TW239887B - - Google Patents

Info

Publication number
TW239887B
TW239887B TW82103212A TW82103212A TW239887B TW 239887 B TW239887 B TW 239887B TW 82103212 A TW82103212 A TW 82103212A TW 82103212 A TW82103212 A TW 82103212A TW 239887 B TW239887 B TW 239887B
Authority
TW
Taiwan
Application number
TW82103212A
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US07/949,959 priority Critical patent/US5295522A/en
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW239887B publication Critical patent/TW239887B/zh

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67376Closed carriers characterised by sealing arrangements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
TW82103212A 1992-09-24 1993-04-26 TW239887B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07/949,959 US5295522A (en) 1992-09-24 1992-09-24 Gas purge system for isolation enclosure for contamination sensitive items

Publications (1)

Publication Number Publication Date
TW239887B true TW239887B (zh) 1995-02-01

Family

ID=25489741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82103212A TW239887B (zh) 1992-09-24 1993-04-26

Country Status (6)

Country Link
US (1) US5295522A (zh)
EP (1) EP0591085A1 (zh)
JP (2) JP2500052B2 (zh)
KR (1) KR970008325B1 (zh)
SG (1) SG42816A1 (zh)
TW (1) TW239887B (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5472086A (en) * 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5785186A (en) * 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5833726A (en) * 1995-05-26 1998-11-10 Extraction System, Inc. Storing substrates between process steps within a processing facility
US5740845A (en) * 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
US5810537A (en) * 1995-10-18 1998-09-22 Bye/Oasis Engineering Inc. Isolation chamber transfer apparatus
FR2747112B1 (fr) * 1996-04-03 1998-05-07 Commissariat Energie Atomique Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement
US6216328B1 (en) * 1996-07-09 2001-04-17 Lam Research Corporation Transport chamber and method for making same
US5746434A (en) * 1996-07-09 1998-05-05 Lam Research Corporation Chamber interfacing O-rings and method for implementing same
US5724748A (en) * 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
JP3367421B2 (ja) * 1998-04-16 2003-01-14 東京エレクトロン株式会社 被処理体の収納装置及び搬出入ステージ
US6056026A (en) * 1998-12-01 2000-05-02 Asyst Technologies, Inc. Passively activated valve for carrier purging
US6267545B1 (en) 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6095741A (en) * 1999-03-29 2000-08-01 Lam Research Corporation Dual sided slot valve and method for implementing the same
US6641349B1 (en) * 1999-04-30 2003-11-04 Tdk Corporation Clean box, clean transfer method and system
US6263542B1 (en) 1999-06-22 2001-07-24 Lam Research Corporation Tolerance resistant and vacuum compliant door hinge with open-assist feature
JP3226511B2 (ja) * 1999-06-23 2001-11-05 ティーディーケイ株式会社 容器および容器の封止方法
US6244811B1 (en) 1999-06-29 2001-06-12 Lam Research Corporation Atmospheric wafer transfer module with nest for wafer transport robot
JP3769417B2 (ja) * 1999-06-30 2006-04-26 株式会社東芝 基板収納容器
FR2802335B1 (fr) * 1999-12-09 2002-04-05 Cit Alcatel Systeme et procede de controle de minienvironnement
US6390448B1 (en) 2000-03-30 2002-05-21 Lam Research Corporation Single shaft dual cradle vacuum slot valve
US6913243B1 (en) 2000-03-30 2005-07-05 Lam Research Corporation Unitary slot valve actuator with dual valves
FR2834974B1 (fr) * 2002-01-24 2004-10-15 Air Liquide Enceinte de stockage, valve d'evacuation de gaz pour cette enceinte, et procede d'alimentation en gaz de cette enceinte
FR2850638B1 (fr) * 2003-02-03 2006-09-29 Excel Services Emballages Sa Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
US7268006B2 (en) 2004-12-30 2007-09-11 E.I. Du Pont De Nemours And Company Electronic device including a guest material within a layer and a process for forming the same
EP2360722B1 (en) * 2006-08-04 2012-12-05 E. I. du Pont de Nemours and Company Assembly for depositing air sensitive material
CN102804942B (zh) 2010-03-18 2015-12-16 诺基亚公司 用于便携电子设备的壳
US9110580B2 (en) 2011-08-05 2015-08-18 Nokia Technologies Oy Apparatus comprising a display and a method and computer program
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
US10036197B1 (en) * 2015-12-31 2018-07-31 Vium, Inc. Device, system and method of interconnecting doorways

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1141611A (en) * 1979-02-02 1983-02-22 Timothy H. Wentzell Nozzle plug for submersible vessel
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
JPS60118653U (zh) * 1984-01-20 1985-08-10
US4674939A (en) * 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
JPH0159007B2 (zh) * 1985-06-17 1989-12-14 Fujitsu Ltd
US5048570A (en) * 1986-04-21 1991-09-17 Combustion Engineering Inc. Multisectioned nozzle dam
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
JPH0263379U (zh) * 1988-11-01 1990-05-11
JPH02242771A (en) * 1989-03-09 1990-09-27 Fujitsu Ltd Storage of magnetic recorder part
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5217053A (en) * 1990-02-05 1993-06-08 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette

Also Published As

Publication number Publication date
KR940007972A (ko) 1994-04-28
JP2921658B2 (ja) 1999-07-19
JPH06227571A (ja) 1994-08-16
EP0591085A1 (en) 1994-04-06
JP2500052B2 (ja) 1996-05-29
US5295522A (en) 1994-03-22
SG42816A1 (en) 1997-10-17
JPH08181045A (ja) 1996-07-12
KR970008325B1 (ko) 1997-05-23

Similar Documents

Publication Publication Date Title
TW300251B (zh)
TW255980B (zh)
JPH07505346A (zh)
DE9209528U1 (zh)
ITLU920017U1 (zh)
TW211075B (zh)
DE9211074U1 (zh)
DE9217973U1 (zh)
DE9301918U1 (zh)
HRP920119A2 (zh)
DK0581360T3 (zh)
EP0562441A3 (zh)
DE9202544U1 (zh)
DE9214934U1 (zh)
DE9216246U1 (zh)
EP0578182A3 (zh)
DE9202319U1 (zh)
DE9216464U1 (zh)
DE9308974U1 (zh)
JPH07504995A (zh)
IN185100B (zh)
DE9214629U1 (zh)
EP0573212A3 (zh)
TW225079B (zh)
TW268020B (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees