TW284912B - - Google Patents

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Publication number
TW284912B
TW284912B TW084113485A TW84113485A TW284912B TW 284912 B TW284912 B TW 284912B TW 084113485 A TW084113485 A TW 084113485A TW 84113485 A TW84113485 A TW 84113485A TW 284912 B TW284912 B TW 284912B
Authority
TW
Taiwan
Application number
TW084113485A
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW284912B publication Critical patent/TW284912B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/60Electrodes
    • H01L28/75Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28568Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising transition metals
TW084113485A 1994-08-01 1995-12-18 TW284912B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/283,873 US5504041A (en) 1994-08-01 1994-08-01 Conductive exotic-nitride barrier layer for high-dielectric-constant materials

Publications (1)

Publication Number Publication Date
TW284912B true TW284912B (zh) 1996-09-01

Family

ID=23087933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084113485A TW284912B (zh) 1994-08-01 1995-12-18

Country Status (5)

Country Link
US (3) US5504041A (zh)
EP (1) EP0697719A3 (zh)
JP (1) JPH0864786A (zh)
KR (1) KR960009156A (zh)
TW (1) TW284912B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7604390B2 (en) 2006-11-02 2009-10-20 Au Optronics Corp. Supporting structure and fixing component having a through-hole and opening for pin structure engagement and backlight module using the same

Families Citing this family (232)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69404189T2 (de) * 1993-03-31 1998-01-08 Texas Instruments Inc Leicht donatoren-dotierte Elektroden für Materialien mit hoher dielektrischer Konstante
US5499207A (en) * 1993-08-06 1996-03-12 Hitachi, Ltd. Semiconductor memory device having improved isolation between electrodes, and process for fabricating the same
US6404003B1 (en) 1999-07-28 2002-06-11 Symetrix Corporation Thin film capacitors on silicon germanium substrate
US6639262B2 (en) * 1993-12-10 2003-10-28 Symetrix Corporation Metal oxide integrated circuit on silicon germanium substrate
US6770924B1 (en) 1994-05-13 2004-08-03 Micron Technology, Inc. Amorphous TiN films for an integrated capacitor dielectric/bottom plate using high dielectric constant materials
US6107105A (en) * 1994-05-13 2000-08-22 Micron Technology, Inc. Amorphous tin films for an integrated capacitor dielectric/bottom plate using high dielectric constant material
US5622893A (en) * 1994-08-01 1997-04-22 Texas Instruments Incorporated Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes
US5585300A (en) * 1994-08-01 1996-12-17 Texas Instruments Incorporated Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes
US5965942A (en) * 1994-09-28 1999-10-12 Sharp Kabushiki Kaisha Semiconductor memory device with amorphous diffusion barrier between capacitor and plug
DE69508737T2 (de) * 1994-10-04 1999-10-07 Koninkl Philips Electronics Nv Halbleiteranordnung mit einem ferroelektrischen speicherbaustein, dessen bodenelenelektrode eine sauerstoff-barriere enthält
US5563762A (en) * 1994-11-28 1996-10-08 Northern Telecom Limited Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
US5576579A (en) * 1995-01-12 1996-11-19 International Business Machines Corporation Tasin oxygen diffusion barrier in multilayer structures
US5614437A (en) * 1995-01-26 1997-03-25 Lsi Logic Corporation Method for fabricating reliable metallization with Ta-Si-N barrier for semiconductors
US5874364A (en) * 1995-03-27 1999-02-23 Fujitsu Limited Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same
KR100199346B1 (ko) * 1995-04-04 1999-06-15 김영환 반도체 소자의 전하저장전극 형성방법
EP0739030A3 (en) * 1995-04-19 1998-07-08 Nec Corporation Highly-integrated thin film capacitor with high dielectric constant layer
US5663088A (en) * 1995-05-19 1997-09-02 Micron Technology, Inc. Method of forming a Ta2 O5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta2 O5 dielectric layer and amorphous diffusion barrier layer
