TW202406675A - 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法 - Google Patents

資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法 Download PDF

Info

Publication number
TW202406675A
TW202406675A TW112128538A TW112128538A TW202406675A TW 202406675 A TW202406675 A TW 202406675A TW 112128538 A TW112128538 A TW 112128538A TW 112128538 A TW112128538 A TW 112128538A TW 202406675 A TW202406675 A TW 202406675A
Authority
TW
Taiwan
Prior art keywords
information
reliability
aforementioned
polishing
end point
Prior art date
Application number
TW112128538A
Other languages
English (en)
Chinese (zh)
Inventor
三谷隆一郎
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202406675A publication Critical patent/TW202406675A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • General Factory Administration (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW112128538A 2022-08-01 2023-07-31 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法 TW202406675A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022122766A JP2024019962A (ja) 2022-08-01 2022-08-01 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2022-122766 2022-08-01

Publications (1)

Publication Number Publication Date
TW202406675A true TW202406675A (zh) 2024-02-16

Family

ID=89848872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128538A TW202406675A (zh) 2022-08-01 2023-07-31 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法

Country Status (6)

Country Link
US (1) US20260034636A1 (https=)
JP (1) JP2024019962A (https=)
KR (1) KR20250047726A (https=)
CN (1) CN119631164A (https=)
TW (1) TW202406675A (https=)
WO (1) WO2024029236A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025170830A (ja) * 2024-05-08 2025-11-20 株式会社荏原製作所 基板研磨装置および膜厚算出方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013176828A (ja) * 2012-02-29 2013-09-09 Ebara Corp 研磨終点検出装置の遠隔監視システム
TW202044394A (zh) * 2019-05-22 2020-12-01 日商荏原製作所股份有限公司 基板處理系統
JP2021028099A (ja) 2019-08-09 2021-02-25 株式会社荏原製作所 終点検知装置、終点検知方法

Also Published As

Publication number Publication date
JP2024019962A (ja) 2024-02-14
WO2024029236A1 (ja) 2024-02-08
CN119631164A (zh) 2025-03-14
US20260034636A1 (en) 2026-02-05
KR20250047726A (ko) 2025-04-04

Similar Documents

Publication Publication Date Title
US20250217670A1 (en) Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
TW202406675A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
TW202339896A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
JP2023116396A (ja) 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
TW202347480A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
US20250173611A1 (en) Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
WO2024024391A1 (ja) 情報処理装置、機械学習装置、情報処理方法、及び、機械学習方法
TW202347476A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
CN118434534A (zh) 信息处理装置、推论装置、机器学习装置、信息处理方法、推论方法及机器学习方法
US20240399527A1 (en) Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
TW202347187A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
US20250125172A1 (en) Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
TW202315703A (zh) 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法
JP2023090667A (ja) 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
CN118660786A (zh) 信息处理装置、推论装置、机器学习装置、信息处理方法、推论方法及机器学习方法
US20250303514A1 (en) Information processing device, substrate polishing device, inference device, machine learning device, information processing method, inference method, and machine learning method
US20260093304A1 (en) Information processing device, machine learning device, information processing method, and machine learning method
TW202443324A (zh) 資訊處理裝置、推導裝置、機器學習裝置、資訊處理方法、推導方法、及機器學習方法