method. Glass-less coating S ': The resistor 12 is printed on the ceramic substrate 1◦, and then coated with glass: After that, it is baked and then coated with epoxy resin 15 and then coated with Gao Cheng: this Due to such a complicated manufacturing process, the performance is reduced. Second, the resistor 12 is printed on the ceramic substrate 10, and then glass
416069 五、發明說明(3) 〜--- 璃塗佈用以絕緣電阻器圖型,然後施以烘焙,缺 氧樹脂15 ’然後予以固化。因此經印製的電阻,器、〗^環 乃降低了’而增加了電阻值誤差變動率。 、特性 第三,由於連續的烘焙,電阻器的顆粒繼續重 此易於變亂。由是電阻器表面變成粗饒而尖, 電壓破壞電阻迅速降低。 ’、、·果抗 第四,如上揭描述,電阻值誤差率較高,由是,為了 滿足客戶需求’不完全的產品乃被倒冑。最後 須決定提高。 第_五’由於使用玻璃與軟質環氧樹脂,材料 高,最後結果價格更加提高。 第2A〜2E圖說明傳統分泄電阻器的各種實例。在其上 面印有電阻器的陶瓷基板10的全面積被浸漬於溶融環^樹 脂內以便塗佈基板。第2A圖說明一具有三條5丨線〗4 ^分泄 電阻器’引線係以軟焊方式連接。因此此電阻器具有:揭 缺點。第2B圖說明一分泄電阻器,其中電阻器圖型係以高 密度形成,而陶瓷基板只有一面塗佈。 门 第2C圖說明另一傳統分泄電阻器,其中陶曼基板〇、有 其一面的一部分以矽塗佈。第2D圖說明分泄電阻器中的焦 點容量基板係一體成形’電阻器1 2以環氧樹脂塗佈,而^ 一開口形成於基板的一部分。第2E圖說明焦點容量基板係 形成一體(並非分泄電阻器)的一例,而開口間的直線距離 (圖型之絕緣用者)係小於陶瓷基板的寬度(W)。 在上揭傳統技術中’由於採用玻璃塗佈及軟質環氧樹416069 V. Description of the invention (3) ~ --- Glass coating is used to insulate the resistor pattern, and then baking is performed, and the anoxic resin 15 ′ is then cured. Therefore, the printed resistance, device, and loop are reduced by ’and increase the variation rate of resistance error. Third, due to continuous baking, the particles of the resistor continue to be heavy and easily become messy. As the surface of the resistor becomes rough and sharp, the voltage destruction resistance decreases rapidly. Fourth, as described in the above description, the error rate of the resistance value is relatively high. Therefore, in order to meet customer needs, incomplete products are dumped. The final decision must be raised. Fifth_fifth 'because of the use of glass and soft epoxy resin, the material is high, and the final price is even higher. Figures 2A to 2E illustrate various examples of conventional bleed resistors. The entire area of the ceramic substrate 10 on which the resistor is printed is immersed in a molten resin to coat the substrate. Fig. 2A illustrates a resistor having three 5 lines and a drain line connected by soldering. Therefore, this resistor has the following disadvantages. Figure 2B illustrates a bleed resistor in which the resistor pattern is formed at a high density and the ceramic substrate is coated on only one side. Gate Figure 2C illustrates another conventional bleeder resistor in which the Taurman substrate 0, a portion of which has one side, is coated with silicon. Fig. 2D illustrates that the focal point capacity substrate in the drain resistor is integrally formed. The resistor 12 is coated with epoxy resin, and an opening is formed in a part of the substrate. Fig. 2E illustrates an example in which the focus capacity substrate is integrated (not a bleeder resistor), and the linear distance between the openings (for the insulation of the figure) is smaller than the width (W) of the ceramic substrate. In the traditional technology of shanghai ’, because of glass coating and soft epoxy resin,