US5665625A (en) 1995-05-19 1997-09-09 Micron Technology, Inc. Method of forming capacitors having an amorphous electrically conductive layer
US5629229A (en) * 1995-07-12 1997-05-13 Sharp Kabushiki Kaisha Metalorganic chemical vapor deposition of (Ba1-x Srx)RuO3 /(Ba1-x Srx)TIO3 /(Ba1-x Srx)TiO3 /(Ba1- Srx)RuO3 capacitors for high dielectric materials
US5786248A (en) * 1995-10-12 1998-07-28 Micron Technology, Inc. Semiconductor processing method of forming a tantalum oxide containing capacitor
JPH09191088A (ja) * 1995-11-09 1997-07-22 Mitsubishi Electric Corp 半導体記憶装置およびその製造方法
JP3504046B2 (ja) 1995-12-05 2004-03-08 株式会社ルネサステクノロジ 半導体装置の製造方法
US6432767B2 (en) 1995-12-05 2002-08-13 Hitachi, Ltd. Method of fabricating semiconductor device
US5716875A (en) * 1996-03-01 1998-02-10 Motorola, Inc. Method for making a ferroelectric device
KR100215867B1 (ko) * 1996-04-12 1999-08-16 구본준 반도체 소자의 커패시터 구조 및 제조 방법
US6239492B1 (en) 1996-05-08 2001-05-29 Micron Technology, Inc. Semiconductor structure with a titanium aluminum nitride layer and method for fabricating same
TW373320B (en) * 1996-05-27 1999-11-01 United Microelectronics Corporaiton Structure and production method of capacitor of dynamic RAM
US5892281A (en) 1996-06-10 1999-04-06 Micron Technology, Inc. Tantalum-aluminum-nitrogen material for semiconductor devices
US5843830A (en) 1996-06-26 1998-12-01 Micron Technology, Inc. Capacitor, and methods for forming a capacitor
DE19630883A1 (de) * 1996-07-31 1998-02-05 Philips Patentverwaltung Bauteil mit einem Kondensator
WO1998006131A1 (fr) * 1996-08-07 1998-02-12 Hitachi, Ltd. Composant a semi-conducteur et son procede de fabrication
US6251720B1 (en) 1996-09-27 2001-06-26 Randhir P. S. Thakur High pressure reoxidation/anneal of high dielectric constant materials
DE19640448C1 (de) * 1996-09-30 1998-02-19 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung mit einem Kondensator
DE19640246A1 (de) * 1996-09-30 1998-04-02 Siemens Ag Halbleiteranordnung mit geschützter Barriere für eine Stapelzelle
DE19640244A1 (de) * 1996-09-30 1998-04-02 Siemens Ag Kondensator mit einem Elektrodenkern und einer dünnen Edelmetallschicht als erster Elektrode
US6043529A (en) * 1996-09-30 2000-03-28 Siemens Aktiengesellschaft Semiconductor configuration with a protected barrier for a stacked cell
DE19646208C2 (de) * 1996-11-08 2001-08-30 Infineon Technologies Ag Verfahren zur Herstellung eines Kondensators und Speicherfeld
KR100190111B1 (ko) * 1996-11-13 1999-06-01 윤종용 반도체장치의 커패시터 제조방법
US6130124A (en) * 1996-12-04 2000-10-10 Samsung Electronics Co., Ltd. Methods of forming capacitor electrodes having reduced susceptibility to oxidation
US5932907A (en) * 1996-12-24 1999-08-03 International Business Machines Corporation Method, materials, and structures for noble metal electrode contacts to silicon
KR100400290B1 (ko) * 1996-12-31 2003-12-24 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조방법
KR19980060522A (ko) * 1996-12-31 1998-10-07 김영환 반도체 소자의 캐패시터 제조방법
KR100227843B1 (ko) * 1997-01-22 1999-11-01 윤종용 반도체 소자의 콘택 배선 방법 및 이를 이용한 커패시터 제조방법
KR100243285B1 (ko) * 1997-02-27 2000-02-01 윤종용 고유전 커패시터 및 그 제조방법
US5744387A (en) * 1997-03-07 1998-04-28 Vanguard International Semiconductor Corporation Method for fabricating dynamic random access memory with a flat topography and fewer photomasks
US5998257A (en) * 1997-03-13 1999-12-07 Micron Technology, Inc. Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitry
KR100258599B1 (ko) * 1997-03-14 2000-06-15 윤종용 강유전체메모리셀의제조방법
DE19712540C1 (de) * 1997-03-25 1998-08-13 Siemens Ag Herstellverfahren für eine Kondensatorelektrode aus einem Platinmetall
KR100230418B1 (ko) * 1997-04-17 1999-11-15 윤종용 백금족 금속층 형성방법 및 이를 이용한 커패시터 제조방법
KR100273988B1 (ko) * 1997-04-30 2001-01-15 윤종용 커패시터제조방법(Method For Making a Capacitor)
US6849557B1 (en) 1997-04-30 2005-02-01 Micron Technology, Inc. Undoped silicon dioxide as etch stop for selective etch of doped silicon dioxide
US6335238B1 (en) * 1997-05-08 2002-01-01 Texas Instruments Incorporated Integrated dielectric and method
US6153491A (en) 1997-05-29 2000-11-28 International Business Machines Corporation Overhanging separator for self-defining discontinuous film
