TW368676B - Internally cooled target assembly for magnetron sputtering - Google Patents

Internally cooled target assembly for magnetron sputtering

Info

Publication number
TW368676B
TW368676B TW087102626A TW87102626A TW368676B TW 368676 B TW368676 B TW 368676B TW 087102626 A TW087102626 A TW 087102626A TW 87102626 A TW87102626 A TW 87102626A TW 368676 B TW368676 B TW 368676B
Authority
TW
Taiwan
Prior art keywords
target assembly
internally cooled
magnetron sputtering
cooled target
target
Prior art date
Application number
TW087102626A
Other languages
Chinese (zh)
Inventor
Larry D Hartsough
David J Harra
Ronald R Cochran
Mingwei Jiang
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/832,718 external-priority patent/US5985115A/en
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Application granted granted Critical
Publication of TW368676B publication Critical patent/TW368676B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

An internally cooled target assembly for use in a magnetron sputtering apparatus is provided. The internally cooled target assembly includes a cooling plate that is configured to promote highly turbulent coolant flow through the target assembly to achieve efficient and uniform target cooling. The volume of coolant required to cool the target assembly is minimized.
TW087102626A 1997-02-24 1998-03-07 Internally cooled target assembly for magnetron sputtering TW368676B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3847697P 1997-02-24 1997-02-24
US08/832,718 US5985115A (en) 1997-04-11 1997-04-11 Internally cooled target assembly for magnetron sputtering

Publications (1)

Publication Number Publication Date
TW368676B true TW368676B (en) 1999-09-01

Family

ID=26715254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087102626A TW368676B (en) 1997-02-24 1998-03-07 Internally cooled target assembly for magnetron sputtering

Country Status (2)

Country Link
TW (1) TW368676B (en)
WO (1) WO1998037568A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093953A1 (en) * 2005-02-28 2006-09-08 Tosoh Smd, Inc. Sputtering target with an insulating ring and a gap between the ring and the target
ATE553227T1 (en) 2006-08-24 2012-04-15 Atomic Energy Council TARGET HOLDER WITH A COOLING DEVICE
US10546733B2 (en) * 2014-12-31 2020-01-28 Applied Materials, Inc. One-piece process kit shield

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH664303A5 (en) * 1985-04-03 1988-02-29 Balzers Hochvakuum HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.
US5171415A (en) * 1990-12-21 1992-12-15 Novellus Systems, Inc. Cooling method and apparatus for magnetron sputtering
US5487822A (en) * 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly

Also Published As

Publication number Publication date
WO1998037568A1 (en) 1998-08-27

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