第7頁 ^16069 -— - 發明" ---—. 月旨冷 二佈而有上揭缺點。此外,即使設有開口,當電壓 疋水準時,同樣在圖型間有輝光放電的發生。尤有 低:如上揭情形’複雜的過程造成可操作性與生產力的減 <發明之總論> 發明ίί傳統技術的上揭缺點而開#。因此本 的目的在棱供一種FBT及其分泄電阻器,其中所有 心螭塗佈、烘焙、浸漬於環氧樹脂、及其固化過程均可免 =,但却改善了抗電壓破環性質,而因製造過程的簡化 α〇得以輕易的製造。 本發明的另一目的在提供一種分泄電阻器及其耦接裴 置,其中在波狀彎曲的電阻圖型間形成有開口藉以避免^ 壓輝光放電,而且插入分泄電阻器於殼體内以完善的絕緣 電卩且器圖型’藉此改善分泄電阻器的電氣特性。 為了達成上揭目的’本發明的分泄電阻器包含: 一基板、及一波狀彎曲電阻器圖型形成於基板上。FBT分 泄電阻器更包含:一對或多對開口形成於基板,各對開〇 包含有一第一開口與一第二開口;第一開口設於基板之〜 邊緣;第二開口設於基板之相對邊;第一與第二開口橫向 延伸於基板上;及該第一與第二開口長度的總和大於第〜 與第二開口間基板的平均寬度。 另一本發明的目的而言,本發明的FBT分泄電阻器耦 接裝置包含:一分泄電阻器;一電阻器殼體用以收納具有 交替與互相面對配置的開口之分泄電阻器;形成於電阻器Page 7 ^ 16069---Inventions " -----. The coldest month has two drawbacks. In addition, even if an opening is provided, when the voltage is at a level, a glow discharge also occurs between the patterns. Especially low: the situation as described above 'the complicated process results in a reduction in operability and productivity < General of invention > Therefore, the purpose of the present invention is to provide an FBT and its discharge resistor, in which all heart palate can be coated, baked, impregnated with epoxy resin, and its curing process can be avoided, but it has improved the anti-voltage breaking properties Because of the simplification of the manufacturing process, α0 can be easily manufactured. Another object of the present invention is to provide a bleeder resistor and a coupling device thereof, wherein an opening is formed between the wave-shaped curved resistance patterns to avoid ^ pressure glow discharge, and the bleeder resistor is inserted into the casing. Improve the electrical characteristics of the bleeder resistor with a perfect insulation pattern. In order to achieve the purpose of disclosure, the bleeder resistor of the present invention includes a substrate and a wave-shaped bending resistor pattern formed on the substrate. The FBT shunt resistor further includes: one or more pairs of openings are formed on the substrate, and each pair of openings includes a first opening and a second opening; the first opening is provided on the edge of the substrate; and the second opening is provided on the opposite side of the substrate. The first and second openings extend laterally on the substrate; and the sum of the lengths of the first and second openings is greater than the average width of the substrate between the first and second openings. For another purpose of the present invention, the FBT bleed resistor coupling device of the present invention includes: a bleed resistor; and a resistor housing for accommodating a bleed resistor having openings arranged alternately and facing each other ; Formed in resistor
第8頁 416069 五、發明說明(5) 殼體内的分隔片,用以插入於八π & β , β0 斗+八 久分泄電阻器的開口,並在分 泄電阻器上方突出;及一蓋子以便分泄電阻器插入於其殼 體後用以覆蓋電阻器殼體頂部。 泄電阻器包含一電阻器圖型 本發明的又一意向而言,本發明的FBT包含:高壓與 低壓線圈軸,其上繞有線圈用以發生一高磨;—FBT殼體 用以收容高壓與低壓線圈轴而被—種絕緣樹脂充填;一分 分泄電阻器基板具有一對 或多對鄰近配置的第-與第:心,第―開口設於基板的 一邊緣,第二開口設於基板的相對一邊緣,而第一與第二 開口的總長大於第一與第二開口間基板的平了 圖型在第一與第二開口間以波狀征祕.φ 見没 电丨 收納分泄電阻器,,具有複數= 器殼體用以 器的開口且突出於分泄電阻器::以=分Hi 電阻器插入其殼體後用以覆蓋電阻器殼體的 η 1 <附圖之簡單說明> 8 ° 本發明之上揭目的與其他優點可參照 發明具體實施例之^細描述即可更深人瞭解,~圖閲讀本 第1圖為-般傳統FBT分泄電阻器製造過程:2圃. 之 第2Α — 2Ε圖為傳統FBT所使用分泄電阻 ' ’ 說明圖; 电阻15各種實例 圖 .