US5796573A (en) * 1997-05-29 1998-08-18 International Business Machines Corporation Overhanging separator for self-defining stacked capacitor
US5955756A (en) * 1997-05-29 1999-09-21 International Business Machines Corporation Trench separator for self-defining discontinuous film
US6002575A (en) * 1997-05-29 1999-12-14 International Business Machines Corporation Adherent separator for self-defining discontinuous film
US6090697A (en) * 1997-06-30 2000-07-18 Texas Instruments Incorporated Etchstop for integrated circuits
US6020233A (en) * 1997-06-30 2000-02-01 Hyundai Electronics Industries Co., Ltd. Ferroelectric memory device guaranteeing electrical interconnection between lower capacitor electrode and contact plug and method for fabricating the same
US6600183B1 (en) 1997-07-01 2003-07-29 Texas Instruments Incorporated Integrated circuit capacitor and memory
US6153490A (en) * 1997-07-01 2000-11-28 Texas Instruments Incorporated Method for forming integrated circuit capacitor and memory
US6841439B1 (en) * 1997-07-24 2005-01-11 Texas Instruments Incorporated High permittivity silicate gate dielectric
US7115461B2 (en) * 1997-07-24 2006-10-03 Texas Instruments Incorporated High permittivity silicate gate dielectric
US6013553A (en) * 1997-07-24 2000-01-11 Texas Instruments Incorporated Zirconium and/or hafnium oxynitride gate dielectric
US5910880A (en) * 1997-08-20 1999-06-08 Micron Technology, Inc. Semiconductor circuit components and capacitors
US6204525B1 (en) * 1997-09-22 2001-03-20 Murata Manufacturing Co., Ltd. Ferroelectric thin film device and method of producing the same
KR100269310B1 (ko) * 1997-09-29 2000-10-16 윤종용 도전성확산장벽층을사용하는반도체장치제조방법
JP3878724B2 (ja) 1997-10-14 2007-02-07 株式会社ルネサステクノロジ 半導体集積回路装置およびその製造方法
US6074885A (en) * 1997-11-25 2000-06-13 Radiant Technologies, Inc Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures
KR100280206B1 (ko) * 1997-12-06 2001-03-02 윤종용 고유전체 캐패시터 및 그의 제조 방법
US6911371B2 (en) 1997-12-19 2005-06-28 Micron Technology, Inc. Capacitor forming methods with barrier layers to threshold voltage shift inducing material
US6165833A (en) * 1997-12-19 2000-12-26 Micron Technology, Inc. Semiconductor processing method of forming a capacitor
US6228701B1 (en) 1997-12-19 2001-05-08 Seimens Aktiengesellschaft Apparatus and method for minimizing diffusion in stacked capacitors formed on silicon plugs
US6320213B1 (en) 1997-12-19 2001-11-20 Advanced Technology Materials, Inc. Diffusion barriers between noble metal electrodes and metallization layers, and integrated circuit and semiconductor devices comprising same
US6285050B1 (en) * 1997-12-24 2001-09-04 International Business Machines Corporation Decoupling capacitor structure distributed above an integrated circuit and method for making same
KR100252854B1 (ko) * 1997-12-26 2000-04-15 김영환 반도체 메모리 장치 및 그 제조방법
KR100436058B1 (ko) 1997-12-27 2004-12-17 주식회사 하이닉스반도체 강유전체 캐패시터 형성 방법
US6303952B1 (en) * 1998-01-14 2001-10-16 Texas Instruments Incorporated Contact structure with an oxide silicidation barrier
JP3211950B2 (ja) * 1998-01-19 2001-09-25 日本電気株式会社 半導体装置およびその製造方法
US6178082B1 (en) * 1998-02-26 2001-01-23 International Business Machines Corporation High temperature, conductive thin film diffusion barrier for ceramic/metal systems
US6162744A (en) * 1998-02-28 2000-12-19 Micron Technology, Inc. Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers
US6191443B1 (en) 1998-02-28 2001-02-20 Micron Technology, Inc. Capacitors, methods of forming capacitors, and DRAM memory cells
DE19811068C1 (de) * 1998-03-13 1999-06-24 Siemens Ag Kondensator in integrierter Schaltung sowie Verfahren zur Herstellung eines derartigen Kondensators
US6111285A (en) 1998-03-17 2000-08-29 Micron Technology, Inc. Boride electrodes and barriers for cell dielectrics
US6156638A (en) * 1998-04-10 2000-12-05 Micron Technology, Inc. Integrated circuitry and method of restricting diffusion from one material to another
US6730559B2 (en) * 1998-04-10 2004-05-04 Micron Technology, Inc. Capacitors and methods of forming capacitors
