TW202323760A - 定位裝置及定位方法 - Google Patents

定位裝置及定位方法 Download PDF

Info

Publication number
TW202323760A
TW202323760A TW111118651A TW111118651A TW202323760A TW 202323760 A TW202323760 A TW 202323760A TW 111118651 A TW111118651 A TW 111118651A TW 111118651 A TW111118651 A TW 111118651A TW 202323760 A TW202323760 A TW 202323760A
Authority
TW
Taiwan
Prior art keywords
light
positioning
imaging
positioning object
light emitted
Prior art date
Application number
TW111118651A
Other languages
English (en)
Chinese (zh)
Inventor
青木陽太
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202323760A publication Critical patent/TW202323760A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW111118651A 2021-08-16 2022-05-19 定位裝置及定位方法 TW202323760A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021132301A JP2023026881A (ja) 2021-08-16 2021-08-16 位置決め装置および位置決め方法
JP2021-132301 2021-08-16

Publications (1)

Publication Number Publication Date
TW202323760A true TW202323760A (zh) 2023-06-16

Family

ID=85181461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111118651A TW202323760A (zh) 2021-08-16 2022-05-19 定位裝置及定位方法

Country Status (4)

Country Link
JP (1) JP2023026881A (ko)
KR (1) KR20230025743A (ko)
CN (1) CN115704780A (ko)
TW (1) TW202323760A (ko)

Also Published As

Publication number Publication date
JP2023026881A (ja) 2023-03-01
KR20230025743A (ko) 2023-02-23
CN115704780A (zh) 2023-02-17

Similar Documents

Publication Publication Date Title
JP4616514B2 (ja) 電気部品装着システムおよびそれにおける位置誤差検出方法
TWI606549B (zh) Suction cup table
JP2009064905A (ja) 拡張方法および拡張装置
JPWO2003088730A1 (ja) 対基板作業システム
WO2007020809A1 (ja) ワーク搬送装置とそれを備えた画像形成装置並びにワーク搬送方法
CN110624856A (zh) 一种oca检测设备
JP2012151407A (ja) ワークステージおよびこのワークステージを使った露光装置
TW202008494A (zh) 搬運機構、電子零件製造裝置及電子零件的製造方法
JP2017081072A (ja) ワークの貼り合わせ方法およびワークの貼り合わせ装置
TW202246731A (zh) 保護膜之厚度測定方法
JP2010157527A (ja) 板状部材の位置認識装置および位置認識方法、ならびにアライメント装置およびアライメント方法
JP7287630B2 (ja) 半導体ウエハへの保護テープの貼付装置及び貼り付け方法
TW202323760A (zh) 定位裝置及定位方法
CN211756987U (zh) 一种oca检测设备
TWI778024B (zh) 分離裝置及分離方法
JP3244402U (ja) 撮像装置
TWI730135B (zh) 對準裝置
WO2018003578A1 (ja) アライメント装置
JP3848299B2 (ja) ワーク保持装置
JP3235024U (ja) 支持装置
JP3210743U (ja) シート貼付装置
JP2023170500A (ja) 電磁波照射装置および電磁波照射方法
JP2023170501A (ja) 電磁波照射装置および電磁波照射方法
JP7133432B2 (ja) シート貼付装置およびシート貼付方法
JP3238327U (ja) 電磁波照射装置