第3圖為本發明FBT,分泄電阻器及蓋子之分解透視 第4圖為本發明分泄電阻器之透視囷; 第5圖為本發明另一實施例中之分泄電阻器之透視Page 8 416069 5. Description of the invention (5) The separator in the housing is used to be inserted into the opening of the eight π & β, β0 bucket + eight-year drain resistor, and protrudes above the drain resistor; and A cover is provided for the drain resistor to be inserted behind its housing to cover the top of the resistor housing. The leakage resistor includes a resistor pattern. In another aspect of the present invention, the FBT of the present invention includes: high-voltage and low-voltage coil shafts, on which coils are wound for high wear;-FBT housings for receiving high voltages And a low-voltage coil shaft are filled with an insulating resin; a shunt resistor substrate has one or more pairs of first-and-first: cores, and the first opening is provided on one edge of the substrate, and the second opening is provided on The opposite edge of the substrate, and the total length of the first and second openings is longer than the flat pattern of the substrate between the first and second openings. The pattern is undulated between the first and second openings. Φ See no electricity 丨 Storage points A bleeder resistor having a plurality of openings for the housing and protruding from the bleeder resistor: η 1 < Brief description> 8 ° The above disclosure and other advantages of the present invention can be better understood by referring to the detailed description of the specific embodiments of the invention. The figure reads the first figure. This is the general manufacturing process of a traditional FBT bleed resistor. : 2 gardens. The 2A-2Ε picture is used to release the traditional FBT The illustration of resistance ''; various examples of resistance 15. Figure 3 is an exploded perspective view of the FBT, drain resistor and cover of the present invention. Figure 4 is a perspective view of the drain resistor of the present invention. Figure 5 is another view of the present invention. Perspective of a bleeder resistor in an embodiment
第9頁 41^0^9_ 五、發明說明(6) 圖;及 第6圖為電阻器殼體之蓋子的透視圖。 圖示 中元件名稱與符 號 對照> 10 : 陶瓷基板 12 : 電阻器 15 : 環氧樹脂 14 : 引線 110 FBT殼體 100 分泄電阻器 130 基板 140 電阻器圖型 180 電阻器殼體 210 蓋子 150 第一開口 150’ :第二開口 160 分隔片 170 電阻器殼體1 8 0 内 部 200 插溝 190 周圍牆 120 電阻器圖型1 4 0 的 輸入端子 120’ :電阻器圖型140的輸出端子 <較佳具體實施例之詳細描述> 第3圖為本發明FBT,分泄電阻器及蓋子之分解透視 圖。第4圖為本發明分泄電阻器之透視圖。Page 9 41 ^ 0 ^ 9_ V. Description of the Invention (6) Figure; and Figure 6 is a perspective view of the cover of the resistor case. Comparison of component names and symbols in the illustration 10: Ceramic substrate 12: Resistor 15: Epoxy resin 14: Lead 110 FBT case 100 Drain resistor 130 Substrate 140 Resistor pattern 180 Resistor case 210 Cover 150 The first opening 150 ': the second opening 160, the separator 170, the resistor housing 1 8 0, the internal 200 slot 190, the surrounding wall 120, the resistor pattern 1 4 0, the input terminal 120': the output terminal of the resistor pattern 140 < Detailed description of the preferred embodiment > FIG. 3 is an exploded perspective view of the FBT, the drain resistor and the cover of the present invention. Figure 4 is a perspective view of a bleeder resistor of the present invention.