US6165834A (en) * 1998-05-07 2000-12-26 Micron Technology, Inc. Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell
US6046059A (en) * 1998-05-08 2000-04-04 Siemens Aktiengesellschaft Method of forming stack capacitor with improved plug conductivity
US6255186B1 (en) 1998-05-21 2001-07-03 Micron Technology, Inc. Methods of forming integrated circuitry and capacitors having a capacitor electrode having a base and a pair of walls projecting upwardly therefrom
KR100292689B1 (ko) * 1998-06-03 2001-07-12 김영환 캐패시터및그형성방법
JP2000012804A (ja) * 1998-06-24 2000-01-14 Matsushita Electron Corp 半導体記憶装置
KR100318453B1 (ko) * 1998-06-29 2002-03-08 박종섭 이리듐막및백금막의이중막구조의하부전극을갖는캐패시터형성방법
KR100301371B1 (ko) * 1998-07-03 2001-10-27 윤종용 반도체메모리장치및그의제조방법
US6277758B1 (en) * 1998-07-23 2001-08-21 Micron Technology, Inc. Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher
US6358810B1 (en) * 1998-07-28 2002-03-19 Applied Materials, Inc. Method for superior step coverage and interface control for high K dielectric capacitors and related electrodes
US6197628B1 (en) * 1998-08-27 2001-03-06 Micron Technology, Inc. Ruthenium silicide diffusion barrier layers and methods of forming same
US6184550B1 (en) 1998-08-28 2001-02-06 Advanced Technology Materials, Inc. Ternary nitride-carbide barrier layers
US6780758B1 (en) * 1998-09-03 2004-08-24 Micron Technology, Inc. Method of establishing electrical contact between a semiconductor substrate and a semiconductor device
US6204172B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Low temperature deposition of barrier layers
US6323081B1 (en) 1998-09-03 2001-11-27 Micron Technology, Inc. Diffusion barrier layers and methods of forming same
US6136660A (en) * 1998-09-28 2000-10-24 Siemens Aktiengesellschaft Stacked capacitator memory cell and method of fabrication
KR100293720B1 (ko) * 1998-10-01 2001-07-12 박종섭 반도체 소자의 캐패시터 형성 방법
TW386286B (en) * 1998-10-26 2000-04-01 Ind Tech Res Inst An ohmic contact of semiconductor and the manufacturing method
DE19849542C2 (de) 1998-10-27 2002-07-11 Infineon Technologies Ag Verfahren zur Herstellung eines Kondensators
KR100318457B1 (ko) * 1998-10-28 2002-02-19 박종섭 플라즈마를이용한강유전체박막형성방법
US6433993B1 (en) * 1998-11-23 2002-08-13 Microcoating Technologies, Inc. Formation of thin film capacitors
JP4416055B2 (ja) 1998-12-01 2010-02-17 ローム株式会社 強誘電体メモリおよびその製造方法
KR100324591B1 (ko) * 1998-12-24 2002-04-17 박종섭 티타늄 알루미늄 질소 합금막을 상부전극의 확산방지막으로서 이용하는 캐패시터 제조 방법
KR100504430B1 (ko) * 1998-12-30 2006-05-17 주식회사 하이닉스반도체 플러그를갖는커패시터의하부전극형성방법
US6075264A (en) 1999-01-25 2000-06-13 Samsung Electronics Co., Ltd. Structure of a ferroelectric memory cell and method of fabricating it
US6495409B1 (en) 1999-01-26 2002-12-17 Agere Systems Inc. MOS transistor having aluminum nitride gate structure and method of manufacturing same
US6387748B1 (en) 1999-02-16 2002-05-14 Micron Technology, Inc. Semiconductor circuit constructions, capacitor constructions, and methods of forming semiconductor circuit constructions and capacitor constructions
US6291363B1 (en) 1999-03-01 2001-09-18 Micron Technology, Inc. Surface treatment of DARC films to reduce defects in subsequent cap layers
US6445023B1 (en) 1999-03-16 2002-09-03 Micron Technology, Inc. Mixed metal nitride and boride barrier layers
US6723436B1 (en) * 1999-03-22 2004-04-20 California Institute Of Technology Electrically conducting ternary amorphous fully oxidized materials and their application
KR100287187B1 (ko) * 1999-03-30 2001-04-16 윤종용 반도체소자의 커패시터 및 그 제조방법
US6268260B1 (en) * 1999-03-31 2001-07-31 Lam Research Corporation Methods of forming memory cell capacitor plates in memory cell capacitor structures
JP2004343150A (ja) * 1999-06-02 2004-12-02 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2001015696A (ja) * 1999-06-29 2001-01-19 Nec Corp 水素バリヤ層及び半導体装置
US6339258B1 (en) 1999-07-02 2002-01-15 International Business Machines Corporation Low resistivity tantalum
US6465828B2 (en) * 1999-07-30 2002-10-15 Micron Technology, Inc. Semiconductor container structure with diffusion barrier
