TW202344326A - 低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線 - Google Patents

低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線 Download PDF

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Publication number
TW202344326A
TW202344326A TW112123222A TW112123222A TW202344326A TW 202344326 A TW202344326 A TW 202344326A TW 112123222 A TW112123222 A TW 112123222A TW 112123222 A TW112123222 A TW 112123222A TW 202344326 A TW202344326 A TW 202344326A
Authority
TW
Taiwan
Prior art keywords
low
temperature
temperature solder
alloy
solder
Prior art date
Application number
TW112123222A
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English (en)
Chinese (zh)
Inventor
岡田守弘
新井卓
新井傑也
新井寛昭
菅原美愛子
小林賢一
小宮秀利
松井正五
錦織潤
森尚久
徳田遼
Original Assignee
日商亞特比目股份有限公司
岡田守弘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商亞特比目股份有限公司, 岡田守弘 filed Critical 日商亞特比目股份有限公司
Publication of TW202344326A publication Critical patent/TW202344326A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
TW112123222A 2020-10-01 2021-09-16 低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線 TW202344326A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-166977 2020-10-01
JP2020166977 2020-10-01
JP2020219193 2020-12-28
JP2020-219193 2020-12-28

Publications (1)

Publication Number Publication Date
TW202344326A true TW202344326A (zh) 2023-11-16

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW112123222A TW202344326A (zh) 2020-10-01 2021-09-16 低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線
TW110134594A TW202219286A (zh) 2020-10-01 2021-09-16 低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110134594A TW202219286A (zh) 2020-10-01 2021-09-16 低溫焊料、低溫焊料的製造方法及低溫焊料被覆導線

Country Status (5)

Country Link
JP (2) JP7576805B2 (https=)
KR (1) KR102877569B1 (https=)
CN (1) CN116324001A (https=)
TW (2) TW202344326A (https=)
WO (1) WO2022070910A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116324001A (zh) * 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP4135268B2 (ja) 1998-09-04 2008-08-20 株式会社豊田中央研究所 無鉛はんだ合金
JP2005296983A (ja) 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2007292901A (ja) 2006-04-24 2007-11-08 Optrex Corp 表示モジュール
US9279176B2 (en) 2008-11-27 2016-03-08 Hitachi Metals, Ltd. Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
JP5169871B2 (ja) * 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) * 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
CN106216872B (zh) * 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
TWI714127B (zh) * 2018-06-26 2020-12-21 日商亞特比目有限公司 太陽能電池及太陽能電池的製造方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
TW202206614A (zh) 2019-07-12 2022-02-16 日商亞特比目有限公司 ＳｎＺｎ焊料及其製造方法
CN116324001A (zh) 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Also Published As

Publication number Publication date
CN116324001A (zh) 2023-06-23
JP7576805B2 (ja) 2024-11-01
KR102877569B1 (ko) 2025-10-27
KR20230075504A (ko) 2023-05-31
JP2024113075A (ja) 2024-08-21
JPWO2022070910A1 (https=) 2022-04-07
WO2022070910A1 (ja) 2022-04-07
TW202219286A (zh) 2022-05-16
JP7770637B2 (ja) 2025-11-17

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