416069 五、發明說明(7) 在本發明之FBT内部,含有帶線圈之高壓與低壓線圈 軸。在一 FBT殼體110内收容高壓與低壓線圈軸,而包含一 絕緣樹脂用以絕緣高壓與低壓線圈軸。在FBT殼體1 1〇頂部 裝設一電阻器殼體180。此電阻器殼體180收納一分泄電阻 器100,其中包含一基板130與一電阻器圖型140形成於基 板130上。電阻器彀體180上覆蓋一蓋子210。 如第4與5圖所示,分泄電阻器1〇〇的形成方式為以一 電阻器圖型1 4 0印製於基板1 3 〇上,而第一與第二開口 1 5 〇 與150’以交替而互相面對的方式形成於電阻器圖型14〇之 波狀部分内。 亦即一對或多對第一與第二開口 150與150’互相鄰近 形成於基板130上◦第一開口 150開放於基板130之一邊 緣。 第二開口 1 50’開放於基板130之相對邊緣,而第一與 第一開口 150與150在基板130内橫向形成。第一與第二開 口 1 5 0與1 5 0 ’長度的總和(h十L2)作成大於第一與第二開口 間之平均基板寬度Ws。 如第3圖所示’在FBT殼體110頂部裝設一電阻器殼體 180,此電阻器殼體180具有複數的分隔片160於其内部 170,使得該分隔片160可插入於開口 150與150’ 。如第6圖 所示,一蓋子210粞接於電阻器殼體180,且具有複數的插 入溝20 0,使蓋子210得以耦接於電阻器殼體180。插入溝 2 0 0係以圍牆1 9 0圍繞形成。 如上揭方式構成的本發明的作用與效果描述如下。416069 V. Description of the invention (7) Inside the FBT of the present invention, there are high voltage and low voltage coil shafts with coils. A high voltage and low voltage coil shaft is housed in an FBT housing 110, and an insulating resin is included to insulate the high voltage and low voltage coil shafts. A resistor case 180 is mounted on top of the FBT case 110. The resistor case 180 houses a bleeder resistor 100, which includes a substrate 130 and a resistor pattern 140 formed on the substrate 130. The resistor body 180 is covered with a cover 210. As shown in Figures 4 and 5, the method of forming the drain resistor 100 is to print a resistor pattern 140 on the substrate 130, and the first and second openings 150 and 150 'Alternatively facing each other are formed in the wavy portion of the resistor pattern 14o. That is, one or more pairs of the first and second openings 150 and 150 'are formed on the substrate 130 adjacent to each other. The first opening 150 is opened on one edge of the substrate 130. The second openings 150 'are opened at opposite edges of the substrate 130, and the first and first openings 150 and 150 are formed laterally in the substrate 130. The sum (h × L2) of the lengths of the first and second openings 150 and 15 0 'is made larger than the average substrate width Ws between the first and second openings. As shown in FIG. 3, 'a resistor case 180 is installed on the top of the FBT case 110, and the resistor case 180 has a plurality of separators 160 inside the 170, so that the separator 160 can be inserted into the opening 150 and 150 '. As shown in FIG. 6, a cover 210 is connected to the resistor case 180 and has a plurality of insertion grooves 20 0 so that the cover 210 can be coupled to the resistor case 180. The insertion groove 2 0 0 is formed by a surrounding wall 19 0. The functions and effects of the present invention constructed as described above are described below.
416069 五、發明說明(8) 如第3至6圖所示,電阻器殼體180係裝設於FBT殼體 11〇之頂部,而分泄電阻器1〇〇則裝設於電阻器殼體18〇 内°在分泄電阻器1〇〇的基板130上印有波狀(掃描)電阻器 圖型140。在電阻器圖型14〇的相鄰波狀部分内形成具有某 些深度的開口 1 5 〇與1 5 0 ’,這些開口係供絕緣用者。 如第4圖所示,在印製於分泄電阻器100的基板130上 的t I1且器圖型丨4〇的波狀部分内至少形成有一對或多對第 一與第二開口 與150,》此外,第一開口 1 50開放於基板 130的一邊緣*而第二開口 150,則開放於基板130之相對邊 緣。 第一與第二開口 150與150,橫向形成於基板130内,第 一與第二開口150與150’的長度總和+ L2)作成大於第一 與第二開口 150與150’間之平均基板寬度Ws。因此經由相 對開放的第一與第二開口 1 5 0與1 5 0 ’之間,電阻器1 40可以 波狀(掃描)印製形成。因此可保持充分的絕緣距離,而更 為加強的絕緣可因開口 1 5 0與1 5 0 ’的形成而得確保。 第5圖為本發明另一實施例中之分泄電阻器之透視 圖°於此實施例中,基板130的寬度並非常數,而成對的 第一與第二開口 150與150’係妥適的橫向形成於基板130 内。此外,第一與第二開口 1 5 0與1 5 0 ’長度的總和(L, + L2) 係大於第一與第二開口 150與150’之間之平均基板寬度 Ws 。 如第3圖所示,假如欲將分泄電阻器1〇〇方便的裝設於 FBT殼體110的頂部,具有分隔片160的電阻器殼體180就得416069 V. Description of the invention (8) As shown in Figures 3 to 6, the resistor housing 180 is installed on the top of the FBT housing 110, and the bleeder resistor 100 is installed on the resistor housing. Within 180 °, a wavy (scanning) resistor pattern 140 is printed on the substrate 130 of the drain resistor 100. Openings 150 and 150 having certain depths are formed in adjacent corrugated portions of the resistor pattern 140, and these openings are provided for insulation. As shown in FIG. 4, at least one or more pairs of the first and second openings and 150 are formed in the undulated portion of t I1 printed on the substrate 130 of the bleed resistor 100 and the device pattern. In addition, the first opening 150 is opened at one edge * of the substrate 130, and the second opening 150 is opened at the opposite edge of the substrate 130. The first and second openings 150 and 150 are formed laterally in the substrate 130. The total length of the first and second openings 150 and 150 '+ L2) is made larger than the average substrate width between the first and second openings 150 and 150'. Ws. Therefore, through the first and second openings 150 and 150 that are relatively open, the resistor 140 can be formed by wave-like (scanning) printing. Therefore, a sufficient insulation distance can be maintained, and a more reinforced insulation can be ensured by the formation of the openings 150 and 150 '. FIG. 5 is a perspective view of a bleeder resistor in another embodiment of the present invention. In this embodiment, the width of the substrate 130 is not constant, and the paired first and second openings 150 and 150 ′ are properly fitted. A lateral direction is formed in the substrate 130. In addition, the sum (L, + L2) of the lengths of the first and second openings 150 and 150 0 'is larger than the average substrate width Ws between the first and second openings 150 and 150'. As shown in FIG. 3, if the bleeder resistor 100 is to be conveniently installed on the top of the FBT case 110, the resistor case 180 with the separator 160 is required.
