TW202448970A - 組合物、接著劑、硬化物之製造方法及硬化物 - Google Patents

組合物、接著劑、硬化物之製造方法及硬化物 Download PDF

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Publication number
TW202448970A
TW202448970A TW113110354A TW113110354A TW202448970A TW 202448970 A TW202448970 A TW 202448970A TW 113110354 A TW113110354 A TW 113110354A TW 113110354 A TW113110354 A TW 113110354A TW 202448970 A TW202448970 A TW 202448970A
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TW
Taiwan
Prior art keywords
compound
composition
mass
compounds
condensed ring
Prior art date
Application number
TW113110354A
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English (en)
Chinese (zh)
Inventor
板野和幸
松土和彦
山岸光
Original Assignee
日商艾迪科股份有限公司
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Application filed by 日商艾迪科股份有限公司 filed Critical 日商艾迪科股份有限公司
Publication of TW202448970A publication Critical patent/TW202448970A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW113110354A 2023-03-23 2024-03-20 組合物、接著劑、硬化物之製造方法及硬化物 TW202448970A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023047384 2023-03-23
JP2023-047384 2023-03-23

Publications (1)

Publication Number Publication Date
TW202448970A true TW202448970A (zh) 2024-12-16

Family

ID=92841529

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113110354A TW202448970A (zh) 2023-03-23 2024-03-20 組合物、接著劑、硬化物之製造方法及硬化物

Country Status (4)

Country Link
JP (1) JPWO2024195693A1 (https=)
CN (1) CN120917077A (https=)
TW (1) TW202448970A (https=)
WO (1) WO2024195693A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112015028360A2 (pt) * 2013-05-24 2017-10-03 Daicel Corp Composição para um material compósito reforçado com fibra, prepreg, e material compósito reforçado com fibra
TWI727026B (zh) * 2016-03-30 2021-05-11 日商Adeka股份有限公司 硬化性組成物,硬化物之製造方法及其硬化物
JP2017193597A (ja) * 2016-04-18 2017-10-26 株式会社Adeka 硬化性組成物
JP2018165329A (ja) * 2017-03-28 2018-10-25 株式会社Adeka 硬化性組成物
KR102815563B1 (ko) * 2018-08-31 2025-05-29 가부시키가이샤 아데카 조성물, 이것을 함유하는 접착제, 그 경화물 및 그 제조 방법
KR20230172453A (ko) * 2021-04-15 2023-12-22 세키스이가가쿠 고교가부시키가이샤 잉크젯용 및 에어 캐비티 형성용 경화성 조성물, 전자 부품 및 전자 부품의 제조 방법
KR20240127336A (ko) * 2021-12-21 2024-08-22 세키스이가가쿠 고교가부시키가이샤 격벽 형성용 잉크젯 조성물, led 모듈, led 모듈의 제조 방법 및 잉크젯 조성물
WO2024024890A1 (ja) * 2022-07-29 2024-02-01 住友化学株式会社 光学積層体

Also Published As

Publication number Publication date
CN120917077A (zh) 2025-11-07
WO2024195693A1 (ja) 2024-09-26
JPWO2024195693A1 (https=) 2024-09-26

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