KR100358063B1 (ko) * 1999-08-04 2002-10-25 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조 방법
US6197651B1 (en) 1999-08-30 2001-03-06 Taiwan Semiconductor Manufacturing Company Structure and method for forming a capacitor dielectric using yttrium barium copper oxide
US6281543B1 (en) 1999-08-31 2001-08-28 Micron Technology, Inc. Double layer electrode and barrier system on hemispherical grain silicon for use with high dielectric constant materials and methods for fabricating the same
TW432689B (en) * 1999-10-18 2001-05-01 Taiwan Semiconductor Mfg Fabricating method of stacked capacitor
US7071520B2 (en) 2000-08-23 2006-07-04 Reflectivity, Inc MEMS with flexible portions made of novel materials
US6720096B1 (en) 1999-11-17 2004-04-13 Sanyo Electric Co., Ltd. Dielectric element
DE19958203A1 (de) * 1999-12-02 2001-06-13 Infineon Technologies Ag Herstellungsverfahren einer oxidationsgeschüzten Elektrode für einen kapazitive Elektrodenstruktur
US6780704B1 (en) 1999-12-03 2004-08-24 Asm International Nv Conformal thin films over textured capacitor electrodes
DE19959711A1 (de) 1999-12-10 2001-06-21 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten Metallschicht
US6635528B2 (en) * 1999-12-22 2003-10-21 Texas Instruments Incorporated Method of planarizing a conductive plug situated under a ferroelectric capacitor
KR100376264B1 (ko) 1999-12-24 2003-03-17 주식회사 하이닉스반도체 게이트 유전체막이 적용되는 반도체 소자의 제조 방법
US6801422B2 (en) * 1999-12-28 2004-10-05 Intel Corporation High performance capacitor
KR100351451B1 (ko) * 1999-12-30 2002-09-09 주식회사 하이닉스반도체 반도체메모리장치의 커패시터제조방법
US6475854B2 (en) 1999-12-30 2002-11-05 Applied Materials, Inc. Method of forming metal electrodes
DE10000005C1 (de) * 2000-01-03 2001-09-13 Infineon Technologies Ag Verfahren zur Herstellung eines ferroelektrischen Halbleiterspeichers
JP2003519913A (ja) * 2000-01-06 2003-06-24 アプライド マテリアルズ インコーポレイテッド コンデンサ構造のための低熱収支金属酸化物堆積
US6417537B1 (en) 2000-01-18 2002-07-09 Micron Technology, Inc. Metal oxynitride capacitor barrier layer
US6590246B1 (en) * 2000-02-08 2003-07-08 Micron Technology, Inc. Structures and methods for improved capacitor cells in integrated circuits
US6461973B1 (en) * 2000-02-11 2002-10-08 Advanced Micro Devices, Inc. Method for forming high quality multiple thickness oxide layers by reducing descum induced defects
JP2001237395A (ja) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd 半導体記憶装置
US7005695B1 (en) 2000-02-23 2006-02-28 Micron Technology, Inc. Integrated circuitry including a capacitor with an amorphous and a crystalline high K capacitor dielectric region
JP2001267529A (ja) * 2000-03-22 2001-09-28 Tokyo Electron Ltd 半導体装置およびその製造方法
US6724611B1 (en) * 2000-03-29 2004-04-20 Intel Corporation Multi-layer chip capacitor
US6492241B1 (en) 2000-04-10 2002-12-10 Micron Technology, Inc. Integrated capacitors fabricated with conductive metal oxides
US6417062B1 (en) * 2000-05-01 2002-07-09 General Electric Company Method of forming ruthenium oxide films
US6528180B1 (en) 2000-05-23 2003-03-04 Applied Materials, Inc. Liner materials
US6579783B2 (en) 2000-07-07 2003-06-17 Applied Materials, Inc. Method for high temperature metal deposition for reducing lateral silicidation
US6352921B1 (en) 2000-07-19 2002-03-05 Chartered Semiconductor Manufacturing Ltd. Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization
US6423632B1 (en) 2000-07-21 2002-07-23 Motorola, Inc. Semiconductor device and a process for forming the same
US6627050B2 (en) 2000-07-28 2003-09-30 Applied Materials, Inc. Method and apparatus for depositing a tantalum-containing layer on a substrate
US6517944B1 (en) 2000-08-03 2003-02-11 Teracomm Research Inc. Multi-layer passivation barrier for a superconducting element
US7057246B2 (en) 2000-08-23 2006-06-06 Reflectivity, Inc Transition metal dielectric alloy materials for MEMS
US7153592B2 (en) * 2000-08-31 2006-12-26 Fujitsu Limited Organic EL element and method of manufacturing the same, organic EL display device using the element, organic EL material, and surface emission device and liquid crystal display device using the material