第12頁 416069 五、發明說明(9) 裝設於FBT殼體11〇之頂部。電阻器殼體180不僅繫固分泄 電阻器1 0 0 ’而且還加強分泄電阻器1 〇 〇的絕緣特性。 亦即有複數的分隔片16〇形成於電阻器殼體180内部, 而使分隔片1 60得以嚴謹的套合於開口 1 50與1 50’ 。因此不 僅分泄電阻器100可以緊密的繫固,同時印製有電阻器圖 型1 40的波狀部分亦可完全互相絕緣❶於此分隔片1 的高 度須大於基板130的厚度t。 於此如第6圖所示,蓋子2 1 〇乃用以覆篕電阻器殼體 180,且蓋子210具有複數的圍牆190用以形成複數的插入 溝200。在分泄電阻器1 〇〇裝設於電阻器殼體1 80内部後,L 將蓋子210套合於電阻器殼體180,以分隔片160緊密套合 於蓋子21 0之插入溝200。 由是,假如有高電壓供應於電阻器圖型14〇(印製於陶 瓷基板130上)之輸入端子120,電阻器圖型140兩端間電壓 降下。在此情形下,由於有分隔片160位於電阻器圖型140 之波狀部分間,因此不致發生輝光放電。 舉例來說,假如有2 0 K V ( d c)電壓供應於電阻器圖型 140的輸入端子120,又假如陶瓷基板130的寬度為i〇mm, 長度為30mm,則電阻器圖型140的總長變成8〇mm »假如空 氣抗電壓破壞強度極限為〇.5KV/mm並再計入環境因素及熱 劣化因素,亦即須要1 _ 8的因數。則應維持〇 . 5KV/mm + 1. 8 =0_ 2 8KV/mm ’ 由是須要有2〇KV(dc) + 0. 28KV/mm = Π‘ 4mm。於此電阻器圖型140有80ππη的長度,因此可保證 充分的電阻。此外’電阻器圖型1 4 〇的波狀部分係以分隔Page 12 416069 V. Description of the invention (9) It is installed on the top of FBT case 11o. The resistor case 180 not only fixes the bleeder resistor 100 0 ′ but also strengthens the insulation characteristics of the bleeder resistor 100. That is, a plurality of separators 160 are formed inside the resistor case 180, so that the separators 160 can be tightly fitted to the openings 150 and 150 '. Therefore, not only the drain resistor 100 can be tightly secured, but also the wavy portions printed with the resistor pattern 1 40 can be completely insulated from each other. The height of the separator 1 must be greater than the thickness t of the substrate 130. Here, as shown in FIG. 6, the cover 21 is used to cover the resistor case 180, and the cover 210 has a plurality of surrounding walls 190 for forming a plurality of insertion grooves 200. After the drain resistor 100 is installed inside the resistor case 180, L fits the cover 210 to the resistor case 180, and the separator 160 fits tightly into the insertion groove 200 of the cover 210. Therefore, if a high voltage is supplied to the input terminal 120 of the resistor pattern 140 (printed on the ceramic substrate 130), the voltage across the resistor pattern 140 drops. In this case, since the separator 160 is located between the wavy portions of the resistor pattern 140, no glow discharge occurs. For example, if a voltage of 20 KV (dc) is supplied to the input terminal 120 of the resistor pattern 140, and if the width of the ceramic substrate 130 is i0mm and the length is 30mm, the total length of the resistor pattern 140 becomes 80mm »If the limit of the air voltage breakdown strength is 0.5KV / mm and then take into account environmental factors and thermal degradation factors, that is, a factor of 1 _ 8 is required. It should be maintained at 0.5KV / mm + 1. 8 = 0_ 2 8KV / mm ′ so it is necessary to have 20KV (dc) + 0.28KV / mm = Π ′ 4mm. Since the resistor pattern 140 has a length of 80ππη, sufficient resistance can be ensured. In addition, the wavy portion of the resistor pattern 14 is separated by
