TW367561B - Wet-etching method - Google Patents

Wet-etching method

Info

Publication number
TW367561B
TW367561B TW085113538A TW85113538A TW367561B TW 367561 B TW367561 B TW 367561B TW 085113538 A TW085113538 A TW 085113538A TW 85113538 A TW85113538 A TW 85113538A TW 367561 B TW367561 B TW 367561B
Authority
TW
Taiwan
Prior art keywords
substrate
etching
wet
insulation
passivation layer
Prior art date
Application number
TW085113538A
Other languages
Chinese (zh)
Inventor
Hsien-Fen Hsieh
Ming-De Shiu
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW085113538A priority Critical patent/TW367561B/en
Application granted granted Critical
Publication of TW367561B publication Critical patent/TW367561B/en

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  • Weting (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A kind of wet-etching method of the surface of semiconductor substrate which includes the welding of insulation/passivation layer on the surface of substrate and forming the thin film circuit pattern thereon by wet-etching. The insulation/passivation layer is formed by two steps: first, to arrange the substrate on the surface of substrate in a suitable pitch for growth of insulation film; second, to turn 180 degree of the completed test sheet and arranged with a suitable pitch and to depose or coat a pair of etching agent of dull protection film on the other exposed substrate surface so that the thin film to be etched on the substrate can be completely isolated with the etching solution. Because there is only the material to be etched existing in the wet-etching environment, the effect of etching solution can be best employed and controlled.
TW085113538A 1996-11-04 1996-11-04 Wet-etching method TW367561B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085113538A TW367561B (en) 1996-11-04 1996-11-04 Wet-etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085113538A TW367561B (en) 1996-11-04 1996-11-04 Wet-etching method

Publications (1)

Publication Number Publication Date
TW367561B true TW367561B (en) 1999-08-21

Family

ID=57941244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085113538A TW367561B (en) 1996-11-04 1996-11-04 Wet-etching method

Country Status (1)

Country Link
TW (1) TW367561B (en)

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