US6430448B1 (en) 2000-11-07 2002-08-06 Pacesetter, Inc. Stimulating electrode having low polarization and method of making same
US6430447B1 (en) 2000-11-07 2002-08-06 Pacesetter, Inc. Stimulating electrode having low polarization and method of making same
JP2002151657A (ja) 2000-11-08 2002-05-24 Sanyo Electric Co Ltd 誘電体素子およびその製造方法
KR20020049875A (ko) * 2000-12-20 2002-06-26 윤종용 반도체 메모리 소자의 강유전체 커패시터 및 그 제조방법
US7378719B2 (en) * 2000-12-20 2008-05-27 Micron Technology, Inc. Low leakage MIM capacitor
KR100390834B1 (ko) * 2000-12-26 2003-07-10 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
US6524867B2 (en) * 2000-12-28 2003-02-25 Micron Technology, Inc. Method for forming platinum-rhodium stack as an oxygen barrier
KR100387262B1 (ko) * 2000-12-29 2003-06-12 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조 방법
JP2002231903A (ja) * 2001-02-06 2002-08-16 Sanyo Electric Co Ltd 誘電体素子およびその製造方法
US6518610B2 (en) 2001-02-20 2003-02-11 Micron Technology, Inc. Rhodium-rich oxygen barriers
US6563161B2 (en) 2001-03-22 2003-05-13 Winbond Electronics Corporation Memory-storage node and the method of fabricating the same
KR100406536B1 (ko) 2001-03-28 2003-11-20 주식회사 하이닉스반도체 산소확산방지막으로서 알루미늄 산화막을 구비하는강유전체 메모리 소자 및 그 제조 방법
US6688584B2 (en) * 2001-05-16 2004-02-10 Micron Technology, Inc. Compound structure for reduced contact resistance
KR100418581B1 (ko) * 2001-06-12 2004-02-11 주식회사 하이닉스반도체 메모리 소자의 제조방법
US7057251B2 (en) * 2001-07-20 2006-06-06 Reflectivity, Inc MEMS device made of transition metal-dielectric oxide materials
US8110489B2 (en) 2001-07-25 2012-02-07 Applied Materials, Inc. Process for forming cobalt-containing materials
US20090004850A1 (en) 2001-07-25 2009-01-01 Seshadri Ganguli Process for forming cobalt and cobalt silicide materials in tungsten contact applications
WO2003030224A2 (en) 2001-07-25 2003-04-10 Applied Materials, Inc. Barrier formation using novel sputter-deposition method
US9051641B2 (en) 2001-07-25 2015-06-09 Applied Materials, Inc. Cobalt deposition on barrier surfaces
US20030029715A1 (en) 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
US7297626B1 (en) * 2001-08-27 2007-11-20 United States Of America As Represented By The Secretary Of The Army Process for nickel silicide Ohmic contacts to n-SiC
US6989108B2 (en) * 2001-08-30 2006-01-24 Micron Technology, Inc. Etchant gas composition
KR100442709B1 (ko) * 2001-09-22 2004-08-02 학교법인 국민학원 이종 질화물의 이중 방지막을 갖는 커패시터 및 그의 전극형성 방법
KR100424710B1 (ko) * 2001-11-21 2004-03-27 주식회사 하이닉스반도체 반도체 소자의 제조방법
KR100438781B1 (ko) * 2001-12-05 2004-07-05 삼성전자주식회사 금속-절연체-금속 캐패시터 및 그 제조방법
KR100447972B1 (ko) * 2001-12-27 2004-09-10 주식회사 하이닉스반도체 반도체 소자의 캐패시터 형성방법
US6972265B1 (en) * 2002-04-15 2005-12-06 Silicon Magnetic Systems Metal etch process selective to metallic insulating materials
DE10218799A1 (de) * 2002-04-23 2003-11-13 Ihp Gmbh Halbleiterkondensator mit Praseodymoxid als Dielektrikum
US6717266B1 (en) * 2002-06-18 2004-04-06 Advanced Micro Devices, Inc. Use of an alloying element to form a stable oxide layer on the surface of metal features
US7067862B2 (en) * 2002-08-02 2006-06-27 Unity Semiconductor Corporation Conductive memory device with conductive oxide electrodes
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US9793523B2 (en) 2002-08-09 2017-10-17 Sapurast Research Llc Electrochemical apparatus with barrier layer protected substrate
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
JP4840794B2 (ja) * 2002-08-30 2011-12-21 国立大学法人東京工業大学 電子デバイスの製造方法
KR100480469B1 (ko) * 2002-10-17 2005-04-07 동부아남반도체 주식회사 반도체 소자내 커패시터 제조방법
US6794753B2 (en) * 2002-12-27 2004-09-21 Lexmark International, Inc. Diffusion barrier and method therefor
US20040140296A1 (en) * 2003-01-22 2004-07-22 Lis Steven A. Close proximity pulsed laser catalyst deposition system and method
US7042705B2 (en) * 2003-01-30 2006-05-09 Infineon Technologies Ag Sidewall structure and method of fabrication for reducing oxygen diffusion to contact plugs during CW hole reactive ion etch processing
KR100536030B1 (ko) * 2003-02-25 2005-12-12 삼성전자주식회사 반도체 장치의 커패시터 형성 방법
