TW202523769A - 氟樹脂片、其製造方法及含其之覆金屬氟樹脂基板 - Google Patents
氟樹脂片、其製造方法及含其之覆金屬氟樹脂基板 Download PDFInfo
- Publication number
- TW202523769A TW202523769A TW113126755A TW113126755A TW202523769A TW 202523769 A TW202523769 A TW 202523769A TW 113126755 A TW113126755 A TW 113126755A TW 113126755 A TW113126755 A TW 113126755A TW 202523769 A TW202523769 A TW 202523769A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- fluororesin
- fluororesin sheet
- inorganic filler
- fluoropolymer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
- C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
- C08J3/215—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase at least one additive being also premixed with a liquid phase
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023207151 | 2023-12-07 | ||
| JP2023-207151 | 2023-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202523769A true TW202523769A (zh) | 2025-06-16 |
Family
ID=95980884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113126755A TW202523769A (zh) | 2023-12-07 | 2024-07-17 | 氟樹脂片、其製造方法及含其之覆金屬氟樹脂基板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7713117B1 (https=) |
| CN (1) | CN121712830A (https=) |
| TW (1) | TW202523769A (https=) |
| WO (1) | WO2025120893A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3942489B2 (ja) * | 2002-05-22 | 2007-07-11 | 株式会社巴川製紙所 | フッ素樹脂プリント配線板及びその製造方法 |
| JP2008181610A (ja) * | 2007-01-25 | 2008-08-07 | Fujifilm Corp | 磁気記録媒体 |
| JP2009054198A (ja) * | 2007-08-23 | 2009-03-12 | Fujifilm Corp | 磁気記録媒体 |
| JP4777389B2 (ja) | 2008-06-11 | 2011-09-21 | 日本バルカー工業株式会社 | ガスケット用充填材入りフッ素樹脂シートおよびガスケット |
| JP2017141345A (ja) | 2016-02-10 | 2017-08-17 | 日本ゼオン株式会社 | 複合材料シートおよび熱伝導シートの製造方法 |
| JP7134594B2 (ja) | 2016-03-18 | 2022-09-12 | 日東電工株式会社 | 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板 |
| TWI680871B (zh) | 2018-09-27 | 2020-01-01 | 南亞塑膠工業股份有限公司 | 一種氟素樹脂組合物及使用該組合物的預浸體及銅箔基板 |
| JP7608450B2 (ja) | 2020-05-18 | 2025-01-06 | 住友電気工業株式会社 | 誘電体シートの製造方法、高周波プリント配線板用基板の製造方法、誘電体シート、及び高周波プリント配線板用基板 |
| JP7478679B2 (ja) | 2021-01-26 | 2024-05-07 | 信越化学工業株式会社 | 低誘電金属張フッ素樹脂基板及びその製造方法 |
| TW202317697A (zh) | 2021-08-04 | 2023-05-01 | 日商Agc股份有限公司 | 片材之製造方法、積層片材之製造方法及片材 |
| US20240422902A1 (en) * | 2021-11-08 | 2024-12-19 | Sumitomo Electric Industries, Ltd. | Dielectric sheet, substrate for high frequency printed wiring board, and high frequency printed wiring board |
| WO2023189794A1 (ja) * | 2022-03-31 | 2023-10-05 | 日鉄ケミカル&マテリアル株式会社 | 金属張積層板及びその製造方法 |
-
2024
- 2024-07-11 CN CN202480052531.7A patent/CN121712830A/zh active Pending
- 2024-07-11 JP JP2024569143A patent/JP7713117B1/ja active Active
- 2024-07-11 WO PCT/JP2024/025105 patent/WO2025120893A1/ja active Pending
- 2024-07-17 TW TW113126755A patent/TW202523769A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2025120893A1 (https=) | 2025-06-12 |
| JP7713117B1 (ja) | 2025-07-24 |
| CN121712830A (zh) | 2026-03-20 |
| WO2025120893A1 (ja) | 2025-06-12 |
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