第13頁 4t6069 五、發明說明(ίο) 片160分隔’因此任何輝光放電均可避免。 由是可達成完善的絕緣,因此不須要傳統的玻璃塗 佈。因此分泄電阻器可在空氣中使用,因此,不須施以會 引起龜裂的傳統樹脂浸潰 為了防止濕氣的侵入’在裝設分泄電阻器後並在套合 蓋子210於電阻器殼體180之後,施以最終密封處理。最終 密封處理係藉浸潰F B T成品於環氧樹脂内來完成,藉此完 全自外界絕緣FBT。因此分泄電阻器並不受傳統環氧樹脂 塗佈的收縮現象的影響。此外’如同玻璃塗佈及環氧樹脂 «潰等最終塗佈應予實施,甚至亦應實施在焊接的引線 上。此外’電阻器圖型140的輸入端子12〇與輸出端子u〇, 可由接觸彈簧或一種絕緣橡膠製成。 如 際,可 處理。 簡化使 低了製 部分内 分泄電 分隔片 型的波 的電氣 環氧樹脂浸漬及固化 已有改進。製造過程 成為可能’而且顯著 曲的電阻器圖型的波 光放電。形成有開口 阻器殼體内,以此方 内。因此臀曲電阻器 更加改進了分泄電阻 上文所描述的本發明,當製 免除玻璃塗佈、烘培、軟質 無論如何,抗電壓破壞性質 以輕易方式製造分泄電阻器 造成本。此外,在基板上彎 形成了開口’可防止任何輝 阻器收納於具有分隔片的電 被插入於分泄電阻器的開口 狀部分完全互相絕緣,藉此 特性。 :上所述,慢為本發明之較佳實施例之㈣ 來限疋本發明實施之U。#凡依本發明中請專利範圍所Page 13 4t6069 V. Description of Invention (ίο) Sheet 160 is separated ’so any glow discharge can be avoided. Because perfect insulation is achieved, traditional glass coatings are not required. Therefore, the bleed resistor can be used in the air. Therefore, it is not necessary to impregnate the traditional resin which can cause cracks. After the case 180, a final sealing process is performed. The final sealing process is completed by impregnating the finished product of F B T in epoxy resin, thereby completely insulating FBT from the outside. Therefore, the bleeder resistor is not affected by the shrinkage phenomenon of the conventional epoxy coating. In addition, final coatings such as glass coatings and epoxy resins should be applied, and should even be applied to soldered leads. In addition, the input terminal 12 and the output terminal u of the resistor pattern 140 may be made of a contact spring or an insulating rubber. If it can be handled. The simplification of the electrical discharge and the curing of the separator-type wave in the low-frequency part has been improved by epoxy impregnation and curing. The manufacturing process is made possible 'and has a significantly curved resistor pattern wave discharge. An opening is formed inside the resistor case. Therefore, the hip flex resistor further improves the drain resistance. The present invention described above, when manufactured without glass coating, baking, and softness. In any case, the anti-voltage destruction property makes it easy to manufacture the drain resistor. In addition, an opening is formed on the substrate by bending to prevent any resistors from being housed in the opening-like portions of the shunt resistors that are housed with separators, thereby completely insulating each other. : As mentioned above, slow is one of the preferred embodiments of the present invention to limit the implementation of the present invention. #Where according to the invention
416069 五、發明說明(11) 做之同等變更與修飾,應皆為本發明專利範圍所涵蓋。 第15頁 1416069 V. Description of the invention (11) The equivalent changes and modifications shall be covered by the scope of the invention patent. Page 15 1
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