JP2004281965A (ja) * 2003-03-19 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US7531380B2 (en) * 2003-04-30 2009-05-12 Cree, Inc. Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof
US7123969B1 (en) 2003-05-21 2006-10-17 Pacesetter, Inc. Lead having one or more low polarization electrodes
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US6849465B2 (en) * 2003-06-20 2005-02-01 Infineon Technologies Ag Method of patterning a magnetic memory cell bottom electrode before magnetic stack deposition
US6849891B1 (en) * 2003-12-08 2005-02-01 Sharp Laboratories Of America, Inc. RRAM memory cell electrodes
US7080896B2 (en) * 2004-01-20 2006-07-25 Lexmark International, Inc. Micro-fluid ejection device having high resistance heater film
DE102004022604B4 (de) * 2004-05-07 2006-06-08 Infineon Technologies Ag Verfahren zur Herstellung einer sublithografischen Kontaktstruktur in einem Halbleiterbauelement
US7301752B2 (en) * 2004-06-04 2007-11-27 International Business Machines Corporation Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
US20060014624A1 (en) * 2004-07-15 2006-01-19 Biljana Mikijelj High dielectric strength monolithic Si3N4
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
JP5095412B2 (ja) 2004-12-08 2012-12-12 シモーフィックス,インコーポレーテッド LiCoO2の堆積
US7371684B2 (en) * 2005-05-16 2008-05-13 International Business Machines Corporation Process for preparing electronics structures using a sacrificial multilayer hardmask scheme
JP2007053141A (ja) * 2005-08-15 2007-03-01 Fujitsu Ltd 半導体装置およびその製造方法
JP4703349B2 (ja) * 2005-10-11 2011-06-15 Okiセミコンダクタ株式会社 アモルファス膜の成膜方法
US7534693B2 (en) * 2006-01-04 2009-05-19 Freescale Semiconductor, Inc. Thin-film capacitor with a field modification layer and methods for forming the same
JP4703500B2 (ja) * 2006-06-30 2011-06-15 富士通セミコンダクター株式会社 半導体装置の製造方法
CN101523571A (zh) 2006-09-29 2009-09-02 无穷动力解决方案股份有限公司 柔性基板上沉积的电池层的掩模和材料限制
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US7713866B2 (en) * 2006-11-21 2010-05-11 Infineon Technologies Ag Semiconductor devices and methods of manufacture thereof
US20080293192A1 (en) * 2007-05-22 2008-11-27 Stefan Zollner Semiconductor device with stressors and methods thereof
US20090108294A1 (en) * 2007-10-30 2009-04-30 International Business Machines Corporation Scalable high-k dielectric gate stack
EP2225406A4 (en) 2007-12-21 2012-12-05 Infinite Power Solutions Inc PROCEDURE FOR SPUTTER TARGETS FOR ELECTROLYTE FILMS
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
EP2229706B1 (en) 2008-01-11 2014-12-24 Infinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
JP5262233B2 (ja) * 2008-03-27 2013-08-14 日本電気株式会社 窒化ジルコニウム界面層を有するキャパシター構造
EP2266183B1 (en) 2008-04-02 2018-12-12 Sapurast Research LLC Passive over/under voltage control and protection for energy storage devices associated with energy harvesting
US8906523B2 (en) * 2008-08-11 2014-12-09 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
CN102150185B (zh) 2008-09-12 2014-05-28 无穷动力解决方案股份有限公司 具有经由电磁能进行数据通信的组成导电表面的能量装置及其方法
WO2010042594A1 (en) 2008-10-08 2010-04-15 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
EP2474056B1 (en) 2009-09-01 2016-05-04 Sapurast Research LLC Printed circuit board with integrated thin film battery
CN102947976B (zh) 2010-06-07 2018-03-16 萨普拉斯特研究有限责任公司 可充电、高密度的电化学设备
US9299926B2 (en) 2012-02-17 2016-03-29 Intermolecular, Inc. Nonvolatile memory device using a tunnel oxide layer and oxygen blocking layer as a current limiter element
CN108257957A (zh) * 2016-12-29 2018-07-06 联华电子股份有限公司 半导体结构及其制作方法
US11133462B2 (en) 2019-06-10 2021-09-28 International Business Machines Corporation Bottom electrode structure and method of forming the same

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4640004A (en) * 1984-04-13 1987-02-03 Fairchild Camera & Instrument Corp. Method and structure for inhibiting dopant out-diffusion
GB8605614D0 (en) * 1986-03-07 1986-04-16 Grant D A Mechanised toilet seat
DE3782904T2 (de) * 1986-09-17 1993-04-08 Fujitsu Ltd Verfahren zur ausbildung einer kupfer enthaltenden metallisierungsschicht auf der oberflaeche eines halbleiterbauelementes.
