TW368676B - Internally cooled target assembly for magnetron sputtering - Google Patents
Internally cooled target assembly for magnetron sputteringInfo
- Publication number
- TW368676B TW368676B TW087102626A TW87102626A TW368676B TW 368676 B TW368676 B TW 368676B TW 087102626 A TW087102626 A TW 087102626A TW 87102626 A TW87102626 A TW 87102626A TW 368676 B TW368676 B TW 368676B
- Authority
- TW
- Taiwan
- Prior art keywords
- target assembly
- internally cooled
- magnetron sputtering
- cooled target
- target
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An internally cooled target assembly for use in a magnetron sputtering apparatus is provided. The internally cooled target assembly includes a cooling plate that is configured to promote highly turbulent coolant flow through the target assembly to achieve efficient and uniform target cooling. The volume of coolant required to cool the target assembly is minimized.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3847697P | 1997-02-24 | 1997-02-24 | |
US08/832,718 US5985115A (en) | 1997-04-11 | 1997-04-11 | Internally cooled target assembly for magnetron sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
TW368676B true TW368676B (en) | 1999-09-01 |
Family
ID=26715254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087102626A TW368676B (en) | 1997-02-24 | 1998-03-07 | Internally cooled target assembly for magnetron sputtering |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW368676B (en) |
WO (1) | WO1998037568A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006093953A1 (en) * | 2005-02-28 | 2006-09-08 | Tosoh Smd, Inc. | Sputtering target with an insulating ring and a gap between the ring and the target |
ATE553227T1 (en) | 2006-08-24 | 2012-04-15 | Atomic Energy Council | TARGET HOLDER WITH A COOLING DEVICE |
US10546733B2 (en) * | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH664303A5 (en) * | 1985-04-03 | 1988-02-29 | Balzers Hochvakuum | HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING. |
US5171415A (en) * | 1990-12-21 | 1992-12-15 | Novellus Systems, Inc. | Cooling method and apparatus for magnetron sputtering |
US5487822A (en) * | 1993-11-24 | 1996-01-30 | Applied Materials, Inc. | Integrated sputtering target assembly |
-
1998
- 1998-02-13 WO PCT/US1998/002657 patent/WO1998037568A1/en unknown
- 1998-03-07 TW TW087102626A patent/TW368676B/en active
Also Published As
Publication number | Publication date |
---|---|
WO1998037568A1 (en) | 1998-08-27 |
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