TW287188B - - Google Patents
Info
- Publication number
- TW287188B TW287188B TW083109538A TW83109538A TW287188B TW 287188 B TW287188 B TW 287188B TW 083109538 A TW083109538 A TW 083109538A TW 83109538 A TW83109538 A TW 83109538A TW 287188 B TW287188 B TW 287188B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5258620A JPH07114183A (ja) | 1993-10-15 | 1993-10-15 | 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW287188B true TW287188B (enEXAMPLES) | 1996-10-01 |
Family
ID=17322812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083109538A TW287188B (enEXAMPLES) | 1993-10-15 | 1994-10-14 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5591562A (enEXAMPLES) |
| JP (1) | JPH07114183A (enEXAMPLES) |
| KR (1) | KR100297128B1 (enEXAMPLES) |
| TW (1) | TW287188B (enEXAMPLES) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07114183B2 (ja) * | 1987-09-03 | 1995-12-06 | 東京エレクトロン株式会社 | レジスト塗布装置及びレジスト塗布方法 |
| US5853957A (en) * | 1995-05-08 | 1998-12-29 | Tamura Kaken Co., Ltd | Photosensitive resin compositions, cured films thereof, and circuit boards |
| JP4328933B2 (ja) * | 1998-04-17 | 2009-09-09 | 関西ペイント株式会社 | 感光性樹脂組成物 |
| JP2004123775A (ja) * | 2002-09-30 | 2004-04-22 | Taiyo Ink Mfg Ltd | 感光性熱硬化性ペースト組成物 |
| US20080156346A1 (en) * | 2006-12-28 | 2008-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for cleaning a substrate |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338232A (en) * | 1977-12-27 | 1982-07-06 | The Dow Chemical Company | Radiation-curable resins |
| US4302373A (en) * | 1980-08-05 | 1981-11-24 | E. I. Du Pont De Nemours And Company | Water-borne coating composition made from modified epoxy resin, polymeric acid and tertiary amine |
| DE3123536A1 (de) * | 1981-06-13 | 1982-12-30 | Basf Farben + Fasern Ag, 2000 Hamburg | Bindemittel fuer kathodisch abscheidbare ueberzugsmassen, verfahren zu ihrer herstellung und ihre verwendung |
| US4431782A (en) * | 1981-07-27 | 1984-02-14 | The Dow Chemical Company | Process for the preparation of radiation-curable, water-thinnable vinyl ester resins |
| JPS6187147A (ja) * | 1984-09-27 | 1986-05-02 | Fuji Photo Film Co Ltd | 光重合性組成物 |
| US4798877A (en) * | 1985-04-08 | 1989-01-17 | The Dow Chemical Company | Radiation-curable resins |
| US4789620A (en) * | 1986-03-03 | 1988-12-06 | Mitsubishi Rayon Co. Ltd. | Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates |
| JPH06828B2 (ja) * | 1986-10-15 | 1994-01-05 | 宇部興産株式会社 | 光硬化性組成物 |
| JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
| CA1338575C (en) * | 1987-12-08 | 1996-09-03 | Naozumi Iwasawa | Curable resin composition |
| GB2213487B (en) * | 1987-12-08 | 1992-01-08 | Kansai Paint Co Ltd | Method of forming a cured coating film |
| JP2686283B2 (ja) * | 1988-06-13 | 1997-12-08 | 関西ペイント株式会社 | 光重合性組成物 |
| JPH02115845A (ja) * | 1988-10-26 | 1990-04-27 | Tokyo Ohka Kogyo Co Ltd | サンドブラスト用光重合性組成物及びこれを用いた彫刻方法 |
| JPH03115845A (ja) * | 1990-03-15 | 1991-05-16 | Tokyo Electron Ltd | 麈埃検出装置 |
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1993
- 1993-10-15 JP JP5258620A patent/JPH07114183A/ja active Pending
-
1994
- 1994-10-13 US US08/322,415 patent/US5591562A/en not_active Expired - Fee Related
- 1994-10-14 KR KR1019940026320A patent/KR100297128B1/ko not_active Expired - Fee Related
- 1994-10-14 TW TW083109538A patent/TW287188B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US5591562A (en) | 1997-01-07 |
| KR950013333A (ko) | 1995-05-17 |
| JPH07114183A (ja) | 1995-05-02 |
| KR100297128B1 (ko) | 2001-11-22 |