US4809225A (en) * 1987-07-02 1989-02-28 Ramtron Corporation Memory cell with volatile and non-volatile portions having ferroelectric capacitors
US4910708A (en) * 1987-07-02 1990-03-20 Ramtron Corporation Dram with programmable capacitance divider
US4914627A (en) * 1987-07-02 1990-04-03 Ramtron Corporation One transistor memory cell with programmable capacitance divider
US4918654A (en) * 1987-07-02 1990-04-17 Ramtron Corporation SRAM with programmable capacitance divider
US4873644A (en) * 1987-09-16 1989-10-10 Kubota, Ltd. Guide system for a working machine having a product identifying system
US4893272A (en) * 1988-04-22 1990-01-09 Ramtron Corporation Ferroelectric retention method
US4888733A (en) * 1988-09-12 1989-12-19 Ramtron Corporation Non-volatile memory cell and sensing method
US5005102A (en) * 1989-06-20 1991-04-02 Ramtron Corporation Multilayer electrodes for integrated circuit capacitors
US4982309A (en) * 1989-07-17 1991-01-01 National Semiconductor Corporation Electrodes for electrical ceramic oxide devices
US5122923A (en) * 1989-08-30 1992-06-16 Nec Corporation Thin-film capacitors and process for manufacturing the same
JPH0644601B2 (ja) * 1989-08-30 1994-06-08 日本電気株式会社 薄膜コンデンサおよびその製造方法
EP0415751B1 (en) * 1989-08-30 1995-03-15 Nec Corporation Thin film capacitor and manufacturing method thereof
JP2861129B2 (ja) * 1989-10-23 1999-02-24 日本電気株式会社 半導体装置
JPH03157965A (ja) * 1989-11-15 1991-07-05 Nec Corp 半導体装置
JP3021800B2 (ja) * 1990-07-24 2000-03-15 セイコーエプソン株式会社 半導体装置及びその製造方法
US5079200A (en) * 1990-08-23 1992-01-07 The United States Of America As Represented By The Secretary Of The Army Detector material for uncooled thermal imaging devices
JP2690821B2 (ja) * 1991-05-28 1997-12-17 シャープ株式会社 半導体装置
JP3483896B2 (ja) * 1991-07-19 2004-01-06 三菱電機株式会社 半導体メモリの記憶用キャパシタ
US5188979A (en) * 1991-08-26 1993-02-23 Motorola Inc. Method for forming a nitride layer using preheated ammonia
US5231306A (en) * 1992-01-31 1993-07-27 Micron Technology, Inc. Titanium/aluminum/nitrogen material for semiconductor devices
EP0557937A1 (en) * 1992-02-25 1993-09-01 Ramtron International Corporation Ozone gas processing for ferroelectric memory circuits
KR100325967B1 (ko) * 1992-04-20 2002-06-20 윌리엄 비. 켐플러 유전체 물질에의 전기 접속부
US5191510A (en) * 1992-04-29 1993-03-02 Ramtron International Corporation Use of palladium as an adhesion layer and as an electrode in ferroelectric memory devices
EP0568064B1 (en) * 1992-05-01 1999-07-14 Texas Instruments Incorporated Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer
JP3120568B2 (ja) * 1992-05-19 2000-12-25 日本電気株式会社 薄膜キャパシタ
JPH0685173A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体集積回路用キャパシタ
US5350705A (en) * 1992-08-25 1994-09-27 National Semiconductor Corporation Ferroelectric memory cell arrangement having a split capacitor plate structure
US5348894A (en) * 1993-01-27 1994-09-20 Texas Instruments Incorporated Method of forming electrical connections to high dielectric constant materials
US5335138A (en) * 1993-02-12 1994-08-02 Micron Semiconductor, Inc. High dielectric constant capacitor and method of manufacture
DE69404189T2 (de) * 1993-03-31 1998-01-08 Texas Instruments Inc Leicht donatoren-dotierte Elektroden für Materialien mit hoher dielektrischer Konstante
JPH07111318A (ja) * 1993-10-12 1995-04-25 Olympus Optical Co Ltd 強誘電体メモリ
US5622893A (en) * 1994-08-01 1997-04-22 Texas Instruments Incorporated Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes
US5554564A (en) * 1994-08-01 1996-09-10 Texas Instruments Incorporated Pre-oxidizing high-dielectric-constant material electrodes
US5489548A (en) * 1994-08-01 1996-02-06 Texas Instruments Incorporated Method of forming high-dielectric-constant material electrodes comprising sidewall spacers
US5585300A (en) * 1994-08-01 1996-12-17 Texas Instruments Incorporated Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7604390B2 (en) 2006-11-02 2009-10-20 Au Optronics Corp. Supporting structure and fixing component having a through-hole and opening for pin structure engagement and backlight module using the same

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